WO2002071825A2 - Electrical component - Google Patents

Electrical component Download PDF

Info

Publication number
WO2002071825A2
WO2002071825A2 PCT/DE2002/000756 DE0200756W WO02071825A2 WO 2002071825 A2 WO2002071825 A2 WO 2002071825A2 DE 0200756 W DE0200756 W DE 0200756W WO 02071825 A2 WO02071825 A2 WO 02071825A2
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic
base body
component according
layers
protective layer
Prior art date
Application number
PCT/DE2002/000756
Other languages
German (de)
French (fr)
Other versions
WO2002071825A3 (en
Inventor
Axel Pecina
Original Assignee
Epcos Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag filed Critical Epcos Ag
Publication of WO2002071825A2 publication Critical patent/WO2002071825A2/en
Publication of WO2002071825A3 publication Critical patent/WO2002071825A3/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/016Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on manganites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00Layered products essentially comprising ceramics, e.g. refractory products
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102Varistor boundary, e.g. surface layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/02Ceramics
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3217Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3262Manganese oxides, manganates, rhenium oxides or oxide-forming salts thereof, e.g. MnO
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3275Cobalt oxides, cobaltates or cobaltites or oxide forming salts thereof, e.g. bismuth cobaltate, zinc cobaltite
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3284Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3294Antimony oxides, antimonates, antimonites or oxide forming salts thereof, indium antimonate
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3298Bismuth oxides, bismuthates or oxide forming salts thereof, e.g. zinc bismuthate
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/76Crystal structural characteristics, e.g. symmetry
    • C04B2235/762Cubic symmetry, e.g. beta-SiC
    • C04B2235/763Spinel structure AB2O4
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic

Definitions

  • the invention relates to an electrical component with a base body that contains a ceramic material and with at least two contact layers provided on the surface of the base body, in which the part of the surface of the base body that is free of contact layers is at least partially covered by a protective layer.
  • Components of the type mentioned at the outset are known which are used as varistors, which have high thermal stability and whose base body contains a mixture of metal oxides. Components of this type are usually soldered on boards in surface mounting and serve to protect various electronic components from voltage in electrical devices and electrical engineering devices.
  • SMD capability surface mounting of the components is achieved by contacting the base body by baking a silver paste on the base body and then galvanizing the silver paste in a nickel and tin bath.
  • the outermost tin contact layer guarantees the SMD capability.
  • the contact layers are applied in usually acid baths, which can chemically attack the ceramic component.
  • a protective layer prevents acid attack on parts of the surface of the ceramic component that are not to be coated with the contact layer.
  • the protective layer also serves to reduce other external influences on the component. In particular, the protective layer prevents the plating of the surfaces of the component that are not covered by the burned-in silver paste.
  • Ceramic materials based on the perovskite structure type and lead are known as protective layers contain. Examples include Pb (Zr, Ti) 0 3 (PZT ceramic), (Pb, La) (Zr, Ti) 0 3 (PLZT ceramic) or (Pb, La) (Zr, Sn, Ti) 0 3 ( PLZST ceramics). These ceramics are used as protective layers for ceramic components, on the surface of which contact layers are to be applied galvanically.
  • the known protective layers have the disadvantage that they have a high lead content.
  • the lead can easily penetrate into the interior of the ceramic base body and adversely affect the electrical characteristics of the component.
  • the non-environmentally friendly and toxic lead accumulates in the sintering furnace necessary for the production of ceramic components.
  • Electrical components that contain a protective layer made from a PLZT ceramic also have the disadvantage that the protective layer can negatively influence the electrical properties of the component due to chemical reactions that take place between the protective layer and the base body of the component.
  • the aim of the present invention is therefore to provide a component which has a protective layer which protects the component from external influences and which has a low lead content.
  • the invention relates to an electrical component with a basic body, which contains a ceramic material.
  • the ceramic material is generally decisive for the function of the electrical component.
  • At least two contact layers are provided on the surface of the base body, which serve to contact the component.
  • the part of the surface of the base body which is free from the contact layers is at least partially covered by a protective layer which contains a spinel ceramic of the composition AB 2 0 4 .
  • the component according to the invention has the advantage that its protective layer consists of a material which can effectively protect the base body of the component from electroplating. Furthermore, the component according to the invention has the advantage that its protective layer contains no lead.
  • a spinel ceramic is to be understood as a ceramic in which the A and B positions can be occupied by the elements magnesium, manganese, selenium, cobalt, nickel, zinc, aluminum or iron.
  • the component according to the invention also has the advantage that, due to the low lead content of the protective layer, the electrical properties of the ceramic component are not changed by lead penetrating into the base body. Due to the low lead content, the component according to the invention is also particularly environmentally friendly and not very toxic.
  • a varistor ceramic is particularly suitable as the ceramic material.
  • the use of a varistor ceramic in the component according to the invention has the advantage that a spinel ceramic of a suitable chemical composition does not adversely affect the electrical properties of the component according to the invention. It is furthermore advantageous if the composition of the spinel ceramic is selected such that the spinel ceramic can be sintered together with the ceramic material of the base body. As a result, the production of the component according to the invention can be considerably simplified since the sintering and the production of the protective layer can take place in a single standard step.
  • the composition of the spinel ceramic is chosen so that it has a specific electrical resistance greater than 1 M ⁇ cm. This can ensure effective insulation between the contact layers, so that short circuits in the protective layer can be avoided.
  • a high electrical resistance of the spinel ceramic has the advantage that the galvanic deposition of metals on surfaces other than those provided for the contact layers of the base body can be avoided.
  • a ceramic with the composition ZnMn 2 0 4 as spinel ceramic.
  • This spinel ceramic can be sintered together with the varistor ceramic mentioned, does not adversely affect the varistor ceramic chemically and offers sufficient mechanical stability, as is necessary, for example, for the galvanization of several electrical components in the bulk material due to the friction occurring there.
  • a spinel ceramic of the abovementioned composition can be produced in a sufficiently dense manner, that is to say sufficiently free of pores, so that it effectively inhibits the access of components of an electroplating bath to parts of the surface of the base body covered by the spinel ceramic.
  • a component that is produced by sintering a stack of superimposed ceramic green foils and electrically conductive electrode layers is particularly advantageous, the top and bottom green foils of the stack containing a spinel ceramic of the composition AB 2 0 4 .
  • Such a component is particularly easy to manufacture by the standard process of sintering a stack of films.
  • the production of the protective layer can be integrated into the production of the base body, which means that further production steps can be dispensed with.
  • the prerequisite for this is that the material used as spinel ceramic can be processed into ceramic green foils (film drawability).
  • the aforementioned spinel ceramic with the composition ZnMn 2 0 4 is particularly well suited for this.
  • a side surface of the stack is covered by a further protective layer which contains a ceramic of the composition (Pb, La) (Zr, Ti) 0 3 .
  • a further protective layer which contains a ceramic of the composition (Pb, La) (Zr, Ti) 0 3 .
  • the use of such a PLZT ceramic on one side surface of the layer stack has the advantage that it can be applied very simply by screen printing. Since the protective effect of a PLZT ceramic is achieved with smaller layer thicknesses than the protective effect of a spinel ceramic, the production of the further protective layer using a screen printing process is particularly advantageous. Larger layer thicknesses as would be necessary when using a spinel ceramic are no longer so easy to produce using the screen printing process, since there is a risk of the layer being detached.
  • the protective layer is designed in such a way that it inhibits the access of components of an electroplating bath to the parts of the surface of the base body which it covers. This ensures effective protection of the base body of the component against components of the electroplating, in particular the caustic acid baths.
  • the surface mountability of the component according to the invention can easily be achieved due to the protective layer.
  • Figure 1 shows an example of a component according to the invention in a schematic perspective view.
  • FIG. 2A shows the component from FIG. 1 in a schematic cross section.
  • FIG. 2B shows the component from FIG. 1 in a schematic longitudinal section.
  • FIG. 3 shows the area of the contact layer of the component from FIG. 2B.
  • FIG. 4 shows the electrical characteristic curve of a component according to the invention according to FIG. 1 in comparison with the characteristic curve of a known component in a schematic illustration.
  • FIG. 5A shows a further example of a component according to the invention in the form of a varistor array.
  • FIG. 5B shows a first longitudinal section of the component from FIG. 5A.
  • FIG. 5C shows a second longitudinal section of the component from FIG. 5A.
  • FIG. 1 shows a ceramic component according to the invention, which has a base body 1 on which a first contact Layer 2 and a second contact layer 3 is arranged.
  • the two contact layers 2, 3 are galvanically applied tin layers. With the help of these tin layers, the component can be soldered onto a printed circuit board in SMD assembly.
  • FIG. 2A shows the component from FIG. 1 in a schematic cross section.
  • the base body 1 consists of a stack 5 of electrode layers 6 lying one above the other, which are separated from one another by ceramic layers 9.
  • Palladium or silver is advantageously used as the material for the conductive electrode layers 6.
  • These two precious metals have the advantage that they can be sintered in air, which means that an electrode-specific sintering atmosphere can be dispensed with.
  • the ceramic layers 9 contain a varistor ceramic, which is a zinc oxide ceramic doped with aluminum, cobalt and manganese oxide. Such a ceramic material has the advantage that it can be used in a varistor.
  • a protective layer 4 is arranged on the top and on the bottom of the stack 5. The layers 6, 9 of the stack 5 are produced with the two protective layers 4 in a common sintering process.
  • the protective layers 4 typically have a thickness of 20 to 40 ⁇ m
  • the principle of the varistor ceramic used for the base body is known per se to the person skilled in the art.
  • the main component is zinc oxide, which is mixed with bismuth oxide, antimony oxide, cobalt oxide, manganese oxide and other metal oxides or 1 ⁇ J n
  • TJ ⁇ d 1 ⁇ xi Cn CQ X) -H d • H 3 -H rH ⁇ J ⁇ O -HX TJ 3 0 3 rö d N i ⁇ CQ J rö 3 » 3 ⁇ • H ⁇ rö d ⁇ • - X da 01 ⁇ TJ d rö rö X rö 4-J CN
  • the raw material mixture is processed into a slip and processed into ceramic green foils.
  • the ceramic green foils are processed in a screen printing process using a precious metal paste suitable for sintering with the ceramic, with which the green foils are printed. This precious metal paste represents the sintered electrode layers 6.
  • the printed green foils are stacked, laminated and separated by cutting, from which green parts of a certain miniaturized design of multilayer varistors, essentially given by the geometric dimensions, result.
  • protective ceramic foils made of a spinel ceramic are used as the base and cover foil, which have a high electrical resistance, are chemically stable with respect to the electroplating baths to be used later and are adapted in their sintering behavior to the varistor ceramic.
  • the green parts are printed on the respective cut sides with a screen printing paste consisting of the same passivating material.
  • the green parts constructed in this way are sintered after careful debinding (removal of carbon residues) and then provided with a metal paste consisting of silver or a silver-containing alloy on the end faces in the area of the emerging electrode layers 6 by immersion.
  • the silver or the silver-containing alloy is then burned in in a separate process step, as a result of which contact is made with the electrode layers 6 of the component.
  • This silver layer also forms the starting layer 10 of the electroplating which, as shown in FIG. 3, is part of the second contact layer 3.
  • the baked metal paste is then galvanically coated with a metal layer 8, which can be a nickel or tin layer or also a nickel / tin double layer, to produce the contact layers 2, 3, as a result of which the component's SMD capability is established.
  • the protective layers 4, 7 prevent the caustic partial dissolution of the varistor ceramic and, moreover, the deposition of nickel or tin on the ceramic surface between the end faces of the component. During sintering, the protective layer 4 compresses largely free of tension and pores, so that the surfaces printed with the protective layer 4 are largely sealed and protect against the acid attack of an electroplating bath.
  • the protective layer can fulfill its protective function, it must have a layer thickness between 20 and 50 ⁇ m.
  • FIG. 4 shows the electrical characteristic curve 11 of a component according to the invention in comparison with the electrical characteristic curve 12 of a known component with a protective layer made of PLZT ceramic.
  • the electrical current in the unit mA is plotted against the electrical voltage in the unit V.
  • the component according to the invention has a lower leakage current than the known component at low voltages, which is due to the reduced chemical influence of the varistor ceramic by the protective layer made of the spinel ceramic.
  • the characteristic curve 12 of the known component with a protective layer made of PLZT ceramic shows that the electrical resistance of the varistor is low at low voltages, which is disadvantageous due to the commonly used parallel connection of the varistor to the electrical circuit to be protected.
  • FIG. 5A shows a component according to the invention in the form of a varistor array in a perspective view.
  • the construction ment has a base body 1, which is produced from stacked electrode layers and ceramic layers using multilayer technology.
  • a protective layer 4 which contains a spinel ceramic of the composition AB 2 0 4 , is provided as the bottom or top layer of the layer stack.
  • FIG. 5B shows in a longitudinal section from FIG. 5A the arrangement of the electrode layers 6 which form the internal electrodes of the component.
  • the electrode layers 6 are arranged in the form of four adjacent stacks 5. It can be seen from the longitudinal section according to FIG. 5C that the electrode layers 6 of each stack 5 lying in one plane are electrically conductively connected to an outer electrode 2.
  • Each stack 5 of electrode layers 6 is assigned a pair of outer electrodes 2, 3.
  • the outer electrodes 2, 3 are each electrically insulated from one another.
  • FIG. 5C also shows the electrode layers arranged under the electrode layers 6 lying in the plane of the drawing in the form of dashed lines.
  • the electrode layers marked with a dashed line are electrically conductively connected to contact layers 3, which are arranged on the side of the component opposite the contact layers 2. Electrodes lying one above the other partially overlap one another, with adjacent electrode layers being contacted with different contact layers 2, 3.
  • the protective layer shown in FIGS. 5A and 5B serves as passivation, which either protects the component from caustic electroplating baths or, if no galvanic reinforcement of the contact layers 2, 3 is necessary, contributes to increasing the surface resistance of the component.
  • the surfaces of the base body 1 free from the protective layers 4 can either remain free or can also be passivated by means of suitable processes using other materials.
  • the varistor array shown in FIGS. 5A to 5C contains several varistors, which are constructed according to FIGS. 1, 2A and 2B, side by side in one component.
  • the specified ceramic materials can optionally contain other conventional constituents in small amounts that do not impair the desired properties.

