WO2002076641A2

WO2002076641A2 - Cleaning apparatus and cleaning method

Info

Publication number: WO2002076641A2
Application number: PCT/EP2002/002458
Authority: WO
Inventors: Olivier Letessier; Jean-Marc Girard; Akinobu Nasu; Mindi Xu
Original assignee: L'air Liquide Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude
Priority date: 2001-01-22
Filing date: 2002-01-22
Publication date: 2002-10-03
Also published as: JP2002224630A; WO2002076641A3; TW521006B

Abstract

To provide a cleaning apparatus and a cleaning method that require a smaller conduit population and less space and as a result cost less and provide an improved operability. A cleaning apparatus (30) contains a gastight container (32) for holding solvent; the interior of this container is partitioned in a gastight manner by a partition wall (34) into a feed compartment (36) that holds fresh solvent and a recovery compartment (38) that holds spent solvent. The partition wall (34) is slideably supported by a sliding support member (42) in such a manner that the pressure within the feed compartment (36) becomes equalized with the pressure within the recovery compartment (38). The feed compartment (36) is connected to a manifold (12) by a feed conduit (44) and the recovery compartment (38) is connected to the manifold (12) by a recovery conduit (46). A gas introduction conduit (52) is connected to the feed conduit (44) in order to introduce pressurization gas from a pressurized gas source (54). An exhaust conduit (62) is connected to the recovery conduit (46) in order to conduct vacuum exhaust using a vacuum exhaust source (64).

Description

Cleaning apparatus and cleaning method

Field of the Invention

This invention relates to a cleaning apparatus and a cleaning method. More specifically, this invention relates to technology for the cleaning fluid-based cleaning of the interior of a chamber or compartment tasked with the handling of chemical reagents.

Description of the Prior Art The process equipment used to fabricate semiconductor devices and electronic devices and instruments frequently employs process liquids that are difficult-to-handle chemical reagents whose residues are difficult to remove simply by a gas purge. Taking as an example the PET (pentaethoxytantalum) that is used to form high dielectric films, upon contact with air this reagent reacts with O₂ and H₂O to form a gel- like material. Once PET has passed through, for example, a manifold or vaporizer, the interior compartments thereof cannot be satisfactorily treated by purging and cleaning with just a simple gas purge cycle (repetitive pressurization with gas and vacuum exhaust) when it is desired to carry out maintenance or replace or change the reagent. A known technology that addresses this problem comprises the use, in addition to the gas purge, of a solvent as a cleaning fluid in order to achieve good purging and cleaning of the target compartment.

An apparatus that employs this particular technology is disclosed in United States Patent 5,964,230. The characteristic feature of this apparatus, which carries out solvent-based purging and cleaning of a chemical-handling manifold, lies in the introduction of solvent into the manifold through a nozzle disposed coaxially with respect to the manifold. Dedicated containers are provided, respectively, for solvent feed and solvent recovery: fresh solvent is fed from the feed container to the manifold while spent solvent that has been used to clean the manifold is recovered to the recovery container.

Problems to Be Solved by the Invention

Prior art cleaning apparatuses of the type that employs solvent to clean chemical-handling compartments, as typified by the apparatus disclosed in United States Patent 5,964,230, contain two containers to effect solvent feed and solvent recovery. Each of these containers is connected to the compartment to be cleaned through its own dedicated conduit structure and is used exclusively for solvent feed or solvent recovery. This configuration requires a large conduit population, both in the cleaning apparatus itself and between the cleaning apparatus and the compartment to be cleaned, and also requires that a large area be dedicated to the cleaning apparatus. These requirements in turn drive up the cost of the cleaning apparatus and impair its operability.

This invention was developed in view of the problems described above for the prior art. With respect to cleaning apparatuses that clean the interior of a target compartment using a cleaning fluid, the object of this invention is to reduce the cost of the apparatus and improve its operability by reducing the conduit population required by the apparatus and reducing the area occupied by the apparatus. Means Solving the Problems

The first aspect of this invention is a cleaning apparatus for cleaning the interior of a target compartment with a cleaning fluid, that is characteristically provided with a gastight container for holding said cleaning fluid, a partition wall that partitions the interior of said container in a gastight manner into a feed compartment that holds fresh cleaning fluid and a recovery compartment that holds spent cleaning fluid, wherein said partition wall can function to equalize the pressure in said feed compartment with the pressure in said recovery compartment, a feed conduit that contains a first valve and that is disposed so as to connect said feed compartment to the aforesaid target compartment, a recovery conduit that contains a second valve and that is disposed so as to connect said recovery compartment to the aforesaid target compartment, a gas introduction conduit that introduces pressurization gas and connects to said feed conduit between said first valve and said target compartment, and an exhaust conduit that carries out vacuum exhaust and is connected to said feed conduit between said first valve and said target compartment or is connected to said recovery conduit between said second valve and said target compartment.

