WO2002053798A1 - Method for depositing thin layers on a porous substrate, fuel cell and fuel cell comprising such a thin layer - Google Patents
Method for depositing thin layers on a porous substrate, fuel cell and fuel cell comprising such a thin layer Download PDFInfo
- Publication number
- WO2002053798A1 WO2002053798A1 PCT/FR2001/004102 FR0104102W WO02053798A1 WO 2002053798 A1 WO2002053798 A1 WO 2002053798A1 FR 0104102 W FR0104102 W FR 0104102W WO 02053798 A1 WO02053798 A1 WO 02053798A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- precursor
- doped
- sequence
- nitrogen
- oxide
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/10—Fuel cells with solid electrolytes
- H01M8/12—Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte
- H01M8/124—Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte characterised by the process of manufacturing or by the material of the electrolyte
- H01M8/1246—Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte characterised by the process of manufacturing or by the material of the electrolyte the electrolyte consisting of oxides
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention relates to a method for depositing thin layers of at least one solid ionic conductor on a porous substrate, to a solid oxide fuel cell cell comprising such an ionic conductor, and to an oxide fuel cell. solid, comprising such a cell, and operating at a temperature below about 800 ° C.
- SOFC solid oxide fuel cells
- an operating temperature between 850 ° C and 1000 ° C remains too high for correct thermal management of the system and obtaining a low cost of materials.
- thermal management there is, on the one hand, a drop in efficiency during thermal losses with the outside, and, on the other hand, the time required to get the operating temperature is too long.
- the desire to lower the operating temperature of SOFCs to a value between 600 ° and 700 ° C. essentially poses the problem of the ohmic drop linked to the electrolyte made of yttria zirconia (YSZ), the conductivity of which is insufficient in this temperature range.
- YSZ yttria zirconia
- a simple method for reducing this resistance consists in reducing the thickness of the electrolyte so as to obtain a thin layer.
- the main drawback which arises, when producing thin layers on a substrate, relates to their densification rate, which remains insufficient vis-à-vis the passage of certain gases with which they are brought into contact.
- the electrolyte must be impermeable to the oxidizing gas and to the combustible gas (in particular to hydrogen), and consequently must be as dense as possible.
- the deposition of the electrolyte is annealed at high temperature (about 1300 ° - 1500 ° C).
- this sintering step raises a problem due to the difference in coefficient of thermal expansion between the electrolyte in yttria zirconia and the support electrode of the deposit. This expansion gap can cause cracks to form in the deposit layer, making it unusable.
- This annealing step can also be used to obtain the cubic phase of the crystalline state known to be the most conductive (see for example: KW CHO ⁇ R, J. CHEN and R. XU, Thin Solid. Films, 304 (1997) 106) .
- KW CHO ⁇ R, J. CHEN and R. XU, Thin Solid. Films, 304 (1997) 106 can also be used to obtain the cubic phase of the crystalline state known to be the most conductive.
- KW CHO ⁇ R, J. CHEN and R. XU Thin Solid. Films, 304 (1997) 106
- the subject of the invention is therefore a process for depositing on the surface of a porous substrate, atomic layer by atomic layer, thin layers of at least one solid ionic conductor, said ionic conductor consisting of at least one oxide of base and at least one doping agent, all of said thin layers constituting an electrolyte, said deposit being produced from at least one precursor I n of the metal ion of one of the base oxides, of a precursor II making it possible to produce an oxide from the precursor I n , and at least one precursor III m of one of the oxides providing one of the doping agents, said precursors being placed in the vapor state, n and m each being an integer greater than or equal to 1, characterized in that it consists in depositing at least one basic oxide according to at least a first sequence, and at least one doping agent according to at least a second sequence, each first sequence being repeated 1 to 10 times fa successive lesson before, after or in admixture, with or without contact with precursor II, with at least a second sequence,
- the ionic conductor also called an oxide ion conductor, is defined as being a compound of at least one metal oxide doped with at least one other metallic element.
- the ionic conductor makes it possible to obtain the migration of the O 2- oxide ions through its own structure.
- the method according to the invention has the advantage of allowing a fine and dense deposit of electrolyte, in the form of at least one thin layer, having an average thickness ranging from about 0.1. at 10 ⁇ m, and having a shallow penetration depth in the porous substrate contrary to what one might expect by the use of the technique of atomic layer epitaxy.
