WO2002037598A1 - Systeme d'interconnexion pour la face arriere d'un dielectrique a air - Google Patents

Systeme d'interconnexion pour la face arriere d'un dielectrique a air Download PDF

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Publication number
WO2002037598A1
WO2002037598A1 PCT/US2001/047589 US0147589W WO0237598A1 WO 2002037598 A1 WO2002037598 A1 WO 2002037598A1 US 0147589 W US0147589 W US 0147589W WO 0237598 A1 WO0237598 A1 WO 0237598A1
Authority
WO
WIPO (PCT)
Prior art keywords
interconnection system
transmission line
line elements
present
conductors
Prior art date
Application number
PCT/US2001/047589
Other languages
English (en)
Inventor
Richard H. Garrett
Richard A. Elco
Timothy A. Lemke
Original Assignee
Fci Americas Technology Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fci Americas Technology Inc. filed Critical Fci Americas Technology Inc.
Publication of WO2002037598A1 publication Critical patent/WO2002037598A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1458—Active back panels; Back panels with filtering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Definitions

  • the present invention relates to electrical connectors. More particularly, the present invention relates to high speed, matched impedance backplane interconnection systems.
  • Performance in the context of the present invention is the ability to correctly read or interpret signals. Performance determinations have been made by generating so called "eye patterns". Assuming a standard 19 inch rack mounted system, the accepted value for the maximum practical bandwidth and standard connector configurations is about 2.5Gb/s. The maximum theoretical bandwidth using state-of-the-art material and connector designs is about 6Gb/s. Beyond 5 Gb/s, fiber optics, cabling and alternative new technologies such as waveguides are being considered as possible solutions.
  • Cabling using high speed materials such as foamed fluorocarbons in transmission line or coaxial cable configurations, is a potential means for high speed transmission.
  • cables are relatively high in cost, and in addition, most termination techniques can introduce significant signal discontinuities in high speed applications.
  • foamed cables with low dielectric constants are inherently unstable and dimensional control is difficult to achieve economically, particularly with miniaturized designs. Dielectric losses of insulators used in printed circuit board constructions also cause significant signal losses in high frequencies applications. Even specialized materials such as fluorocarbons have high losses in these applications.
  • One method of minimizing conductive losses would be to use rectangular or round conductors assembled into a circuit. If conductive "wires" are used rather than etched foil, the geometry can be designed to optimize the performance and circuit density. Round conductors are advantageous because they are readily available, compatible with conventional equipment, and do not require high cost tooling to fabricate. However, in order to optimize the performance of round conductors, dielectric losses should also be minimized. Since air has a dielectric constant of 1, air dielectric transmission lines could be extremely useful in transmitting high frequency, high bandwidth signals across a printed circuit board. There is a need, therefore, for a low cost, high tolerance connector system that transmits high frequency, high bandwidth signals over wire transmission lines having an air dielectric.
  • the present invention satisfies the aforementioned need by providing systems and methods for constructing an interconnection system using transmission line elements having an air dielectric to achieve the transmission of high frequency, high bandwidth signals between two electrical systems.
  • the air dielectric backplane interconnection system of the present invention is used to connect backplane connectors or circuit boards to other circuit boards, such as, for example, daughter boards or the like.
  • a high speed backplane interconnection system comprises a plurality of conductor matched impedance transmission line elements and an air dielectric surrounding the plurality of transmission line elements.
  • the system includes a ground plate disposed a predetermined distance from the transmission line elements. For example, spacers are used to dispose the transmission line elements a predetermined distance thereby creating a predetermined characteristic impedance of the interconnection system.
  • FIG. 1 is a top view of an interconnection system in accordance with the present invention
  • FIG. 2 is a side view of the interconnection system of FIG. 1;
  • FIG. 3 is a front view of the conductors and spacer elements as used in the interconnection system of the present invention;
  • FIG. 4 is a top view of a ground plate as used in one embodiment of the present invention.
  • FIG. 5 is a block diagram of several intercomiection systems of the present invention as used with various other electrical systems.
  • FIGS. 1 and 2 are top and side views, respectively, of an interconnection system in accordance with one embodiment of the present invention.
  • the high speed backplane interconnection system 5 includes two planes or plates 10, 12 with wire conductors or transmission lines 15 suspended therebetween. h a preferred embodiment, the two plates 10, 12 are formed from a non-conductive material.