Abstract

The invention relates to an electrical component comprising a base body (1), which contains a ceramic material, and comprises at least two contact layers (2, 3), which are provided on the surface of the base body (1). The portion of the surface of the base body (1) not covered by the contact layers (2, 3) is at least partially covered by a protective layer (4) that contains a spinel ceramic of the composition AB2O4. The inventive component provided with the protective layer made of a spinel ceramic is advantageous in that the electrical properties of the ceramic material, in particular, of a varistor ceramic material are not negatively influenced.

Description

Beschreibungdescription
Elektrisches BauelementElectrical component
Die Erfindung betrifft ein elektrisches Bauelement mit einem Grundkörper, der ein Keramikmaterial enthält und mit wenigstens zwei auf der Oberfläche des Grundkörpers vorgesehenen Kontaktschichten, bei dem der von Kontaktschichten freie Teil der Oberfläche des Grundkörpers wenigstens teilweise von einer Schutzschicht bedeckt ist.The invention relates to an electrical component with a base body that contains a ceramic material and with at least two contact layers provided on the surface of the base body, in which the part of the surface of the base body that is free of contact layers is at least partially covered by a protective layer.
Es sind Bauelemente der eingangs genannten Art bekannt, die als Varistoren verwendet werden, die eine hohe thermische Stabilität aufweisen und deren Grundkörper eine Mischung aus Metalloxiden enthält. Derartige Bauelemente werden üblicherweise in Oberflächenmontage auf Platinen gelötet und dienen dem Spannungsschutz verschiedener elektronischer Komponenten in elektrischen Geräten und Apparaten der Elektrotechnik.Components of the type mentioned at the outset are known which are used as varistors, which have high thermal stability and whose base body contains a mixture of metal oxides. Components of this type are usually soldered on boards in surface mounting and serve to protect various electronic components from voltage in electrical devices and electrical engineering devices.
Die Möglichkeit der Oberflächenmontage (SMD-Fähigkeit) der Bauelemente wird erreicht durch Kontaktierung des Grundkörpers mittels Einbrennen einer Silberpaste auf dem Grundkörper und anschließendes Galvanisieren der Silberpaste in einem Nickel- und Zinnbad. Die äußerste Zinn-Kontaktschicht garantiert dabei die SMD-Fähigkeit. Das Aufbringen der Kontaktschichten geschieht dabei in üblicherweise sauren Bädern, die das keramische Bauelement chemisch angreifen können. Durch eine Schutzschicht wird ein Säureangriff auf nicht mit der Kontaktschicht zu beschichtenden Teilen der Oberfläche des keramischen Bauelements verhindert. Ferner dient die Schutzschicht zur Reduzierung anderer äußerer Einflüsse auf das Bauelement. Insbesondere verhindert die Schutzschicht das Plattieren der nicht von der eingebrannten Silberpaste bedeckten Oberflächen des Bauelements.The possibility of surface mounting (SMD capability) of the components is achieved by contacting the base body by baking a silver paste on the base body and then galvanizing the silver paste in a nickel and tin bath. The outermost tin contact layer guarantees the SMD capability. The contact layers are applied in usually acid baths, which can chemically attack the ceramic component. A protective layer prevents acid attack on parts of the surface of the ceramic component that are not to be coated with the contact layer. The protective layer also serves to reduce other external influences on the component. In particular, the protective layer prevents the plating of the surfaces of the component that are not covered by the burned-in silver paste.
Es sind als Schutzschichten verwendete keramische Materialien bekannt, die auf dem Perowskit-Strukturtyp basieren und Blei enthalten. Beispiele hierfür sind Pb(Zr,Ti)03 (PZT-Keramik) , (Pb,La) (Zr,Ti)03 (PLZT-Keramik) oder (Pb,La) (Zr,Sn,Ti)03 (PLZST-Keramik) . Diese Keramiken werden als Schutzschichten für keramische Bauelemente verwendet, auf deren Oberfläche Kontaktschichten galvanisch aufgebrachte werden sollen.Ceramic materials based on the perovskite structure type and lead are known as protective layers contain. Examples include Pb (Zr, Ti) 0 3 (PZT ceramic), (Pb, La) (Zr, Ti) 0 3 (PLZT ceramic) or (Pb, La) (Zr, Sn, Ti) 0 3 ( PLZST ceramics). These ceramics are used as protective layers for ceramic components, on the surface of which contact layers are to be applied galvanically.
Die bekannten Schutzschichten haben den Nachteil, daß sie einen hohen Bleigehalt aufweisen. Das Blei kann leicht in das Innere des keramischen Grundkörpers eindringen und die elektrischen Kennwerte des Bauelements negativ beeinflussen. Darüber hinaus reichert sich das nicht umweltfreundliche und giftige Blei im für die Herstellung keramischer Bauelemente notwendigen Sinterofen an.The known protective layers have the disadvantage that they have a high lead content. The lead can easily penetrate into the interior of the ceramic base body and adversely affect the electrical characteristics of the component. In addition, the non-environmentally friendly and toxic lead accumulates in the sintering furnace necessary for the production of ceramic components.
Elektrische Bauelemente, die eine Schutzschicht aus einer PLZT-Keramik enthalten, haben darüber hinaus den Nachteil, daß die Schutzschicht die elektrischen Eigenschaften des Bauelements negativ beeinflussen kann aufgrund von chemischen Reaktionen, die zwischen Schutzschicht und Grundkörper des Bauelements stattfinden.Electrical components that contain a protective layer made from a PLZT ceramic also have the disadvantage that the protective layer can negatively influence the electrical properties of the component due to chemical reactions that take place between the protective layer and the base body of the component.
Es sind ferner aus der Druckschrift DE 196 34 498 C2 elektrische Bauelemente bekannt, deren Schutzumhüllungen Bariumtita- nat , Siliziumoxid oder Aluminiumoxid enthalten. Diese Schutzumhüllungen haben den Nachteil, daß sie mit Keramiken, die zum Beispiel für Varistoren verwendet werden, nicht gemeinsam sinterbar sind und daher die Herstellung solcher Bauelemente aufwendig ist.There are also known from the publication DE 196 34 498 C2 electrical components whose protective coatings contain barium titanate, silicon oxide or aluminum oxide. These protective casings have the disadvantage that they cannot be sintered together with ceramics, which are used, for example, for varistors, and the manufacture of such components is therefore complex.
Ziel der vorliegenden Erfindung ist es daher, ein Bauelement anzugeben, das eine Schutzschicht aufweist, die das Bauelement vor äußeren Einflüssen schützt und die einen geringen Bleigehalt aufweist.The aim of the present invention is therefore to provide a component which has a protective layer which protects the component from external influences and which has a low lead content.
Dieses Ziel wird erfindungsgemäß durch ein elektrisches Bauelement nach Patentanspruch 1 erreicht. Vorteilhafte Ausge- staltungen der Erfindung sind den weiteren Patentansprüchen zu entnehmen.This goal is achieved according to the invention by an electrical component according to claim 1. Advantageous Events of the invention can be found in the further claims.
Die Erfindung betrifft ein elektrisches Bauelement mit einem Grundkorper, der ein Keramikmaterial enthält. Das Keramikmaterial ist im allgemeinen bestimmend für die Funktion des elektrischen Bauelements. Auf der Oberfläche des Grundkörpers sind wenigstens zwei Kontaktschichten vorgesehen, die der Kontaktierung des Bauelements dienen. Der von den Kontakt- schichten freie Teil der Oberfläche des Grundkörpers ist wenigstens teilweise von einer Schutzschicht bedeckt, die eine Spinell-Keramik der Zusammensetzung AB204 enthält.The invention relates to an electrical component with a basic body, which contains a ceramic material. The ceramic material is generally decisive for the function of the electrical component. At least two contact layers are provided on the surface of the base body, which serve to contact the component. The part of the surface of the base body which is free from the contact layers is at least partially covered by a protective layer which contains a spinel ceramic of the composition AB 2 0 4 .