- Another subject of the invention is a solid oxide fuel cell cell comprising at least one solid ionic conductor present in at least one thin layer, and deposited by the process as defined above.
- a final object of the invention is a solid oxide fuel cell comprising at least one cell as defined above.
- the precursor I n is chosen from zirconium hologenides and in particular zirconium chloride, cerium halides and in particular cerium chloride, cerium beta-diketonates and in particular tetrakis (2,2, 6,6- tetramethyl-3-5-heptanedionato) cerium, and their mixture.
- the precursor II can be chosen from water, oxygen, ozone or an alcohol, and the precursor III m can be chosen from: - yttriu halides and in particular yttrium chloride,
- gadolinium beta-diketonates and in particular. tris (2, 2, 6, 6-tetramethyl-3, 5-heptanedionato) gadolinium, and samarium halides and in particular samarium chloride, samarium beta-diketonates and in particular tris, (2, 2, 6, 6-tetramethyl-3, 5-heptanedionato) samarium, and mixtures thereof.
- the first sequence can be defined as desired by the successions of the following elements: first succession: a) precursor I n b) nitrogen c) precursor II d) nitrogen
- precursors III m and III (m + 1)
- nitrogen b) nitrogen
- the process of the invention can make it possible to deposit at least one basic oxide and at least one doping agent simultaneously, with durations of contact with the surface of the substrate, identical or different for each precursor I n , II or III m .
- the method can also make it possible to deposit, at first, at least one basic oxide according to a first sequence, then at least one doping agent, according to a second sequence, following the first sequence.
- the ionic conductor is preferably chosen from zirconia doped with yttrium, zirconia doped with scandium, zirconia doped with ytterbium, cerine doped with gadolinium, cerine doped with samarium, and their mixtures.
- the duration during which a precursor in the vapor state is brought into contact with the surface of the substrate ranges from 0.1 to 20 seconds, and more preferably from 0.1 to 5 seconds.
- the number of cycles can range from 500 to 50,000, and preferably from 500 to 5,000.
- the atomic ratio of the doping agent (s) to the base oxide (s) can range from 2 to 25%.
- the thickness of each thin layer can range from 0.1 to 10 ⁇ m.
- Gradients of compositions in the ionic conductor can moreover be produced by varying the proportion of the sequences of synthesis of the base oxide (s) relative to the sequences of syntheses of the doping agent (s) during the deposition of thin layers.
- LSM lanthanum anganite doped with strontium
- - Figure 1 shows a schematic view, from above, obtained by the scanning electron microscopy technique of a substrate sample covered with thin layers according to the method of the invention
- - Figure 2 shows a schematic view, in perspective, obtained by the scanning electron microscopy technique of a sample of the substrate covered with two thin layers, according to the method of the invention.
- the reactor of the atomic layer epitaxy technique used is of the alternating flow type (F120 manufactured by ASM-Microche isty Ltd.). Nitrogen is used as the carrier gas.
- the deposits are made on a porous substrate, such as a lanthanum manganite plate doped with strontium (La 0 , 8, s ⁇ o, 2 ⁇ Mn0 3 or LSM) which can be used as a SOFC cathode, or a plate of cermet of nickel and yttria zirconia (Ni / YSZ) which can serve as an anode of SOFC.
- a porous substrate such as a lanthanum manganite plate doped with strontium (La 0 , 8, s ⁇ o, 2 ⁇ Mn0 3 or LSM) which can be used as a SOFC cathode, or a plate of cermet of nickel and yttria zirconia (Ni / YSZ) which can serve as an anode of SOFC.
- the precursors are heated to the following temperatures
- the substrate is heated from 200 ° to 600 ° C before carrying out the process and is maintained at a temperature ranging from 205 ° to 600 ° C during the carrying out of the process of the invention.
- n zirconia synthesis sequences n being able to vary from 1 to 10. The sequence is defined as follows:
- the number of yttrium oxide synthesis sequences relative to the number of zirconia synthesis sequences is adjusted as a function of the concentration of doping agent desired in the thin layer present on the surface of the substrates.
- the combination of the “n” zirconia synthesis sequences and the unique yttrium oxide synthesis sequence constitutes a basic cycle for zirconia doped with yttrium.
- the thickness of the thin layer depends on the number of cycles performed.
- a cycle consists of the following two sequences 1 st sequence
- This second sequence is performed only once.
- the cycle is performed from 1800 to 2000 times.
- porous substrate of doped lanthanum manganite 1 is covered by two thin layers 2, 3, arranged successively and each constituted by zirconia doped with yttrium. All of layers 2 and 3 form the top 4 of the sample obtained at the end of the process.
- the set of these two layers is dense, and that it covers the pores of the substrate 1 well (see FIG. 1).
- the first layer 2 has a thickness of approximately 1.4 ⁇ m, and the second a thickness of approximately 1.1 ⁇ m.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01989640A EP1356133A1 (en) | 2000-12-28 | 2001-12-20 | Method for depositing thin layers on a porous substrate, fuel cell and fuel cell comprising such a thin layer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0017225A FR2818993B1 (en) | 2000-12-28 | 2000-12-28 | METHOD FOR DEPOSITING THIN FILMS ON A POROUS SUBSTRATE, FUEL CELL CELL AND FUEL CELL HAVING SUCH A THIN FILM |
FR00/17225 | 2000-12-28 |
Publications (1)
Publication Number | Publication Date |
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WO2002053798A1 true WO2002053798A1 (en) | 2002-07-11 |
Family
ID=8858345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/FR2001/004102 WO2002053798A1 (en) | 2000-12-28 | 2001-12-20 | Method for depositing thin layers on a porous substrate, fuel cell and fuel cell comprising such a thin layer |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1356133A1 (en) |
FR (1) | FR2818993B1 (en) |
WO (1) | WO2002053798A1 (en) |
Families Citing this family (1)
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CN109628890B (en) * | 2019-01-10 | 2020-12-29 | 河北大学 | Strontium ruthenate/lanthanum strontium manganese oxygen transition metal oxide heterojunction and preparation method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5403461A (en) * | 1993-03-10 | 1995-04-04 | Massachusetts Institute Of Technology | Solid electrolyte-electrode system for an electrochemical cell |
US5693139A (en) * | 1984-07-26 | 1997-12-02 | Research Development Corporation Of Japan | Growth of doped semiconductor monolayers |
US5753385A (en) * | 1995-12-12 | 1998-05-19 | Regents Of The University Of California | Hybrid deposition of thin film solid oxide fuel cells and electrolyzers |
US5972430A (en) * | 1997-11-26 | 1999-10-26 | Advanced Technology Materials, Inc. | Digital chemical vapor deposition (CVD) method for forming a multi-component oxide layer |
-
2000
- 2000-12-28 FR FR0017225A patent/FR2818993B1/en not_active Expired - Fee Related
-
2001
- 2001-12-20 EP EP01989640A patent/EP1356133A1/en not_active Withdrawn
- 2001-12-20 WO PCT/FR2001/004102 patent/WO2002053798A1/en not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5693139A (en) * | 1984-07-26 | 1997-12-02 | Research Development Corporation Of Japan | Growth of doped semiconductor monolayers |
US5403461A (en) * | 1993-03-10 | 1995-04-04 | Massachusetts Institute Of Technology | Solid electrolyte-electrode system for an electrochemical cell |
US5753385A (en) * | 1995-12-12 | 1998-05-19 | Regents Of The University Of California | Hybrid deposition of thin film solid oxide fuel cells and electrolyzers |
US5972430A (en) * | 1997-11-26 | 1999-10-26 | Advanced Technology Materials, Inc. | Digital chemical vapor deposition (CVD) method for forming a multi-component oxide layer |
Non-Patent Citations (1)
Title |
---|
NILSEN O ET AL: "THIN FILM DEPOSITION OF LANTHANUM MANGANITE PEROVSKITE BY THE ALE PROCESS", JOURNAL OF MATERIALS CHEMISTRY, THE ROYAL SOCIETY OF CHEMISTRY, CAMBRIDGE, GB, vol. 9, no. 8, August 1999 (1999-08-01), pages 1781 - 1784, XP000906224, ISSN: 0959-9428 * |
Also Published As
Publication number | Publication date |
---|---|
EP1356133A1 (en) | 2003-10-29 |
FR2818993B1 (en) | 2003-11-28 |
FR2818993A1 (en) | 2002-07-05 |
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