WO2002027750A1 - Electron gun and method for manufacturing electrode of electron gun - Google Patents

Electron gun and method for manufacturing electrode of electron gun Download PDF

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Publication number
WO2002027750A1
WO2002027750A1 PCT/JP2001/002817 JP0102817W WO0227750A1 WO 2002027750 A1 WO2002027750 A1 WO 2002027750A1 JP 0102817 W JP0102817 W JP 0102817W WO 0227750 A1 WO0227750 A1 WO 0227750A1
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WO
WIPO (PCT)
Prior art keywords
metal material
electron gun
thin plate
hole
manufacturing
Prior art date
Application number
PCT/JP2001/002817
Other languages
French (fr)
Japanese (ja)
Inventor
Yasunobu Amano
Masahiko Mizuki
Koichi Tahara
Noritaka Hamaya
Masamichi Senami
Original Assignee
Sony Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000292550A external-priority patent/JP2001167699A/en
Application filed by Sony Corporation filed Critical Sony Corporation
Publication of WO2002027750A1 publication Critical patent/WO2002027750A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02Manufacture of electrodes or electrode systems
    • H01J9/14Manufacture of electrodes or electrode systems of non-emitting electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/46Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
    • H01J29/48Electron guns
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/46Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
    • H01J29/48Electron guns
    • H01J29/485Construction of the gun or of parts thereof

Definitions

  • the present invention relates to an electron gun for a cathode ray tube and an electrode component thereof, that is, a method for manufacturing an electron gun electrode.
  • the first grid electrode G For example, looking at the electron guns in chronological order, the first grid electrode G! The diameter of the beam transmission hole of
  • the plate thickness of the first grid electrode G1 around the beam transmission hole is determined according to the beam transmission hole diameter.
  • the conventional first grid electrode Gi is manufactured using coining technology.
  • Coining technology is a technology that taps a metal base plate to make it thinner.
  • FIG. 13 shows an example of a first shaped first grid electrode Gi using a coining technique.
  • the metal material is gradually reduced in thickness.
  • Coining is carried out several times to move the car.
  • the original plate thickness T of the metal material is obtained at the coupling cross section 80 passing through the beam transmitting hole 83.
  • the desired thickness around the plate thickness t In order to perform the coining process up to the thickness of the sheet around the coining part ⁇ . 'Must be thinned by coining. In conventional multiple coining, the flesh escapes in the direction of the center hole and the flesh escapes in the radially outward direction.Therefore, the circular rib 82 is used as an escape. Must be provided. 8 1 indicates the edge of the coining part.
  • a cutting (punching) processing technique is known as one of the drilling methods.
  • Fig. 15 shows the concept of this shaving process.
  • the material base plate 70 has a diameter a (for example, 0. A shaving preparation hole (so-called lower hole) 73 is formed, and this material base plate 70 is placed on a shaving die 72 having an opening 7 4 having a diameter b. And fix it.
  • a for example, 0.
  • a shaving preparation hole (so-called lower hole) 73 is formed, and this material base plate 70 is placed on a shaving die 72 having an opening 7 4 having a diameter b. And fix it.
  • the inner wall portion 75 of the machining preparation hole 73 of the base material plate 0 is cut at the tip of the punching die 71.
  • the coining technology used in the manufacture of electron gun electrodes is a technology of hitting the base plate of a metal material to make it thinner.
  • the thickness of the material it was limited to, for example, about 1/4 of the original material thickness.
  • control of the coining portion of the edge portion 8 a first meat of upsurge in 1 grid electrode G and the second grid distance between de electrode G 2 di 2 is unavoidably difficult .
  • An object of the present invention is to provide a method of manufacturing an electron gun electrode which can form a thin plate on which a fine electron beam transmitting hole is to be partially formed in a thick material.
  • the present invention includes, for example, a high-precision
  • An object of the present invention is to provide a highly reliable electron gun suitable for a fine cathode ray tube.
  • the electron gun of the cathode ray tube according to the present invention has a metal part cut by shaving from one surface of a metal material.
  • the metal portion cut by shaving from one surface of the metal material is formed in a thin plate continuous with the metal material, and the portion of the thin plate formed by coining is further formed. And an electrode in which an electron beam transmitting hole is formed.
  • a metal part cut by sieving from one surface of the metal material is formed by a metal material. Form into a continuous thin plate.
  • a metal part cut by sieving from one surface of the metal material is formed by a metal material. Then, it is formed into a continuous thin plate, and the thin plate is thinned by coining.
  • the direction in which the processing reference hole is punched and the direction in which the metal material is cut are reversed with respect to the thickness direction of the metal material. Thereafter, the processes shown in the above-mentioned respective manufacturing methods are performed.
  • a metal material in which a periphery of a processing preparation hole is raised from another portion is formed, and a metal portion cut by shaving from one side of the metal material is formed into a metal material. It is formed into a 'continuous thin plate'. After being formed into a thin plate, a portion of the thin plate may be coined. In the above-mentioned shaving, all the raised portions may be shaved, or A part of the part may be shaved.
  • an electron beam transmitting hole is formed in the thin plate portion.
  • an electron beam transmitting hole is formed in the coining molded portion.
  • the working preparation hole formed in advance in the metal material is preferably a working reference hole having a diameter of 80% or more of the diameter of the thin plate to be subsequently formed. After forming such a processing reference hole, the processing shown in the above-described manufacturing method is performed.
  • the basic processing technology of the electron gun electrode of the present invention is based on the following method.
  • this processing technique will be referred to as shaving coin processing or, for short, shaving coin processing.
  • a metal meat portion to be cut from a metal material and then process it into a thin plate shape connected to the metal material.
  • the desired electrode is formed by shaping a metal portion cut by shaving from one surface of the metal material into a thin plate continuous with the metal material, and transmitting the electron beam through the thin plate portion. Since the electrodes are formed with holes, the mechanical strength of the electrodes is maintained, and minute electron beam transmission holes are obtained. Therefore, a highly accurate electron gun with no dimensional change can be obtained.
  • the method includes a step of forming a metal portion cut by sieving from one surface of a metal material of a predetermined thickness into a thin plate continuous with the metal material. Regardless of the thickness of the metal material, a thin part with a small thickness can be formed in one process.
  • the thickness of the thin plate portion can be reduced regardless of the thickness of the metal material (original plate material). improves.
  • an electrode having smaller electron beam transmission holes and high mechanical strength can be manufactured.
  • the edge of the thick plate around the thin plate forms an electric field lens, but in the present invention, this edge is formed with high relative position accuracy without swelling unlike conventional coining. it can. Therefore, not only the case where the so-called shaving coin portion is not required in characteristics but also the use as an electron lens is possible. In any case, the beam spot characteristics can be improved as compared with the conventional case.
  • a thinner thin plate portion can be formed. Therefore, finer electron beam transmission holes can be formed.
  • a thin plate having a desired thickness can be accurately formed, and a target electron can be formed.
  • Gun electrodes can be manufactured.
  • the direction in which the preparation hole is punched and the direction in which the metal material is cut by shaving are reversed with respect to the thickness direction of the metal material.
  • a protruding part is formed in advance on the surface of the metal material, a processing preparation hole is formed in this protruding part, and then, the cutting hole is processed to reduce the remaining hole diameter of the thin plate regardless of the original plate thickness of the metal material. It is possible to form a reduced shaving cone portion, and it is possible to manufacture an electron gun electrode having an extremely small electron beam transmitting hole.
  • the supporting piece formed integrally with the electron gun electrode can be made as thin as desired, and the electron gun electrode can be stably supported on the bead glass. it can.
  • the shaving coil When leaving the thick plate around the shaving coil, the shaving coil can be reinforced.
  • the electron gun according to the present invention is constructed by assembling the electron gun electrodes manufactured by the above-described method according to the present invention, a highly reliable electron gun can be provided.
  • the present invention can be suitably applied to an electron gun for a high-definition cathode ray tube.
  • 1A to 1 are manufacturing process diagrams (No. 1) showing a method for manufacturing an electron gun electrode according to the first embodiment of the present invention.
  • 2D to 2E are manufacturing process diagrams (part 2) illustrating the method for manufacturing the electron gun electrode according to the first embodiment of the present invention.
  • 3A to 3D are manufacturing process diagrams showing a method for manufacturing an electron gun electrode according to the second embodiment of the present invention.
  • 4A to 4C are manufacturing process diagrams illustrating a method for manufacturing an electron gun electrode according to the third embodiment of the present invention.
  • 5A and 5B are manufacturing process diagrams (part 1) illustrating a method for manufacturing an electron gun electrode according to the fourth embodiment of the present invention.
  • 6C to 6D are manufacturing process diagrams (No. 2) illustrating the method for manufacturing the electron gun electrode according to the fourth embodiment of the present invention.
  • 7E to 7F are manufacturing process diagrams (part 3) illustrating a method for manufacturing an electron gun electrode according to the fourth embodiment of the present invention.
  • 8A and 8B are manufacturing process diagrams illustrating a method for manufacturing an electron gun electrode according to a fifth embodiment of the present invention.
  • 9A and 9B are manufacturing process diagrams (part 1) illustrating a method for manufacturing an electron gun electrode according to the sixth embodiment of the present invention.
  • FIGS. 10C to 10E are manufacturing process diagrams (part 2) illustrating a method for manufacturing an electron gun electrode according to the sixth embodiment of the present invention.
  • 11A and 11B are manufacturing process diagrams showing a method for manufacturing an electron gun electrode according to a seventh embodiment of the present invention.
  • FIGS. 12A and 12B are explanatory views showing another example of the shaving coin processing of the present invention.
  • FIG. 13 shows the first grid electrode G! Using conventional coining.
  • FIG. 14 is an explanatory diagram of ordinary coining processing.
  • FIGS. 15A to 15C are manufacturing process diagrams showing the concept of the shaving process.
  • FIG. 1 and 2 show an embodiment of a method for manufacturing an electron gun electrode of the present invention and an electron gun electrode manufactured by the method.
  • a metal material (for example, SUS material, other electrode material, etc.) 1 having a predetermined plate thickness is prepared, and the metal material 1 is provided with a processing hole for a shaving coin having a desired hole diameter a X (a so-called processing hole).
  • a pilot hole 2 is formed.
  • the hole diameter ai of the working preparation hole 2 is set to be at least 80% and less than 100% of the diameter bi of the sieving / coining die 3.
  • the metal material 1 provided with the processing preparation hole 2 is placed and fixed on a die 4 for a single fin.
  • the die 4 for a shaving coin a die having no opening or a die having an opening 5 having a hole diameter C sufficiently smaller than the hole diameter for preparation as shown in the drawing can be used.
  • the inner wall of the working preparation hole 2 is cut by a die for the cutting and coining. That is, cut portions 6 corresponding to the difference between the processing ready pore size a i and the diameter i of the die 3.
  • the cut portion, the so-called metal part 6, is not cut off, and the die 4 and the mold 3 are connected with the material 1.
  • a thin plate 7 having a thickness ti smaller than the thickness T 1 of the metal material 1 and a diameter 13 1 equivalent to the diameter of the mold 3 so as to have a coining shape.
  • a remaining hole 2 'having a diameter di is formed in the center of the thin plate 7, .
  • the remaining hole 2 must be smaller than the diameter fi (see FIG. 2E) of the final electron beam transmitting hole to be formed later.
  • the thin plate 7 is subjected to coining with a smaller diameter 6 to form a thinner thin plate portion 8 if necessary.
  • the electron beam transmission hole 9 is formed by punching with a fine punch.
  • the electrode 101 of the electron gun is manufactured.
  • the diameter 3 of 3 is, for example, 1 mm
  • the hole diameter a of the processing preparation hole 2 for the moving coin is, for example, 0.85 mm
  • the opening diameter of the die 4 for the moving coin is, for example, 0.2 mm
  • the remaining hole for example, the hole diameter of 2 ′ can be 0.37 mm
  • the diameter ei of coining molding can be 0.9 mm, for example
  • the hole diameter f of the electron beam transmitting hole 9 can be 0.4 mm, for example.
  • the shaving coin machining method As shown in FIG. 1B, after the volume of the portion M shown by the broken line before the inner wall of the machining preparation hole 2 is shaved, it is moved to the portion. And press bottom dead center figure 1. In, the part ⁇ before being cut finally moves to the part N '.
  • the thickness of thin plate 7! And the hole diameter d of the remaining hole 2 '! Are calculated from the thickness of the metal material 1, the diameter of the shaving coin portion, and the hole diameter a i of the preparation hole 2, respectively. For example, it can be expressed by Equation 1.
  • the inner wall of the processing preparation hole 2 of the metal material 1 is cut off, so that the metal material 1 is thin enough to form a coining shape in one step from the state where the plate thickness T i remains large.
  • a thin plate having a thickness t 1 can be formed.
  • the peripheral portion of the thin plate 7 has the thickness T of the conventional peripheral portion of the coining in FIG. 13 described above. '' It is possible to realize a thin plate 7 with a small thickness t while maintaining mechanical strength with a thicker original material plate thickness. it can.
  • an edge portion is formed by one cutting process. Therefore, as shown in FIG. 1C, an edge portion of the shaving coin portion end, that is, an end of the thin plate 7 of the metal material 1 is formed.
  • the edge portion 11 is clearly formed, positioning can be performed with high accuracy, and accuracy management is also facilitated.
  • the surface of the metal material 1 after the shaving coin processing has no raised portion as in the conventional coining processing, and is kept flat.
  • a normal coining process is performed on the thin plate 7.
  • the processing in FIG. 2D may be omitted.
  • FIG. 3 shows another embodiment of the present invention showing this example.
  • Steps C to C are the same as those in the above-described steps of FIGS. 1A to 1C.
  • shaving coin processing is performed on the metal material 1 having a thickness to form a thin plate 7 having a desired thickness ti shown in FIG.
  • an electron beam transmitting hole 9 having a hole diameter f 2 is formed directly in the thin plate 7 by punching to manufacture a target electron gun electrode 102.
  • FIG. 2D further normal coining is applied to A thin plate 8 having a thin plate thickness t 2 can be formed.
  • Method of manufacturing an electron gun electrode of the present invention is applied to the production of the first grid electrode G t, a second glycidyl Tsu cathode electrode G 2, or other grid electrodes constituting an electron gun.
  • a plurality of electrodes are arranged so as to include the electrode grid manufactured as described above, and integrated to constitute an electron gun for a cathode ray tube.
  • the thin plate ⁇ is formed by shaving the inner wall of the preparation hole 2 of the metal material 1 while cutting the cut portion 6 without cutting off the inner wall and connecting the material 1 to the material 1.
  • so-called shibbing coin processing it is not necessary to reduce the thickness of the periphery of the thin plate 7, that is, the so-called shibbing coin, that is, to increase the thickness of the metal material 1 as it is. Can be. Therefore, it is possible to manufacture a grid electrode that is strong against deformation due to pressure during assembly of the electron gun, and to assemble an electron gun with no dimensional change.