Das erfindungsgemäße Bauelement hat den Vorteil, daß seine Schutzschicht aus einem Material besteht, das den Grundkörper des Bauelements wirksam vor Galvanik schützen kann. Desweiteren hat das erfindungsgemäße Bauelement den Vorteil, daß seine Schutzschicht kein Blei enthält. Unter einer Spinell- Keramik ist dabei eine Keramik zu verstehen, bei der die A- Plätze und B-Plätze mit den Elementen Magnesium, Mangan, Selen, Kobalt, Nickel, Zink, Aluminium oder Eisen besetzt sein können.The component according to the invention has the advantage that its protective layer consists of a material which can effectively protect the base body of the component from electroplating. Furthermore, the component according to the invention has the advantage that its protective layer contains no lead. A spinel ceramic is to be understood as a ceramic in which the A and B positions can be occupied by the elements magnesium, manganese, selenium, cobalt, nickel, zinc, aluminum or iron.
Das erfindungsgemäße Bauelement hat ferner den Vorteil, daß aufgrund des niedrigen Bleigehalts der Schutzschicht die elektrischen Eigenschaften des keramischen Bauelements nicht durch in den Grundkörper eindringendes Blei verändert werden. Durch den niedrigen Bleigehalt ist das erfindungsgemäße Bauelement auch besonders umweltfreundlich und wenig giftig.The component according to the invention also has the advantage that, due to the low lead content of the protective layer, the electrical properties of the ceramic component are not changed by lead penetrating into the base body. Due to the low lead content, the component according to the invention is also particularly environmentally friendly and not very toxic.
Als Keramikmaterial kommt dabei insbesondere eine Varistorkeramik in Betracht. Die Verwendung einer Varistorkeramik in dem erfindungsgemäßen Bauelement hat den Vorteil, daß eine Spinell-Keramik einer geeigneten chemischen Zusammensetzung die elektrischen Eigenschaften des erfindungsgemäßen Bauelements nicht negativ beeinflußt. Es ist desweiteren vorteilhaft, wenn die Zusammensetzung der Spinell-Keramik so gewählt ist, daß die Spinell-Keramik mit dem Keramikmaterial des Grundkörpers gemeinsam sinterbar ist. Dadurch kann die Herstellung des erfindungsgemäßen Bauelements wesentlich vereinfacht werden, da das Sintern und die Herstellung der Schutzschicht in einem einzigen Standardschritt erfolgen können. Bei der gemeinsamen Sinterbarkeit von Spinell-Keramik und Keramikmaterial des Grundkörpers ist insbesondere auf die Sintertemperatur, die Sinterkurve (das heißt der Zeitverlauf der Temperatur während des Sinterns) , den Sinterschwund und den Ausdehnungskoeffizient zu achten.A varistor ceramic is particularly suitable as the ceramic material. The use of a varistor ceramic in the component according to the invention has the advantage that a spinel ceramic of a suitable chemical composition does not adversely affect the electrical properties of the component according to the invention. It is furthermore advantageous if the composition of the spinel ceramic is selected such that the spinel ceramic can be sintered together with the ceramic material of the base body. As a result, the production of the component according to the invention can be considerably simplified since the sintering and the production of the protective layer can take place in a single standard step. In the case of the joint sinterability of spinel ceramic and ceramic material of the base body, particular attention must be paid to the sintering temperature, the sintering curve (that is to say the time profile of the temperature during sintering), the sintering shrinkage and the coefficient of expansion.
Es ist desweiteren vorteilhaft, wenn die Zusammensetzung der Spinell-Keramik so gewählt ist, daß sie einen spezifischen elektrischen Widerstand größer als 1 MΩcm aufweist. Dadurch kann für eine wirksame Isolation zwischen den Kontaktschichten gesorgt werden, so daß Kurzschlüsse in der Schutzschicht vermieden werden können. Darüber hinaus hat ein hoher elektrischer Widerstand der Spinell-Keramik den Vorteil, daß das galvanische Abscheiden von Metallen auf anderen als den für die Kontaktschichten vorgesehenen Flächen des Grundkörpers vermieden werden kann.It is also advantageous if the composition of the spinel ceramic is chosen so that it has a specific electrical resistance greater than 1 MΩcm. This can ensure effective insulation between the contact layers, so that short circuits in the protective layer can be avoided. In addition, a high electrical resistance of the spinel ceramic has the advantage that the galvanic deposition of metals on surfaces other than those provided for the contact layers of the base body can be avoided.
In Verbindung mit einer Varistorkeramik, die auf ZnO basiert, ist es besonders vorteilhaft, als Spinell-Keramik eine Keramik der Zusammensetzung ZnMn204 zu verwenden. Diese Spinell- Keramik ist zusammen mit der genannten Varistorkeramik sinterbar, beeinflußt die Varistorkeramik chemisch nicht nachteilig und bietet eine ausreichende mechanische Stabilität, wie sie beispielsweise für die Galvanisierung mehrerer elektrischer Bauelemente im Schüttgut aufgrund der dort auftretenden Reibung notwendig ist. Darüber hinaus kann eine Spinell-Keramik der genannten Zusammensetzung ausreichend dicht, das heißt ausreichend porenfrei hergestellt werden, so daß sie den Zutritt von Bestandteilen eines Galvanikbades zu durch die Spinell-Keramik bedeckten Teilen der Oberfläche des Grundkörpers wirksam hemmt . Es ist desweiteren ein Bauelement besonders vorteilhaft, das durch Sintern eines Stapels von übereinander liegenden keramischen Grünfolien und elektrisch leitenden Elektrodenschichten hergestellt ist, wobei die oberste und die unterste Grünfolie des Stapels eine Spinell-Keramik der Zusammensetzung AB204 enthält. Ein solches Bauelement ist besonders leicht durch den Standardprozeß des Sinterns eines Folienstapels herstellbar. Die Herstellung der Schutzschicht kann in die Herstellung des Grundkörpers integriert werden, wodurch auf weitere Herstellungsschritte verzichtet werden kann. Voraussetzung dafür ist, daß das als Spinell-Keramik verwendete Material zu keramischen Grünfolien verarbeitet werden kann (Fo- lienziehbarkeit) . Die genannte Spinell-Keramik der Zusammensetzung ZnMn204 ist hierfür besonders gut geeignet.In connection with a varistor ceramic based on ZnO, it is particularly advantageous to use a ceramic with the composition ZnMn 2 0 4 as spinel ceramic. This spinel ceramic can be sintered together with the varistor ceramic mentioned, does not adversely affect the varistor ceramic chemically and offers sufficient mechanical stability, as is necessary, for example, for the galvanization of several electrical components in the bulk material due to the friction occurring there. In addition, a spinel ceramic of the abovementioned composition can be produced in a sufficiently dense manner, that is to say sufficiently free of pores, so that it effectively inhibits the access of components of an electroplating bath to parts of the surface of the base body covered by the spinel ceramic. Furthermore, a component that is produced by sintering a stack of superimposed ceramic green foils and electrically conductive electrode layers is particularly advantageous, the top and bottom green foils of the stack containing a spinel ceramic of the composition AB 2 0 4 . Such a component is particularly easy to manufacture by the standard process of sintering a stack of films. The production of the protective layer can be integrated into the production of the base body, which means that further production steps can be dispensed with. The prerequisite for this is that the material used as spinel ceramic can be processed into ceramic green foils (film drawability). The aforementioned spinel ceramic with the composition ZnMn 2 0 4 is particularly well suited for this.
In einer weiteren vorteilhaften Ausführungsform der Erfindung ist eine Seitenfläche des Stapels von einer weiteren Schutzschicht bedeckt, die eine Keramik der Zusammensetzung (Pb, La) (Zr, Ti) 03 enthält. Die Verwendung einer solchen PLZT- Keramik an einer Seitenfläche des Schichtstapels hat den Vorteil, daß diese sehr einfach durch Siebdruck aufgebracht werden kann. Da die Schutzwirkung einer PLZT-Keramik bei kleineren Schichtdicken erreicht wird als die Schutzwirkung einer Spinell-Keramik erreicht wird, ist die Herstellung der weiteren Schutzschicht mit Hilfe eines Siebdruckverfahrens besonders vorteilhaft. Größere Schichtdicken wie sie bei der Verwendung einer Spinell-Keramik notwendig wären sind durch das Siebdruckverfahren nicht mehr so leicht herstellbar, da die Gefahr der Ablösung der hergestellten Schicht besteht.In a further advantageous embodiment of the invention, a side surface of the stack is covered by a further protective layer which contains a ceramic of the composition (Pb, La) (Zr, Ti) 0 3 . The use of such a PLZT ceramic on one side surface of the layer stack has the advantage that it can be applied very simply by screen printing. Since the protective effect of a PLZT ceramic is achieved with smaller layer thicknesses than the protective effect of a spinel ceramic, the production of the further protective layer using a screen printing process is particularly advantageous. Larger layer thicknesses as would be necessary when using a spinel ceramic are no longer so easy to produce using the screen printing process, since there is a risk of the layer being detached.