  • the transmission lines 15 are also connected to signal tabs 35 A and 35B through apertures 38 in plate 12. Signal tabs 35A and 35B are then each connected to separate electrical systems (not shown) to electrically interconnect them via the transmission lines 15.
  • the wire or filament conductors 15 may be manufactured using a conventional extrusion process, i.e. where the material is forced through a precisely formed die opening.
  • the tolerances of extruded wires 15 are typically held to tenths of thousandths of an inch.
  • the system 5 also includes a ground plate 25 (shown in isolation in FIG. 4) connected to ground tabs 30.
  • the distance between the plate 25 and the conductors 15 determines the characteristic impedance of the transmission line system 5. Consequently, varying the distance between the ground plate 25 and the conductor 15 varies the characteristic impedance of the system.
  • the impedance needs to be controlled to within 10% to prevent unwanted signal reflections. At the scale required for circuit boards, it is necessary to control the space between the plates or planes and the conductors to several thousandths of an inch.
  • FIG. 3 is a cross sectional view of the conductors and spacer elements as used in the interconnection system of the present invention in FIGJ. As shown, spacer 20 is formed to include grooves 21 for securing conductors 15 at a predetermined distance from the ground plate 25.
  • the spacers are made of a polymer monofilament, however, other materials may be used without departing from the scope of the present invention.
  • the spacers or filaments are placed on a 0.250" pitch and have a negligible effect on the characteristic impedance or the high speed transmission characteristics of the transmission line.
  • the spacers 20 are stitched into holes in the ground plate 25.
  • Other configurations, such as gluing or molding the spacers to the ground plate 25 could be used without departing from the scope of the present invention.
  • larger conductors external to the spacer matrix, larger conductors (not shown) are used to establish the overall structural spacing of the ground plates.
  • a 22 AWG conductor (with a diameter of 0.025") is placed on either side of a group of conductors to provide structural spacing for the system.
  • the 22 AWG conductor may be bonded or soldered to the ground structures. This configuration is particularly useful in systems where power transmission is required throughout the backplane system.
  • the power conductors are closely coupled to the ground system, but electrically isolated to provide a capacitively coupled power system.
  • Such a configuration may be integrated into the above described system by using a magnet wire, either round, square, or rectangular, of the appropriate dimensions to provide both a mechanical spacer for the transmission line system and a power distribution system.
  • the transmission line conductors are cut into discrete lengths and the ends bent at right angles to form staple like elements.
  • the middle section of the staple would be determined by the link length and the short legs by the thickness of the PCB to which the link is to be mounted.
  • the short legs of the "staple" would be inserted into holes in a thin PCB that would serve as the bottom shield of the link.
  • the shield layer around the leads is etched away in the areas where the signal lines extend through the bard and the ground lines are soldered directly to the shield.
  • the wire staples are then inserted over the spacers to provide the appropriate spacing for the impedance matched system.
  • the upper shield layer would have additional filament spacers and would be assembled on top of the transmission line conductors.
  • the outer conductors of the link could consist of larger ground or capacitively coupled power conductors as previously discussed.
  • the upper shield could be a thin printed circuit board similar to the bottom board, or could alternatively be a relatively thin sheet metal structure.
  • the two shields are mechanically fastened to one another using a variety of fasteners.
  • the links are surface mountable.
  • the tabs or solder tails 35 A and 35B are bent such that they extend in the same plane as the link after insertion through the printed circuit board.
  • the leads could extend in a co-planar_manner through spacers and would be formed so that they would be co-planar to the link but be able to contact the printed circuit board surface.
  • a relatively thin sheet metal stamping is used having holes or slots stamped in the area where the leads are to protrude.
  • a plastic molding with holes corresponding to the centers of the transmission line conductors is then press-fit through the holes in the stamping.
  • the spacers may be part of the molding, eliminating the need for separate parts and assembly operations.
  • Such spacers also include grooves to secure the conductors and the top cover is assembled to the base. The cover is designed to precisely clamp the conductors in place.
  • the clamping areas and transitions through the system are carefully designed to have controlled impedance throughout the structure and in the printed circuit board transition.
  • the printed circuit transition is carefully designed and the impedance is controlled by careful spacing of the centerlines of the ground and signal conductors through the system and in the printed circuit transition.
  • the ground conductors are eliminated and the grounds are terminated by extensions of the ground planes by means of thin metal tabs 30 (FIG. 1) that project through the housing and are soldered into holes or pads on the printed circuit board.
