WO2002081224A1 - Micro-injecteur ayant un circuit d'entrainement et son procede de fabrication - Google Patents

Micro-injecteur ayant un circuit d'entrainement et son procede de fabrication Download PDF

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Publication number
WO2002081224A1
WO2002081224A1 PCT/CN2001/001230 CN0101230W WO02081224A1 WO 2002081224 A1 WO2002081224 A1 WO 2002081224A1 CN 0101230 W CN0101230 W CN 0101230W WO 02081224 A1 WO02081224 A1 WO 02081224A1
Authority
WO
WIPO (PCT)
Prior art keywords
driving circuit
layer
micro
bubble
forming
Prior art date
Application number
PCT/CN2001/001230
Other languages
English (en)
Chinese (zh)
Inventor
Chihching Chen
Tsungwei Huang
Original Assignee
Benq Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Benq Corporation filed Critical Benq Corporation
Priority to EP01983414A priority Critical patent/EP1375149B1/fr
Priority to DE60130806T priority patent/DE60130806T2/de
Publication of WO2002081224A1 publication Critical patent/WO2002081224A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/1437—Back shooter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/13—Heads having an integrated circuit

Definitions

  • the present invention relates to a microinject head and a manufacturing method thereof, and more particularly, to a microinjection head with driving circuits and a one-piece molding and a manufacturing method thereof. ⁇ Background technique ⁇
  • liquid bead ejectors are widely used in printing by inkjet printers.
  • liquid bead ejectors also have many other possible applications, such as: Fuel injection systems, Cell sorting, Drug release systems (Drug delivery systems), Direct print lithography, and Micro jet propulsion systems, etc. All these applications have in common that they all need to be reliable, low cost, and Provides high-quality liquid droplet ejectors with high frequency and high spatial resolution. '
  • the main object of the present invention is to provide a micro-jet head with a driving circuit, which is used for simultaneously controlling a plurality of pairs of first bubble generating pieces and second bubble generating pieces, and spraying the fluid inside a plurality of fluid chambers through the spray holes. To achieve the effect of ejecting fluid from a plurality of nozzle holes.
  • Another object of the present invention is to provide a method for manufacturing a micro-jet head with a driving circuit, which is used to integrate a driving circuit and a bubble generating member on the same substrate, the number of steps in the manufacturing process is small, and circuit components and connections are The number of lines is small.
  • the micro-jet head with a driving circuit disclosed in the present invention includes a plurality of fluid chambers, a manifold, a plurality of nozzle holes, a plurality of pairs of bubble generators, and a driving circuit, wherein the bubble generator includes a first bubble generator The component and a second bubble generating component.
  • the manifold is in communication with the fluid cavity and is used for supplying fluid into the fluid cavity; and a plurality of nozzle holes are in communication with the corresponding fluid cavity.
  • the first bubble generating member and the second bubble generating member are disposed near the corresponding spray holes and are located above the corresponding fluid cavity.
  • the first bubble generating element When the corresponding fluid cavity is filled with fluid, the first bubble generating element generates a first bubble in the fluid cavity.
  • the second air bubble generating element As a virtual air valve, after the first air bubble is generated, the second air bubble generating element generates a second air bubble, so that the fluid in the fluid cavity is ejected from the spray hole.
  • the driving circuit includes a plurality of functional elements and is formed on the same substrate as a plurality of pairs of the first bubble generating member and the second bubble generating member.
  • the driving circuit is used to independently transmit signals to separate bubble generators, and use them together. For driving multiple pairs of bubble generators, the function of controlling multiple pairs of bubble generators at the same time is achieved.
  • the method includes the following steps: providing a substrate, forming a driving circuit on the substrate, and the driving circuit including a plurality of functional elements, and then forming a sacrificial layer on the substrate -Without covering the driving circuit or using the driving circuit, the top dielectric material layer is used as a sacrificial layer, and then a low-stress material layer is formed on the sacrificial layer; the substrate and the sacrificial layer are etched to form a Manifold and multiple fluid chambers Communicating to supply fluid into the fluid cavity.