  • the thickness ti of the thin plate 7 can be made extremely thin, and a fine hole diameter f 2 in this thin plate 7 or further coining is formed to form an electron beam transmitting hole 9 with a small hole diameter f in the thin plate 8. it can.
  • a thinner sheet 8 is formed by coining, an electron beam transmitting hole 9 having a smaller hole diameter f can be formed.
  • a thin plate 7 having a desired plate thickness tt can be formed with high accuracy.
  • the sheet 7 of the sheet 7 which is the cutting coin portion is formed. Since the thickness ti can be reduced, the degree of freedom in designing an electron gun in the direction of reducing the electrode plate thickness is improved.
  • the shaving coin edge portion 11 of the electrode can be formed with high relative position accuracy. Therefore, the shaving cone portion can be used as an electronic lens as well as when it is not necessary in terms of characteristics, and in any case, the beam spot characteristics can be improved as compared with the conventional case.
  • an electron gun having good dimensional accuracy and a small electron beam spot diameter can be formed, and this electron gun is particularly suitable for application to a high-definition cathode ray tube.
  • FIG. 4 shows another embodiment of the present invention.
  • the processing preparation hole 2 shown in, for example, FIG. 1A or FIG. 3A is formed, and then the shaving coin processing in FIG. 1C or FIG. 3C is performed. Finally, the electron beam transmitting holes 9 shown in FIG. 2E or FIG. 3D are punched out by fine punching. Since the preparation hole 2 is subjected to normal punching, the inner wall of the punched metal material 1 has a smooth shear surface 2 2 and a rough fracture surface 23 with irregularities as shown in FIG. 4A. . It is difficult to control the size and shape of the fractured surface 23, and there is a possibility that the fractured surface 23 will be displaced in the subsequent shaving coin process and remain as a fractured surface mark. Figure 4 shows an improvement in this point.
  • the fractured surface 23 is formed on the upper surface side where the shaving-coin is performed. Indicated by arrow 2 1
  • the blank 1 is punched from the back side to the top side of the blank 1 to form a working preparation hole 2.
  • the sheet is subjected to sieve coining in a direction opposite to the direction in which the processing preparation hole 2 is punched, that is, from the upper surface side to the lower surface side of the material 1 indicated by an arrow 25.
  • an electron beam transmitting hole 9 is formed by punching to remove the remaining fracture surface mark 24, thereby manufacturing a target electrode 103.
  • the thin plate 7 is subjected to a normal coining process to form a thin plate 8 after the shaving coining process shown in FIG. 4B, and then the thin plate 8 is broken.
  • the target electrode may be manufactured by forming the electron beam transmitting hole 9 so as to remove the cross-sectional mark 24.
  • the processing preparation hole 2 is formed by punching from the surface opposite to the surface to be subjected to the shaving coin processing, and the fracture surface 23 is left above the processing preparation hole 2.
  • the fracture surface 23 of the preparation hole 2 and therefore the trace 24 of the fracture surface in the remaining hole 2 ′ can be completely removed by the next shaving coin process and the punching process of the electron beam transmission hole. . Therefore, an electron gun electrode with good dimensional accuracy can be manufactured.
  • the desired sheet thickness tt and the desired thickness after the shaving coin are obtained.
  • the conditions that determine the remaining hole diameter of the preparatory hole are the base thickness of the metal material T! There is.
  • the thickness of the part where the sieving coin is to be applied and the thickness of other parts can be changed independently from the material cost and the convenience of molding the parts other than the electron beam transmission hole, the design is free. The degree will increase.
  • the original plate thickness of the metal material (the so-called material plate thickness) is selected and determined depending on the shaving coin processing.
  • the remaining hole diameter after the cutting coin machining d! Therefore, in order to further reduce the size of the electron beam transmission hole with a small diameter, the degree of freedom in selecting the thickness of the material becomes necessary.
  • a bulging portion is formed in advance on the material 'base plate, and the plate thickness of the portion forming the processing preparation hole is made smaller than the material base plate thickness. Place it thickly and give it a sieve-coining process.
  • FIG. 5 shows another embodiment of the present invention using this method.
  • an electrode member that is, a metal material having a predetermined thickness T 2 (not shown) (a so-called material base plate, for example, a SUS material, An electrode material, etc.) 31 is prepared, and a raised portion, in this example, a convex coining portion 32 is formed on one surface of the metal material 31.
  • the metal material 3 1 is placed on the pre-working coining die 3 4, fixed, and processed by the pre-processing coining mold 3 3 at the portion where the preparation hole for the metal material 3 1 should be formed. forming a convex coining portion 3 2 having a pore size a 3 larger diameter g 3 of the preparation hole. This coining, increasing the thickness of the portion to be shell one Bingukoi down process until the desired thickness T 3 I do.
  • plate thickness T 4 is thinner than the material source thickness T 2.
  • a metal material 31 having a convex coining part 32 is placed and fixed on a die 37 for a preparation hole, and the metal material 31 is prepared by a punching die 36 for the preparation. ⁇ Hole for preparation for processing one bing coin 3
  • the processing preparation hole 3 8 is smaller rather Mr than the pore size of a 3 convex shape Koiningu 3 2 diameter g 3 a (a 3 rather g 3), convex Koi-learning around the hole diameter a 3 It is formed so that the thick plate portion 35 by the portion remains.
  • the diameter a 3 of the machining preparation hole 3 8, in the same way as described above sheet We - are set so that Bingukoi emissions strike die 4 1 0 below 0% in the first diameter b 3 of 80% or more.
  • the same blanking processing as described above is performed on the metal material 31. That is, as shown in FIG. 6C, the metal material 31 having the processing preparation hole 38 formed thereon is placed and fixed on the die 42 for the cutting coin. Shi We one Bingukoi down die 4 2, those openings are not, or can be used with the machining preparation opening 4 3 having a pore size of a 3 than a sufficiently small pore size c 3 as shown in FIG.
  • a cutting die 41 having a diameter b 3 is cut so as to cut the entire thick plate portion 35 around the preparation hole 38. . That is, cutting the portion 3 9 (including thick plate portion 35) corresponding to the difference between the processing quasi ⁇ diameter a and diameter b 3 of the mold 4 1.
  • a thin plate 45 having a thickness t is formed continuously from the metal material 31 without being cut off (see FIG. 7E).
  • the hole diameter d 3 of the remaining hole 3 8 ′ of the formed thin plate 45 becomes the diameter 0 1 of the remaining hole 2 of FIG. 1C. It is processed to a smaller diameter (d 3 ⁇ d!).
  • coining die diameter g 3 and the machining preparation hole diameter a 3 and shell - size of the relationship between Bingukoi down strike die diameter b 3 of becomes a 3 ⁇ g ⁇ b.
  • an electron beam transmitting hole 46 having a hole diameter f is formed in the thin plate 45 by punching with a fine punch to manufacture an electrode 104 of the electron gun.
  • FIG. 8 shows another embodiment. This embodiment, after the aforementioned FIG 7 E step, as shown in FIG. 8 A, further subjected to Koiningu processing of smaller diameter 6 4 than the diameter b relative to the thin plate 4 5, the thin plate portions and thinner Form 4 7 The hole diameter of the remaining hole 38 f is d 4 .
  • the electron beam transmitting hole 4 8 a pore diameter f 4 is formed by punching hitting by fine punching in a thin plate portion 4 7, to produce the electrodes 1 0 5 of electron guns.
  • the thickness of the portion where the processing preparation hole 38 is formed is increased in advance.
  • the convex coining part 32 is formed, and then a processing preparation hole 38 is formed so as to leave the thick plate part 35 around it.
  • the remaining hole 3 of the thin sheet 45 after processing is formed.
  • 8 ′ can be formed even smaller, and electron gun electrodes 104 and 105 having smaller electron beam transmission holes 46 or 48 can be manufactured.
  • the metal material 3 1 having the predetermined base plate thickness T 2 is used regardless of the base plate thickness of the metal base material (that is, without selecting the base plate thickness). From this, a desired small-diameter shaving-coin remaining hole 38 'can be formed, and compared with the shaving-coin technology shown in FIG. 1 to FIG. 2 or FIG. Beam transmission holes 46 or 4.8 can be realized.
  • the electron gun electrode can be formed of the desired thickness of the metal material 31 without increasing the thickness of the base material of the metal material, the support pieces embedded in the bead glass which is the support member of the electron gun That is, pins and tabs can be provided integrally with the electron gun electrode.
  • the pins and tabs can be formed thin, and the electron gun electrodes can be stably supported on the bead glass.
  • FIGS. 9 and 10 show still another embodiment of the present invention.
  • a thick plate portion is left around the shaving coin part.
  • an electrode member that is, a metal material having a predetermined plate thickness T 2 (not shown) (a so-called raw material plate, for example, a SUS material
  • An electrode material 31 is prepared, and a raised portion, in this example, a convex coining portion 32 is formed on one surface of the metal material 31.
  • the metal material 31 is placed and fixed on the pre-working coining die 34 in the same manner as described above, and the part where the pre-working hole of the metal material 31 is to be formed by the pre-working die 33 is used.
  • a convex coining portion 32 having a diameter ⁇ ⁇ ⁇ ⁇ 5 larger than the hole diameter a5 of the processing preparation hole is formed.
  • the thickness of the portion to be subjected to shaving coin processing is increased to a desired thickness T5.
  • the thickness T 6 of the other portion, particularly the portion around the moving coin portion becomes smaller than the original thickness T 2 of the material.
  • a metal material 31 having a convex coining portion 32 is placed and fixed on a die 37 for a preparation hole, and the metal material 31 is prepared by a punching die 36 for the preparation. ⁇ Form a processing preparation hole 38 for one bing coin.
  • the processing preparation hole 3 8 the hole diameter a 5 Mr rather smaller than convex shaped coining portion 3 2 diameter g 5 (a 5 ⁇ g 5 ), convex Koi-learning around the hole diameter a 5 It is formed so that the thick plate portion 35 by the portion remains.
  • Diameter a 5 in the machining preparation hole 3 8 also, in the same way as described above shell - is set to be 1 0 less than 0% by Bingukoi emission beating mold 5 1 8 of diameter 50% or more.
  • the metal material 31 is subjected to a sieve coining process. That is, as shown in FIG. 1 0 C, in the same manner as described above, the metal material 3 1 formed with the machining preparation hole 3 8 is placed fixed on Shiwebingukoi down die 5 2, rather large from the machining preparation hole diameter a 5 and in sheet chromatography Bing coin striking mold 5 1 having a diameter g 5 smaller than the diameter d 5 of the coining portion 3 2 performs a shaving coin processing continuously, as shown in FIG. 1 0 D, the metal material 3 1 The thin plate 4 5 to be formed is formed.
  • the shaving coin processing is performed so that the thick plate portion 35 by the convex-shaped coining remains around the shaving coin portion.
  • the thickness of the formed thin plate 4 5 is t 5 .
  • the hole diameter of the remaining hole 38 of 5 was d5.
  • the electron beam transmission hole 4 6 with a pore diameter f 5 is formed by punching by small punch sheet 4 5, to produce the electrode 1 0 6 of the electron gun.
  • FIG. 11 shows another embodiment. This embodiment is based on the above-mentioned figure. 1 0
  • D step as shown in FIG. 1 1 A, form a thin plate portion 4 7 subjected to coining was rather more thin small diameter 6 5 than further in diameter 13 5 with respect to the thin plate 4 5 I do.
  • the pore size of the remaining holes becomes d 6.
  • an electron beam transmitting hole 48 having a hole diameter fs is formed in the thin plate portion 47 by punching with a fine punch to manufacture an electrode 107 of an electron gun.
  • the thick plate portion 35 remains around the shaving coin portion, so that the shaving coin portion is further reinforced.
  • the mechanical strength of the electron gun electrode can be increased.
  • the convex coining part 32 is formed on one surface (front surface) of the metal material.
  • the metal meat portion to be cut is processed into a thin plate shape connected to the metal material before cutting from the metal material. It is also possible to cut the metal part to be cut from the metal material and then add it to a thin plate shape connected to the metal material.
  • the shaved-coin mold is used to make the cut meat Immediately after cutting, the die cut into the cutting hole immediately from the die for the cutting coil and the cutting part cut in co-operation with the die for the cutting coil are re-formed into the metal material.
  • a flush plate 63 can be integrally formed on the back surface of the metal material 62, and as shown in FIG. The thin plate 62 in the middle of the hole can be integrally formed.
  • a metal portion cut by sieving from one surface of a metal material having a predetermined thickness is formed into a thin plate continuous with the metal material.
  • the thinning portion can be formed thin irrespective of the thickness of the metal material (original plate material) by the above equation (1). ! The degree of freedom in designing electron guns in the direction of thinning is improved. Further, an electrode having finer electron beam transmission holes and having high mechanical strength can be manufactured.
  • the edge of the thick plate around the thin plate forms an electric field lens, but in the present invention, this edge is formed with high relative position accuracy without swelling unlike conventional coining. it can. Therefore, it is possible not only to use a so-called shaving coin portion in terms of characteristics but also to use it as an electronic lens, and to improve the beam spot characteristics as compared with the conventional case. it can.
  • a thin plate having a desired thickness can be accurately formed, and Electron gun electrodes can be manufactured.
  • the direction in which the preparation hole is punched and the direction in which the metal material is cut by shaving are reversed with respect to the thickness direction of the metal material.
  • the resulting fracture surface can be transferred as a fracture surface mark to the inner surface of the remaining hole after forming the thin plate. Therefore, it is possible to completely remove the fractured surface in the processing preparation hole by forming the electron beam transmitting hole thereafter, and it is possible to manufacture an electron gun electrode with high dimensional accuracy.
  • a raised portion is formed on the surface of the metal material in advance, a working preparation hole is formed in this raised portion, and then a shaving coin process is performed to increase the remaining hole diameter of the thin plate regardless of the original plate thickness of the metal material. It is possible to form a reduced shaving coil part,
  • the supporting piece formed integrally with the electron gun electrode can be made as thin as desired, and the electron gun electrode can be stably supported on the bead glass. it can.
  • the shaving coin When leaving the thick plate around the shaving coin, the shaving coin can be reinforced.
  • the electron gun according to the present invention is constructed by assembling the electron gun electrodes manufactured by the above-described manufacturing method according to the present invention, a highly reliable electron gun is provided.
  • the present invention can be suitably applied to an electron gun for a high-definition cathode ray tube.

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Abstract

An electron gun of a cathode-ray tube and a method for manufacturing the electrode of an electron gun. The electrode of an electron gun is formed into a thin plate (7) where a metallic part (N) formed from one side of a metallic material (1) by shaving is continuous with the metallic material. The thin plate may be formed by coining. In such a way a thin plate part can be formed by a single machining regardless of the thickness of the metallic material. When a hole for passing an electron beam is made in the thin plate part of such an electrode, a highly precise electron gun having a micro hole for passing an electron beam can be produced while maintaining the mechanical strength of the electrode.