Es ist darüber hinaus vorteilhaft, wenn die Schutzschicht so ausgeführt ist, daß sie den Zutritt von Bestandteilen eines Galvanikbades zu den von ihr bedeckten Teilen der Oberfläche des Grundkörpers hemmt. Dadurch wird ein effektiver Schutz des Grundkörpers des Bauelements vor Bestandteilen der Galvanik, insbesondere den ätzenden Säurebädern gewährleistet. Das 1 1 _d 1 ω 1 4JIt is also advantageous if the protective layer is designed in such a way that it inhibits the access of components of an electroplating bath to the parts of the surface of the base body which it covers. This ensures effective protection of the base body of the component against components of the electroplating, in particular the caustic acid baths. The 1 1 _d 1 ω 1 4J
1 11 1
KO Φ 3 1 υ 1 d 4-) 1 φ d =0 H 4-) IΛ d 4-> d 2 rö d 1 3 CQ M (Ö •H • d TJ Φ JH rö -H - o TJ <υ 03 o 1 m 4 Φ Φ 1 (Ö Φ Φ d ε TJ -H 4-) 4-> X! ΦKO Φ 3 1 υ 1 d 4- ) 1 φ d = 0 H 4-) IΛ d 4-> d 2 rö d 1 3 CQ M ( Ö • H • d TJ Φ JH rö -H - o TJ <υ 03 o 1 m 4 Φ Φ 1 ( Ö Φ Φ d ε TJ -H 4-) 4-> X! Φ
© (Ö -d w Φ rH© (Ö -d w Φ rH
4-) ε Cn rH CQ TJ rH H d TJ 1 N φ Φ o rH M r4- ) ε Cn rH CQ TJ rH H d TJ 1 N φ Φ o rH M r
-Q 0 u 0 d rH Φ MH Φ CQ 3 ω Φ d -H d d -H 4 TJ H T o Λ; P, -H Φ X! > 0 Φ rH -: 3 fÖ d Φ CQ 0 fÖ Φ S 4-> d Φ rö-Q 0 u 0 d rH Φ MH Φ CQ 3 ω Φ d -H dd -H 4 TJ HT o Λ; P, -H Φ X! > 0 Φ rH -: 3 fÖ d Φ CQ 0 fÖ Φ S 4-> d Φ rö
W -H rH •H CJ > 4J Φ (Ö υ fÖ Φ Φ 0 4-) > 4-> XI X! d m Φ 4J XIW -H rH • H CJ> 4J Φ ( Ö υ fÖ Φ Φ 0 4-)>4-> XI X! dm Φ 4J XI
Q d J-) cn TJ fÖ d CQ 3 -H d 4J o. TJ -d 4J CQ ü H 3 TJ 5H C H rö 01 =o Φ rH Φ (0 Xi SS -H -d 5π d u ε u co CQ üt! d o Φ U xi α. ε d X) TJ -d Cn CQ o Λ o =o Φ d •H n Φ rö CQ d Φ > H i-H cj Φ Φ tÖ CQ φ H -s-; 4-> Φ I H 0 J ϊ Cn φ H n 4-> 4 rö -H x; d tn d N φ d -H d -d TJ H 4-> u 4J Pn -H d d Φ Φ TJ dQ d J-) cn TJ fÖ d CQ 3 -H d 4J o. TJ -d 4J CQ ü H 3 TJ 5H CH rö 01 = o Φ rH Φ ( 0 Xi SS -H -d 5π du ε u co CQ üt! do Φ U xi α. ε d X) TJ -d Cn CQ o Λ o = o Φ d • H n Φ rö CQ d Φ> H iH cj Φ Φ tÖ CQ φ H -s-; 4-> Φ I H 0 J ϊ Cn φ H n 4-> 4 ro -H x; d tn d N φ d -H d -d TJ H 4-> u 4J Pn -H dd Φ Φ TJ d
Ü rH υ Φ UH Φ S Xi o d •H Φ o Φ xi CQ , s . 3 -H CQ -H d oÜ rH υ Φ UH Φ S Xi o d • H Φ o Φ xi CQ, s. 3 -H CQ -H d o
Cn 3 J 3 xt > fÖ Φ ä .Cn 3 J 3 xt> fÖ Φ ä.
5 rH CJ c fÖ d d . d 4J 4-> rö ε ε «o (0 πJ rö Xi > 4-> -H ω 4-> H φ Φ 4-> d rö • 4-) d ε •w x: Φ o rH r-i Φ SH φ Xi Xi -d TJ d TJ CQ rö rH 4-> 3 CQ Φ5 rH CJ c fö dd. d 4J 4-> rö ε ε «o ( 0 πJ rö Xi>4-> -H ω 4-> H φ Φ 4-> d rö • 4- ) d ε • wx: Φ o rH ri Φ SH φ Xi Xi -d TJ d TJ CQ rö rH 4-> 3 CQ Φ
TJ TJ φ H QQ CQ -d (Ö CQ (Ö Φ J o 0 o d u -H (--. C-< Φ CQ XTJ TJ φ H QQ CQ -d ( Ö CQ (Ö Φ J o 0 odu -H (-. C- <Φ CQ X
Φ d Λ Φ φ 0 •H -H TJ φ 4-> rJ CQ CQ >H M Φ CQ Q) CΛ TJ Φ Φ J 5-Φ d Λ Φ φ 0 • H -H TJ φ 4-> rJ CQ CQ> H M Φ CQ Q) CΛ TJ Φ Φ J 5-
H 3 • Di 4-) 5H d N Φ d CQ Φ -H M 4-) 4-> -H ϊ 4J U-J d 5-ι TJ :(Ö o CQ TJ .. d Di rö . H 3 • Di 4-) 5H d N Φ d CQ Φ -HM 4-) 4-> -H ϊ 4J UJ d 5-ι TJ: ( Ö o CQ TJ .. d Di rö.
2 5 4-> d Φ J JH H i i X! SH M-l d 3 Φ -H rH 52 5 4-> d Φ J JH H ii X! SH Ml d 3 Φ -H rH 5
> Φ r4 4 •■0 Φ > d CQ ε H -Q 4J ε Φ J J 4-> 4J rö Φ (Ö 5 CQ s 4H> Φ r4 4 • ■ 0 Φ> d CQ ε H -Q 4J ε Φ JJ 4-> 4J rö Φ ( Ö 5 CQ s 4H
& B H UH X ε φ rH Φ rH ε d i rö rH CQ -H M SH i J 3 5-1 T& B H UH X ε φ rH Φ rH ε di rö rH CQ -HM SH i J 3 5-1 T
N rö 3 ϊ fÖ TJ Φ d (d φ TJ Φ 0 φ d d Φ w H X! Φ <-\ d Φ ö 5H ΦN rö 3 ϊ fÖ TJ Φ d ( d φ TJ Φ 0 φ dd Φ w HX! Φ <- \ d Φ ö 5H Φ
4-) TJ :t0 ! d rH -H cn 0Q JH H i -H d Φ rH Φ r4 CJ rH H -H φ > SH Φ )4-) TJ: t0! d rH -H cn 0Q JH H i -H d Φ rH Φ r4 CJ rH H -H φ> SH Φ)
3 U 4J rH 3 Φ Φ 0 Φ a TJ -H ϊ Φ ^ φ 4J CQ Φ N Φ =3 cn rö X o C3 U 4J rH 3 Φ Φ 0 Φ a TJ -H ϊ Φ ^ φ 4J CQ Φ N Φ = 3 cn rö X o C
X! •-> rH rH -H 4 3 4J JH δ CQ CQ N 4-) d 3 4-) HH d : TJ üX! • -> rH rH -H 4 3 4J JH δ CQ CQ N 4-) d 3 4-) HH d: TJ ü
CJ d Xi rH Φ O αJ 3 Cn -H W H » - -d >-l φ Φ SH J M 3 •rH CQ φ X co Φ o Φ 4-> m '3 Cn 4-1 Φ Φ CQ 4-) Φ υ <Ö rH TJ φ Φ O Φ 4J d Φ ε HCJ d Xi rH Φ O αJ 3 Cn -HW H »- -d> -l φ Φ SH JM 3 • rH CQ φ X co Φ o Φ 4-> m '3 Cn 4-1 Φ Φ CQ 4- ) Φ υ <Ö rH TJ φ Φ O Φ 4J d Φ ε H
Di X 4J )H d 4H 4-J φ r-H Λ • Λ 3 UH TJ -Q Φ o J n 4 rH X -H xi JDi X 4J) H d 4H 4-J φ r-H Λ • Λ 3 UH TJ -Q Φ o J n 4 rH X -H xi J
(0 rH 01 o Φ φ 4-> d rH d 0 fÖ (Ö d 3 i d rö J J 0(0 rH 01 o Φ φ 4-> d rH d 0 fÖ (Ö d 3 i d rö J J 0
VD rH 0 φ Φ > TJ Xi d » -H Φ d •H ^ -d Φ TJ u d J d Λ, SH φ Xi Φ 4-)VD rH 0 φ Φ> TJ Xi d »-H Φ d • H ^ -d Φ TJ u d J d Λ, SH φ Xi Φ 4-)
4H d tn CJ φ Λ Φ 4-J φ Φ 4J rH Cn (Ö φ M d SH 0 ε J 4J Φ JH CQ xi SH φ MH rH 4J ü CQ d CQ - -d -H φ Φ d 4J φ fÖ rö 4J Φ co CQ -H φ H4H d tn CJ φ Λ Φ 4-J φ Φ 4J rH Cn (Ö φ M d SH 0 ε J 4J Φ JH CQ xi SH φ MH rH 4J ü CQ d CQ - -d -H φ Φ d 4J φ fÖ rö 4J Φ co CQ -H φ H
4-> Φ 0 Φ 4-> 3 0 -d CQ d Φ d Φ o Φ -H -H φ X! rH M 4 CQ rH d CQ cn 4 x; Xi d fÖ CO υ d n =0 4-) Cn -H 4-) rH TJ -Q u Kl CQ -H Φ d 0 H d u Xi 4-) Φ •H ε tÖ M Ä <ö -d H -H d SH 3 Φ -H d H φ4-> Φ 0 Φ 4-> 3 0 -d CQ d Φ d Φ o Φ -H -H φ X! rH M 4 CQ rH d CQ cn 4 x; Xi d fÖ CO υ dn = 0 4-) Cn -H 4-) rH TJ -Q u Kl CQ -H Φ d 0 H du Xi 4-) Φ • H ε tÖ M Ä <ö -d H -H d SH 3 Φ -H d H φ
H CJ 0. Φ ε -d • xi •H Λ. Φ J J O H Xi Φ CQ rö rö xi 4-> Φ TJ n x. SH X! rH Φ CJ d J Xi d -H Cn o > Φ 4-) φ CJ KV ε 4-) > CQ υ rö 4J φ d H CJ 0. Φ ε -d • xi • H Λ. Φ JJO H Xi Φ CQ rö rö xi 4-> Φ TJ n x. SH X! rH Φ CJ d J Xi d -H Cn o> Φ 4-) φ CJ KV ε 4- ) > CQ υ rö 4J φ d
O 3 U -fÖ rH co Φ CQ tn Λ Φ -d TJ rH Λ CQ J ε d CQ M -H -H 3 rO 3 U -fÖ rH co Φ CQ tn Λ Φ -d TJ rH Λ CQ J ε d CQ M -H -H 3 r
(0 T5 H d Φ H 4 4-> -H υ n 4-) o d Φ CQ d :(Ö 0 4-J =fÖ Φ d CQ -H -H Φ d TJ(0 T5 H d Φ H 4 4-> -H υ n 4-) or Φ CQ d: ( Ö 0 4-J = fÖ Φ d CQ -H -H Φ d TJ
N rö rH (Ö 3 d rH J 4J -H Xi 0. -H Φ rö i ϊ M cn « ε φ rH d d rH dN rö rH ( Ö 3 d rH J 4J -H Xi 0. -H Φ rö i ϊ M cn «ε φ rH dd rH d
4-> TJ tn « (Ö (Ö (Ö rö -H 3 rH J d Φ d 4-> (Ö d d rö 0 3 d Φ r4-> TJ tn «(Ö (Ö (Ö rö -H 3 rH J d Φ d 4-> (Ö d d rö 0 3 d Φ r
3 O CQ > X! 4-) Φ TJ rH H d 4-> QQ 4-> -H d 4 3 d rH H φ J d H Φ Φ φ ε d -H ϊ C xi 0) ε φ rH 4-) d N (Ö -H -d -H -d 3 01 Φ d 4-> J TJ αJ d 0 Λ Q -Q υ l o =fÖ H r4 d o X! TJ ε Φ Φ o 3 Φ i o cn co Φ 4-) d d tn φ « CJ CQ -H Φ d •H =3 d fÖ TJ Φ t-. d d s φ τ> CQ Φ -H •H • TJ rH Φ -d Φ CQ -Q Φ CQ M-l Φ CQ =3 rH 3 Φ d X d -H xi CQ d d Φ Φ d d rH d u -H 3 =3 4J d CQ 4H 4-1 Φ Φ TJ d cn Φ J3 O CQ> X! 4-) Φ TJ rH H d 4-> QQ 4-> -H d 4 3 d rH H φ J d H Φ Φ φ ε d -H ϊ C xi 0) ε φ rH 4-) d N ( Ö -H -d -H -d 3 01 Φ d 4-> J TJ αJ d 0 Λ Q -Q υ lo = fÖ H r4 do X! TJ ε Φ Φ o 3 Φ io cn co Φ 4-) dd tn φ «CJ CQ -H Φ d • H = 3 d fÖ TJ Φ t-. dds φ τ> CQ Φ -H • H • TJ rH Φ -d Φ CQ -Q Φ CQ Ml Φ CQ = 3 rH 3 Φ d X d -H xi CQ dd Φ Φ dd rH du -H 3 = 3 4J d CQ 4H 4-1 Φ Φ TJ d cn Φ J
Φ 0 Φ Φ Φ Φ -H rH Φ 3 (Ö H CQ TJ tö -d 4-> Φ 3 -H d S d d Φ CQ CQΦ 0 Φ Φ Φ Φ -H rH Φ 3 ( Ö H CQ TJ tö -d 4-> Φ 3 -H d S dd Φ CQ CQ
TJ CO X! tn d 4-) 4-) TJ Cn d 4-) Φ rH d CQ u d d <: Φ φ φ 3 3 (Ö 5 Φ HTJ CO X! tn d 4-) 4-) TJ Cn d 4-) Φ rH d CQ udd <: Φ φ φ 3 3 ( Ö 5 Φ H
<υ -d Φ -d xi d 4-J Φ Φ TJ -H 4J •H d Φ X CQ d N ft CQ H d X) CQ CJ 4 o ü OS d «0 -d 2 -d 0, d -d d .d Φ TJ n CJ -H Φ 1 CQ Φ J 4<υ -d Φ -d xi d 4-J Φ Φ TJ -H 4J • H d Φ X CQ d N ft CQ H d X) CQ CJ 4 o ü OS d «0 -d 2 -d 0, d -dd .d Φ TJ n CJ -H Φ 1 CQ Φ J 4
00 Φ CQ (0 5-4 φ -H •H rö Φ -!-! o o a 3 φ υ Φ -H in CQ Φ SH rH S-i SH S -*-! - d J 3 4-> Xi Xi TJ 4-> -ιH Φ 3 o J-l ε CQ 4-1 •H TJ Φ -H 5 0 Φ Φ Φ rH00 Φ CQ (0 5-4 φ -H • H rö Φ -! -! Ooa 3 φ υ Φ -H in CQ Φ SH rH Si SH S - * -! - d J 3 4-> Xi Xi TJ 4- > -ιH Φ 3 o Jl ε CQ 4-1 • H TJ Φ -H 5 0 Φ Φ Φ rH
© -d •H TJ •H CJ CJ d d Φ 4-> (Ö Q rH φ Φ d Φ XI TJ JH CQ 4-> rH 4-) XI - rH r© -d • H TJ • H CJ CJ dd Φ 4-> ( Ö Q rH φ Φ d Φ XI TJ JH CQ 4-> rH 4- ) XI - rH r
«3 .. Φ CQ CQ « Φ Φ rH J-3 Φ -Q rH Φ Cn υ X! d 4-> rH CQ rH 3 =P XI rö o >M d -H φ s 4 rH r ε TJ υ Φ ΛJ =3 Φ TJ CQ U rö Λ. φ -H rö & rö ω d Φ d (0 - rH -H Φ d (Ö φ d J t 3 0 d φ -H SH JH ε d 4-) -H 5- " 3 .. Φ CQ CQ" Φ Φ rH J-3 Φ -Q rH Φ Cn υ X! d 4-> rH CQ rH 3 = P XI rö o> M d -H φ s 4 rH r ε TJ υ Φ ΛJ = 3 Φ TJ CQ U rö Λ. φ -H rö & rö ω d Φ d (0 - rH -H Φ d ( Ö φ d J t 3 0 d φ -H SH JH ε d 4-) -H 5-
3 H -d φ rö rö Φ rH Φ Φ TJ •H -H (Ö fÖ JH Φ 3 -H rH ft rö rö 0 0 Φ3 H -d φ rö rö Φ rH Φ Φ TJ • H -H ( Ö fÖ JH Φ 3 -H rH ft rö rö 0 0 Φ
Λ: 4-1 o Q 4-J 4-) 4J Φ Ξε 4-> Λ 0 Φ Ϊ5 Q CQ 4-) TJ > Q Φ φ CQ > a u > ε -H m T Λ: 4-1 o Q 4-J 4-) 4J Φ Ξε 4-> Λ 0 Φ Ϊ5 Q CQ 4- ) TJ> Q Φ φ CQ>au> ε -H m T