  • a plurality of pairs of the first bubble generating member and the second bubble generating member are formed on the low-stress material layer and communicate with the driving circuit.
  • a plurality of spray holes are formed, which are located in the corresponding first bubble generating member and the second bubble generating member. Between the air bubble generating members, the corresponding fluid chambers are communicated to eject the fluid, so that a levitation spray head having a driving circuit and being integrally formed is completed.
  • FIG. 1 is a perspective structural view of an injection device having a virtual gas valve function in the prior art
  • FIG. 2 is a crusted sectional view of an inkjet head having a driving circuit in the prior art
  • FIG. 9 is a schematic diagram of the complete structure of a micro-jet head with a driving circuit according to the present invention.
  • 10 to 12 are schematic structural diagrams of steps and steps of manufacturing a microjet head with a driving circuit according to another embodiment of the present invention.
  • an array 10 of micro-injectors 12 is shown.
  • the array 10 includes a plurality of adjacent micro-injectors 12.
  • Each micro-injector includes a fluid chamber 14 and a manifold. (Manifold) 16, an injection hole (Orifice) 18, a first heater 20 and a second heater 22.
  • the first heater 20 and the second heater 22 are connected in series to a common heater.
  • the working method of the first heater 20 and the second heater 22 is that the first heater 20 generates a first bubble to isolate the fluid cavity 14 and the nozzle hole 18, and generates a function similar to a gas valve, and the second heater 22 continues A second air bubble is generated, and the second air bubble is used to push the fluid 26 so that the fluid 26 is ejected from the injection hole 18 to achieve the function of ejecting the fluid 26.
  • the fluid chamber 14 is filled with a fluid 26.
  • the fluid 26 may include, but is not limited to, the following fluids: ink, gasoline, oils, chemicals, biomedical solution, water, and the like The choice of fluid depends on the particular application.
  • a driving circuit needs to be added to the micro-jet head to achieve this purpose.
  • a thin oxide layer 101 is formed on the substrate 38, and then a A silicon nitride (SiNx) layer 102 is formed on a thin oxide layer (as shown in FIG. 3).
  • etching is performed (as shown in FIG. 4 and then local oxidation is used for oxidation)
  • An unprotected thin oxide layer 101 to form a field oxide. So far, a dielectric layer 51 (see FIG.
  • the first portion 52 Is the part of the thin oxide layer 101 covered by the silicon nitride layer 102
  • the second part 50 is a field oxide layer formed by a local thermal oxidation method.
  • the field oxide layer can be etched in the subsequent manufacturing process, The fluid cavity 14 is formed.
  • the silicon nitride layer 102 is removed, and a blanket boron implant (Blanket boron implant) is placed on the first portion 52 and the second portion 50 (as shown in FIG. 5) to adjust the driving circuit.
  • a polysilicon gate 105 is formed on the first part 52, and phosphorus ions are doped onto the polysilicon gate 105 to reduce its resistance value. Finally, arsenic ions are doped on the substrate. 38 to form a source 106 and a drain 107 adjacent to the gate. At this point, multiple functional elements can be formed on the substrate 38 (as shown in FIG. 6).
  • a low stress layer 42 such as a silicon nitride (SiNx) material, is deposited on the second portion 50 as an upper layer of the fluid cavity 14.
  • an etching solution of potassium hydroxide (KOH) is etched from the back surface of the substrate 38 to form a manifold 16 as a main flow channel for supplying a fluid, and then the second portion 50 is treated with an etching solution of hydrogen. Fluoric acid (HF) was removed. Perform another etching with an etching solution of potassium hydroxide (KOH) under precise control of the etching time to increase the depth of the fluid cavity 14, and thus, the fluid cavity 14 is connected to the manifold 16 Pass and fill the fluid; pay special attention during this etching step, because the convex corners of the fluid cavity 14 will also be eroded and etched into the shape of an arc.
  • KOH potassium hydroxide