Description

明 細 書  Specification
電子銃及び電子銃電極の製造方法  Electron gun and method for manufacturing electron gun electrode
技術分野 Technical field
本発明は、 陰極線管の電子銃及びその電極部品、 即ち電子銃電 極の製造方法に関する。  The present invention relates to an electron gun for a cathode ray tube and an electrode component thereof, that is, a method for manufacturing an electron gun electrode.
背景技術 Background art
近年、 例えばディ スプレイ用等のカラ一陰極線管に対して、 よ り高精細度の要求が高まってきている。 従って、 このような陰極 線管に用いられる電子銃では、 高精細度への要求から電子ビーム スポッ ト径をより小さ くすべく、 その電子銃を構成するグリ ッ ド 電極のビーム透過孔の孔径がますます縮小化されてきている。  In recent years, there has been an increasing demand for higher definition for a color cathode ray tube for a display, for example. Therefore, in the electron gun used for such a cathode ray tube, the diameter of the beam transmission hole of the grid electrode constituting the electron gun is reduced in order to reduce the diameter of the electron beam spot due to the demand for high definition. Increasingly smaller.
例えば、 電子銃を古い順にみると、 第 1 グリ ッ ド電極 G! のビ —ム透過孔の孔径は、  For example, looking at the electron guns in chronological order, the first grid electrode G! The diameter of the beam transmission hole of
Φ 0 . 4 3 111 111相当→ $¾ 0 . 3 2 m m相当 0 0 . 3 0 m m相当  Φ 0.43 111 111 equivalent → $ ¾ 0.32 mm equivalent 0 0.30 mm equivalent
の順に推移している。 このように推移する電子銃を、 従来通りの 回路電圧にて駆動するためには、 力ソー ド Kと第 1 グリ ッ ド電極 G! 間の距離 d を小さ く しなければならず、 必然的に第 1 ダリ ッ ド電極 の板厚を薄く しなければならない。 このため、 上記 の各々の電子銃について、 第 1 グリ ッ ド電極 G 1 のビーム透過孔 周辺での板厚は、 上記ビーム透過孔径に応じて In order. In order to drive the electron gun, which changes in this way, at the same circuit voltage as before, the power source K and the first grid electrode G! The distance d between them must be reduced, and the plate thickness of the first Darriedd electrode must inevitably be reduced. Therefore, for each of the electron guns described above, the plate thickness of the first grid electrode G1 around the beam transmission hole is determined according to the beam transmission hole diameter.
0 . 0 6 m m→ 0 . 0 5 m m→ 0 . 0 4 5 m m  0 .06 mm → 0 .05 mm → 0 .0 5 mm
の順に薄く なつてきている。 It becomes thinner in this order.
ここで、 従来の第 1 グリ ッ ド電極 G i の製造は、 コイニング技 術が用いられている。 コイニング技術は、 金属素材の元板を叩い て薄くする技術である。  Here, the conventional first grid electrode Gi is manufactured using coining technology. Coining technology is a technology that taps a metal base plate to make it thinner.
図 1 3 は、 コイニング技術を用いた従来形状の第 1ダリ ッ ド電 極 G i の例を示す。 ここでは、 金属素材の元扳を段階的に薄く し てゆく ための複数回のコイニング加工が施される。 FIG. 13 shows an example of a first shaped first grid electrode Gi using a coining technique. Here, the metal material is gradually reduced in thickness. Coining is carried out several times to move the car.
この第 1 グリ ッ ド電極 G 1 では、 ビーム透過孔 8 3を通るコィ 二ング断面 8 0 において、 金属素材の元板厚さ T。 を、 所望の孔 周り板厚 t 。 までコイニング加工するためには、 コイニング部周 辺の板厚 Τ。 ' もコイニング加工して薄く しておかなくてはなら ない。 また、 従来の複数回のコイニングでは、 中心孔の向きへの 肉部の逃げととともに、 放射方向外側の向きへの肉部の逃げがあ り、 したがって逃げしろと して円形リ ブ 8 2を設けなければなら ない。 8 1 はコイニング部のエッジ部を示す。  In the first grid electrode G 1, the original plate thickness T of the metal material is obtained at the coupling cross section 80 passing through the beam transmitting hole 83. The desired thickness around the plate thickness t. In order to perform the coining process up to the thickness of the sheet around the coining part Τ. 'Must be thinned by coining. In conventional multiple coining, the flesh escapes in the direction of the center hole and the flesh escapes in the radially outward direction.Therefore, the circular rib 82 is used as an escape. Must be provided. 8 1 indicates the edge of the coining part.
一方、 孔開け加工法の 1つとして、 シヱ一ビング (切削打ち抜 き) 加工技術が知られている。 このシヱ一ビング加工の概念を図 1 5 に示す。 ·  On the other hand, as one of the drilling methods, a cutting (punching) processing technique is known. Fig. 15 shows the concept of this shaving process. ·
図 1 5 Αに示すように、 素材元板 7 0 に、 シヱ一ビング用の打 ち抜き金型 7 1の径 b (例えば l m m ) に比べて 8 0 %以上の径 a (例えば 0 . 8 5 m m ) となるシェ一ビング用加工準備孔 (い わゆる下孔) 7 3を形成し、 この素材元板 7 0を径 bの開孔 7 4 を有するシェービング用ダイ 7 2上に載置固定する。  As shown in Fig. 15 (5), the material base plate 70 has a diameter a (for example, 0. A shaving preparation hole (so-called lower hole) 73 is formed, and this material base plate 70 is placed on a shaving die 72 having an opening 7 4 having a diameter b. And fix it.
次に、 図 1 5 Bに示すように、 打ち抜き金型 7 1の先端で素材 元板 Ί 0 の加工準備孔 7 3 の内壁部分 7 5を切削する。  Next, as shown in FIG. 15B, the inner wall portion 75 of the machining preparation hole 73 of the base material plate 0 is cut at the tip of the punching die 71.
その後、 図 1 5 Cに示すように、 打ち抜き金型 7 1の先端が素 材元板 7 0 の裏面 7 0 bまで達し、 削られた素材内壁の部分 (い わゆる肉部) 7 5が切り落され ¾。 この結果、 素材元板 7 0に孔 径 bを有する最終形状の透孔 7 6が形成される。  Then, as shown in Fig. 15C, the tip of the punching die 71 reaches the back 70b of the base material plate 70, and the cut-out portion of the inner wall of the material (so-called meat portion) 75切 り. As a result, a through hole 76 of a final shape having a hole diameter b is formed in the base material plate 70.
シヱ一ビング加工では、 図 1 5の工程を繰り返しながら、 順次 孔径を大き く して、 最終的に所望の孔径を有する透孔を形成する 技術も知られている。  In the shaving process, there is also known a technique of sequentially increasing the hole diameter while repeating the process of FIG. 15 to finally form a through hole having a desired hole diameter.
ところで、 電子銃電極の製造に用いるコイニング技術では、 前 述したように、 金属素材の元板を叩いて薄くする技術であるため 、 素材の板厚によって、 例えば素材元板厚の 1 / 4程度にコィニ ングするのが限界であった。 By the way, the coining technology used in the manufacture of electron gun electrodes, as described above, is a technology of hitting the base plate of a metal material to make it thinner. However, depending on the thickness of the material, it was limited to, for example, about 1/4 of the original material thickness.
これについては、 先に報告した 「陰極線管用電子銃の力ソー ド 支持構造」 (特願平 1 0 _ 3 0 4 3 7 7号) 等により素材金属板 に薄板を用いるアプローチをしてきたが、 一方で電子銃の電極部 品は、 組立時の加圧などに対して変形しないように強度を保持し ていなく てはならないので、 ビーム透過孔を小さ くするために、 素材に薄板を用いることにも限界があった。 つまり、 コイニング 加工技術を用いてビーム透過孔を有する電子銃電極、 例えば第 1 ダリ ッ ド電極 を製造する場合、 強度を保持しつつ、 より微小 なビーム透過孔を形成することが困難であつた。  Regarding this, the approach of using a thin plate as the material metal plate has been attempted by the previously reported “Structure support for the power source of the cathode ray tube electron gun” (Japanese Patent Application No. 10-304703). On the other hand, the electrode parts of the electron gun must maintain strength so that they are not deformed by pressure during assembly, etc., so use a thin plate as the material to reduce the beam transmission hole. Also had limitations. In other words, when manufacturing an electron gun electrode having a beam transmitting hole, for example, the first Darling electrode using coining processing technology, it is difficult to form a finer beam transmitting hole while maintaining strength. .
一方、 従来のコイニング加工では、 段階的に板厚を薄く し ゆ く ために、 複数回のコイニング加工となる都合上、 図 1 4に示す コイニング加工前の素材 8 6からコイニング加工後の断面形状 8 9で判るように、 コイニング用加工準備孔 8 8が形成されるも、 コィニング部のェッジ部 8 1が盛り上がり斜面として形成されて しま うので、 寸法測定時の観測条件などにより測定精度、 測定再 現性等が悪く、 コイニング部の相対位置精度を維持管理するのが 難しかった。 図 1 4において、 9 0 はコィニング加工後の加工準 備孔 8 8 の残り孔である。  On the other hand, in the conventional coining process, since the thickness is gradually reduced, the cross-sectional shape after the coining process is changed from the raw material 86 before the coining process shown in Fig. 14 due to multiple coining processes. As can be seen from 8 9, although the machining preparation hole 8 8 for coining is formed, the edge 8 1 of the coining part is formed as a rising slope, so the measurement accuracy and measurement depend on the observation conditions at the time of dimension measurement. Poor reproducibility made it difficult to maintain and maintain the relative positional accuracy of the coining part. In FIG. 14, reference numeral 90 denotes a remaining hole of the preparation hole 88 after coining.
また、 このコイニング部のエッジ部 8 1での肉の盛り上りで第 1 グリ ッ ド電極 G 及び第 2 グリ ッ ド電極 G 2 間の距離 d i 2の制 御が困難とならざるを得なかった。 Further, control of the coining portion of the edge portion 8 a first meat of upsurge in 1 grid electrode G and the second grid distance between de electrode G 2 di 2 is unavoidably difficult .
発明の開示 Disclosure of the invention
本発明は、 板厚の厚い素材に、 部分的に微小な電子ビーム透過 孔を形成すべき薄板を形成できるようにした電子銃電極の製造方 法を提供するものである。  An object of the present invention is to provide a method of manufacturing an electron gun electrode which can form a thin plate on which a fine electron beam transmitting hole is to be partially formed in a thick material.
本発明は、 このような製法で製造した電極を有して例えば高精 細度の陰極線管に適した信頼性の高い電子銃を提供するものであ 本発明に係る陰極線管の電子銃は、 金属素材の一の面からのシ エービングにより切削される金属部が金属素材に連続した薄板に 成形され、 この薄板の部分に電子ビーム透過孔が形成されてなる 電極を有して構成する。 The present invention includes, for example, a high-precision An object of the present invention is to provide a highly reliable electron gun suitable for a fine cathode ray tube. The electron gun of the cathode ray tube according to the present invention has a metal part cut by shaving from one surface of a metal material. An electrode formed by forming an electron beam transmitting hole in a portion of the thin plate.
本発明に係る陰極線管の電子銃は、 金属素材の一の面からのシ ェ一ビングにより切削される金属部が金属素材に連続した薄板に 形成され、 さ らにコイニング成形された薄板の部分に電子ビーム 透過孔が形成されてなる電極を有して構成する。  In the electron gun of the cathode ray tube according to the present invention, the metal portion cut by shaving from one surface of the metal material is formed in a thin plate continuous with the metal material, and the portion of the thin plate formed by coining is further formed. And an electrode in which an electron beam transmitting hole is formed.
本発明に係る電子銃電極の製造方法は、 厚板の金属素材の一部 を薄板に成形する工程において、 金属素材の一の面からのシヱ一 ビングにより切削される金属部を、 金属素材に連続した薄板に成 形する。  In the method for manufacturing an electron gun electrode according to the present invention, in the step of forming a part of a thick metal material into a thin plate, a metal part cut by sieving from one surface of the metal material is formed by a metal material. Form into a continuous thin plate.
本発明に係る電子銃電極の製造方法は、 厚板の金属素材の一部 を薄板に成形する工程において、 金属素材の一の面からのシヱ一 ビングにより切削される金属部を、 金属素材に連続した薄板に成 形し、 さ らにこの薄板の部分をコイニング成形して薄くする。  In the method for manufacturing an electron gun electrode according to the present invention, in the step of forming a part of a thick metal material into a thin plate, a metal part cut by sieving from one surface of the metal material is formed by a metal material. Then, it is formed into a continuous thin plate, and the thin plate is thinned by coining.
本発明に係る電子銃電極の製造方法は、 金属素材の板厚方向に 対して、 加工基準孔を打ち抜く 向きと、 金属素材を切削する向き とを、 互いに逆にして加工する。 その後、 上述の各製法で示す加 ェを行う。  In the method for manufacturing an electron gun electrode according to the present invention, the direction in which the processing reference hole is punched and the direction in which the metal material is cut are reversed with respect to the thickness direction of the metal material. Thereafter, the processes shown in the above-mentioned respective manufacturing methods are performed.
本発明に係る電子銃電極の製造方法は、 加工準備孔の周囲が他 部より盛り上げられた金属素材を形成し、 金属素材に一面からシ ェ一ビングにより切削される金属部を、 金属素材に連続した薄板' に成形する。 薄板に成形した後、 さ らに薄板の部分をコイニング 成形することもできる。 上記シヱ一ビングにおいては、 盛り上げ られた部分の全てをシエービングしても良く、 あるいは盛り上げ られた部分の一部をシェ一ビングするようにしても良い。 In the method for manufacturing an electron gun electrode according to the present invention, a metal material in which a periphery of a processing preparation hole is raised from another portion is formed, and a metal portion cut by shaving from one side of the metal material is formed into a metal material. It is formed into a 'continuous thin plate'. After being formed into a thin plate, a portion of the thin plate may be coined. In the above-mentioned shaving, all the raised portions may be shaved, or A part of the part may be shaved.
上述において、 薄板を成形した後に、 その薄板の部分に電子ビ —ム透過孔を形成する。 或いは、 更にコイニング成形したときは 、 そのコイニング成形部に電子ビーム透過孔を形成する。  In the above, after forming a thin plate, an electron beam transmitting hole is formed in the thin plate portion. Alternatively, when coining is further performed, an electron beam transmitting hole is formed in the coining molded portion.
上記の金属素材に予め形成される加工準備孔としては、 その後 成形されるべき薄板の径の 8 0 %以上の径を有する加工基準孔と することが好ましい。 このような加工基準孔を形成した後、 上述 の製法で示す加工を行う。  The working preparation hole formed in advance in the metal material is preferably a working reference hole having a diameter of 80% or more of the diameter of the thin plate to be subsequently formed. After forming such a processing reference hole, the processing shown in the above-described manufacturing method is performed.