dadurch die Bestückung von Platinen mit großen Stückzahlen und wenig Aufwand gelingt.this enables the assembly of boards with large quantities and little effort.
Die Oberflächenmontierbarkeit des erfindungsgemäßen Bauelements kann aufgrund der Schutzschicht leicht erlangt werden.The surface mountability of the component according to the invention can easily be achieved due to the protective layer.
Im folgenden wird die Erfindung anhand eines Ausführungsbei- spiels und den dazugehörigen Figuren näher erläutert.The invention is explained in more detail below on the basis of an exemplary embodiment and the associated figures.
Figur 1 zeigt beispielhaft ein erfindungsgemäßes Bauelement in schematisch-perspektivischer Darstellung.Figure 1 shows an example of a component according to the invention in a schematic perspective view.
Figur 2A zeigt das Bauelement aus Figur 1 in einem schematischen Querschnitt .FIG. 2A shows the component from FIG. 1 in a schematic cross section.
Figur 2B zeigt das Bauelement aus Figur 1 in einem schematischen Längsschnitt .FIG. 2B shows the component from FIG. 1 in a schematic longitudinal section.
Figur 3 zeigt den Bereich der Kontaktschicht des Bauelements aus Figur 2B.FIG. 3 shows the area of the contact layer of the component from FIG. 2B.
Figur 4 zeigt die elektrische Kennlinie eines erfindungsgemäßen Bauelements gemäß Figur 1 im Vergleich mit der Kennlinie eines bekannten Bauelements in einer schematischen Darstellung.FIG. 4 shows the electrical characteristic curve of a component according to the invention according to FIG. 1 in comparison with the characteristic curve of a known component in a schematic illustration.
Figur 5A zeigt ein weiteres Beispiel für ein erfindungsgemäßes Bauelement in Form eines Varistor-Arrays .FIG. 5A shows a further example of a component according to the invention in the form of a varistor array.
Figur 5B zeigt einen ersten Längsschnitt des Bauelements aus Figur 5A.FIG. 5B shows a first longitudinal section of the component from FIG. 5A.
Figur 5C zeigt einen zweiten Längsschnitt des Bauelements aus Figur 5A.FIG. 5C shows a second longitudinal section of the component from FIG. 5A.
Figur 1 zeigt ein erfindungsgemäßes keramisches Bauelement, das einen Grundkörper 1 aufweist, an dem eine erste Kontakt- Schicht 2 und eine zweite Kontaktschicht 3 angeordnet ist. Die beiden Kontaktschichten 2, 3 sind galvanisch aufgebrachte Zinnschichten. Mit Hilfe dieser Zinnschichten kann das Bauelement in SMD-Montage auf eine Leiterplatte gelötet werden.FIG. 1 shows a ceramic component according to the invention, which has a base body 1 on which a first contact Layer 2 and a second contact layer 3 is arranged. The two contact layers 2, 3 are galvanically applied tin layers. With the help of these tin layers, the component can be soldered onto a printed circuit board in SMD assembly.
Auf der Oberseite des Grundkörpers 1 ist eine Schutzschicht 4 aufgebracht, die ZnMn04 enthält. An einer Seitenfläche des Grundkörpers 1 ist eine weitere Schutzschicht 7 aufgebracht, die eine PLZT-Keramik enthält und die durch Siebdrucken aufgebracht ist. Die Schutzschicht 4 ist durch Laminieren einer keramischen Grünfolie auf der Oberseite des Grundkörpers 1 aufgebracht .A protective layer 4, which contains ZnMn0 4 , is applied to the top of the base body 1. A further protective layer 7, which contains a PLZT ceramic and which is applied by screen printing, is applied to one side surface of the base body 1. The protective layer 4 is applied by laminating a ceramic green sheet on the top of the base body 1.
Figur 2A zeigt das Bauelement aus Figur 1 im schematischen Querschnitt . Der Grundkörper 1 besteht aus einem Stapel 5 von übereinander liegenden Elektrodenschichten 6, die durch Keramikschichten 9 voneinander getrennt sind. Als Material für die leitfähigen Elektrodenschichten 6 kommt vorteilhafterweise Palladium oder Silber zum Einsatz. Diese beiden Edelmetalle haben den Vorteil, daß sie an Luft gesintert werden können, wodurch auf eine elektrodenspezifische Sinteratmosphäre verzichtet werden kann.FIG. 2A shows the component from FIG. 1 in a schematic cross section. The base body 1 consists of a stack 5 of electrode layers 6 lying one above the other, which are separated from one another by ceramic layers 9. Palladium or silver is advantageously used as the material for the conductive electrode layers 6. These two precious metals have the advantage that they can be sintered in air, which means that an electrode-specific sintering atmosphere can be dispensed with.
Die Keramikschichten 9 enthalten eine Varistorkeramik, die eine mit Aluminium-, Kobalt- und Manganoxid dotierte Zinkoxidkeramik ist. Ein solches keramisches Material hat den Vorteil, daß es in einem Varistor verwendet werden kann. Auf der Ober- und auf der Unterseite des Stapels 5 ist jeweils eine Schutzschicht 4 angeordnet. Die Schichten 6, 9 des Stapels 5 sind mit den beiden Schutzschichten 4 in einem gemeinsamen Sinterprozeß hergestellt. Die Schutzschichten 4 haben typischerweise eine Dicke von 20 bis 40 μmThe ceramic layers 9 contain a varistor ceramic, which is a zinc oxide ceramic doped with aluminum, cobalt and manganese oxide. Such a ceramic material has the advantage that it can be used in a varistor. A protective layer 4 is arranged on the top and on the bottom of the stack 5. The layers 6, 9 of the stack 5 are produced with the two protective layers 4 in a common sintering process. The protective layers 4 typically have a thickness of 20 to 40 μm
Das Prinzip der für den Grundkörper verwendeten Varistorkeramik ist dem Fachmann an sich bekannt. Als Hauptbestandteil kommt Zinkoxid zum Einsatz, welches mit Bismutoxid, Antimonoxid, Kobaltoxid, Manganoxid und weiteren Metalloxiden oder 1 φ J nThe principle of the varistor ceramic used for the base body is known per se to the person skilled in the art. The main component is zinc oxide, which is mixed with bismuth oxide, antimony oxide, cobalt oxide, manganese oxide and other metal oxides or 1 φ J n
-H 1 -H 01 d 1 d , C d d 1 φ Φ d IΛ Φ 54 54 Φ TJ d CQ Φ -H 3 4-J 3 Φ co Xi -H H -H - CQ - H-H 1 -H 01 d 1 d, C dd 1 φ Φ d IΛ Φ 54 54 Φ TJ d CQ Φ -H 3 4-J 3 Φ co Xi -H H -H - CQ - H
© 4-1 Φ CQ d Φ -H - ε 3 H rö 4-J Φ -H Cn TJ φ J TJ TJ Φ© 4-1 Φ CQ d Φ -H - ε 3 H rö 4-J Φ -H Cn TJ φ J TJ TJ Φ
© w d Q , 4-> 0 φ 54 TJ x> d X 1 d CN Φ d d J -H© w d Q, 4-> 0 φ 54 TJ x> d X 1 d CN Φ d d J -H
Φ φ »M 54 54 Φ 54 4J -H J N 4-J Φ 1 -* -H Φ X » J 4-JΦ φ »M 54 54 Φ 54 4J -H J N 4-J Φ 1 - * -H Φ X» J 4-J
© TJ • rH rö Cn φ TJ d Φ in MH xi φ 4-J -H TJ 4-J 4-J Cn 54 X φ CJ D d CQ W TJ 4-> φ X! 4-> Φ 5 rö TJ 3 4-J 01 3© TJ • rH rö Cn φ TJ d Φ in MH xi φ 4-J -H TJ 4-J 4-J Cn 54 X φ CJ D d CQ W TJ 4-> φ X! 4-> Φ 5 rö TJ 3 4-J 01 3
Q ε d X! X -H XI -HQ ε d X! X -H XI -H
Φ CQ rH 3 -H -H 54 φ Xi 54 Φ X Φ CJ rö X MH -H -H N d H H s H φ -H N φ Φ Φ 4-J CQ rH Φ XI υ rH cn -rH 4-J =rö 3 ≥ φ 4-J Φ d 4-J U 3 54 Φ Sä XI d X! -H -H XI O Φ X d Cn d CQ 3 J Φ • d α. 4-> 4-> rö 4-) 4-> H ü Φ φ o cn 54 -H CJ 0 1 H 54 X 0 X d φΦ CQ rH 3 -H -H 54 φ Xi 54 Φ X Φ CJ rö X MH -H -HN d H H s H φ -HN φ Φ Φ 4-J CQ rH Φ XI υ rH cn -rH 4- J = rö 3 ≥ φ 4-J Φ d 4-JU 3 54 Φ Sä XI d X! -H -H XI O Φ X d Cn d CQ 3 J Φ • d α. 4->4-> ro 4-) 4-> H ü Φ φ o cn 54 -H CJ 0 1 H 54 X 0 X d φ
4-1 Φ N Φ 54 X! 4J ». Φ H -ϊ 4-J 54 54 3 rH CQ ü-J P 54 Φ Φ U 54 φ4-1 Φ N Φ 54 X! 4y ». Φ H -ϊ 4-J 54 54 3 rH CQ ü-JP 54 Φ Φ U 54 φ
5-1 TJ 4-) d o O •H 4-J rH Φ 54 54 rö «. φ n 5-1 4-) 2 φ 4-) O 4-J 4-J Φ ε5-1 TJ 4-) do O • H 4-J rH Φ 54 54 rö «. φ n 5-1 4- ) 2 φ 4- ) O 4-J 4-J Φ ε
Φ d Φ -H > -H ε X ; 54 Φ O TJ CN d -H Φ X CO J tH ß X CQ cn HΦ d Φ -H> -H ε X; 54 Φ O TJ CN d -H Φ X CO J tH ß X CQ cn H
4-J Φ 01 rH d υ 54 i > •H Cn XI rö CQ d Φ Φ d Φ d Sε 4-> d Φ Φ •H Φ O 4-J d Φ =3 4-J Φ Φ S 54 Φ ι- X H 34-J Φ 01 rH d υ 54 i> • H Cn XI rö CQ d Φ Φ d Φ d Sε 4-> d Φ Φ • H Φ O 4-J d Φ = 3 4-J Φ Φ S 54 Φ ι - X H 3
-H Φ X! φ in CQ TJ Φ 01 r 01 Φ CQ d d -H d d Φ J 54 w 54 rö --H Φ X! φ in CQ TJ Φ 01 r 01 Φ CQ d d -H d d Φ J 54 w 54 rö -
CQ Φ CJ d Φ Φ X) X -H -H 4J 4J 3 Φ 0 P -H φ a d rö ε 54 CQCQ Φ CJ d Φ Φ X) X -H -H 4J 4J 3 Φ 0 P -H φ a d rö ε 54 CQ
Φ > ε -H d CQ -H XI H s d Xi -H • rö cn « Φ 54 54 3 X) xi 3 φ n 3 d =0 rH J J ε φ 01 u ε d Φ • CQ X! =0 4-1 J -rH > ΦΦ> ε -H d CQ -H XI H sd Xi -H • rö cn «Φ 54 54 3 X) xi 3 φ n 3 d = 0 rH JJ ε φ 01 u ε d Φ • CQ X! = 0 4-1 J -rH> Φ
CQ H - Φ X rö rö 4-J 4J W -H Φ 4-J Cn Φ 4J -rö X 1 X -H J 4->CQ H - Φ X rö rö 4-J 4J W -H Φ 4-J Cn Φ 4J -rö X 1 X -HJ 4->
TJ s 5-4 Λ; a J -H X) — X! X! H X d 4-J X! 4-J -ϊ J 54 J CQ rö CQ rH d rö 54 TJ rö d ε X Φ J . J cj φ -H CQ CJ d d Φ -H rH -PTJ s 5-4 Λ; a J -H X) - X! X! H X d 4-J X! 4-J -ϊ J 54 J CQ rö CQ rH d rö 54 TJ rö d ε X Φ J. J cj φ -H CQ CJ d d Φ -H rH -P