  • a redeposition heater wherein the heater includes a first heater 20 and a second heater 22, and patterning the same; for the first heater 20 and the second heater 22, a preferred material Aluminum 4 denier alloy (Alloys of tantalum and aluminum) and other materials such as platinum (platinum), hafnium boride (Hffi2), etc. can also achieve the same role; In addition, in order to protect the first heater 20 and the second heater 22 The plurality of functional elements are isolated, and a low-temperature oxide layer 45 is further deposited as a protective layer on the entire substrate 38 including the gate 105, the source 106, the drain 107, and the second portion 50.
  • a conductive layer 44 is formed on the first heater 20 and the second heater 22 to conduct the first heater 20, the second heater 22, and the functional elements of the driving circuit, wherein the driving circuit For transmitting signals to separate heaters (first heater 20 and second heater 22) independently, and for driving multiple pairs of heaters (first heater 20 and second heater 22), and so on
  • the driving circuit For transmitting signals to separate heaters (first heater 20 and second heater 22) independently, and for driving multiple pairs of heaters (first heater 20 and second heater 22), and so on
  • the same circuit control effect can be achieved with a smaller number of circuit elements and connecting lines.
  • the first heater 20 and the second heater 22 are connected in series, and the driving circuit controls a plurality of bubble generators in a matrix manner, for example, one column of bubble generators is powered on at the same time, and the other row is It is used to input transmission signals (or data) separately, so as to achieve the function of controlling the first and second heaters 20 and 22 independently.
  • the preferred material of the conductive layer 44 is a metal material such as Alloys of Aluminum-Silicon-Copper, Aluminum, Copper, Gold, or Tungsten; and then, a low temperature is deposited.
  • the oxide layer 46 is provided on the conductive layer 44 as a protective layer.
  • the spray holes 18 are formed between the first heater 20 and the second heater 22. If Lithography allows a line width of 3 ⁇ m, the spray holes 18 can be as small as about 2 ⁇ m, And the pitch (Pitch) between the spray holes 18 and adjacent spray holes can be as small as about 15 ⁇ m.
  • an integrated micro-injector array with a driving circuit can be formed. Not only can the driving circuit and the heater be integrated on the same substrate, but the structure of the entire micro-injecting head can be completed without additionally attaching a nozzle plate.
  • FIGS. 7, 8 and 9 of the above embodiment is to directly contact the second part 50 shown in FIG. 6 to form the fluid cavity 14.
  • a part of the second portion 50 is etched first, and then a sacrificial layer 40 is formed at the position of the etched portion, and then a subsequent manufacturing process is performed on the sacrificial layer 40.
  • FIG. 10 is a manufacturing process following FIG. 6. First, the second part 50 shown in FIG. 6 is partially processed. Etching, and depositing another oxide layer on the substrate 38 that does not cover the driving circuit, as a sacrificial layer 40 of the fluid cavity 14 (refer to FIG. 11), and then depositing a low stress layer 42 ', Is the upper layer of the fluid cavity 14.
  • Figs. 11 and 12 are subsequent to FIG. 10 and are similar to the manufacturing process described in FIGS. 8 and 9.
  • the substrate 38 and the sacrificial layer 40 are etched from the back surface to form the manifold 16 and the fluid cavity 14, and then a first heater 20, a second heater 22, and a low-temperature oxidation layer 45 having a protective effect are deposited.
  • a conductive layer 44 is formed to turn on the first and second heaters 20 and 22 and the driving circuit, and another low-temperature oxide layer 46 is deposited on the conductive layer 44 as a protective layer.
  • a spray hole 18 is formed between the first heater 20 and the second heater 22 by photolithography, so that a micro-injector array with integral driving and a driving circuit is completed.
  • the order of the manufacturing process steps described above can be adjusted according to the situation, and it is not limited to the order described above, and the same micro-liquid bead ejection head with a driving circuit can also be formed.
  • micro-liquid bead jetting head that can be applied to technologies such as inkjet printing
  • micro-liquid bead ejection head which integrates the driving circuit and the heater on the same substrate, and does not need to attach a nozzle plate to complete the overall crusting;

