WO2002097880A3 - Power semiconductor module and method for the production of a power semiconductor module - Google Patents

Power semiconductor module and method for the production of a power semiconductor module Download PDF

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Publication number
WO2002097880A3
WO2002097880A3 PCT/EP2002/005520 EP0205520W WO02097880A3 WO 2002097880 A3 WO2002097880 A3 WO 2002097880A3 EP 0205520 W EP0205520 W EP 0205520W WO 02097880 A3 WO02097880 A3 WO 02097880A3
Authority
WO
WIPO (PCT)
Prior art keywords
power semiconductor
semiconductor module
module
carrier
production
Prior art date
Application number
PCT/EP2002/005520
Other languages
German (de)
French (fr)
Other versions
WO2002097880A2 (en
Inventor
Roman Tschirbs
Peter Wallmeier
Manfred Loddenkoetter
Original Assignee
Eupec Gmbh & Co Kg
Roman Tschirbs
Peter Wallmeier
Manfred Loddenkoetter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eupec Gmbh & Co Kg, Roman Tschirbs, Peter Wallmeier, Manfred Loddenkoetter filed Critical Eupec Gmbh & Co Kg
Priority to JP2003500964A priority Critical patent/JP4780268B2/en
Publication of WO2002097880A2 publication Critical patent/WO2002097880A2/en
Publication of WO2002097880A3 publication Critical patent/WO2002097880A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The invention relates to a power semiconductor module comprising active semiconductor components (5 to 10) placed on a carrier arrangement and a module housing (20) produced by plastic extrusion coating of the active semiconductor elements (5 to 10). In order to reduce or compensate for deformations arising as a result of mechanical stress during extrusion coating and plastic shrinkage, the carrier array consists of several carrier elements (1, 2, 3) that can be positioned independently of one another on different planes in the casting mold in such a way that a module housing (20) with a flat module bottom (25) is obtained.
PCT/EP2002/005520 2001-05-25 2002-05-18 Power semiconductor module and method for the production of a power semiconductor module WO2002097880A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003500964A JP4780268B2 (en) 2001-05-25 2002-05-18 Power semiconductor module and method of manufacturing power semiconductor module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10125697.3A DE10125697B4 (en) 2001-05-25 2001-05-25 Power semiconductor module and method for manufacturing a power semiconductor module
DE10125697.3 2001-05-25

Publications (2)

Publication Number Publication Date
WO2002097880A2 WO2002097880A2 (en) 2002-12-05
WO2002097880A3 true WO2002097880A3 (en) 2003-09-25

Family

ID=7686238

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/005520 WO2002097880A2 (en) 2001-05-25 2002-05-18 Power semiconductor module and method for the production of a power semiconductor module

Country Status (3)

Country Link
JP (1) JP4780268B2 (en)
DE (1) DE10125697B4 (en)
WO (1) WO2002097880A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003071601A2 (en) * 2002-02-18 2003-08-28 Infineon Technologies Ag Circuit module and method for the production thereof
DE102005061772B4 (en) * 2005-12-23 2017-09-07 Danfoss Silicon Power Gmbh The power semiconductor module
JP5565147B2 (en) 2010-06-30 2014-08-06 株式会社デンソー Manufacturing method of semiconductor module

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710951A (en) * 1980-06-25 1982-01-20 Rohm Co Ltd Semiconductor device
DE3508456A1 (en) * 1985-03-09 1986-09-11 Brown, Boveri & Cie Ag, 6800 Mannheim Power semiconductor module
EP0292059A2 (en) * 1987-05-18 1988-11-23 STMicroelectronics S.r.l. Modular resin-encapsulated multi-chip circuit package and its manufacturing method
EP0381054A2 (en) * 1989-01-30 1990-08-08 Kabushiki Kaisha Toshiba Semiconductor device package
US5083189A (en) * 1987-03-31 1992-01-21 Kabushiki Kaisha Toshiba Resin-sealed type IC device
US5194933A (en) * 1990-10-05 1993-03-16 Fuji Electric Co., Ltd. Semiconductor device using insulation coated metal substrate
US5245216A (en) * 1990-09-11 1993-09-14 Kabushiki Kaisha Toshiba Plastic-molded type semiconductor device
US5245215A (en) * 1982-01-11 1993-09-14 Kabushiki Kaisha Toshiba Multichip packaged semiconductor device and method for manufacturing the same
US5373188A (en) * 1992-11-04 1994-12-13 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device including multiple semiconductor chips and cross-over lead
EP1122778A2 (en) * 2000-01-31 2001-08-08 Sanyo Electric Co., Ltd. Circuit device and manufacturing method of circuit device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5075759A (en) 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
DE3940933C2 (en) * 1989-12-12 1996-08-01 Eupec Gmbh & Co Kg Method for deforming a base plate for semiconductor modules and device for carrying out the method
JP3206717B2 (en) * 1996-04-02 2001-09-10 富士電機株式会社 Power semiconductor module
US6404065B1 (en) 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710951A (en) * 1980-06-25 1982-01-20 Rohm Co Ltd Semiconductor device
US5245215A (en) * 1982-01-11 1993-09-14 Kabushiki Kaisha Toshiba Multichip packaged semiconductor device and method for manufacturing the same
DE3508456A1 (en) * 1985-03-09 1986-09-11 Brown, Boveri & Cie Ag, 6800 Mannheim Power semiconductor module
US5083189A (en) * 1987-03-31 1992-01-21 Kabushiki Kaisha Toshiba Resin-sealed type IC device
EP0292059A2 (en) * 1987-05-18 1988-11-23 STMicroelectronics S.r.l. Modular resin-encapsulated multi-chip circuit package and its manufacturing method
EP0381054A2 (en) * 1989-01-30 1990-08-08 Kabushiki Kaisha Toshiba Semiconductor device package
US5245216A (en) * 1990-09-11 1993-09-14 Kabushiki Kaisha Toshiba Plastic-molded type semiconductor device
US5194933A (en) * 1990-10-05 1993-03-16 Fuji Electric Co., Ltd. Semiconductor device using insulation coated metal substrate
US5373188A (en) * 1992-11-04 1994-12-13 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device including multiple semiconductor chips and cross-over lead
EP1122778A2 (en) * 2000-01-31 2001-08-08 Sanyo Electric Co., Ltd. Circuit device and manufacturing method of circuit device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
HINCHLEY D A ET AL: "Innovative low-cost power module", IEE PROCEEDINGS: CIRCUITS DEVICES AND SYSTEMS, INSTITUTION OF ELECTRICAL ENGINEERS, STENVENAGE, GB, vol. 148, no. 2, 6 April 2001 (2001-04-06), pages 85 - 88, XP006016213, ISSN: 1350-2409 *
PATENT ABSTRACTS OF JAPAN vol. 006, no. 072 (E - 105) 7 May 1982 (1982-05-07) *

Also Published As

Publication number Publication date
DE10125697A1 (en) 2002-12-05
JP4780268B2 (en) 2011-09-28
WO2002097880A2 (en) 2002-12-05
DE10125697B4 (en) 2019-01-03
JP2004532529A (en) 2004-10-21

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