WO2002082491A3 - Plasma source having supplemental energizer for ion enhancement - Google Patents
Plasma source having supplemental energizer for ion enhancement Download PDFInfo
- Publication number
- WO2002082491A3 WO2002082491A3 PCT/US2002/010335 US0210335W WO02082491A3 WO 2002082491 A3 WO2002082491 A3 WO 2002082491A3 US 0210335 W US0210335 W US 0210335W WO 02082491 A3 WO02082491 A3 WO 02082491A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- supplemental
- plasma
- energizer
- signal generator
- antenna assembly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Electron Sources, Ion Sources (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002256040A AU2002256040A1 (en) | 2001-04-06 | 2002-04-04 | Plasma source having supplemental energizer for ion enhancement |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82805501A | 2001-04-06 | 2001-04-06 | |
US09/828,055 | 2001-04-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002082491A2 WO2002082491A2 (en) | 2002-10-17 |
WO2002082491A3 true WO2002082491A3 (en) | 2002-12-05 |
Family
ID=25250817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/010335 WO2002082491A2 (en) | 2001-04-06 | 2002-04-04 | Plasma source having supplemental energizer for ion enhancement |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2002256040A1 (en) |
TW (1) | TW533752B (en) |
WO (1) | WO2002082491A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050205211A1 (en) * | 2004-03-22 | 2005-09-22 | Vikram Singh | Plasma immersion ion implantion apparatus and method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5324553A (en) * | 1993-04-30 | 1994-06-28 | Energy Conversion Devices, Inc. | Method for the improved microwave deposition of thin films |
US5453305A (en) * | 1991-12-13 | 1995-09-26 | International Business Machines Corporation | Plasma reactor for processing substrates |
US6083363A (en) * | 1997-07-02 | 2000-07-04 | Tokyo Electron Limited | Apparatus and method for uniform, low-damage anisotropic plasma processing |
US6225745B1 (en) * | 1999-12-17 | 2001-05-01 | Axcelis Technologies, Inc. | Dual plasma source for plasma process chamber |
-
2002
- 2002-04-03 TW TW91106701A patent/TW533752B/en active
- 2002-04-04 WO PCT/US2002/010335 patent/WO2002082491A2/en not_active Application Discontinuation
- 2002-04-04 AU AU2002256040A patent/AU2002256040A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5453305A (en) * | 1991-12-13 | 1995-09-26 | International Business Machines Corporation | Plasma reactor for processing substrates |
US5324553A (en) * | 1993-04-30 | 1994-06-28 | Energy Conversion Devices, Inc. | Method for the improved microwave deposition of thin films |
US6083363A (en) * | 1997-07-02 | 2000-07-04 | Tokyo Electron Limited | Apparatus and method for uniform, low-damage anisotropic plasma processing |
US6225745B1 (en) * | 1999-12-17 | 2001-05-01 | Axcelis Technologies, Inc. | Dual plasma source for plasma process chamber |
Also Published As
Publication number | Publication date |
---|---|
TW533752B (en) | 2003-05-21 |
AU2002256040A1 (en) | 2002-10-21 |
WO2002082491A2 (en) | 2002-10-17 |
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