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Micro-Organisms Or Cultivation Processes Thereof (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Reciprocating Pumps (AREA)

Abstract

L'invention porte sur un micro-injecteur ayant un circuit d'entraînement et son procédé de fabrication. Le micro-injecteur utilise des bulles tenant lieu de soupape virtuelle afin d'évacuer le milieu fluide, à l'aide d'un déflecteur, de multiples chambres de fluide, de multiples paires d'un premier élément de génération de bulles et d'un second élément de génération de bulles, de multiples buses et un circuit d'entraînement qui commande les multiples paires du premier élément de génération de bulles et du second élément de génération de bulles simultanément afin d'évacuer le fluide qui se trouve dans la chambre de fluide correspondante en provenance de la buse correspondante, et ce afin d'atteindre l'effet pour évacuer le fluide. De plus, en raison de l'intégration du circuit d'entraînement avec les éléments de génération de bulles dans le même substrat, il est possible de réduire le nombre d'opérations nécessaires et d'obtenir une structure nécessitant moins d'unités de circuit et moins de lignes d'interconnexion.
PCT/CN2001/001230 2001-04-03 2001-08-20 Micro-injecteur ayant un circuit d'entrainement et son procede de fabrication WO2002081224A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP01983414A EP1375149B1 (fr) 2001-04-03 2001-08-20 Micro-injecteur ayant un circuit d'entrainement et son procede de fabrication
DE60130806T DE60130806T2 (de) 2001-04-03 2001-08-20 Mikroinjektionsvorrichtung mit steuerschaltung und verfahren zur herstellung derselben

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN01112357.5 2001-04-03
CNB011123575A CN1165428C (zh) 2001-04-03 2001-04-03 具有驱动电路的微喷射头

Publications (1)

Publication Number Publication Date
WO2002081224A1 true WO2002081224A1 (fr) 2002-10-17

Family

ID=4659270

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2001/001230 WO2002081224A1 (fr) 2001-04-03 2001-08-20 Micro-injecteur ayant un circuit d'entrainement et son procede de fabrication

Country Status (5)

Country Link
EP (1) EP1375149B1 (fr)
CN (1) CN1165428C (fr)
AT (1) ATE374693T1 (fr)
DE (1) DE60130806T2 (fr)
WO (1) WO2002081224A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1317736C (zh) * 2003-08-14 2007-05-23 明基电通股份有限公司 单片流体喷射装置的制作方法
EP2533963A4 (fr) * 2010-02-11 2015-01-21 Yung-Chieh Tan Systèmes et procédés de fabrication de microstructures
TWI763992B (zh) * 2019-05-06 2022-05-11 萬潤科技股份有限公司 液材擠出裝置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695853A (en) * 1986-12-12 1987-09-22 Hewlett-Packard Company Thin film vertical resistor devices for a thermal ink jet printhead and methods of manufacture
EP0317171A2 (fr) * 1987-11-13 1989-05-24 Hewlett-Packard Company Système d'injection intégral à couches minces pour une tête imprimante à projection thermique et méthodes d'opération
US4947192A (en) * 1988-03-07 1990-08-07 Xerox Corporation Monolithic silicon integrated circuit chip for a thermal ink jet printer
EP0493897A2 (fr) * 1991-01-03 1992-07-08 Hewlett-Packard Company Tête d'impression thermique par jet d'encre avec circuit d'actionnement et son procédé de fabrication
US5216447A (en) * 1989-01-13 1993-06-01 Canon Kabushiki Kaisha Recording head
US6102530A (en) * 1998-01-23 2000-08-15 Kim; Chang-Jin Apparatus and method for using bubble as virtual valve in microinjector to eject fluid

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695853A (en) * 1986-12-12 1987-09-22 Hewlett-Packard Company Thin film vertical resistor devices for a thermal ink jet printhead and methods of manufacture
EP0317171A2 (fr) * 1987-11-13 1989-05-24 Hewlett-Packard Company Système d'injection intégral à couches minces pour une tête imprimante à projection thermique et méthodes d'opération
US4947192A (en) * 1988-03-07 1990-08-07 Xerox Corporation Monolithic silicon integrated circuit chip for a thermal ink jet printer
US5216447A (en) * 1989-01-13 1993-06-01 Canon Kabushiki Kaisha Recording head
EP0493897A2 (fr) * 1991-01-03 1992-07-08 Hewlett-Packard Company Tête d'impression thermique par jet d'encre avec circuit d'actionnement et son procédé de fabrication
US6102530A (en) * 1998-01-23 2000-08-15 Kim; Chang-Jin Apparatus and method for using bubble as virtual valve in microinjector to eject fluid

Also Published As

Publication number Publication date
CN1165428C (zh) 2004-09-08
EP1375149A1 (fr) 2004-01-02
EP1375149B1 (fr) 2007-10-03
DE60130806D1 (de) 2007-11-15
DE60130806T2 (de) 2008-07-03
CN1377734A (zh) 2002-11-06
EP1375149A4 (fr) 2005-05-04
ATE374693T1 (de) 2007-10-15

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