本発明の電子銃電極の加工技術の基本は、 金属素材の加工基準 孔の内壁をシヱ一ビングにより削りながら、 その素材内壁の肉部 The basic processing technology of the electron gun electrode of the present invention is based on the following method.
、 即ち金属部を完全に削り落さずに繋がった状態で残し、 その残 つた切削金属部分をプレスしてあたかもコイニング形状となるよ うに薄板状に成形することである。 以下、 この加工技術をシヱ一 ビングコィニング、 略してシェ一ビングコイン加工と呼ぶことに する。 That is, the metal part is left in a connected state without being completely cut off, and the remaining cut metal part is pressed and formed into a thin plate shape as if it were a coining shape. Hereinafter, this processing technique will be referred to as shaving coin processing or, for short, shaving coin processing.
本発明のシヱ一ビングコィ ン加工技術の変形としては、 切削さ れる金属肉部を金属素材より切断した後に金属素材に連接する薄 板形状に加工することも可能である。  As a modification of the shaving-coin processing technology of the present invention, it is also possible to cut a metal meat portion to be cut from a metal material and then process it into a thin plate shape connected to the metal material.
本発明の電子銃によれば、 その所望の電極が、 金属素材の一の 面からのシェ一ビングにより切削される金属部を金属素材に連続 した薄板に成形し、 この薄板部に電子ビーム透過孔を形成して構 成されるので、 電極の機械的強度が維持されると共に、 微小な電 子ビーム透過孔が得られる。 従って、 寸法変化のない高精度の電 子銃が得られる。  According to the electron gun of the present invention, the desired electrode is formed by shaping a metal portion cut by shaving from one surface of the metal material into a thin plate continuous with the metal material, and transmitting the electron beam through the thin plate portion. Since the electrodes are formed with holes, the mechanical strength of the electrodes is maintained, and minute electron beam transmission holes are obtained. Therefore, a highly accurate electron gun with no dimensional change can be obtained.
さらに上記薄板に対してコイニング成形し、 このコイニング成 形された薄板の部分に電子ビーム透過孔を形成するときは、 電極 の機械的強度が維持されながら、 より微小な電子ビーム透過孔が 得られ、 電子銃の更なる高精度化が図れる。 本発明の電子銃電極の製造方法によれば、 所定厚板の金属素材 の一の面からのシヱービングにより切削される金属部を、 金属素 材に連続した薄板に成形する工程を有することにより、 金属素材 の厚さにかかわらず 1回の加工で板厚の薄い薄板部分を成形する こ とができる。 Further, when the above thin plate is coined and an electron beam transmitting hole is formed in the coined formed thin plate portion, a finer electron beam transmitting hole can be obtained while maintaining the mechanical strength of the electrode. The accuracy of the electron gun can be further improved. According to the method for manufacturing an electron gun electrode of the present invention, the method includes a step of forming a metal portion cut by sieving from one surface of a metal material of a predetermined thickness into a thin plate continuous with the metal material. Regardless of the thickness of the metal material, a thin part with a small thickness can be formed in one process.
従って、 電子銃組立時の加圧によっても変形しにく い機械的強 度の大きい電極を作ることができ、 寸法変化のない電子銃を組み 立てることができる。  Therefore, it is possible to produce an electrode having high mechanical strength that is not easily deformed even by pressurization at the time of assembling the electron gun, and to assemble an electron gun having no dimensional change.
また、 本発明による加工では、 金属素材 (元板材) の板厚にか かわらず薄板部分の板厚を薄く成形できるので、 電極部品の板厚 を薄くする方向での電子銃設計の自由度が向上する。 そして、 よ り微小な電子ビーム透過孔を有し、 且つ機械強度の大きい電極を 製造することができる。  In addition, in the processing according to the present invention, the thickness of the thin plate portion can be reduced regardless of the thickness of the metal material (original plate material). improves. In addition, an electrode having smaller electron beam transmission holes and high mechanical strength can be manufactured.
陰極線管の動作時、 薄板周辺部の厚板部分のエツジ部は電界レ ンズを形成するが、 本発明では、 このエッジ部が従来のコィニン グ加工のように盛り上がることなく、 相対位置精度よく形成でき る。 従って、 いわゆるシヱ一ビングコイ ン部を特性上必要と しな い場合のみならず、 電子レンズとして利用することも可能であり 、 いずれも従来に比べてビームスポッ 卜特性を向上させることが できる。  During operation of the cathode ray tube, the edge of the thick plate around the thin plate forms an electric field lens, but in the present invention, this edge is formed with high relative position accuracy without swelling unlike conventional coining. it can. Therefore, not only the case where the so-called shaving coin portion is not required in characteristics but also the use as an electron lens is possible. In any case, the beam spot characteristics can be improved as compared with the conventional case.
シェ一ビングコィ ン加工により薄板を形成した後、 さ らに薄板 に対してコイニング成形するときは、 更に薄い薄板部分を形成す るこ とができる。 従ってより微小な電子ビーム透過孔を形成する こ とができる。  When a thin plate is formed by shaving coin processing and then coining is performed on the thin plate, a thinner thin plate portion can be formed. Therefore, finer electron beam transmission holes can be formed.
加工準備孔として、 その後成形されるべき薄板の径の 8 0 %以 上の径を有する加工準備孔を形成するときは、 精度よく所望の板 厚の薄板を形成することができ、 目的の電子銃電極を製造するこ とができる。 金属素材の板厚方向に対して、 加工準備孔を打ち抜く 向きと、 金属素材をシエービングにより切削する向きとを、 互に逆にする ことにより、 加工準備孔の打ち抜き加工時に上部に生じた破断面 を、 薄板成形後の残り孔内面に破断面痕として移すことができる 。 従って、 その後の電子ビーム透過孔の形成で加工準備孔におけ る破断面を完全に除去することができ、 寸法精度の良い電子銃電 極を製造することができる。 When forming a working preparation hole having a diameter of 80% or more of the diameter of a thin plate to be subsequently formed as a working preparation hole, a thin plate having a desired thickness can be accurately formed, and a target electron can be formed. Gun electrodes can be manufactured. The direction in which the preparation hole is punched and the direction in which the metal material is cut by shaving are reversed with respect to the thickness direction of the metal material. Can be transferred to the inner surface of the remaining hole after forming the thin plate as a fracture mark. Therefore, it is possible to completely remove the fractured surface in the processing preparation hole by forming the electron beam transmitting hole thereafter, and it is possible to manufacture an electron gun electrode with high dimensional accuracy.
金属素材の面に予め盛り上がり部を形成し、 この盛り上がり部 に加工準備孔を形成した後、 シ —ビングコィ ン加工することに より、 金属素材の元板厚によらず、 薄板の残り孔径をより縮小し たシヱ一ビングコィ ン部の成形を可能にし、 さ らに極小の電子ビ —ム透過孔を有する電子銃電極を製造することができる。  A protruding part is formed in advance on the surface of the metal material, a processing preparation hole is formed in this protruding part, and then, the cutting hole is processed to reduce the remaining hole diameter of the thin plate regardless of the original plate thickness of the metal material. It is possible to form a reduced shaving cone portion, and it is possible to manufacture an electron gun electrode having an extremely small electron beam transmitting hole.
金属素材の元板厚を薄くすることが可能になるので、 電子銃電 極に一体に形成する支持片も所望の薄さにでき、 電子銃電極をビ — ドガラスへ安定して支持することができる。  Since the original thickness of the metal material can be reduced, the supporting piece formed integrally with the electron gun electrode can be made as thin as desired, and the electron gun electrode can be stably supported on the bead glass. it can.
シヱ一ビングコィ ン部の周囲の厚板部分を残すときは、 シヱ一 ビングコィ ン部を補強することができる。  When leaving the thick plate around the shaving coil, the shaving coil can be reinforced.
本発明に係る電子銃は、 上述の本発明による製法で製造した電 子銃電極を組立てて構成するので、 信頼性の高い電子銃を提供す ることができる。 特に高精細度の陰極線管用の電子銃に適用して 好適ならしめるものである。  Since the electron gun according to the present invention is constructed by assembling the electron gun electrodes manufactured by the above-described method according to the present invention, a highly reliable electron gun can be provided. In particular, the present invention can be suitably applied to an electron gun for a high-definition cathode ray tube.
図面の簡単な説明 BRIEF DESCRIPTION OF THE FIGURES
図 1 A〜 (:は本発明の第 1実施の形態に係る電子銃電極の製造 方法を示す製造工程図 (その 1 ) である。  1A to 1 () are manufacturing process diagrams (No. 1) showing a method for manufacturing an electron gun electrode according to the first embodiment of the present invention.
図 2 D〜 Eは本発明の第 1実施の形態に係る電子銃電極の製造 方法を示す製造工程図 (その 2 ) である。  2D to 2E are manufacturing process diagrams (part 2) illustrating the method for manufacturing the electron gun electrode according to the first embodiment of the present invention.
図 3 A〜Dは本発明の第 2実施の形態に係る電子銃電極の製造 方法を示す製造工程図である。 図 4 A〜Cは本発明の第 3実施の形態に係る電子銃電極の製造 方法を示す製造工程図である。 3A to 3D are manufacturing process diagrams showing a method for manufacturing an electron gun electrode according to the second embodiment of the present invention. 4A to 4C are manufacturing process diagrams illustrating a method for manufacturing an electron gun electrode according to the third embodiment of the present invention.
図 5 A〜 Bは本発明の第 4実施の形態に係る電子銃電極の製造 方法を示す製造工程図 (その 1 ) である。  5A and 5B are manufacturing process diagrams (part 1) illustrating a method for manufacturing an electron gun electrode according to the fourth embodiment of the present invention.
図 6 C〜Dは本発明の第 4実施の形態に係る電子銃電極の製造 方法を示す製造工程図 (その 2 ) である。  6C to 6D are manufacturing process diagrams (No. 2) illustrating the method for manufacturing the electron gun electrode according to the fourth embodiment of the present invention.
図 7 E〜 Fは本発明の第 4実施の形態に係る電子銃電極の製造 方法を示す製造工程図 (その 3 ) である。  7E to 7F are manufacturing process diagrams (part 3) illustrating a method for manufacturing an electron gun electrode according to the fourth embodiment of the present invention.
図 8 A〜 Bは本発明の第 5実施の形態に係る電子銃電極の製造 方法を示す製造工程図である。  8A and 8B are manufacturing process diagrams illustrating a method for manufacturing an electron gun electrode according to a fifth embodiment of the present invention.
図 9 A〜 Bは本発明の第 6実施の形態に係る電子銃電極の製造 方法を示す製造工程図 (その 1 ) である。  9A and 9B are manufacturing process diagrams (part 1) illustrating a method for manufacturing an electron gun electrode according to the sixth embodiment of the present invention.
図 1 0 C〜Eは本発明の第 6実施の形態に係る電子銃電極の製 造方法を示す製造工程図 (その 2 ) である。  FIGS. 10C to 10E are manufacturing process diagrams (part 2) illustrating a method for manufacturing an electron gun electrode according to the sixth embodiment of the present invention.
図 1 1 A〜Bは本発明の第 7実施の形態に係る電子銃電極の製 造方法を示す製造工程図である。  11A and 11B are manufacturing process diagrams showing a method for manufacturing an electron gun electrode according to a seventh embodiment of the present invention.
図 1 2 A、 Bは本発明のシヱ一ビングコィ ン加工の他の例を示 す説明図である。  FIGS. 12A and 12B are explanatory views showing another example of the shaving coin processing of the present invention.
図 1 3 は従来のコィニング加工を用いた第 1 グリ ッ ド電極 G! の構成図である。  Fig. 13 shows the first grid electrode G! Using conventional coining. FIG.
図 1 4 は通常のコイニング加工の説明図である。  FIG. 14 is an explanatory diagram of ordinary coining processing.
図 1 5 A〜Cはシヱ一ビング加工の概念を示す製造工程図であ o  FIGS. 15A to 15C are manufacturing process diagrams showing the concept of the shaving process.
発明を実施するための最良の形態 BEST MODE FOR CARRYING OUT THE INVENTION
以下、 図面を参照して本発明の実施の形態を説明する。  Hereinafter, embodiments of the present invention will be described with reference to the drawings.
図 1及び図 2 は、 本発明の電子銃電極の製造方法、 及びこの方 法によつて製造された電子銃電極の一実施の形態を示す。  1 and 2 show an embodiment of a method for manufacturing an electron gun electrode of the present invention and an electron gun electrode manufactured by the method.
本実施の形態においては、 図 1 Aに示すように、 電極部材、 す なわち所定の板厚 を有する金属素材 (例えば S U S材料、 そ の他の電極材料等) 1を用意し、 この金属素材 1に所望の孔径 a X を有するシ 一ビングコイ ン用加工準備孔 (いわゆる下孔) 2 を形成する。 この加工準備孔 2の孔径 a i は、 シヱ一ビングコィ ン打ち用金型 3の径 b i の 8 0 %以上で 1 0 0 %未満となるよう に設定される。 この加工準備孔 2を設けた金属素材 1をシヱ一ビ ング ィ ン用ダイ 4上に載置固定する。 このシヱービングコィ ン 用ダイ 4 は、 開孔が無いもの、 あるいは、 同図示のように加工準 備孔径 より十分に小さい孔径 C の開孔 5を有するものを用 いる ことができる。 In the present embodiment, as shown in FIG. That is, a metal material (for example, SUS material, other electrode material, etc.) 1 having a predetermined plate thickness is prepared, and the metal material 1 is provided with a processing hole for a shaving coin having a desired hole diameter a X (a so-called processing hole). A pilot hole 2 is formed. The hole diameter ai of the working preparation hole 2 is set to be at least 80% and less than 100% of the diameter bi of the sieving / coining die 3. The metal material 1 provided with the processing preparation hole 2 is placed and fixed on a die 4 for a single fin. As the die 4 for a shaving coin, a die having no opening or a die having an opening 5 having a hole diameter C sufficiently smaller than the hole diameter for preparation as shown in the drawing can be used.
次に、 図 1 Bに示すように、 シヱ一ビングコイ ン打ち用金型 3 により、 加工準備孔 2 の内壁を切削する。 即ち、 金型 3の径 i と加工準備孔径 a i の差分に相当する部分 6を削る。 Next, as shown in FIG. 1B, the inner wall of the working preparation hole 2 is cut by a die for the cutting and coining. That is, cut portions 6 corresponding to the difference between the processing ready pore size a i and the diameter i of the die 3.