The second aspect of this invention is characterized in that the partition wall of the cleaning apparatus of the first aspect comprises a rigid plate and is supported in such a manner that it can slide along the inner surface of the container.

The third aspect of this invention is characterized in that the partition wall of the cleaning apparatus of the first aspect comprises a flexible bag that inflates and deflates in response to the pressures within said feed compartment and said recovery compartment.

The fourth aspect of this invention is characterized by the additional installation in an apparatus according to any of the first through third aspects of a vent mechanism that connects to said recovery compartment or that connects to said recovery conduit between said recovery compartment and said second valve.

The fifth aspect of this invention is characterized by the additional installation in an apparatus according to any of the first to fourth aspects of a separate pressurization gas introduction conduit that is connected to said recovery compartment or said recovery conduit.

The sixth aspect of this invention is a cleaning method that uses a cleaning apparatus in accordance with the first aspect to clean a target compartment and that characteristically comprises a preparation process in which the interior of the container is pressurized by pressurization gas and the contents of the target compartment are discharged, and in which subsequent thereto, with said first and second valves closed, the pressure of the interior of the target compartment is reduced by evacuation through the vacuum exhaust conduit, a feed and cleaning process, which is carried out after said preparation process, in which, with said first valve open and said second valve closed, fresh cleaning fluid is fed, utilizing the pressure difference between the container and the target compartment, from said feed compartment through the feed conduit into the target compartment and the target compartment is thereby cleaned, and a recovery process, which is carried out after said feed and cleaning process, in which, with said first valve closed and said second valve open, pressurization gas is introduced from said gas introduction conduit and the spent cleaning fluid is recovered from the target compartment through the recovery conduit and into the recovery compartment.

The seventh aspect of this invention is characterized in that the container is pressurized in the preparation process of the method of the sixth aspect by the introduction of pressurization gas from the gas introduction conduit with said first valve closed and said second valve open. The eight aspect of this invention is characterized in that the container is pressurized in the preparation process of the method of the sixth aspect by the introduction of pressurization gas from a separate pressurization gas introduction conduit that is connected to said recovery compartment or recovery conduit.

The ninth aspect of this invention is characterized by the additional provision in a method in accordance with any of the sixth through eighth aspects, said provision occurring after the feed and cleaning process and before or during the recovery process, of a process comprising the opening of a vent mechanism that is connected to the recovery compartment or to the recovery conduit between the recovery compartment and the second valve. The embodiments of this invention explore a variety of executions of this invention, and various embodiments of this invention can be derived by suitable combination of the plural number of disclosed constituent elements. For example, when an embodiment of the invention has been derived in which some constituent elements have been omitted from the overall set of constituent elements presented for the embodiment, these omitted elements can be suitably fulfilled by conventional well- known technologies in the actual working of the derived inventive embodiment.

Embodiments of the Invention

Embodiments of this invention are described below with reference to the drawings appended herewith. In the description that follows, constituent elements that have approximately the same structure and function are assigned a common reference symbol and their description will be repeated only when necessary. Figure 1 contains a schematic drawing of the conduit layout of a cleaning apparatus 30 that is an embodiment of the present invention. This embodiment shows the inventive apparatus connected to the manifold 12 (target compartment) of a semiconductor process system.

This manifold 12 is connected through a valve V1 -equipped main conduit 14 to a tank 16 that stores a chemical reagent (process liquid). The manifold 12 is also connected through a valve V2-equipped branch conduit 18 to a process compartment 20 of the semiconductor process system. The manifold 12 is additionally connected to other process compartments through separate branch lines, but these features are not shown for the sake of convenience. A lower nozzle 22 and an upper nozzle 24 are connected to the manifold 12 for purposes of cleaning; these nozzles communicate with the space within the manifold 12 through which the chemical reagent (process liquid) passes. A flange-equipped valve V3 is disposed in the lower nozzle 22 and a flange-equipped valve V4 is disposed in the upper nozzle 24 to enable detachable connection with the corresponding pipework of the cleaning apparatus 30.