3 E-ι CQ rö d 4-) -H (Ö -tH Φ -H d 01 01 Φ ε Φ 54 rö Φ d 3 X CQ d rH d Φ3 E-ι CQ rö d 4-) -H (Ö -tH Φ -H d 01 01 Φ ε Φ 54 rö Φ d 3 X CQ d rH d Φ
4-) 3 • CQ CQ 54 d 1 X X! Φ 4-J 54 T) Φ ϊ Φ 54 ε Φ 54 O Φ rö φ 4-J4-) 3 • CQ CQ 54 d 1 XX! Φ 4-J 54 T) Φ ϊ Φ 54 ε Φ 54 O Φ rö φ 4-J
4 d 5-1 CQ d 4-) Φ rö •-{ CJ ü TJ X Φ Φ rH N XI Φ TJ CD TJ C-. ε CQ4 d 5-1 CQ d 4-) Φ rö • - {CJ ü TJ X Φ Φ rH N XI Φ TJ CD TJ C-. ε CQ
N Φ Φ MH Φ X! » > rH -H 01 54 rö a XI Φ Φ Φ rH 54 CN d Φ ΦN Φ Φ MH Φ X! »> RH -H 01 54 rö a XI Φ Φ Φ rH 54 CN d Φ Φ
4 5H J φ 3 TJ J d 1 rH Φ J N Φ 4J 54 3 d d Cn Φ 54 d Φ -H J rH Cn4 5H J φ 3 TJ J d 1 rH Φ J N Φ 4J 54 3 d d Cn Φ 54 d Φ -H J rH Cn
Φ Φ 0 d rö 54 H Φ rö d 4-J 4-J 5 d =0 3 rö < -H MH 3 0 Φ J 54 MH d Φ 54Φ Φ 0 d rö 54 H Φ rö d 4-J 4-J 5 d = 0 3 rö <-H MH 3 0 Φ J 54 MH d Φ 54
CQ TJ H Φ i CQ N O -iH X! 3 0 X N CQ Φ 3 rö > J 3 Φ 3 3 rö σ> 54 d l φ Φ S CJ 01 H a CJ X! 4-J « J • rö CQ MH cn X) rö TJCQ TJ H Φ i CQ NO -iH X! 3 0 XN CQ Φ 3 rö> J 3 Φ 3 3 rö σ> 54 dl φ Φ S CJ 01 H a CJ X! 4-J «J • rö CQ MH cn X) rö TJ
Φ rö -H CO °2 CU ε CO -H O X! d X Φ H 4-J rH MH 3 -H CQΦ rö -H CO ° 2 CU ε CO -H O X! d X Φ H 4-J rH MH 3 -H CQ
> TJ d d 4J ε Φ X! CQ CJ d 3 -H Xi 01 r ε 3 rö tu rH Φ CQ d 0 φ -H Φ o 54 d 54 ü rö 0 54 ε ü 54 -H CQ rö X 01 CN d φ φ CQ rH TJ φ 3 Φ H φ CO d 54 CD rö co Φ 4-J TJ 54 TJ d CQ rH Φ> TJ dd 4J ε Φ X! CQ CJ d 3 -H Xi 01 r ε 3 rö tu rH Φ CQ d 0 φ -H Φ o 54 d 54 ü rö 0 54 ε ü 54 -H CQ rö X 01 CN d φ φ CQ rH TJ φ 3 Φ H φ CO d 54 CD rö co Φ 4-J TJ 54 TJ d CQ rH Φ
Φ 5H CQ H d d TJ N d φ d Φ XI 54 -<H a rH X! Φ d -H 54 -H T5 TJ -Φ 5H CQ H dd TJ N d φ d Φ XI 54 - <H a rH X! Φ d -H 54 -H T5 TJ -
DI 3 rö φ d Φ -H -H φ 54 Φ 4-J 01 Φ ε 54 J d a -H Φ CO d d 4J 5 Φ 5 d d Φ 54 Φ 54 φ cn xi φ rö =0 CQ -H Φ 54 -. CQ X a TJ 3DI 3 rö φ d Φ -H -H φ 54 Φ 4-J 01 Φ ε 54 J d a -H Φ CO d d 4J 5 Φ 5 d d Φ 54 Φ 54 φ cn xi φ rö = 0 CQ -H Φ 54 -. CQ X a TJ 3
3 a fc-J 54 Φ Φ Φ Φ 4-J MH J TJ 1 54 X 54 X X =0 CN ü 54 CQ d3 a fc-J 54 Φ Φ Φ Φ 4-J MH J TJ 1 54 X 54 X X = 0 CN ü 54 CQ d
TJ Φ d 1 Φ xi Cn CQ X) -H d H 3 -H rH Φ J Φ O -H X TJ 3 =0 3 rö d N i φ CQ J rö 3 »3 Φ H Φ rö d φ •- X d a 01 Φ TJ d rö rö X rö 4-J CNTJ Φ d 1 Φ xi Cn CQ X) -H d H 3 -H rH Φ J Φ O -HX TJ 3 = 0 3 rö d N i φ CQ J rö 3 » 3 Φ H Φ rö d φ • - X da 01 Φ TJ d rö rö X rö 4-J CN
-H Φ ü -H Cn -rö 54 rö d X) Φ s X! Φ 3 54 4-> rH d Φ X) J CQ-H Φ ü -H Cn -rö 54 rö d X) Φ s X! Φ 3 54 4-> rH d Φ X) J CQ
XI pei 5-4 rH d 54 rH 4-J Φ rH d Φ υ d CQ 54 :0 X 54 3 4-J ; Φ d Cn 54 d :XI pei 5-4 rH d 54 rH 4-J Φ rH d Φ υ d CQ 54: 0 X 54 3 4-J; Φ d Cn 54 d:
5H 3 rö 3 0 MH IM r Cn CQ X Φ Φ rH -rö -H rö CD X rö Φ 54 X -H -H . 3 d Φ φ5H 3 rö 3 0 MH IM r Cn CQ X Φ Φ rH -rö -H rö CD X rö Φ 54 X -H -H. 3 d Φ φ
Φ d TJ -H d 4J d 3 Φ rH -H 54 r-\ r-i a J TJ 4-J CD J d TJ 4-J 3 TJ 54Φ d TJ -H d 4J d 3 Φ rH -H 54 r- \ r-i a J TJ 4-J CD J d TJ 4-J 3 TJ 54
> -H 54 d CQ φ rö d Cn ö Φ TJ X! rö MH CQ d d d -H rö Φ CD Xi -H 3 rH X! 4-) φ rö -H 4-) Φ -H rö 54 4J Φ 3 0 n CQ X > rH d u 12 cn rH 3 4-J a 54 -H d 4-J Cn d TJ d IM -. φ CQ cn X 54 i- Φ CJ rH J CQ co H rö Φ ε rö co rö Φ Φ X! d Φ Φ 54 Xi XI 3 -H J CD -. TJ CQ rö CQ φ •H d Cn> -H 54 d CQ φ rö d Cn ö Φ TJ X! rö MH CQ ddd -H rö Φ CD Xi -H 3 rH X! 4-) φ rö -H 4-) Φ -H rö 54 4J Φ 3 0 n CQ X> rH du 12 cn rH 3 4-J a 54 -H d 4-J Cn d TJ d IM -. φ CQ cn X 54 i- Φ CJ rH J CQ co H rö Φ ε rö co rö Φ Φ X! d Φ Φ 54 Xi XI 3 -HJ CD -. TJ CQ rö CQ φ • H d Cn
4-> 4-> CQ 2 1 > CO X CJ 3 X Xi d Φ J O rö Φ CQ Φ CN 4-J CD 54 0 TJ 2 φ4-> 4-> CQ 2 1> CO X CJ 3 X Xi d Φ J O rö Φ CQ Φ CN 4-J CD 54 0 TJ 2 φ
Φ •H •H ε υ H X O ü d > H N -H CQ 4-J N X Φ Φ X dΦ • H • H ε υ HXO ü d> HN -H CQ 4-JNX Φ Φ X d
2 Φ CQ d 0 CQ d -H Xi 54 -H 54 =o X rH 54 <tf ε Φ H d 4-) rö ε a 01 d 54 ü φ2 Φ CQ d 0 CQ d -H Xi 54 -H 54 = o X rH 54 <tf ε Φ H d 4-) rö ε a 01 d 54 ü φ
00 5 Φ 54 rH Φ TJ CJ H TJ 3 X u cn φ CQ rö J φ φ 3 4-> -H 54 d 54 φ CQ S - d ε 4J 4J rö TJ 4-J CQ 5 4-> Q 3 =o TJ 4J CN 54 -ä 4J X d =0 rö φ d ε00 5 Φ 54 rH Φ TJ CJ H TJ 3 X u cn φ CQ rö J φ φ 3 4-> -H 54 d 54 φ CQ S - d ε 4J 4J rö TJ 4-J CQ 5 4-> Q 3 = o TJ 4J CN 54 -ä 4J X d = 0 rö φ d ε
© Φ d Φ d CQ xi N N X! .».-, 54 d X d -H X d© Φ d Φ d CQ xi N N X! . ».-, 54 d X d -H X d
Φ J d φ d ü 4-J 4- • ε Xi Φ d N X J 0 J υΦ J d φ d ü 4-J 4- • ε Xi Φ d N X J 0 J υ
© ε TJ Φ ü 54 X Φ J co , Φ TS ^ d Φ 0 -H© ε TJ Φ ü 54 X Φ J co, Φ TS ^ d Φ 0 -H
Φ d rö Φ co rö -H 3 3 -H d a. XI 54 rH -H 3 4-J Φ -H d -Φ d rö Φ co rö -H 3 3 -H d a. XI 54 rH -H 3 4-J Φ -H d -
O TJ d -H d X! -H X! X! Xi Xi d Φ φ -H X! Cn ε -H d X ε 3 3 d CQ d CQ d =0 Φ Φ υ Φ ε CJ J ü υ rö LD -H XI Φ ü -H Φ -H CJ 3 (ü =rö 54 φ ε 3 Φ rö rö - -Q cn CQ D co O CO co J-i r4 O rö 01 tu d O Φ CQ N J o CD 4-> rö TJ P O TJ d -H d X! -HX! X! Xi Xi d Φ φ -HX! Cn ε -H d X ε 3 3 d CQ d CQ d = 0 Φ Φ υ Φ ε CJ J ü υ rö LD -H XI Φ ü -H Φ -H CJ 3 (ü = rö 54 φ ε 3 Φ rö rö - -Q cn CQ D co O CO co Ji r4 O rö 01 tu d O Φ CQ NJ o CD 4-> rö TJ P
Ausgehend von einer mit Aluminium-, Kobalt- und Manganoxid dotierten Zinkoxidkeramik, deren Gefügeausbildung im nachfolgenden Sinterprozeß durch weitere Zusätze, vor allem Bi2θ3 Sb2θ3, Siθ2, NiO und Cr2θ3 sowie etwas Borsäure gesteuert wird, wird die Rohstoffmischung zu einem Schlicker aufbereitet und zu keramischen Grünfolien verarbeitet. Die Verarbeitung der keramischen Grünfolien geschieht in einem Siebdruckverfahren mit einer zur gemeinsamen Sinterung mit der Keramik geeigneten Edelmetallpaste, mit der die Grünfolien bedruckt werden. Diese Edelmetallpaste stellt die gesinterten Elektrodenschichten 6 dar.Starting from a zinc oxide ceramic doped with aluminum, cobalt and manganese oxide, the structure of which is controlled in the subsequent sintering process by further additives, especially Bi2θ 3 Sb2θ 3 , Siθ2, NiO and Cr2θ 3 as well as some boric acid, the raw material mixture is processed into a slip and processed into ceramic green foils. The ceramic green foils are processed in a screen printing process using a precious metal paste suitable for sintering with the ceramic, with which the green foils are printed. This precious metal paste represents the sintered electrode layers 6.
Die bedruckten Grünfolien werden gestapelt, laminiert und durch Schneiden vereinzelt, woraus Grünteile einer bestimmten, im wesentlichen durch die geometrischen Abmessungen gegebenen, miniaturisierten Bauform von Vielschichtvaristoren entstehen. Bei diesem Prozeß werden als Basis- und Deckfolie schutzgebende Keramikfolien (Schutzschichten 4) aus einer Spinell-Keramik angewendet, die einen hohen elektrischen Widerstand aufweisen, gegenüber den später anzuwendenden Galvanikbädern chemisch stabil und in ihrem Sinterverhalten an die Varistorkeramik angepaßt sind.The printed green foils are stacked, laminated and separated by cutting, from which green parts of a certain miniaturized design of multilayer varistors, essentially given by the geometric dimensions, result. In this process protective ceramic foils (protective layers 4) made of a spinel ceramic are used as the base and cover foil, which have a high electrical resistance, are chemically stable with respect to the electroplating baths to be used later and are adapted in their sintering behavior to the varistor ceramic.
Nach dem Schneiden werden die Grünteile an den jeweiligen Schnittseiten mit einer Siebdruckpaste, bestehend aus dem gleichen passivierenden Material bedruckt. Die so aufgebauten Grünteile werden nach dem sorgfältigen Entbindern (Entfernen von Kohlenstoffresten) gesintert und anschließend an den Stirnseiten im Bereich der austretenden Elektrodenschichten 6 im Tauchverfahren mit einer Metallpaste, bestehend aus Silber oder einer silberhaltigen Legierung, versehen. Das Silber beziehungsweise die silberhaltige Legierung wird anschließend in einem gesonderten Prozeßschritt eingebrannt, wodurch der Kontakt zu den Elektrodenschichten 6 des Bauelements hergestellt wird. Diese Silberschicht bildet gleichzeitig die Startschicht 10 der Galvanik, die, wie in Figur 3 dargestellt, Teil der zweiten Kontaktschicht 3 ist. Anschließend wird die eingebrannte Metallpaste mit einer Metallschicht 8, die eine Nickel- oder Zinnschicht oder auch eine Nickel/Zinn-Doppelschicht sein kann, zur Herstellung der Kontaktschichten 2, 3 galvanisch überzogen, wodurch die SMD-Fähigkeit des Bauelements hergestellt wird. Die Schutzschichten 4, 7 verhindern die ätzende partielle Auflösung der Varistorkeramik und darüber hinaus die Abscheidung von Nickel oder Zinn auf der Keramikoberfläche zwischen den Stirnseiten des Bauelementes. Beim Sintern verdichtet die Schutzschicht 4 weitgehend span- nungs- und porenfrei, so daß die mit der Schutzschicht 4 bedruckten Flächen weitgehend dicht sind und vor dem Säureangriff eines Galvanikbades schützen.After cutting, the green parts are printed on the respective cut sides with a screen printing paste consisting of the same passivating material. The green parts constructed in this way are sintered after careful debinding (removal of carbon residues) and then provided with a metal paste consisting of silver or a silver-containing alloy on the end faces in the area of the emerging electrode layers 6 by immersion. The silver or the silver-containing alloy is then burned in in a separate process step, as a result of which contact is made with the electrode layers 6 of the component. This silver layer also forms the starting layer 10 of the electroplating which, as shown in FIG. 3, is part of the second contact layer 3. The baked metal paste is then galvanically coated with a metal layer 8, which can be a nickel or tin layer or also a nickel / tin double layer, to produce the contact layers 2, 3, as a result of which the component's SMD capability is established. The protective layers 4, 7 prevent the caustic partial dissolution of the varistor ceramic and, moreover, the deposition of nickel or tin on the ceramic surface between the end faces of the component. During sintering, the protective layer 4 compresses largely free of tension and pores, so that the surfaces printed with the protective layer 4 are largely sealed and protect against the acid attack of an electroplating bath.