次に、 図 1 Cに示すように、 金型 3により肖 られながら、 その 削られた部分、 いわゆる金属部 6 は切り落さずに、 素材 1 と繋が つた状態でダイ 4 と金型 3間で加圧し、 あたかもコィニング形状 となるような、 金属素材 1の板厚 T 1 より薄い板厚 t i で、 且つ 金型 3の径 と同等の径13 1 を有する薄板 7 として成形する。 この薄板 7 の中央には径 d i の残り孔 2 ' が形成される。 ここで 、 残り孔 2 は、 この後に形成する最終の電子ビーム透過孔の孔 径 f i (図 2 E参照) より も小さ く なくてはならない。 Next, as shown in FIG. 1C, while being cut by the mold 3, the cut portion, the so-called metal part 6, is not cut off, and the die 4 and the mold 3 are connected with the material 1. To form a thin plate 7 having a thickness ti smaller than the thickness T 1 of the metal material 1 and a diameter 13 1 equivalent to the diameter of the mold 3 so as to have a coining shape. In the center of the thin plate 7, a remaining hole 2 'having a diameter di is formed. Here, the remaining hole 2 must be smaller than the diameter fi (see FIG. 2E) of the final electron beam transmitting hole to be formed later.
次に、 図 2 Dに示すように、 薄板 7に対して必要であれば、 更 に径 より小さい径 6 のコイニング加工を施し、 さらに薄く した薄板部分 8を形成する。 .  Next, as shown in FIG. 2D, if necessary, the thin plate 7 is subjected to coining with a smaller diameter 6 to form a thinner thin plate portion 8 if necessary. .
そして最後に、 図 2 Eに示すように、 薄板部分 8に孔径 f ! の 電子ビーム透過孔 9 を微小パンチによる打ち抜き加工で形成する 。 このようにして、 電子銃の電極 1 0 1を製造する。  And finally, as shown in Fig. 2E, the hole diameter f! The electron beam transmission hole 9 is formed by punching with a fine punch. Thus, the electrode 101 of the electron gun is manufactured.
尚、 具体的な数値例を示すと、 シェービングコイ ン打ち用金型 3の径 丄 は例えば l mm、 シヱ一ビングコイン用加工準備孔 2 の孔径 a は例えば 0. 8 5 m m、 シヱ一ビングコイン用ダイ 4 の開孔径 は例えば 0. 2 mm、 残り孔 2 ' の孔径 は例え ば 0. 3 7 m m、 コイニング成形の径 e i は例えば 0. 9 mm、 電子ビーム透過孔 9 の孔径 f は例えば 0. 4 mmとすることが できる。 In addition, a specific numerical example is shown below. The diameter 3 of 3 is, for example, 1 mm, the hole diameter a of the processing preparation hole 2 for the moving coin is, for example, 0.85 mm, the opening diameter of the die 4 for the moving coin is, for example, 0.2 mm, and the remaining hole. For example, the hole diameter of 2 ′ can be 0.37 mm, the diameter ei of coining molding can be 0.9 mm, for example, and the hole diameter f of the electron beam transmitting hole 9 can be 0.4 mm, for example.
シェ一ビングコィ ン加工方法では、 図 1 Bに示すように、 加工 準備孔 2の内壁の削られる前の破線図示の部分 Mの体積が削られ た後、 部分 へと移動する。 そして、 プレス下死点の図 1 。で は、 削られる前の部分 Νが最終的に部分 N' へ移動することにな る。 こ こで、 薄板 7の扳厚 t ! 及び残り孔 2 ' の孔径 d! は、 夫 々金属素材 1 の扳厚 とシヱ一ビングコイ ン部の径 と加工 準備孔 2 の孔径 a i から算出される。 例えば数 1で表すことがで きる。  In the shaving coin machining method, as shown in FIG. 1B, after the volume of the portion M shown by the broken line before the inner wall of the machining preparation hole 2 is shaved, it is moved to the portion. And press bottom dead center figure 1. In, the part Ν before being cut finally moves to the part N '. Here, the thickness of thin plate 7! And the hole diameter d of the remaining hole 2 '! Are calculated from the thickness of the metal material 1, the diameter of the shaving coin portion, and the hole diameter a i of the preparation hole 2, respectively. For example, it can be expressed by Equation 1.
数 1 Number 1
t ! (mm) = 1 3. 2 + 1 6. 2 T i (mm)  t! (mm) = 13.2 + 16.2Ti (mm)
+ 1 8. 8 b! (mm)  + 18.8 b! (mm)
- 0. 9 a i (mm)  -0.9 ai (mm)
d i (mm) = 1 4 3 - 1 3 6 O T t (mm)  d i (mm) = 1 4 3-1 3 6 O T t (mm)
- 1 6 7 0 b i (mm) + 2 5 7 0 a L (mm) 各項の係数は、 装置条件、 環境による定数である。  -167 0 b i (mm) + 2 570 a L (mm) The coefficient of each term is a constant depending on the equipment conditions and environment.
上述のシヱービングコィ ン加工においては、 金属素材 1の加工 準備孔 2 の内壁を削り取るという原理上、 金属素材 1の板厚 T i が厚いままの状態から一工程で、 コィニング形状となるような薄 い板厚 t 1 の薄板マを成形することができる。 これによつて、 図 In the above-mentioned shaving coin processing, in principle, the inner wall of the processing preparation hole 2 of the metal material 1 is cut off, so that the metal material 1 is thin enough to form a coining shape in one step from the state where the plate thickness T i remains large. A thin plate having a thickness t 1 can be formed. As a result,
1 Cに示すように、 薄板 7周辺部は、 前述の図 1 3における従来 のコイニング周辺部の厚さ T。 ' より厚い元の素材板厚 で機 械強度を保持したまま、 薄い板厚 t の薄板 7を実現することが できる。 As shown in FIG. 1C, the peripheral portion of the thin plate 7 has the thickness T of the conventional peripheral portion of the coining in FIG. 13 described above. '' It is possible to realize a thin plate 7 with a small thickness t while maintaining mechanical strength with a thicker original material plate thickness. it can.
また、 前述したように、 従来の複数回コイニング加工では、 ィニングに伴って外側の向きへのいわゆる肉部の逃げがあり、 し たがって、 この逃げしろと しての円形リ ブ 8 2 (図 1 3参照) を 設ける必要があつたが、 本実施の形態で用いるシヱ一ビングコィ ン加工では、 この外側の向きへの肉部の逃げがない。 従って、 従 来のような円形リ ブ 8 2を設ける必要がないので、 より強い機械 的強度を保持することができる。  Also, as described above, in conventional multiple coining processing, there is a so-called escape of the flesh portion in the outward direction accompanying the thinning, and therefore, the circular rib 8 2 (see FIG. 13), but in the shaving-coin processing used in the present embodiment, there is no escape of the flesh toward the outside. Therefore, there is no need to provide the circular rib 82 as in the related art, so that higher mechanical strength can be maintained.
シェ一ビングコィン加工では、 1回の切削工程によってエツ ジ 部が形成されるので、 図 1 Cに示すように、 シヱ一ビングコイ ン 部端のエツ ジ部、 即ち金属素材 1の薄板 7側端のエツジ部 1 1が 明確に形成され、 精度良く位置決めすることができ、 また精度管 理も容易となる。  In shaving coin machining, an edge portion is formed by one cutting process. Therefore, as shown in FIG. 1C, an edge portion of the shaving coin portion end, that is, an end of the thin plate 7 of the metal material 1 is formed. The edge portion 11 is clearly formed, positioning can be performed with high accuracy, and accuracy management is also facilitated.
シエービングコィ ン加工後の金属素材 1の面は、 従来のコィニ ング加工のように盛り上がり部分がなく、 平坦面に維持される。 前述の実施の形態では、 図 1 Cのシヱ一ビングコィン加工によ り薄板 Ίを形成した工程の後に、 さ らに図 2 Dに示すように、 薄 板 7に対して通常のコィニング加工を施したが、 この図 2 Dの加 ェを省略するようにしても良い。  The surface of the metal material 1 after the shaving coin processing has no raised portion as in the conventional coining processing, and is kept flat. In the embodiment described above, after the step of forming the thin plate by the shaving coining process of FIG. 1C, as shown in FIG. 2D, a normal coining process is performed on the thin plate 7. However, the processing in FIG. 2D may be omitted.
図 3 は、 この例を示す本発明の他の実施の形態である。 図 3 A FIG. 3 shows another embodiment of the present invention showing this example. Fig. 3 A
〜 Cは、 前述の図 1 A〜 Cの工程と同様であるので、 対応する部 分には同一符号を付して重複説明は省略する。 Steps C to C are the same as those in the above-described steps of FIGS. 1A to 1C.
本実施の形態においては、 板厚 の金属素材 1 に対してシェ ―ビングコィ ン加工を施して、 図 3 Cに示す所望の板厚 t i とさ れた薄板 7を成形した後に、 図 3 Dに示すように、 この薄板 7に 直接、 孔径 f 2 の電子ビーム透過孔 9を打ち抜き加工で形成し、 目的の電子銃電極 1 0 2を製造する。  In the present embodiment, shaving coin processing is performed on the metal material 1 having a thickness to form a thin plate 7 having a desired thickness ti shown in FIG. As shown, an electron beam transmitting hole 9 having a hole diameter f 2 is formed directly in the thin plate 7 by punching to manufacture a target electron gun electrode 102.
図 2 Dでは、 更に通常のコィニング加工を施すことにより、 更 に薄い板厚 t 2 の薄板 8を形成できる。 In Fig. 2D, further normal coining is applied to A thin plate 8 having a thin plate thickness t 2 can be formed.
本発明の電子銃電極の製造方法は、 電子銃を構成する第 1 グリ ッ ド電極 G t、 第 2 グリ ツ ド電極 G 2 、 あるいはその他のグリ ッ ド電極の製造に適用される。 本発明は、 このようにして製造され た電極グリ ッ ドを含むように、 複数の電極を配列し、 一体化して 陰極線管用の電子銃を構成する。 Method of manufacturing an electron gun electrode of the present invention is applied to the production of the first grid electrode G t, a second glycidyl Tsu cathode electrode G 2, or other grid electrodes constituting an electron gun. According to the present invention, a plurality of electrodes are arranged so as to include the electrode grid manufactured as described above, and integrated to constitute an electron gun for a cathode ray tube.
上述の実施の形態によれば、 金属素材 1の加工準備孔 2の内壁 を削りながらその削られた部分 6を切り落さずに素材 1 と繋がつ た状態で加工して薄板 Ίを成形する、 いわゆるシヱ一ビングコィ ン加工を用いることにより、 薄板 7周辺部、 いわゆるシヱ一ビン グコイ ン周辺部の板厚 を薄くする必要がなく、 即ち金属素材 1のままの厚い板厚 にすることができる。 したがって、 電子 銃組立時の加圧による変形に対して強度のあるグリ ッ ド電極を製 造することができ、 寸法変化の無い電子銃を組み立てることがで きる。  According to the above-described embodiment, the thin plate 成形 is formed by shaving the inner wall of the preparation hole 2 of the metal material 1 while cutting the cut portion 6 without cutting off the inner wall and connecting the material 1 to the material 1. However, by using so-called shibbing coin processing, it is not necessary to reduce the thickness of the periphery of the thin plate 7, that is, the so-called shibbing coin, that is, to increase the thickness of the metal material 1 as it is. Can be. Therefore, it is possible to manufacture a grid electrode that is strong against deformation due to pressure during assembly of the electron gun, and to assemble an electron gun with no dimensional change.
本発明の製法によって、 例えば第 1 グリ ッ ド電極 G i 、 あるい は第 1 グリ ッ ド電極 G! 及び第 2 グリ ッ ド電極 G 2 を製造すると きは、 第 1 グリ ッ ド電極 G! の電子ビーム透過孔 9が形成された 側の端面が平坦に形成されるので、 電子銃組立てに際して、 第 1 グリ ッ ド電極 と第 2 グリ ッ ド電極 G 2 間の距離 d 1 2の制御が 容易、 確実になり、 距離 d 1 2を所望の距離に精度良く設定するこ とができる。 ' According to the production method of the present invention, for example, the first grid electrode G i or the first grid electrode G! And the can and the second for producing the grid electrode G 2, first grid electrode G! Since the end face of the electron beam transmitting hole 9 is formed side are formed flat, during electron gun assembly, the distance control d 1 2 between the first grid electrode and the second grid electrode G 2 It is easy and reliable, and the distance d 12 can be set to a desired distance with high accuracy. '
金属素材 1 の板厚 T! にかかわらず、 薄板 7の板厚 t i を極め て薄くすることができ、 この薄板 7に微小孔径 f 2 、 或は更にコ イニング成形して薄板 8に微小孔径 f の電子ビーム透過孔 9を 形成できる。 コイニング成形で更に薄い薄板 8 としたときには、 より微小孔径 f の電子ビーム透過孔 9が形成できる。 Metal material 1 thickness T! Regardless of the thickness, the thickness ti of the thin plate 7 can be made extremely thin, and a fine hole diameter f 2 in this thin plate 7 or further coining is formed to form an electron beam transmitting hole 9 with a small hole diameter f in the thin plate 8. it can. When a thinner sheet 8 is formed by coining, an electron beam transmitting hole 9 having a smaller hole diameter f can be formed.
金属素材 1 に予め、 その後成形される薄板 7の径13 i の 8 0 % 以上で 1 0 0 %未満の孔径 a i を有する加工準備孔 2を形成する こ とにより、 精度良く、 所望の板厚 t t の薄板 7を形成できる。 80% of the diameter 13 i of the thin plate 7 to be formed beforehand on the metal material 1 By forming the preparation hole 2 having a hole diameter ai of less than 100% as described above, a thin plate 7 having a desired plate thickness tt can be formed with high accuracy.
このように、 シヱービングコイン加工では、 上述の数 1の式に ' より元板材である金属素材 1の板厚 T i にかかわらず、 シヱ一ビ ングコィ ン部である薄板 7 の板厚 t i を薄くできるので、 電極板 厚を薄くする方向での電子銃設計の自由度が向上する。  Thus, in the cutting coin machining, according to the above equation (1), regardless of the sheet thickness T i of the metal material 1 which is the original sheet material, the sheet 7 of the sheet 7 which is the cutting coin portion is formed. Since the thickness ti can be reduced, the degree of freedom in designing an electron gun in the direction of reducing the electrode plate thickness is improved.
シェ一ビングコイ ン加工により、 電極におけるシヱ一ビングコ ィ ンエツ ジ部 1 1 は、 相対位置精度良く成形できる。 従って、 シ ェ一ビングコィ ン部を特性上必要としない場合のみならず、 電子 レンズと して利用することができ、 いずれも、 従来に比べてビ一 ムスポッ ト特性を向上させることができる。  By the shaving coin processing, the shaving coin edge portion 11 of the electrode can be formed with high relative position accuracy. Therefore, the shaving cone portion can be used as an electronic lens as well as when it is not necessary in terms of characteristics, and in any case, the beam spot characteristics can be improved as compared with the conventional case.
従って、 本発明では、 寸法精度が良く、 且つ電子ビームスポッ ト径が小さい電子銃を構成することができ、 この電子銃は、 特に 高精細度の陰極線管用に適用して好適ならしめる。  Therefore, according to the present invention, an electron gun having good dimensional accuracy and a small electron beam spot diameter can be formed, and this electron gun is particularly suitable for application to a high-definition cathode ray tube.
図 4 は、 本発明の他の実施の形態を示す。  FIG. 4 shows another embodiment of the present invention.
シヱ一ビングコイ ン加工では、 前述の例えば図 1 A、 又は図 3 Aに示した加工準備孔 2を形成してから、 図 1 C又は図 3 Cのシ ェ一ビングコイン加工を施す。 そして、 最終的に図 2 E、 又は図 3 Dに示す電子ビーム透過孔 9を微小パンチ加工にて打ち抜く よ うにしている。 加工準備孔 2 は、 通常の打ち抜き加工を施すため 、 その打ち抜かれた金属素材 1 の内壁は、 図 4 Aに示すように、 滑らかな剪断面 2 2 と、 凹凸の粗い破断面 2 3が生ずる。 破断面 2 3 は、 寸法や形状制御が難しく、 またこの後のシヱ一ビングコ イ ン工程で変位し、 破断面痕と して残る恐れがある。 この点を改 善したのが図 4の例である。  In the shaving coin processing, the processing preparation hole 2 shown in, for example, FIG. 1A or FIG. 3A is formed, and then the shaving coin processing in FIG. 1C or FIG. 3C is performed. Finally, the electron beam transmitting holes 9 shown in FIG. 2E or FIG. 3D are punched out by fine punching. Since the preparation hole 2 is subjected to normal punching, the inner wall of the punched metal material 1 has a smooth shear surface 2 2 and a rough fracture surface 23 with irregularities as shown in FIG. 4A. . It is difficult to control the size and shape of the fractured surface 23, and there is a possibility that the fractured surface 23 will be displaced in the subsequent shaving coin process and remain as a fractured surface mark. Figure 4 shows an improvement in this point.
本実施の形態においては、 図 4 Aに示すように、 金属素材 1に シェービングコィ ン用加工準備孔 2を形成する際に、 破断面 2 3 がシヱ一ビングコィ ンされる上面側に生ずるように矢印 2 1で示 す素材 1 の裏面側から上面側に向って打ち抜き加工を施し、 加工 準備孔 2を形成する。 In the present embodiment, as shown in FIG. 4A, when forming the shaving-coin processing preparation hole 2 in the metal material 1, the fractured surface 23 is formed on the upper surface side where the shaving-coin is performed. Indicated by arrow 2 1 The blank 1 is punched from the back side to the top side of the blank 1 to form a working preparation hole 2.
次に、 図 4 Bに示すように、 加工準備孔 2を打ち抜く向きとは 逆向きに、 即ち矢印 2 5で示す素材 1上面側から裏面側に向って シヱ一ビングコイ ン加工を施し、 薄板 7を成形する。 これにより Next, as shown in FIG. 4B, the sheet is subjected to sieve coining in a direction opposite to the direction in which the processing preparation hole 2 is punched, that is, from the upper surface side to the lower surface side of the material 1 indicated by an arrow 25. Form 7 This
、 破断面痕 2 4 は、 薄板 7 の残り孔 2 ' の内面に移動することに なる。 However, the fracture surface mark 24 moves to the inner surface of the remaining hole 2 ′ of the thin plate 7.
次いで、 図 4 Cに示すように、 この残った破断面痕 2 4を除去 するように、 打ち抜き加工によつて電子ビーム透過孔 9を形成し て目的の電極 1 0 3を製造する。  Next, as shown in FIG. 4C, an electron beam transmitting hole 9 is formed by punching to remove the remaining fracture surface mark 24, thereby manufacturing a target electrode 103.
なお、 図 4 Bのシヱ一ビングコィ ン加工の後、 薄板 7に前述の 図 2 Dに示したように、 通常のコィニング加工を施してさらに薄 板 8 に成形し、 その後、 薄板 8に破断面痕 2 4を除去するように 電子ビーム透過孔 9を形成し目的の電極を製造するようにしても 良い。  It should be noted that, as shown in FIG. 2D, the thin plate 7 is subjected to a normal coining process to form a thin plate 8 after the shaving coining process shown in FIG. 4B, and then the thin plate 8 is broken. The target electrode may be manufactured by forming the electron beam transmitting hole 9 so as to remove the cross-sectional mark 24.
図 4の実施の形態によれば、 加工準備孔 2を、 シヱ一ビングコ ィ ン加工する面とは反対面から打ち抜き加工して形成し、 破断面 2 3を加工準備孔 2 の上部に残すことにより、 次のシヱービング コィ ン工程と電子ビーム透過孔の打ち抜き工程によって、 加工準 備孔 2 の破断面 2 3、 従って残り孔 2 ' 内の破断面痕 2 4を完全 に除去することができる。 従って、 寸法精度の良い電子銃電極を 製造することができる。  According to the embodiment of FIG. 4, the processing preparation hole 2 is formed by punching from the surface opposite to the surface to be subjected to the shaving coin processing, and the fracture surface 23 is left above the processing preparation hole 2. As a result, the fracture surface 23 of the preparation hole 2 and therefore the trace 24 of the fracture surface in the remaining hole 2 ′ can be completely removed by the next shaving coin process and the punching process of the electron beam transmission hole. . Therefore, an electron gun electrode with good dimensional accuracy can be manufactured.
また、 電極の異なる部分に破断面痕が残存したときには、 電子 銃と して構成したときに電極間で形成される電界レンズに歪み等 が生じる恐れがある。 本実施の形態では、 このような電界レンズ の歪みは発生せず、 信頼性の高い電子銃が構成できる。 .  Also, if a fracture surface remains on a different part of the electrode, distortion or the like may occur in an electric field lens formed between the electrodes when configured as an electron gun. In the present embodiment, such a distortion of the electric field lens does not occur, and a highly reliable electron gun can be configured. .
ところで、 シヱ一ビングコィ ン加工法では、 前述の数 1 に示す ように、 シヱ一ビングコイ ン後の、 所望の薄板の板厚 t t 及び加 ェ準備孔の残り孔径 を決定付けている条件には、 金属素材の 元板厚 T! がある。 しかし、 材料コス トゃ、 電子ビーム透過孔以 外の部分の成形都合から、 シ 一ビングコィンを施す部分の板厚 とその他の部品板厚とを独立して可変することが出来れば、 設計 の自由度が增すことになる。 By the way, in the shaving coin machining method, as shown in Equation 1 above, the desired sheet thickness tt and the desired thickness after the shaving coin are obtained. The conditions that determine the remaining hole diameter of the preparatory hole are the base thickness of the metal material T! There is. However, if the thickness of the part where the sieving coin is to be applied and the thickness of other parts can be changed independently from the material cost and the convenience of molding the parts other than the electron beam transmission hole, the design is free. The degree will increase.
前述の実施の形態では、 シェービングコィ ン加工の都合により 、 金属素材の元板厚 (いわゆる素材板厚) を選択して決めること になる。 即ち、 素材板厚によってシヱ一ビングコィン加工後の残 り孔径 d! が決まるので、 小孔径の電子ビーム透過孔を更に小さ くするためには、 素材板厚の選択の自由度が必要になってく る。 次 、 金属素材の元板厚を選択せずにシヱ一ビングコィン加工 後の、 残り孔径を所望の孔径にし、 電子ビームの更なる小孔径化 を可能にする製造方法の実施の形態を示す。  In the above-described embodiment, the original plate thickness of the metal material (the so-called material plate thickness) is selected and determined depending on the shaving coin processing. In other words, depending on the material thickness, the remaining hole diameter after the cutting coin machining d! Therefore, in order to further reduce the size of the electron beam transmission hole with a small diameter, the degree of freedom in selecting the thickness of the material becomes necessary. Next, an embodiment of a manufacturing method will be described in which the remaining hole diameter after the shaving coin processing is selected to a desired hole diameter without selecting the original plate thickness of the metal material, and the electron beam can be further reduced in diameter.
本実施の形態は、 シェービングコィ ンの加工準備孔を形成する 前に、 予め素材'元板に盛り上がり部を形成して、 加工準備孔を形 成する部分の板厚を素材元板厚より も厚く成形して置き、 ここに シヱ一ビングコィ ン加工を施すようにする。  In the present embodiment, before forming the processing preparation hole of the shaving cone, a bulging portion is formed in advance on the material 'base plate, and the plate thickness of the portion forming the processing preparation hole is made smaller than the material base plate thickness. Place it thickly and give it a sieve-coining process.
図 5 は、 この方法を用いた本発明の他の実施の形態を示す。 本実施の形態においては、 図 5 Aに示すように、 電極部材、 す なわち所定の板厚 T 2 (図示せず) を有する金属素材 (いわゆる 素材元板であり、 例えば S U S材料、 その他の電極材料等) 3 1 を用意し、 この金属素材 3 1 の一面上に予め盛り上がり部、 本例 では凸形状コイニング部 3 2 を成形する。 このため、 金属素材 3 1を前加工コイニング用ダイ 3 4上に載置.固定し、 前加工コィニ ング用金型 3 3 により金属素材 3 1の加工準備孔を形成すべき部 分に、 加工準備孔の孔径 a 3 より大きい径 g 3 を有する凸形状コ イニング部 3 2 を成形する。 このコイニング加工により、 シェ一 ビングコィ ン加工される部分の板厚を所望の板厚 T 3 にまで厚く する。 この際、 他部、 特にシェービングコイン部周辺の部分につ いては、 板厚 T 4 が素材元板厚 Τ 2 より も薄く なる。 FIG. 5 shows another embodiment of the present invention using this method. In this embodiment, as shown in FIG. 5A, an electrode member, that is, a metal material having a predetermined thickness T 2 (not shown) (a so-called material base plate, for example, a SUS material, An electrode material, etc.) 31 is prepared, and a raised portion, in this example, a convex coining portion 32 is formed on one surface of the metal material 31. For this purpose, the metal material 3 1 is placed on the pre-working coining die 3 4, fixed, and processed by the pre-processing coining mold 3 3 at the portion where the preparation hole for the metal material 3 1 should be formed. forming a convex coining portion 3 2 having a pore size a 3 larger diameter g 3 of the preparation hole. This coining, increasing the thickness of the portion to be shell one Bingukoi down process until the desired thickness T 3 I do. At this time, another portion, especially One to a portion near the shaving coin unit information, plate thickness T 4 is thinner than the material source thickness T 2.
次に、 図 5 Βに示すように、 凸形状コイニング部 3 2を有する 金属素材 3 1 を加工準備孔用ダイ 3 7上に載置固定し、 加工準備 孔打ち用金型 3 6 により、 シヱ一ビングコイン用め加工準備孔 3 Next, as shown in FIG. 5 金属, a metal material 31 having a convex coining part 32 is placed and fixed on a die 37 for a preparation hole, and the metal material 31 is prepared by a punching die 36 for the preparation.め Hole for preparation for processing one bing coin 3
8を形成する。 こ こで、 加工準備孔 3 8 は、 その孔径 a 3 を凸形 状コィニング部 3 2の径 g 3 より小さ く し ( a 3 く g 3 ) 、 孔径 a 3 の周りに凸形状コィ二ング部による厚板部分 3 5が残るよう に形成する。 この加工準備孔 3 8の径 a 3 は、 前述と同様にシヱ -ビングコィ ン打ち用金型 4 1の径 b 3 の 8 0 %以上で 1 0 0 % 未満となるように設定される。 Form 8. In here, the processing preparation hole 3 8 is smaller rather Mr than the pore size of a 3 convex shape Koiningu 3 2 diameter g 3 a (a 3 rather g 3), convex Koi-learning around the hole diameter a 3 It is formed so that the thick plate portion 35 by the portion remains. The diameter a 3 of the machining preparation hole 3 8, in the same way as described above sheet We - are set so that Bingukoi emissions strike die 4 1 0 below 0% in the first diameter b 3 of 80% or more.
次に、 この金属素材 3 1 に対して前述と同様のシヱービングコ ィ ン加工を施す。 即ち、 図 6 Cに示すように、 加工準備孔 3 8を 形成した金属素材 3 1 をシヱ一ビングコィン用ダイ 4 2上に載置 固定する。 シヱ一ビングコイ ン用ダイ 4 2 は、 開孔が無いもの、 あるいは、 同図のように加工準備孔径 a 3 より十分に小さい孔径 c 3 の開孔 4 3を有するものを用いることができる。 Next, the same blanking processing as described above is performed on the metal material 31. That is, as shown in FIG. 6C, the metal material 31 having the processing preparation hole 38 formed thereon is placed and fixed on the die 42 for the cutting coin. Shi We one Bingukoi down die 4 2, those openings are not, or can be used with the machining preparation opening 4 3 having a pore size of a 3 than a sufficiently small pore size c 3 as shown in FIG.
次いで、 図 6 Dに示すように、 加工準備孔 3 8の周囲の厚板部 分 3 5 の全てを切削するように径 b 3 を有するシヱ一ビングコィ ン打ち用金型 4 1で切削する。 即ち、 金型 4 1の径 b 3 と加工準 備孔径 a の差分に相当する部分 3 9 (厚板部分 3 5を含む) を 削る。 Next, as shown in FIG. 6D, a cutting die 41 having a diameter b 3 is cut so as to cut the entire thick plate portion 35 around the preparation hole 38. . That is, cutting the portion 3 9 (including thick plate portion 35) corresponding to the difference between the processing quasi備孔diameter a and diameter b 3 of the mold 4 1.
このシヱ一ビングコィ ン加工では、 加工準備孔 3 . 8の内壁の削 られる前の破線図示の部分 Pの体積が削られた後、 部分 P ' へと 移動し、 削られた部分 3 9が切り落とされずに金属素材 3 1に連 続して厚さ t の薄板 4 5が成形される (図 7 E参照) 。  In this shaving-coin machining, after the volume of the portion P indicated by the broken line before the inner wall of the machining preparation hole 3.8 was cut, the volume moved to the portion P ', and the cut portion 39 was removed. A thin plate 45 having a thickness t is formed continuously from the metal material 31 without being cut off (see FIG. 7E).
この時、 図 6 Dの肉部 Pと前述の図 1 Bの肉部 Mの体積と比較 すると、 M部の金属量 く P部の金属量 At this time, comparing the volume of the meat portion P in FIG. 6D with the volume of the meat portion M in FIG. 1B described above, Metal content of part M Metal content of part P
となる。 Becomes
この移動する肉部の金属量の違いにより、 図 7 Eに示すように 、 成形された薄板 4 5の残り孔 3 8 ' の孔径 d 3 は、 図 1 Cの残 り孔 2 の径 0 1 より も小径 ( d 3 < d! ) に加工される。 Due to the difference in the amount of metal in the moving meat portion, as shown in FIG. 7E, the hole diameter d 3 of the remaining hole 3 8 ′ of the formed thin plate 45 becomes the diameter 0 1 of the remaining hole 2 of FIG. 1C. It is processed to a smaller diameter (d 3 <d!).