The cleaning apparatus 30 includes a gastight container 32 — made of a rigid and corrosion-resistant material — for holding solvent, i.e., the cleaning fluid. This container 32 is partitioned in a gastight manner by the partition wall 34, itself made of a rigid and corrosion-resistant material, into a feed compartment 36 that holds fresh solvent and a recovery compartment 38 that holds spent solvent. The partition wall 34 is supported by the sliding support member 42, comprising, for example, an O-ring and piston ring, and is supported in such a manner that it can slide along the inner surface of the container 32. In other words, the partition wall 34 can function to bring about continuous equalization of the pressure within the feed compartment 36 with the pressure within the recovery compartment 38.

The feed compartment 36 is connected through a valve V11 -equipped feed conduit 44 to the lower nozzle 22 of the manifold 12. A flange F11 is disposed at the end of the feed conduit 44 in order to effect detachable attachment to the flange of the lower nozzle 22. The recovery compartment 38 is connected through a valve V12- equipped recovery conduit 46 to the upper nozzle 24 of the manifold 12. A flange F12 is disposed at the end of the recovery conduit 46 in order to effect detachable attachment to the flange of the upper nozzle 24. A gas introduction conduit 52 for the introduction of pressurization gas is connected to the feed conduit 44 between the valve V11 and the flange F11. In order to obtain a feed of a pressurized inert gas such as Ar, the gas introduction conduit 52 is connected to the outlet nozzle 56 of a pressurized gas source 54 that is disposed on the plant equipment side that includes the semiconductor process system. A flange- equipped valve V21 is disposed on the outlet nozzle 56 to enable detachable connection with the corresponding pipework of the cleaning apparatus 30. A flange F13 is disposed at the end of the gas introduction conduit 52 to enable detachable attachment to the flange of the outlet nozzle 56.

An exhaust conduit 62 for effecting vacuum exhaust is connected to the recovery conduit 46 between the valve V12 and the flange F12. This exhaust conduit 62 is connected to the suction nozzle 66 of a vacuum exhaust source 64 that includes a vacuum pump and that is disposed on the plant equipment side that includes the semiconductor process system. A flange-equipped valve V22 is disposed on the suction nozzle 66 to enable detachable connection with the corresponding pipework of the cleaning apparatus 30. A flange F14 is disposed at the end of the exhaust conduit 62 to enable detachable attachment to the flange of the suction nozzle 66. As will be explained below, the exhaust conduit 62 may be connected to the feed conduit 44 between the valve V11 and the flange F11 rather than being connected to the recovery conduit 46.

A vent mechanism 72 comprising a valve V13-equipped vent conduit 74 is connected to the top of the container 32, i.e., to the recovery compartment 38. This vent conduit 74 is connected as necessary or desired to a suitable solvent recovery member (not shown). In addition, the vent mechanism 72 may be connected to the recovery conduit 46 between the recovery compartment 38 and the flange F12 rather than being connected to the recovery compartment 38. An embodiment of the inventive method for cleaning the interior of the manifold 12 is explained in the following; this embodiment is executed using the cleaning apparatus illustrated in Figure 1. Figure 7 contains a flowchart of the sequence used in this cleaning method. During operation of the semiconductor process system that contains the manifold 12, the cleaning apparatus 30 may reside disconnected from the manifold 12 or may reside connected to the manifold 12 but in an idle mode. When it subsequently becomes necessary to clean the interior of the manifold 12 during maintenance or reagent replacement or change, the operation of the semiconductor process system is stopped, i.e., the feed of chemical reagent (process liquid) from the tank 16 is halted and the process in the process compartment 20 is ended, and use of the cleaning apparatus 30 is initiated.

Substantially only fresh cleaning fluid, i.e., solvent, is held in the container 32 when use of the cleaning apparatus 30 is initiated. The feed compartment 36 is therefore full and the recovery compartment 38 is empty. The slideable partition wall 34 will as a consequence be raised to its topmost position Tp as shown by the dashed line in Figure 1 (Bp in Figure 1 denotes the bottomost position of the partition wall 34). Designating this condition as the starting condition, the cleaning process then proceeds according to the sequence explained below. It is assumed in the explanation that follows that operations are begun with all of the valves V1 to V22 initially set in a closed position.