Damit die Schutzschicht ihre Schutzfunktion erfüllen kann, muß sie eine Schichtdicke zwischen 20 und 50 μm aufweisen.So that the protective layer can fulfill its protective function, it must have a layer thickness between 20 and 50 μm.
Figur 4 zeigt die elektrische Kennlinie 11 eines erfindungsgemäßen Bauelements im Vergleich mit der elektrischen Kennlinie 12 eines bekannten Bauelements mit einer Schutzschicht aus PLZT-Keramik. In Figur 4 ist dabei der elektrische Strom in der Einheit mA gegenüber der elektrischen Spannung in der Einheit V aufgetragen. Es ist deutlich zu erkennen, daß das erfindungsgemäße Bauelement bei niedrigen Spannungen einen geringeren Leckstrom als das bekannte Bauelement aufweist, was auf die verringerte chemische Beeinflussung der Varistorkeramik durch die Schutzschicht aus der Spinell-Keramik zurückzuführen ist. Demgegenüber zeigt die Kennlinie 12 des bekannten Bauelements mit einer Schutzschicht aus PLZT-Keramik, daß der elektrische Widerstand des Varistors bei niedrigen Spannungen klein ist, was aufgrund der üblicherweise verwendeten Parallelschaltung des Varistors zu der zu schützenden elektrischen Schaltung nachteilig ist.FIG. 4 shows the electrical characteristic curve 11 of a component according to the invention in comparison with the electrical characteristic curve 12 of a known component with a protective layer made of PLZT ceramic. In FIG. 4, the electrical current in the unit mA is plotted against the electrical voltage in the unit V. It can be clearly seen that the component according to the invention has a lower leakage current than the known component at low voltages, which is due to the reduced chemical influence of the varistor ceramic by the protective layer made of the spinel ceramic. In contrast, the characteristic curve 12 of the known component with a protective layer made of PLZT ceramic shows that the electrical resistance of the varistor is low at low voltages, which is disadvantageous due to the commonly used parallel connection of the varistor to the electrical circuit to be protected.
Figur 5A zeigt ein erfindungsgemäßes Bauelement in Form eines Varistor-Arrays in perspektivischer Darstellung. Das Bauele- ment weist einen Grundkörper 1 auf, der aus miteinander verstapelten Elektrodenschichten und Keramikschichten in Viel- schichttechnologie hergestellt ist. Als unterste beziehungsweise oberste Schicht des Schichtstapels ist eine Schutzschicht 4 vorgesehen, die eine Spinell-Keramik der Zusammensetzung AB204 enthält. Dabei sind nun mehrere Einzelelemente gemäß den Figuren 1 bis 3 in einem einzigen Keramikkörper zusammengefaßt. Für jedes der Einzelelemente ist ein Paar von Kontaktschichten 2, 3 vorgesehen, die an einander gegenüberliegenden Außenflächen des Grundkörpers 1 angeordnet sind.FIG. 5A shows a component according to the invention in the form of a varistor array in a perspective view. The construction ment has a base body 1, which is produced from stacked electrode layers and ceramic layers using multilayer technology. A protective layer 4, which contains a spinel ceramic of the composition AB 2 0 4 , is provided as the bottom or top layer of the layer stack. Several individual elements according to FIGS. 1 to 3 are now combined in a single ceramic body. For each of the individual elements, a pair of contact layers 2, 3 are provided, which are arranged on opposite outer surfaces of the base body 1.
Figur 5B zeigt in einem Längsschnitt von Figur 5A die Anordnung der Elektrodenschichten 6, die die Innenelektroden des Bauelements bilden. Die Elektrodenschichten 6 sind in Form von vier nebeneinanderliegenden Stapeln 5 angeordnet. Aus dem Längsschnitt gemäß Figur 5C geht hervor, daß die in einer Ebene liegenden Elektrodenschichten 6 eines jeden Stapels 5 mit einer Außenelektrode 2 elektrisch leitend verbunden sind. Dabei ist jedem Stapel 5 von Elektrodenschichten 6 ein Paar von Außenelektroden 2, 3 zugeordnet. Die Außenelektroden 2, 3 sind jeweils elektrisch voneinander isoliert. In Figur 5C sind darüber hinaus die unter der in der Zeichenebene liegenden Elektrodenschichten 6 angeordneten Elektrodenschichten in Form von gestrichelten Linien dargestellt. Die mit gestrichelter Linie gekennzeichneten Elektrodenschichten sind mit Kontaktschichten 3 elektrisch leitend verbunden, die auf der den Kontaktschichten 2 gegenüberliegenden Seite des Bauelements angeordnet sind. Übereinanderliegende Elektroden überlappen einander teilweise, wobei benachbarte Elektrodenschichten mit unterschiedlichen Kontaktschichten 2, 3 kontaktiert sind.FIG. 5B shows in a longitudinal section from FIG. 5A the arrangement of the electrode layers 6 which form the internal electrodes of the component. The electrode layers 6 are arranged in the form of four adjacent stacks 5. It can be seen from the longitudinal section according to FIG. 5C that the electrode layers 6 of each stack 5 lying in one plane are electrically conductively connected to an outer electrode 2. Each stack 5 of electrode layers 6 is assigned a pair of outer electrodes 2, 3. The outer electrodes 2, 3 are each electrically insulated from one another. FIG. 5C also shows the electrode layers arranged under the electrode layers 6 lying in the plane of the drawing in the form of dashed lines. The electrode layers marked with a dashed line are electrically conductively connected to contact layers 3, which are arranged on the side of the component opposite the contact layers 2. Electrodes lying one above the other partially overlap one another, with adjacent electrode layers being contacted with different contact layers 2, 3.
Die in den Figuren 5A und 5B dargestellte Schutzschicht dient als Passivierung, die entweder den Schutz des Bauelements vor ätzenden Galvanikbädern bewirkt oder aber, falls keine galvanische Verstärkung der Kontaktschichten 2, 3 notwendig ist, zur Erhöhung des Oberflächenwiderstands des Bauelements beiträgt .The protective layer shown in FIGS. 5A and 5B serves as passivation, which either protects the component from caustic electroplating baths or, if no galvanic reinforcement of the contact layers 2, 3 is necessary, contributes to increasing the surface resistance of the component.
Die von den Schutzschichten 4 freien Oberflächen des Grundkörpers 1 können entweder frei bleiben oder mittels geeigneter Verfahren unter Verwendung anderer Materialien ebenfalls passiviert werden.The surfaces of the base body 1 free from the protective layers 4 can either remain free or can also be passivated by means of suitable processes using other materials.
Das in den Figuren 5A bis 5C gezeigte Varistor-Array enthält mehrere Varistoren, die gemäß den Figuren 1, 2A und 2B aufgebaut sind, nebeneinander in einem Bauelement.The varistor array shown in FIGS. 5A to 5C contains several varistors, which are constructed according to FIGS. 1, 2A and 2B, side by side in one component.
Die angegebenen keramischen Materialien können gegebenenfalls weitere übliche Bestandteile in geringen Mengen enthalten, die die gewünschten Eigenschaften nicht beeinträchtigen.The specified ceramic materials can optionally contain other conventional constituents in small amounts that do not impair the desired properties.
Die Erfindung beschränkt sich nicht auf das dargestellte Aus- führungsbeispiel, sondern wird in ihrer allgemeinsten Form durch Patentanspruch 1 definiert. The invention is not limited to the exemplary embodiment shown, but is defined in its most general form by patent claim 1.