  • thin metal tabs 30 FIG. 1
  • the transmission lines are continuous over the length of the backplane.
  • the spacers are again molded to include slots to accept the conductors on the required pitch and are placed on the transmission line conductors at the same spacing as required by the connectors, generally .75" to 2", with 1.5" being typical.
  • These spacers may be molded separately and assembled to the transmission line conductors, or preferably are molded in a continuous molding operation and reeled in continuous length.
  • the transmission lines are then cut to length and the molded spacers are aligned with slots or grooves in the ground structure. Openings are present to allow for connectorization of the backplane assembly.
  • the connector system can also have contacts with slots that are press fit over the conductors to make an electrical connection to the conductors of the transmission lines. In this manner, the body of the connector can be at a right angle to the backplane and designed to accept daughter cards.
  • the connectors would require care in design to maintain impedance control and grounding throughout the transmission line pathway.
  • the design has slots in the ground plane structure, ground lines are incorporated onto the transmission line structure so that the gaps in the ground structure can be bridged. If care is not taken in the comiector design, a high impedance discontinuity spike might occur as a result of having a gap in the ground plane at the area of the slot. This concept would require a special connector design.
  • the transmission lines are a series of discrete links, rather than continuous transmission lines with openings in the ground plane structure.
  • the links are interconnected by short pad areas on the printed circuit board that either have associated holes or surface mount pads terminating the system of the present invention. Pads and terminations are designed to minimize potential impedance discontinuities and shield interruptions.
  • connectors for daughter cards are mounted either between the links or on the opposite side of the board. In this case, conventional connectors may be utilized in the system, although optimum results are obtained with custom comiector designs.
  • the elements between the links and the connectors connected to a system of the present invention may vary without departing from the scope of the present invention.
  • the configuration may be user dependant.
  • the interconnection system of the present invention has an overall width W of 40 mm.
  • the system width may vary without departing from the present invention. System widths over 2 inches (50mm) may be used, however, such larger dimensions may cause difficulties in manufacturing the parts to sufficiently tight tolerances. Furthermore, the reliability of standard surface mount techniques tends to decrease as 2" is approached.
  • the system can include any number of channels per system with 12 (.050" pitch) to 16 (1mm pitch) channels per system preferred. Additionally, in one embodiment of the present invention, the conductors
  • the interconnection system are 28 AWG round conductors with a diameter of 0.0126" with a pitch of 0.050".
  • a 0.010" air gap between the conductor and the ground plate is required over the entire length of the transmission line.
  • the 0.010" air gap is established using polymer monofilaments of 0.010" diameter oriented at right angles to the transmission lines.
  • the system has a channel density of 3mm with individual conductors on 1mm centers.
  • the channel density may vary, however, without departing from the scope of the present invention.
  • multi-layer designs with each layer having a corresponding ground and signal row
  • circuit density can be designed and constructed with any number of layers.
  • the conductors are arranged relative to each other with the centers of the conductors staggered so that the net conductor pitch of the two rows would be half the pitch of the conductors on each layer. For example, if the pitch on an individual layer is 0.050", the net pitch of two layers would be 0.025".
  • the conductors exit the system through a hole pattern of 0.050" with staggered rows to maximize the space between the holes so that the trace width is optimized.
  • FIG. 5 is a block diagram of several interconnection systems of the present invention as used with various other electrical systems.
  • the interconnection system of the present invention may be used in a variety of contexts.
  • the interconnection system 5 of the present invention is used to connect to two portions of the backplane 50.
  • the interconnection system 5 of the present invention is used to connect two daughtercards 65 connected to the backplane 5 by way of a daughtercard connector 60.
  • the present invention is directed to an air dielectric backplane interconnection system. It is understood that changes may be made to the embodiments described above without departing from the broad inventive concepts thereof. For example, the channel density of the interconnection system may vary without departing from the scope of the present invention. Accordingly, the present invention is not limited to the particular embodiments disclosed, but is intended to cover all modifications that are within the scope of the present invention, as defined by the appended claims.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