The manifold 12 is first emptied (process S1). Th is process is carried out by bringing the valves V1 , V3, and V21 into their open positions (the valve V2 is closed). In this configuration, pressurization gas is introduced into the manifold 12 from the pressurized gas source 54 through the gas introduction conduit 52 and the feed conduit 44. Utilizing the pressure of the pressurization gas, the chemical reagent (process liquid) in the manifold 12 is thereby returned to the tank 16 or is transported to a suitable process liquid recovery member (not shown) through a drain conduit situated near the tank 16. Once the manifold 12 has been emptied the valve V1 is closed and the back-transport of the process liquid is then complete. The interior of the container 32 is then pressurized (process S2). This process is carried out by bringing the valves V3, V4, V12, and V21 into their open positions (the valve V11 is closed). In this configuration pressurization gas is introduced from the pressurized gas source 54 through the gas introduction conduit 52, feed conduit 44, manifold 12, and recovery conduit 46 into the recovery compartment 38. This serves to pressurize the interior of the container 32 from the side of the recovery compartment 38 using the pressure of the pressurization gas. The valves V12 and V21 are closed once the interior of the container 32 has been raised to the desired target pressure, thus ending pressurization of the interior of the container 32. Since the partition wall 34 can slide in response to pressure, the pressure within the feed compartment 36 and the pressure within the recovery compartment 38 are equalized during the pressurization process. Since pressurization of the container 32 is carried out via the manifold 12, the pressure within the manifold 12 is also equalized with the pressure in the container 32.

The interior of the manifold 12 is then depressurized (process S3). Th is process is carried out by bringing the valves V3, V4, and V22 into their open positions (the valves V11 and V12 are closed). In this configuration the interior of the manifold 12 is vacuum exhausted by the vacuum exhaust source 64 via the exhaust conduit 62 and recovery conduit 46. This serves to reduce the pressure within the manifold 12, which had previously been equalized with the pressure within the container 32, and produce a pressure difference of sufficient magnitude between the interior of the container 32 and the interior of the manifold 12. The valves V4 and V22 are closed once the interior of the manifold 12 has been evacuated to the desired target pressure, thus ending depressurization of the interior of the manifold 12. Fresh solvent is then fed into the manifold 12 (process S4).

This process is carried out by bringing the valves V3 and V11 into their open positions (the valve V4 is closed), thereby creating communication between the interior of the feed compartment 36 and the interior of the manifold 12. Fresh solvent is thereby transported from the feed compartment 36 through the feed conduit 44 into the manifold 12 based on the pressure difference between the interior of the container 32 and the interior of the manifold 12. The valve V11 is closed once the interior of the manifold 12 has been filled, which ends solvent feed to the interior of the manifold 12. The interior of the manifold 12 is then allowed to stand for some period of time in this solvent-filled condition in order for the solvent to decompose the residues within the manifold 12. In other words, the solvent recovery process, infra, is not begun until a prescribed treatment time has elapsed.

The interior of the container 32 is then depressurized (process S5). ln this process the valve V13 in the vent mechanism 72 is opened (the valves V11 and V12 are closed) and the pressure in the container 32 is released through the vent conduit 74. This serves to drop the pressure within the container 32, which at this point would still be at a relatively high value, and thereby to improve the operational efficiency in the ensuing solvent recovery process. Once the interior of the container 32 has been depressurized to the prescribed target pressure, the valve V13 may either be closed or may be left open during solvent recovery in the next process.

Pressure release at the container 32 can also be carried out during the time interval in which the interior of the manifold 12 is being held in the solvent-filled state. Alternatively, pressure release at the container 32 can be effected using the vacuum exhaust source 64 rather than the vent mechanism 72. In another alternative, pressure release at the container 32 need not be carried out if the pressure within the container 32 is sufficiently low upon completion of solvent feed to the manifold 12.

The spent solvent is then recovered to the container 32 (process S6). In this process the valves V3, V4, V12, and V21 are brought into their open positions (the valve V11 is closed), thereby effecting communication between the interior of the recovery compartment 38 and the interior of the manifold 12. In this configuration pressurization gas is introduced from the pressurized gas source 54 through the gas introduction conduit 52 and the feed conduit 44 into the manifold 12. This serves, utilizing the pressure of the pressurization gas, to transport the spent solvent from the interior of the manifold 12 through the recovery conduit 46 and into the recovery compartment 38. The excess pressurization gas can be discharged through the vent conduit 74 when the valve V13 on the vent mechanism 72 has been left open. Solvent recovery to the container 32 is complete once the interior of the manifold 12 has been emptied.