Claims

Patentansprüche claims
1. Elektrisches Bauelement1. Electrical component
- mit einem Grundkörper (1) , der ein Keramikmaterial enthält,- With a base body (1) containing a ceramic material,
- mit mindestens zwei auf der Oberfläche des Grundkörpers (1) vorgesehenen Kontaktschichten (2, 3) ,- With at least two contact layers (2, 3) provided on the surface of the base body (1),
- bei dem der von Kontaktschichten (2, 3) freie Teil der Oberfläche des Grundkörpers (1) wenigstens teilweise von einer Schutzschicht (4) bedeckt ist, die eine Spinell-Keramik der Zusammensetzung AB2O4 enthält.- In which the part of the surface of the base body (1) free of contact layers (2, 3) is at least partially covered by a protective layer (4) which contains a spinel ceramic of the composition AB2O4.
2. Bauelement nach Anspruch 1, bei dem das Keramikmaterial des Grundkörpers (1) eine Varistorkeramik enthält .2. The component according to claim 1, wherein the ceramic material of the base body (1) contains a varistor ceramic.
3. Bauelement nach einem der Ansprüche 1 bis 2, bei dem die Zusammensetzung der Spinell-Keramik so gewählt ist, daß sie mit dem Keramikmaterial des Grundkorpers (1) gemeinsam sinterbar ist.3. Component according to one of claims 1 to 2, wherein the composition of the spinel ceramic is selected so that it is sinterable together with the ceramic material of the base body (1).
4. Bauelement nach einem der Ansprüche 1 bis 3, bei dem die Zusammensetzung der Spinell-Keramik so gewählt ist, daß die Schutzschicht (4) einen spezifischen elektrischen Widerstand größer als 1 MΩcm aufweist.4. Component according to one of claims 1 to 3, wherein the composition of the spinel ceramic is selected so that the protective layer (4) has a specific electrical resistance greater than 1 MΩcm.
5. Bauelement nach einem der Ansprüche 1 bis 4, bei dem die Zusammensetzung der Spinell-Keramik ZnMn2Ü4 ist.5. The component according to one of claims 1 to 4, wherein the composition of the spinel ceramic is ZnMn 2 Ü4.
6. Bauelement nach einem der Ansprüche 1 bis 5, das durch Sintern eines Stapels (5) von übereinander liegenden keramischen Grünfolien und elektrisch leitenden Elektrodenschichten (6) hergestellt ist, wobei die oberste und die unterste Grünfolie des Stapels (5) eine Spinell-Keramik der Zusammensetzung AB2O4 enthält.6. Component according to one of claims 1 to 5, which is produced by sintering a stack (5) of superimposed ceramic green foils and electrically conductive electrode layers (6), the top and bottom green foils of the stack (5) being a spinel ceramic of the composition contains AB2O4.
7. Bauelement nach einem der Ansprüche 1 bis 6, bei dem eine Seitenfläche des Stapels (5) von einer weiteren Schutzschicht (7) bedeckt ist, die eine Keramik der Zusammensetzung (Pb,La) (Zr,Ti)03 enthält.7. The component according to one of claims 1 to 6, in which one side surface of the stack (5) is covered by a further protective layer (7) which contains a ceramic of the composition (Pb, La) (Zr, Ti) 0 3 .
8. Bauelement nach Anspruch 7, bei dem die weitere Schutzschicht (7) in Form einer Siebdruckpaste aufgebracht ist.8. The component according to claim 7, wherein the further protective layer (7) is applied in the form of a screen printing paste.
9. Bauelement nach einem der Ansprüche 1 bis 8, bei dem die Schutzschicht (4) so ausgeführt ist, daß sie den Zutritt von Bestandteilen eines Galvanikbades zu den von ihr bedeckten Teilen der Oberfläche des Grundkörpers (1) hemmt.9. The component according to one of claims 1 to 8, in which the protective layer (4) is designed such that it inhibits the access of components of an electroplating bath to the parts of the surface of the base body (1) it covers.
10. Bauelement nach einem der Ansprüche 1 bis 9, bei dem die Kontaktschichten (2, 3) galvanisch aufgebrachte Metallschichten (8) enthalten.10. The component according to one of claims 1 to 9, wherein the contact layers (2, 3) contain galvanically applied metal layers (8).
11. Bauelement nach einem der Ansprüche 1 bis 10, das im Grundkörper (1) angeordnete, übereinander liegende elektrisch leitende Elektrodenschichten (6) enthält, die durch Keramikschichten (9) voneinander getrennt sind und bei dem benachbarte Elektrodenschichten (6) mit verschiedenen Kontaktschichten (2, 3) kontaktiert sind.11. The component according to one of claims 1 to 10, which contains arranged in the base body (1), one above the other electrically conductive electrode layers (6), which are separated by ceramic layers (9) and in which the adjacent electrode layers (6) with different contact layers ( 2, 3) are contacted.
12. Bauelement nach einem der Ansprüche 1 bis 10, das mehrere im Grundkörper (1) angeordnete Stapel (5) von übereinander liegenden, durch Keramikschichten (9) voneinander getrennte elektrisch leitende Elektrodenschichten (6) enthält, bei dem die Stapel (5) nebeneinander im Grundkörper (1) angeordnet sind, bei dem benachbarte Elektrodenschichten (6) eines jeden Stapels (5) mit verschiedenen Kontaktschichten (2, 3) kontaktiert sind und bei dem jedem Stapel (5) ein Paar von Kontaktschichten (2, 3) zugeordnet ist, das von jedem weiteren Paar von Kontaktschichten (2, 3) elektrisch isoliert ist. 12. The component according to one of claims 1 to 10, which contains a plurality of stacks (5) arranged in the base body (1) of superimposed, electrically conductive electrode layers (6) separated from one another by ceramic layers (9), in which the stack (5) side by side are arranged in the base body (1), in which adjacent electrode layers (6) of each stack (5) are contacted with different contact layers (2, 3) and in which each pair (5) is assigned a pair of contact layers (2, 3) which is electrically insulated from each further pair of contact layers (2, 3).
PCT/DE2002/000756 2001-03-06 2002-03-01 Electrical component WO2002071825A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2001110680 DE10110680A1 (en) 2001-03-06 2001-03-06 Electrical component
DE10110680.7 2001-03-06

Publications (2)

Publication Number Publication Date
WO2002071825A2 true WO2002071825A2 (en) 2002-09-12
WO2002071825A3 WO2002071825A3 (en) 2002-10-31

Family

ID=7676442

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/000756 WO2002071825A2 (en) 2001-03-06 2002-03-01 Electrical component

Country Status (2)

Country Link
DE (1) DE10110680A1 (en)
WO (1) WO2002071825A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003030187A2 (en) * 2001-09-28 2003-04-10 Epcos Ag Electroceramic component comprising a plurality of contact surfaces

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005036102A1 (en) * 2005-08-01 2007-02-08 Epcos Ag Electrical component
DE102015120640A1 (en) * 2015-11-27 2017-06-01 Epcos Ag Multi-layer component and method for producing a multilayer component
DE102022121865A1 (en) * 2022-08-30 2024-02-29 Tdk Electronics Ag Monolithic functional ceramic element and method for producing a contact for a functional ceramic

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2607454A1 (en) * 1975-10-16 1977-04-21 Meidensha Electric Mfg Co Ltd NON-LINEAR VOLTAGE DEPENDENT RESISTANCE

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02189903A (en) * 1989-01-18 1990-07-25 Murata Mfg Co Ltd Laminated varistor
JP3631341B2 (en) * 1996-10-18 2005-03-23 Tdk株式会社 Multilayer composite functional element and method for manufacturing the same
JPH11150005A (en) * 1997-11-18 1999-06-02 Marcon Electron Co Ltd Ceramic barrister and manufacture of the same
DE19946196B4 (en) * 1999-09-27 2005-02-24 Epcos Ag Electro-ceramic component and method for its production

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2607454A1 (en) * 1975-10-16 1977-04-21 Meidensha Electric Mfg Co Ltd NON-LINEAR VOLTAGE DEPENDENT RESISTANCE

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 467 (E-0989), 11. Oktober 1990 (1990-10-11) & JP 02 189903 A (MURATA MFG CO LTD), 25. Juli 1990 (1990-07-25) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11, 30. September 1999 (1999-09-30) & JP 11 150005 A (MARCON ELECTRON CO LTD), 2. Juni 1999 (1999-06-02) *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003030187A2 (en) * 2001-09-28 2003-04-10 Epcos Ag Electroceramic component comprising a plurality of contact surfaces
WO2003030187A3 (en) * 2001-09-28 2003-07-03 Epcos Ag Electroceramic component comprising a plurality of contact surfaces
US7123467B2 (en) 2001-09-28 2006-10-17 Epcos Ag Electroceramic component comprising a plurality of contact surfaces
US7341639B2 (en) 2001-09-28 2008-03-11 Epcos Ag Electroceramic component comprising a plurality of contact surfaces

Also Published As

Publication number Publication date
WO2002071825A3 (en) 2002-10-31
DE10110680A1 (en) 2002-10-02

Similar Documents

Publication Publication Date Title
DE2264943C3 (en) Multi-layer circuit construction and method of making the same
DE112007001335T9 (en) Dielectric ceramic, ceramic element and multilayer ceramic capacitor
DE112004000186B4 (en) Multilayer ceramic electronic components and methods of making the same
DE4010827C2 (en) Monolithic ceramic capacitor
EP1430489B1 (en) Electroceramic component comprising a plurality of contact surfaces
DE2701411C3 (en) Dielectric ceramic compound
DE112008000744B4 (en) Multilayer thermistor with positive temperature coefficient
EP1502310B1 (en) Piezoactuator and method for the production thereof
EP3238218B1 (en) Ceramic multilayer component and method for producing a ceramic multilayer component
DE102012010031A1 (en) Electronic component
DE19622690B4 (en) Process for producing a monolithic ceramic capacitor
DE102020107286A1 (en) Multi-layer ceramic capacitor and method for its manufacture
DE10164354A1 (en) Layered dielectric device, a manufacturing method, and an electrode paste material
EP1386335B1 (en) Electrical multilayer component and method for the production thereof
EP2104941B1 (en) Electric component and external contact of an electric component
EP1863104B1 (en) Method of manufacturing a multi-layered ceramic component
DE4005505A1 (en) MONOLITHIC CERAMIC CONDENSER
WO2002071825A2 (en) Electrical component
DE10026258B4 (en) Ceramic material, ceramic component with the ceramic material and use of the ceramic component
DE102022134924A1 (en) ELECTRONIC MULTILAYER CERAMIC DEVICE AND METHOD OF PRODUCTION THEREOF
DE10039649B4 (en) Method for producing a ceramic multilayer component and corresponding multilayer component
DE102020006903A1 (en) CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD FOR IT
EP2568246B1 (en) Retaining device for ceramic multilayer component
DE102020118857B4 (en) Multilayer capacitor
DE10026260B4 (en) Ceramic component and its use and method for the galvanic generation of contact layers on a ceramic base body

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CN JP US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

AK Designated states

Kind code of ref document: A3

Designated state(s): CN JP US

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP