WO2002038490A3 - Method for producing glass-silicon-glass sandwich structures - Google Patents
Method for producing glass-silicon-glass sandwich structures Download PDFInfo
- Publication number
- WO2002038490A3 WO2002038490A3 PCT/DE2001/004141 DE0104141W WO0238490A3 WO 2002038490 A3 WO2002038490 A3 WO 2002038490A3 DE 0104141 W DE0104141 W DE 0104141W WO 0238490 A3 WO0238490 A3 WO 0238490A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- glass
- silicon
- sandwich structures
- substrate
- producing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
- B81C1/00357—Creating layers of material on a substrate involving bonding one or several substrates on a non-temporary support, e.g. another substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/019—Bonding or gluing multiple substrate layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Joining Of Glass To Other Materials (AREA)
- Micromachines (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01993578A EP1332106A2 (en) | 2000-11-07 | 2001-11-07 | Method for producing glass-silicon-glass sandwich structures |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10055155.6 | 2000-11-07 | ||
DE10055155 | 2000-11-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002038490A2 WO2002038490A2 (en) | 2002-05-16 |
WO2002038490A3 true WO2002038490A3 (en) | 2002-08-15 |
Family
ID=7662439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/004141 WO2002038490A2 (en) | 2000-11-07 | 2001-11-07 | Method for producing glass-silicon-glass sandwich structures |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP1332106A2 (en) |
WO (1) | WO2002038490A2 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1988000335A1 (en) * | 1986-06-30 | 1988-01-14 | Rosemount Inc. | Differential pressure sensor |
EP0389071A2 (en) * | 1989-01-30 | 1990-09-26 | Dresser Industries Inc. | Method for fabricating semiconductor diaphragms |
DE4409068A1 (en) * | 1994-03-14 | 1996-01-25 | Mannesmann Ag | Oxidised silicon layer to boron-silicate glass bonding method |
WO1998047712A1 (en) * | 1997-04-18 | 1998-10-29 | Topaz Technologies, Inc. | Nozzle plate for an ink jet print head |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4318407A1 (en) | 1993-06-03 | 1994-12-08 | Rossendorf Forschzent | Microcapillary with integrated chemical microsensors and process for their manufacture |
-
2001
- 2001-11-07 EP EP01993578A patent/EP1332106A2/en not_active Withdrawn
- 2001-11-07 WO PCT/DE2001/004141 patent/WO2002038490A2/en not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1988000335A1 (en) * | 1986-06-30 | 1988-01-14 | Rosemount Inc. | Differential pressure sensor |
EP0389071A2 (en) * | 1989-01-30 | 1990-09-26 | Dresser Industries Inc. | Method for fabricating semiconductor diaphragms |
DE4409068A1 (en) * | 1994-03-14 | 1996-01-25 | Mannesmann Ag | Oxidised silicon layer to boron-silicate glass bonding method |
WO1998047712A1 (en) * | 1997-04-18 | 1998-10-29 | Topaz Technologies, Inc. | Nozzle plate for an ink jet print head |
Also Published As
Publication number | Publication date |
---|---|
EP1332106A2 (en) | 2003-08-06 |
WO2002038490A2 (en) | 2002-05-16 |
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