The decision is then made as to whether cleaning will be repeated (process S7).

When the interior of the manifold 12 is not to be recleaned, the valves V3, V4, V12, and V21 are closed once the interior of the manifold 12 has been emptied, which ends the cleaning treatment within the manifold 12. In contrast, the operation is returned to process S2 when the interior of the manifold 12 is to be cleaned again. When cleaning is to be repeated, the valves V3, V4, V12, and V21 are not closed when the spent solvent recovery process S6 is ended; rather, these valves are left open (the valve V11 is closed) and the introduction of pressurization gas is continued. The valve V13 in the vent mechanism 72 must, however, be closed at this point. This configuration results in pressurization of the interior of the container 32 from the recovery compartment 38 side using the pressure of the pressurization gas.

Operations are then continued according to the processes S2 through S7 already described above. The cleaning treatment within the manifold 12 can be carried out the necessary number of times by repeating the sequence of processes S2 to S7 any number of times.

Figure 2 contains a schematic drawing that shows the conduit layout of a cleaning apparatus 30B that is another embodiment of this invention. The cleaning apparatus 30B is shown connected to the manifold 12.

In the cleaning apparatus 30B of this embodiment, the feed compartment 36 is connected via the feed conduit 44 to the upper nozzle 22' of the manifold 12 while the recovery compartment 38 is connected via the recovery conduit 46 to the lower nozzle 24^' of the manifold 12. In addition, the exhaust conduit 62 for effecting vacuum exhaust is connected to the feed conduit 44 between the valve V11 and the flange F11 rather than being connected to the recovery conduit 46. The exhaust conduit 62 is connected to the suction nozzle 66 of the vacuum exhaust source 64 that is disposed on the plant equipment side.

The cleaning apparatus 30B with the above-described structure can also be used to clean the interior of the manifold 12 through application of the processes S1 to S7 described with reference to the flowchart in Figure 7. Derivation of the operating procedure with cleaning apparatus 30B, however, requires substitution in the description by making the operations at the nozzles 22 and 24 and the valves V3 and V4 in Figure 1 correspond, respectively, to the operations at the nozzles 22' and 24^' and the valves V3^' and V4^' in Figure 2.

Figure 3 contains a schematic drawing that shows the conduit layout of a cleaning apparatus 30C that is yet another embodiment of this invention. The cleaning apparatus 30C is shown connected to the manifold 12.

In the cleaning apparatus 30C of this embodiment, a second gas introduction conduit 82 for the introduction of pressurization gas is connected to the recovery conduit 46 between the container 32 and the flange F12. In order to obtain a feed of a pressurized inert gas such as Ar, the gas introduction conduit 82 is connected to the outlet nozzle 86 of a pressurized gas source 84 that is disposed on the plant equipment side that includes the semiconductor process system. A flange-equipped valve V23 is disposed on the outlet nozzle 86 to enable detachable connection to the corresponding pipework of the cleaning apparatus 30C. A flange F15 is disposed at the end of the gas introduction conduit 82 to enable detachable attachment to the flange of the outlet nozzle 86.

Figure 4 contains a schematic drawing that shows the conduit layout of a cleaning apparatus 30D that is another embodiment of this invention. The cleaning apparatus 30D is shown connected to the manifold 12.

The second gas introduction conduit 82 in the cleaning apparatus 30D of this embodiment is directly connected to the top, i.e., the recovery compartment 38, of the container 32 rather than being connected to the recovery conduit 46. The gas introduction conduit 82 is also connected to the outlet nozzle 86 of a pressurized gas source 84 disposed on the plant equipment side.

The cleaning apparatuses 30C and 30D with the structures described in Figures 3 and 4 can also be used to clean the interior of the manifold 12 through application of the processes S1 to S7 described with reference to the flowchart in Figure 7. In the apparatuses under consideration, however, pressurization of the interior of the container 32 (corresponding to process S2, supra) is carried out using the feed system attached to the gas introduction conduit 82 rather than the feed system attached to the gas introduction conduit 52. In other words, with the valves V12 and V23 brought into their open positions (the valve V4 is closed), pressurization gas is introduced from the pressurized gas source 84 through the second gas introduction conduit 82 into the interior of the recovery compartment 38. This embodiment provides a high degree of freedom for the timing of pressurization of the interior of the container 32 since the interior of the container 32 can be pressurized by the gas introduction conduit 82 without passage through the manifold 12. Figure 5 contains a schematic drawing that shows the conduit layout of a cleaning apparatus 30E that is yet another embodiment of this invention. The cleaning apparatus 30E is shown together with the manifold 12.