こ こで、 コイニング用金型の径 g 3 と加工準備孔径 a 3 とシェ —ビングコイ ン打ち用金型の径 b 3 との大きさの関係は、 a 3 < g < b となる。 In here, coining die diameter g 3 and the machining preparation hole diameter a 3 and shell - size of the relationship between Bingukoi down strike die diameter b 3 of becomes a 3 <g <b.
そして最後に、 図 7 Fに示すように、 薄板 4 5に孔径 f の電 子ビーム透過孔 4 6を微小パンチによる打ち抜き加工で形成し、 電子銃の電極 1 0 4を製造する。  Finally, as shown in FIG. 7F, an electron beam transmitting hole 46 having a hole diameter f is formed in the thin plate 45 by punching with a fine punch to manufacture an electrode 104 of the electron gun.
図 8 は、 他の実施の形態を示す。 本実施の形態は、 前述の図 7 Eの工程の後、 図 8 Aに示すように、 薄板 4 5に対して更に径 b より も小さい径 6 4 のコィニング加工を施し、 さらに薄く した 薄板部分 4 7を形成する。 残り孔 3 8 f の孔径は d 4 となる。 FIG. 8 shows another embodiment. This embodiment, after the aforementioned FIG 7 E step, as shown in FIG. 8 A, further subjected to Koiningu processing of smaller diameter 6 4 than the diameter b relative to the thin plate 4 5, the thin plate portions and thinner Form 4 7 The hole diameter of the remaining hole 38 f is d 4 .
次いで、 図 8 Bに示すように、 薄板部分 4 7に孔径 f 4 の電子 ビーム透過孔 4 8を微小パンチによる打つ抜き加工で形成し、 電 子銃の電極 1 0 5を製造する。 Then, as shown in FIG. 8 B, the electron beam transmitting hole 4 8 a pore diameter f 4 is formed by punching hitting by fine punching in a thin plate portion 4 7, to produce the electrodes 1 0 5 of electron guns.
図 5〜図 7、 及び図 8 に示すように、 本実施の形態によれば、 加工準備孔 3 8を形成する前に予め加工準備孔 3 8を形成する部 分の板厚を大き くする凸形状コイニング部 3 2を成形し、 次いで 周囲に厚板部分 3 5を残すように加工準備孔 3 8を形成し、 シェ ―ビングコィ ン加工することにより、 加工後の薄板 4 5の残り孔 3 8 ' をさ らに小さ く形成することが出来、 より小さい電子ビ一 ム透過孔 4 6又は 4 8を有する電子銃電極 1 0 4、 1 0 5を製造 することができる。  As shown in FIGS. 5 to 7 and 8, according to the present embodiment, before forming the processing preparation hole 38, the thickness of the portion where the processing preparation hole 38 is formed is increased in advance. The convex coining part 32 is formed, and then a processing preparation hole 38 is formed so as to leave the thick plate part 35 around it. By shaving coining, the remaining hole 3 of the thin sheet 45 after processing is formed. 8 ′ can be formed even smaller, and electron gun electrodes 104 and 105 having smaller electron beam transmission holes 46 or 48 can be manufactured.
即ち、 本実施の形態では、 金属素材の元板厚によらず (つまり 元板厚を選択すること無く) 、 所定の元板厚 T 2 の金属素材 3 1 から所望の小径のシヱ一ビングコィ ン残り孔 3 8 ' を形成でき、 図 1〜図 2、 又は図 3等に示すシヱ一ビングコィン技術に増して 、 より縮小された所望の小孔径の電子ビーム透過孔 4 6又は 4 .8 を実現できる。 That is, in the present embodiment, the metal material 3 1 having the predetermined base plate thickness T 2 is used regardless of the base plate thickness of the metal base material (that is, without selecting the base plate thickness). From this, a desired small-diameter shaving-coin remaining hole 38 'can be formed, and compared with the shaving-coin technology shown in FIG. 1 to FIG. 2 or FIG. Beam transmission holes 46 or 4.8 can be realized.
また、 本実施の形態では、 金属素材の元板厚を厚くせず、 所望 の薄さの金属素材 3 1で電子銃電極を形成できるので、 電子銃の 支持部材であるビー ドガラスに埋め込む支持片、 即ちピンやタブ を電子銃電極に一体に設けることができる。 因みに、 シヱ一ビン グコィ ン加工のための元板厚が厚過ぎると、 これと一体に形成す るピンやタブも厚く なり、 ビ一 ドガラスへの埋め込み支持が不安 定となる。 しかし、 本実施の形態においては、 ピンやタブを薄く 形成することが可能になり、 電子銃電極のビ一 ドガラスへの支持 が安定して行える。  Further, in the present embodiment, since the electron gun electrode can be formed of the desired thickness of the metal material 31 without increasing the thickness of the base material of the metal material, the support pieces embedded in the bead glass which is the support member of the electron gun That is, pins and tabs can be provided integrally with the electron gun electrode. By the way, if the base plate thickness for the single coining process is too thick, the pins and tabs formed integrally with the base plate will also be thick, and the embedded support in the bead glass will be unstable. However, in the present embodiment, the pins and tabs can be formed thin, and the electron gun electrodes can be stably supported on the bead glass.
図 9及び図 1 0 は、 本発明のさ らに他の実施の形態を示す。 本 例はシヱ一ビングコィ ン加工したときに、 シェ一ビングコイ ン部 の周囲に厚板部分が残るようにした場合である。  9 and 10 show still another embodiment of the present invention. In this example, when shaving coin processing is performed, a thick plate portion is left around the shaving coin part.
本実施の形態においては、 図 9 Aに示すように、 電極部材、 す なわち所定の板厚 T 2 (図示せず) を有する金属素材 (いわゆる 素材元板であり、 例えば S U S材料、 その他の電極材料等) 3 1 を用意し、 この金属素材 3 1の一面上に予め盛り上がり部、 本例 では凸形状コイニング部 3 2を成形する。 このため、 前述と同様 に金属素材 3 1を前加工コイニング用ダイ 3 4上に載置固定し、 前加工コィ二ング用金型 3 3により金属素材 3 1の加工準備孔を 形成すべき部分に、 加工準備孔の孔径 a 5 より大きい径 § 5 を有 する凸形状コイニング部 3 2を成形する。 このコイニング加工に より、 シェービングコィ ン加工される部分の板厚を所望の板厚 T 5 にまで厚くする。 この際、 他部、 特にシヱ一ビングコイン部周 辺の部分については、 板厚 T 6 が素材元扳厚 T 2 よりも薄く なる 次に、 図 9 Bに示すように、 凸形状コィニング部 3 2を有する 金属素材 3 1を加工準備孔用ダイ 3 7上に載置固定し、 加工準備 孔打ち用金型 3 6 により、 シヱ一ビングコィン用の加工準備孔 3 8を形成する。 こ こで、 加工準備孔 3 8 は、 その孔径 a 5 を凸形 状コイニング部 3 2 の径 g 5 より小さ く し ( a 5 < g 5 ) 、 孔径 a 5 の周りに凸形状コィ二ング部による厚板部分 3 5が残るよう に形成する。 この加工準備孔 3 8の径 a 5 も、 前述と同様にシェ ―ビングコィ ン打ち用金型 5 1 の径 5 の 8 0 %以上で 1 0 0 % 未満となるように設定される。 In the present embodiment, as shown in FIG. 9A, an electrode member, that is, a metal material having a predetermined plate thickness T 2 (not shown) (a so-called raw material plate, for example, a SUS material, An electrode material 31 is prepared, and a raised portion, in this example, a convex coining portion 32 is formed on one surface of the metal material 31. For this reason, the metal material 31 is placed and fixed on the pre-working coining die 34 in the same manner as described above, and the part where the pre-working hole of the metal material 31 is to be formed by the pre-working die 33 is used. Then, a convex coining portion 32 having a diameter よ り 大 き い5 larger than the hole diameter a5 of the processing preparation hole is formed. By this coining, the thickness of the portion to be subjected to shaving coin processing is increased to a desired thickness T5. At this time, the thickness T 6 of the other portion, particularly the portion around the moving coin portion, becomes smaller than the original thickness T 2 of the material. Next, as shown in FIG. 9B, a metal material 31 having a convex coining portion 32 is placed and fixed on a die 37 for a preparation hole, and the metal material 31 is prepared by a punching die 36 for the preparation.加工 Form a processing preparation hole 38 for one bing coin. In here, the processing preparation hole 3 8, the hole diameter a 5 Mr rather smaller than convex shaped coining portion 3 2 diameter g 5 (a 5 <g 5 ), convex Koi-learning around the hole diameter a 5 It is formed so that the thick plate portion 35 by the portion remains. Diameter a 5 in the machining preparation hole 3 8 also, in the same way as described above shell - is set to be 1 0 less than 0% by Bingukoi emission beating mold 5 1 8 of diameter 50% or more.
次に、 この金属素材 3 1 に対してシヱ一ビングコィン加工を施 す。 即ち、 図 1 0 Cに示すように、 前述と同様に、 加工準備孔 3 8 を形成した金属素材 3 1をシヱービングコイ ン用ダイ 5 2上に 載置固定し、 加工準備孔径 a 5 より大き く且つコイニング部 3 2 の径 g 5 より小さい径 d 5 を有するシヱービングコイン打ち用金 型 5 1 でシェービングコイ ン加工を行い、 図 1 0 Dに示すように 、 金属素材 3 1 に連続する薄板 4 5を成形する。 Next, the metal material 31 is subjected to a sieve coining process. That is, as shown in FIG. 1 0 C, in the same manner as described above, the metal material 3 1 formed with the machining preparation hole 3 8 is placed fixed on Shiwebingukoi down die 5 2, rather large from the machining preparation hole diameter a 5 and in sheet chromatography Bing coin striking mold 5 1 having a diameter g 5 smaller than the diameter d 5 of the coining portion 3 2 performs a shaving coin processing continuously, as shown in FIG. 1 0 D, the metal material 3 1 The thin plate 4 5 to be formed is formed.
このシェービングコイ ン加工は、 シェ一ビングコィ ン部の周囲 に凸形状コィ二ングによる厚板部分 3 5が残るように行われる。 なお、 前述と同様に、 成形された薄板 4 5 の厚さは t 5 、 薄板 4The shaving coin processing is performed so that the thick plate portion 35 by the convex-shaped coining remains around the shaving coin portion. As described above, the thickness of the formed thin plate 4 5 is t 5 ,
5 の残り孔 3 8 の孔径は d 5 と した。 The hole diameter of the remaining hole 38 of 5 was d5.
ここで、 コイニング用金型の径 § 5 と加工準備孔径 a 5 とシェ 一ビングコイ ン打ち用金型の径13 5 との大きさの関係は、 a 5 く b 5 < g 5 となる。 Here, the magnitude of the relationship between the diameter 13 5 machining preparation hole diameter a 5 and shell one Bingukoi down strike die to the diameter § 5 of coining mold becomes a 5 rather b 5 <g 5.
そして最後に、 図 1 0 Eに示すように、 薄板 4 5に孔径 f 5 の 電子ビーム透過孔 4 6 を微小パンチによる打ち抜き加工で形成し 、 電子銃の電極 1 0 6を製造する。 Finally, as shown in FIG. 1 0 E, the electron beam transmission hole 4 6 with a pore diameter f 5 is formed by punching by small punch sheet 4 5, to produce the electrode 1 0 6 of the electron gun.
図 1 1 は、 他の実施の形態を示す。 本実施の形態は、 前述の図 1 0 Dの工程の後、 図 1 1 Aに示すように、 薄板 4 5に対して更 に径13 5 より も小さい径 6 5 のコイニング加工を施し、 さらに薄 く した薄板部分 4 7を形成する。 残り孔の孔径は d 6 となる。 次いで、 図 1 1 Bに示すように、 薄板部分 4 7に孔径 f s の電 子ビーム透過孔 4 8を微小パンチによる打ち抜き加工で形成し、 電子銃の電極 1 0 7を製造する。 FIG. 11 shows another embodiment. This embodiment is based on the above-mentioned figure. 1 0 After D step, as shown in FIG. 1 1 A, form a thin plate portion 4 7 subjected to coining was rather more thin small diameter 6 5 than further in diameter 13 5 with respect to the thin plate 4 5 I do. The pore size of the remaining holes becomes d 6. Next, as shown in FIG. 11B, an electron beam transmitting hole 48 having a hole diameter fs is formed in the thin plate portion 47 by punching with a fine punch to manufacture an electrode 107 of an electron gun.
図 9〜図 1 0、 及び図 1 1'に示す本実施の形態においても、 前 述と同様に予め凸形状コイニング部 3 2を成形した後、 周囲に厚 板部分 3 5を残すように加工準備孔 3 8を形成し、 シ 一ビング コィ ン加工することにより、 加工後の薄板 4 5の残り孔 3 8 を さ らに小さ く形成することができ、 より小さな電子ビーム透過孔 4 6又は 4 8を有する電子銃電極 1 0 6、 1 0 7を製造すること ができる。 また、 電極に此れと一体の支持片、 即ちピンやタブ等 を形成することができ、 安定したビーディ ングが可能になる。  Also in the present embodiment shown in FIGS. 9 to 10 and 11 ′, after forming the convex coining portion 32 in advance in the same manner as described above, processing is performed so that the thick plate portion 35 is left around. By forming the preparation hole 38 and performing the shaving coin processing, the remaining hole 38 of the processed thin plate 45 can be formed even smaller, and the smaller electron beam transmission hole 46 or Electron gun electrodes 106 and 107 having 48 can be manufactured. In addition, a support piece integrated with the electrode, that is, a pin, a tab, or the like can be formed on the electrode, and stable beading can be performed.
さ らに、 本実施の形態では、 電子銃電極 1 0 6、 1 0 7の完成 後も、 シヱ一ビングコィ ン部の周囲に厚板部分 3 5が残るので、 シェ一ビングコィン部がより補強され、 電子銃電極の機械的強度 を高めることができる。  Further, in the present embodiment, even after the electron gun electrodes 106 and 107 are completed, the thick plate portion 35 remains around the shaving coin portion, so that the shaving coin portion is further reinforced. Thus, the mechanical strength of the electron gun electrode can be increased.
なお、 図 5及び図 9 の例では凸形状コイニング部 3 2を金属素 材の一面 (表面) に形成したが、 その他、 例えば金属素材の裏面 In the examples of FIGS. 5 and 9, the convex coining part 32 is formed on one surface (front surface) of the metal material.
、 或いは表裏両面に凸形状コイニング部を形成することも可能で め o Or it is also possible to form convex coining parts on both front and back. O
上述の各実施の形態では、 シヱ一ビングコィン加工と して、 切 削される金属肉部を金属素材より切断する前に金属素材に連接す る薄板形状に加工するようにしたが、 その他、 切削される金属肉 部を金属素材より切断した後に金属素材に連接する薄板形状に加 ェすることも可能である。  In each of the above-described embodiments, as the cutting coin processing, the metal meat portion to be cut is processed into a thin plate shape connected to the metal material before cutting from the metal material. It is also possible to cut the metal part to be cut from the metal material and then add it to a thin plate shape connected to the metal material.
即ち、 シェ一ビングコィ ン用金型により切削肉部を金属素材よ り切断した直後に、 直ぐにシヱ一ビングコィ ン用ダイ側から切削 孔内に挿入される金型と、 シヱ一ビングコィン用金型との共動で 切断された切削肉部を、 再び金属素材に圧接合し同時に薄板形状 に成形することができる。 これにより、 例えば、 図 1 2 Aに示す ように、 金属素材 6 2 の裏面に面一の薄板 6 3を一体に成形する ことができ、 また図 1 2 Bに示すように、 金属素材 6 2の孔中間 部の薄板 6 2 を一体成形することができる。 That is, the shaved-coin mold is used to make the cut meat Immediately after cutting, the die cut into the cutting hole immediately from the die for the cutting coil and the cutting part cut in co-operation with the die for the cutting coil are re-formed into the metal material. To form a thin plate at the same time. Thus, for example, as shown in FIG. 12A, a flush plate 63 can be integrally formed on the back surface of the metal material 62, and as shown in FIG. The thin plate 62 in the middle of the hole can be integrally formed.
以上説明したように本発明に係る電子銃電極の製造方法によれ ば、 所定厚板の金属素材の一の面からのシヱ -ビングにより切削 される金属部を、 金属素材に連続した薄板に成形する加工、 いわ ゆるシェービングコィ ン加工法を用いることにより、 薄板周辺部 の板厚を薄くする必要がない。 即ち、 厚い金属素材の状態のまま で 1回の加工で板厚の薄い薄板部分を成形することができる。 従 つて、 電子銃組立時の加圧によつても変形しにく い機械的強度の 大きい電極を作ることができ、 寸法変化のない電子銃を組み立て ることができる。  As described above, according to the method for manufacturing an electron gun electrode according to the present invention, a metal portion cut by sieving from one surface of a metal material having a predetermined thickness is formed into a thin plate continuous with the metal material. By using the shaping and coining method, it is not necessary to reduce the thickness of the periphery of the thin plate. That is, it is possible to form a thin sheet portion with a single processing while maintaining the state of a thick metal material. Therefore, it is possible to produce an electrode having high mechanical strength, which is not easily deformed even by pressurization at the time of assembling the electron gun, and to assemble an electron gun having no dimensional change.
また、 本発明によるシヱ一ビングコィ ン加工では、 前述の数 1 の式により、 金属素材 (元板材) の板厚にかかわらず薄板部分の 板厚を薄く成形できるので、 電極部品の板厚 t ! を薄くする方向 での電子銃設計の自由度が向上する。 そして、 より微小な電子ビ ーム透過孔を有し、 且つ機械強度の大きい電極を製造することが できる。  Further, according to the present invention, the thinning portion can be formed thin irrespective of the thickness of the metal material (original plate material) by the above equation (1). ! The degree of freedom in designing electron guns in the direction of thinning is improved. Further, an electrode having finer electron beam transmission holes and having high mechanical strength can be manufactured.
陰極線管の動作時、 薄板周辺部の厚板部分のエツジ部は電界レ ンズを形成するが、 本発明では、 このエッジ部が従来のコィニン グ加工のように盛り上がることなく、 相対位置精度よく形成でき る。 従って、 いわゆるシヱ一ビングコイ ン部を特性上必要としな い場合のみならず、 電子レンズと して利用することも可能であり 、 いずれも従来に比べてビ一ムスポッ ト特性を向上させることが できる。 During operation of the cathode ray tube, the edge of the thick plate around the thin plate forms an electric field lens, but in the present invention, this edge is formed with high relative position accuracy without swelling unlike conventional coining. it can. Therefore, it is possible not only to use a so-called shaving coin portion in terms of characteristics but also to use it as an electronic lens, and to improve the beam spot characteristics as compared with the conventional case. it can.
シヱービングコィ ン加工により薄板を形成した後、 さ らに薄板 に対してコイニング成形するときは、 更に薄い薄板部分を形成す ることができる。 従ってより微小な電子ビーム透過孔を形成する こ とができる。  When a thin plate is formed by shaving coin processing and then coining-formed on the thin plate, a thinner thin plate portion can be formed. Therefore, finer electron beam transmission holes can be formed.
加工準備孔として、 その後成形されるべき薄板の径の 8 0 %以 上の径を有する加工準備孔を形成するときは、 精度よく所望の板 厚の薄板を形成するこ とができ、 目的の電子銃電極を製造するこ とができる。  When forming a working preparation hole having a diameter of 80% or more of the diameter of the thin plate to be subsequently formed as a working preparation hole, a thin plate having a desired thickness can be accurately formed, and Electron gun electrodes can be manufactured.
金属素材の板厚方向に対して、 加工準備孔を打ち抜く 向きと、 金属素材をシヱ一ビングにより切削する向きとを、 互に逆にする こ とにより、 加工準備孔の打ち抜き加工時に上部に生じた破断面 を、 薄板成形後の残り孔内面に破断面痕として移すことができる 。 従って、 その後の電子ビーム透過孔の形成で加工準備孔におけ る破断面を完全に除去することができ、 寸法精度の良い電子銃電 極を製造することができる。  The direction in which the preparation hole is punched and the direction in which the metal material is cut by shaving are reversed with respect to the thickness direction of the metal material. The resulting fracture surface can be transferred as a fracture surface mark to the inner surface of the remaining hole after forming the thin plate. Therefore, it is possible to completely remove the fractured surface in the processing preparation hole by forming the electron beam transmitting hole thereafter, and it is possible to manufacture an electron gun electrode with high dimensional accuracy.
金属素材の面に予め盛り上がり部を形成し、 この盛り上がり部 に加工準備孔を形成した後、 シヱービングコィ ン加工することに より、 金属素材の元板厚によ らず、 薄板の残り孔径をよ り縮小し たシヱ一ビングコィ ン部の成形を可能にし、 さらに極小の電子ビ A raised portion is formed on the surface of the metal material in advance, a working preparation hole is formed in this raised portion, and then a shaving coin process is performed to increase the remaining hole diameter of the thin plate regardless of the original plate thickness of the metal material. It is possible to form a reduced shaving coil part,
—ム透過孔を有する電子銃電極を製造することができる。 -An electron gun electrode having a film transmission hole can be manufactured.
金属素材の元板厚を薄くすることが可能になるので、 電子銃電 極に一体に形成する支持片も所望の薄さにでき、 電子銃電極をビ ― ドガラスへ安定して支持することができる。  Since the original thickness of the metal material can be reduced, the supporting piece formed integrally with the electron gun electrode can be made as thin as desired, and the electron gun electrode can be stably supported on the bead glass. it can.
シヱ一ビングコイ ン部の周囲の厚板部分を残すときは、 シェ一 ビングコィ ン部を補強することができる。  When leaving the thick plate around the shaving coin, the shaving coin can be reinforced.
本発明に係る電子銃は、 上述の本発明による製法で製造した電 子銃電極を組立てて構成するので、 信頼性の高い電子銃を提供す ることができる。 特に高精細度の陰極線管用の電子銃に適用して 好適ならしめるものである。 Since the electron gun according to the present invention is constructed by assembling the electron gun electrodes manufactured by the above-described manufacturing method according to the present invention, a highly reliable electron gun is provided. Can be In particular, the present invention can be suitably applied to an electron gun for a high-definition cathode ray tube.

Claims

請求の範囲 The scope of the claims
1. 金属素材の一の面からのシヱ一ビングにより切削される金属 部が前記金属素材に連続した薄板に成形され、 該薄板の部分に 電子ビーム透過孔が形成されてなる電極を有して成ることを特 徴とする電子銃。  1. A metal portion cut by sieving from one surface of a metal material is formed into a thin plate continuous with the metal material, and the thin plate portion has an electrode in which an electron beam transmission hole is formed. An electron gun characterized by consisting of:
2. 金属素材の一の面からのシヱ一ビングにより切削される金属 部が前記金属素材に連続した薄板に成形され、 さ らにコィニン グ成形された前記薄板の部分に電子ビーム透過孔が形成されて なる電極を有して成ることを特徵とする電子銃。  2. A metal part cut by sieving from one surface of the metal material is formed into a thin sheet continuous with the metal material, and an electron beam transmission hole is formed in the thinned part of the thinned sheet. An electron gun comprising an electrode formed.
3. 厚板の金属素材の一部を薄板に成形する工程において、 前記 金属素材の一の面からのシ 'ェ一ビングにより切削される金属部 を、 前記金属素材に連続した薄板に成形することを特徴とする 電子銃電極の製造方法。 3. In the step of forming a part of the thick metal material into a thin plate, the metal part cut by shaving from one surface of the metal material is formed into a thin plate continuous with the metal material. A method for producing an electron gun electrode, comprising:
4. 厚板の金属素材の一部を薄板に成形する工程において、 前記 金属素材の一の面からのシエービングにより切削される金属部 を、 前記金属素材に連続した薄板に成形し、 該薄板の部分をコ イニング成形することを特徵とする電子銃電極の製造方法。 4. In the step of forming a part of the thick metal material into a thin plate, the metal part cut by shaving from one surface of the metal material is formed into a thin plate continuous with the metal material. A method for producing an electron gun electrode, which comprises coining a part.
5. 前記金属素材に、 その後成形されるべき前記薄板の径の 8 0 %以上の径で加工準備孔を形成することを特徵とする請求の範 囲第 3項記載の電子銃電極の製造方法。 5. The method for manufacturing an electron gun electrode according to claim 3, wherein a processing preparation hole having a diameter of 80% or more of a diameter of the thin plate to be subsequently formed is formed in the metal material. .
6. 前記金属素材に、 その後形成されるべき前記薄板の径の 8 0 %以上の径で加工準備孔を形成することを特徴とする請求の範 囲第 4項記載の電子銃電極の製造方法。  6. The method for manufacturing an electron gun electrode according to claim 4, wherein a processing preparation hole having a diameter of 80% or more of a diameter of the thin plate to be formed thereafter is formed in the metal material. .
7. 前記金属素材の板厚方向に対して、 加工準備孔を打ち抜く向 きと、 前記金属素材をシヱ一ビングにより切削する向きとを、 互いに逆にして加工することを特徵とする請求の範囲第 3項記 載の電子銃電極の製造方法。  7. The method is characterized in that the direction of punching a preparation hole and the direction of cutting the metal material by shaving are opposite to each other with respect to the thickness direction of the metal material. 3. The method for manufacturing an electron gun electrode according to item 3 of the scope.
8. 前記金属素材の扳厚方向に対して、 加工準備孔を打ち抜く 向 きと、 前記金属素材をシ —ビングにより切削する向きとを、 互いに逆にして加工することを特徴とする請求の範囲第 4項記 載の電子銃電極の製造方法。 8. In the thickness direction of the metal material 5. The method for manufacturing an electron gun electrode according to claim 4, wherein the metal material is processed in a direction opposite to the direction in which the metal material is cut by shaving.
9. 前記金属素材の板厚方向に対して、 加工準備孔を打ち抜く向 きと、 前記金属素材をシェービングにより切削する向きとを、 互いに逆にして加工することを特徵とする請求の範囲第 5項記 載の電子銃電極の製造方法。  9. The method according to claim 5, wherein the direction of punching a working preparation hole and the direction of cutting the metal material by shaving are opposite to each other with respect to the thickness direction of the metal material. The method for manufacturing an electron gun electrode described in the item.
10. 前記金属素材の板厚方向に対して、 加工準備孔を打ち抜く向 きと、 前記金属素材をシ 一ビングにより切削する向きとを、 互いに逆にして加工することを特徵とする請求の範囲第 6項記 載の電子銃電極の製造方法。  10. The method according to claim 1, wherein a direction of punching a working preparation hole and a direction of cutting the metal material by sieving are opposite to each other with respect to a thickness direction of the metal material. Item 6. The method for manufacturing an electron gun electrode described in Item 6.
11. 前記薄板に電子ビーム透過孔を形成することを特徵とする請 求の範囲第 3項記載の電子銃電極の製造方法。  11. The method for manufacturing an electron gun electrode according to claim 3, wherein an electron beam transmitting hole is formed in said thin plate.
12. 前記コイニング成形部に電子ビーム透過孔を形成することを 特徵とする請求の範囲第 4項記載の電子銃電極の製造方法。 12. The method for manufacturing an electron gun electrode according to claim 4, wherein an electron beam transmitting hole is formed in the coining molded part.
13. 加工準備孔の周囲が他部より盛り上げられた金属素材を形成 し、 前記金属素材に一面からシヱ一ビングにより切削される金 属部を、 前記金属素材に連続した薄板に成形することを特徵と する電子銃電極の製造方法。 13. Forming a metal material in which the periphery of the processing preparation hole is raised from the other part, and forming a metal part cut from one side of the metal material by sieving into a thin plate continuous with the metal material. A method for manufacturing an electron gun electrode characterized by the following.
14. 前記盛り上げられた部分の全てをシ 一ビングすることを特 徵とする請求の範囲第 1 3項記載の電子銃電極の製造方法。14. The method for manufacturing an electron gun electrode according to claim 13, wherein all of the raised portions are sieved.
15. 前記盛り上げられた部分の一部をシェ一ビングすることを特 徵とする請求の範囲第 1 3項記載の電子銃電極の製造方法。15. The method for manufacturing an electron gun electrode according to claim 13, wherein a part of the raised portion is shaved.
16. 前記薄板に成形した後、 該薄板の部分をコイニング成形する ことを特徴とする請求の範囲第 1 3項記載の電子銃電極の製造 方法。 16. The method for manufacturing an electron gun electrode according to claim 13, wherein after forming the thin plate, coining is performed on a portion of the thin plate.
17. 前記薄板に電子ビーム透過孔を形成することを特徼とする請 求の範囲第 1 3項記載の電子銃電極の製造方法。 17. The method for manufacturing an electron gun electrode according to claim 13, wherein the thin plate is provided with an electron beam transmitting hole.
18. 前記コィ二ング成形部に電子ビーム透過孔を形成することを 特徴とする請求の範囲第 1 6項記載の電子銃電極の製造方法。 18. The method for manufacturing an electron gun electrode according to claim 16, wherein an electron beam transmitting hole is formed in said coining molded part.
PCT/JP2001/002817 2000-09-26 2001-03-30 Electron gun and method for manufacturing electrode of electron gun WO2002027750A1 (en)

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JPH11288664A (en) * 1998-03-31 1999-10-19 Mitsubishi Electric Corp Manufacture of electrode for electron gun and electron gun
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JPH06251695A (en) * 1993-02-24 1994-09-09 Sony Corp Method and device for producing electron gate member
US5980350A (en) * 1996-03-05 1999-11-09 Sony Corporation Beam control electrode, electron gun provided with the beam control electrode, cathode-ray tube provided with the electron gun, and method of fabricating the beam control electrode
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