La présente invention concerne un système d'interconnexion pour la face arrière d'un diélectrique à air. Le système d'interconnexion selon l'invention est un système (5) d'interconnexion de face arrière à grande vitesse comprenant une pluralité d'éléments (15) de ligne de transmission à impédance appariés de conducteur et un diélectrique à air entourant la pluralité d'éléments de ligne de transmission. Un système d'interconnexion comportant également des éléments espaceurs (20) disposés entre les éléments de ligne de transmission et une plaque de terre (25) est présenté.
PCT/US2001/047589 2000-11-03 2001-11-05 Systeme d'interconnexion pour la face arriere d'un dielectrique a air WO2002037598A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US24561700P 2000-11-03 2000-11-03
US60/245,617 2000-11-03
US10/015,985 2001-11-02

Publications (1)

Publication Number Publication Date
WO2002037598A1 true WO2002037598A1 (fr) 2002-05-10

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Application Number Title Priority Date Filing Date
PCT/US2001/047589 WO2002037598A1 (fr) 2000-11-03 2001-11-05 Systeme d'interconnexion pour la face arriere d'un dielectrique a air

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US (1) US20020125967A1 (fr)
WO (1) WO2002037598A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070268087A9 (en) * 2000-11-03 2007-11-22 Lemke Timothy A High speed, controlled impedance air dielectric electronic backplane systems
US6743049B2 (en) 2002-06-24 2004-06-01 Advanced Interconnections Corporation High speed, high density interconnection device
US20040048420A1 (en) * 2002-06-25 2004-03-11 Miller Ronald Brooks Method for embedding an air dielectric transmission line in a printed wiring board(PCB)
US6828514B2 (en) * 2003-01-30 2004-12-07 Endicott Interconnect Technologies, Inc. High speed circuit board and method for fabrication
US7023707B2 (en) * 2003-01-30 2006-04-04 Endicott Interconnect Technologies, Inc. Information handling system
US7035113B2 (en) * 2003-01-30 2006-04-25 Endicott Interconnect Technologies, Inc. Multi-chip electronic package having laminate carrier and method of making same
US6995322B2 (en) * 2003-01-30 2006-02-07 Endicott Interconnect Technologies, Inc. High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same
CA2455024A1 (fr) * 2003-01-30 2004-07-30 Endicott Interconnect Technologies, Inc. Module electronique a puces empilees dote d'un porte-puces stratifie et methode de fabrication
JP2006073555A (ja) * 2004-08-31 2006-03-16 Hirose Electric Co Ltd 伝送回路基板構造及び伝送回路基板そしてこれを有するコネクタ
US7654870B2 (en) * 2008-02-11 2010-02-02 Z-Plane, Inc. Interconnection assembly for printed circuit boards
WO2011140438A2 (fr) 2010-05-07 2011-11-10 Amphenol Corporation Connecteur de câble de haute performance
US8827746B2 (en) 2011-08-01 2014-09-09 Z-Plane, Inc. Crosstalk reduction

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2182968A (en) * 1935-02-28 1939-12-12 Bell Telephone Labor Inc Method of making electrical connections
US2452948A (en) * 1944-05-13 1948-11-02 Davis Marinsky Coaxial cable
US2557781A (en) * 1946-06-19 1951-06-19 Amalgamated Wireless Australas Radio-frequency transmission line
US3560896A (en) * 1967-07-06 1971-02-02 Telefunken Patent Inner conductor support for shielded microwave strip lines
US4437074A (en) * 1980-12-18 1984-03-13 Thomson-Csf Ultrahigh-frequency transmission line of the three-plate air type and uses thereof
US5072201A (en) * 1988-12-06 1991-12-10 Thomson-Csf Support for microwave transmission line, notably of the symmetrical strip line type

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2182968A (en) * 1935-02-28 1939-12-12 Bell Telephone Labor Inc Method of making electrical connections
US2452948A (en) * 1944-05-13 1948-11-02 Davis Marinsky Coaxial cable
US2557781A (en) * 1946-06-19 1951-06-19 Amalgamated Wireless Australas Radio-frequency transmission line
US3560896A (en) * 1967-07-06 1971-02-02 Telefunken Patent Inner conductor support for shielded microwave strip lines
US4437074A (en) * 1980-12-18 1984-03-13 Thomson-Csf Ultrahigh-frequency transmission line of the three-plate air type and uses thereof
US5072201A (en) * 1988-12-06 1991-12-10 Thomson-Csf Support for microwave transmission line, notably of the symmetrical strip line type

Also Published As

Publication number Publication date
US20020125967A1 (en) 2002-09-12

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