Based on the use of the flanges F11 to F15, the apparatuses 30 to 30D shown in Figures 1 to 4 are constructed as independent apparatuses that are attachable to and detachable from the manifold 12. The cleaning apparatus 30E of the embodiment illustrated in Figure 5, however, is constructed as an attachment that is permanently mounted on the manifold 12. In order to enable a replenishing feed of fresh solvent, feed pump 94 and solvent tank 96 are connected to the feed compartment 36 through a valve V31 -equipped solvent replenishing conduit 92. A valve V32-equipped drain conduit 98 is also connected to the recovery compartment 38 to enable discharge of spent solvent. The drain 98, as necessary or desired, is connected to a suitable solvent recovery member (not shown).

In the case of the cleaning apparatus 30E with the above-described structure, the container 32 can be replenished with solvent and solvent can be discharged therefrom without disengagement from the manifold 12. Moreover, replenishment with fresh solvent and discharge of spent solvent can be carried out simultaneously through the operation of the feed pump 94. That is, with the valves V31 and V32 brought into their open positions, operation of the feed pump 94 causes the feed compartment 36 to be replenished with fresh solvent from the solvent tank 96. During this operation, spent solvent in the recovery compartment 38 is spontaneously discharged through the drain conduit 98 due to the upward sliding movement of the partition wall 34 during equalization of the pressure within the feed compartment 36 and the pressure within the recovery compartment 38.

Figure 6 contains a drawing that illustrates the container 32 of a cleaning apparatus 30F that is another embodiment of this invention. In the case of the cleaning apparatuses 30 to 30E illustrated in Figures 1 to 5, the interior of the container 32 is partitioned in a gastight manner into the feed compartment 36 and recovery compartment 38 by a rigid partition wall 34. In contrast to this, in the case of the cleaning apparatus 30F of the embodiment of Figure 6 the interior of the container 32 is partitioned in a gastight manner into the feed compartment 36 and recovery compartment 38 by a flexible and corrosion-resistant synthetic resin bag 100. The interior of the bag 100 forms the recovery compartment 38 while the feed compartment 36 is formed between the outer surface of the bag 100 and the inner surface of the container 32. The bag 100 inflates and deflates in response to the pressures within the feed compartment 36 and recovery compartment 38. In other words, the flexible synthetic resin wall that forms the bag 100 functions as a mobile partition wall that demarcates the feed compartment 36 and the recovery compartment 38.

The interior of the manifold 12 can be cleaned using the cleaning apparatus 30F with the above-described structure again employing the processes S1 to S7 described above with reference to Figure 7. When the interior of the container 32 is filled with fresh cleaning fluid (solvent), the bag 100 assumes a shrunken condition as shown by the solid line in Figure 6. As the cleaning treatment proceeds, the bag 100 expands to assume the condition shown by the dashed line in Figure 6 as the amount of fresh solvent declines and spent solvent is recovered.

In the cleaning apparatuses 30 to 30E illustrated in Figures 1 to 5, the partition wall 34 is made mobile in response to the pressures in the feed compartment 36 and recovery compartment 38 by virtue of being supported by the sliding support member 42, comprising, for example, an O-ring and piston ring. In the case of the cleaning apparatus 30F illustrated in Figure 6, however, the partition wall is made mobile in response to the pressures in the feed compartment 36 and recovery compartment 38 by virtue of being constructed from the flexible bag 100. The pressure-responsive partition wall can also be constructed based on the principles of known diaphragms and bellows.

As described above, the cleaning apparatuses 30 to 30D illustrated in Figures 1 to 4 are constructed as independent apparatuses that can be transported to a site when needed and connected to the cleaning target. The cleaning apparatus 30E illustrated in Figure 5, on the other hand, is constructed as an attachment that is permanently mounted on the cleaning target. The bag 100-equipped cleaning apparatus 30F shown in Figure 6 can itself be implemented as either an independent apparatus or an attachment.

While various modifications and alterations within the technical sphere of the concept of this invention can be devised by the individual skilled in the art, it should be understood that these modifications and alterations also fall within the scope of this invention. Advantageous Effects of the Invention

As has been explained hereinabove, the inventive cleaning apparatus for cleaning the interior of a target compartment with a cleaning fluid requires a smaller conduit population and less space and as a result costs less and provides an improved operability.

Brief Description of the Drawings

Figure 1 contains a schematic drawing of the conduit layout of a cleaning apparatus that is an embodiment of the present invention. The cleaning apparatus is shown connected to the manifold (target compartment) of a semiconductor process system.

Figure 2 contains a schematic drawing of the conduit layout of a cleaning apparatus that is another embodiment of the present invention. The cleaning apparatus is shown connected to a manifold. Figure 3 contains a schematic drawing of the conduit layout of a cleaning apparatus that is another embodiment of the present invention. The cleaning apparatus is shown connected to a manifold.

Figure 4 contains a schematic drawing of the conduit layout of a cleaning apparatus that is yet another embodiment of the present invention. The cleaning apparatus is shown connected to a manifold.

Figure 5 contains a schematic drawing of the conduit layout of a cleaning apparatus that is still another embodiment of the present invention. The cleaning apparatus is shown together with a manifold. Figure 6 contains a drawing that illustrates the container of a cleaning apparatus that is another embodiment of the present invention.

Figure 7 contains a flowchart that illustrates the sequence of a method for cleaning the interior of a manifold; this method is carried out using the cleaning apparatus illustrated in Figure 1.

Claims

1. Cleaning apparatus for cleaning the interior of a target compartment with a cleaning fluid, said cleaning apparatus being characteristically provided with a gastight container for holding said cleaning fluid, a partition wall that partitions the interior of said container in a gastight manner into a feed compartment that holds fresh cleaning fluid and a recovery compartment that holds spent cleaning fluid, wherein said partition wall can function to equalize the pressure in said feed compartment with the pressure in said recovery compartment, a feed conduit that contains a first valve and that is disposed so as to connect said feed compartment to the aforesaid target compartment, a recovery conduit that contains a second valve and that is disposed so as to connect said recovery compartment to the aforesaid target compartment, a gas introduction conduit that introduces pressurization gas and connects to said feed conduit between said first valve and said target compartment, and an exhaust conduit that carries out vacuum exhaust and is connected to said feed conduit between said first valve and said target compartment or is connected to said recovery conduit between said second valve and said target compartment.

2. The cleaning apparatus of claim 1 , characterized in that said partition wall comprises a rigid plate and is supported in such a manner that it can slide along the inner surface of the container.

3. The cleaning apparatus of claim 1 , characterized in that said partition wall comprises a flexible bag that inflates and deflates in response to the pressures within said feed compartment and said recovery compartment.

4. Cleaning apparatus according to any of claims 1 through 3, that is characteristically also provided with a vent mechanism that connects to said recovery compartment or that connects to said recovery conduit between said recovery compartment and said second valve.

5. Cleaning apparatus according to any of claims 1 through 4, that is characteristically also provided with a separate pressurization gas introduction conduit that is connected to said recovery compartment or said recovery conduit.

6. Cleaning method that uses the cleaning apparatus of claim 1 to clean said target compartment and that characteristically comprises a preparation process in which the interior of the container is pressurized by pressurization gas and the contents of the target compartment are discharged, and in which subsequent thereto, with said first and second valves closed, the pressure of the interior of the target compartment is reduced by evacuation through the vacuum exhaust conduit, a feed and cleaning process, which is carried out after said preparation process, in which, with said first valve open and said second valve closed, fresh cleaning fluid is fed, utilizing the pressure difference between the container and the target compartment, from said feed compartment through the feed conduit into the target compartment and the target compartment is thereby cleaned, and a recovery process, which is carried out after said feed and cleaning process, in which, with said first valve closed and said second valve open, pressurization gas is introduced from said gas introduction conduit and the spent cleaning fluid is recovered from the target compartment through the recovery conduit and into the recovery compartment.

7. The cleaning method of claim 6, characterized in that in said preparation process the container is pressurized by the introduction of pressurization gas from the gas introduction conduit with said first valve closed and said second valve open.

8. The cleaning method of claim 6, characterized in that in said preparation process the container is pressurized by the introduction of pressurization gas from a separate pressurization gas introduction conduit that is connected to said recovery compartment or recovery conduit.

9. The cleaning method of any of claims 6 through 8, that is characteristically also provided, after said feed and cleaning process and before or during the recovery process, with a process comprising the opening of a vent mechanism that is connected to the recovery compartment or to the recovery conduit between the recovery compartment and the second valve.