WO2002025702A3 - Semi-conducteur a alliage d'argent et d'or - Google Patents

Semi-conducteur a alliage d'argent et d'or Download PDF

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Publication number
WO2002025702A3
WO2002025702A3 PCT/US2001/027723 US0127723W WO0225702A3 WO 2002025702 A3 WO2002025702 A3 WO 2002025702A3 US 0127723 W US0127723 W US 0127723W WO 0225702 A3 WO0225702 A3 WO 0225702A3
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WO
WIPO (PCT)
Prior art keywords
silver
gold alloy
layer
semiconductor product
underlies
Prior art date
Application number
PCT/US2001/027723
Other languages
English (en)
Other versions
WO2002025702A2 (fr
Inventor
Stephen M Kim
Soon Sung Hong
Ji Yong Lee
Byung Jun Park
Hyok Won Kwon
Original Assignee
Stephen M Kim
Soon Sung Hong
Ji Yong Lee
Byung Jun Park
Hyok Won Kwon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stephen M Kim, Soon Sung Hong, Ji Yong Lee, Byung Jun Park, Hyok Won Kwon filed Critical Stephen M Kim
Priority to AU2001294526A priority Critical patent/AU2001294526A1/en
Publication of WO2002025702A2 publication Critical patent/WO2002025702A2/fr
Publication of WO2002025702A3 publication Critical patent/WO2002025702A3/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
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Abstract

L'invention concerne un semi-conducteur comprenant une couche d'alliage d'argent et d'or, dans lequel cette couche forme une couche extérieure du produit. Elle concerne aussi un substrat semi-conducteur comprenant une couche d'alliage d'or et d'argent, dans lequel la couche d'alliage d'or et d'argent forme une couche extérieure du substrat semi-conducteur. Selon l'invention, la couche d'alliage d'or et d'argent peut former la couche extérieure d'articles variés tels qu'un réseau de conducteurs, une grille matricielle de carte, un commutateur Reed, et un connecteur.
PCT/US2001/027723 2000-09-20 2001-09-20 Semi-conducteur a alliage d'argent et d'or WO2002025702A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001294526A AU2001294526A1 (en) 2000-09-20 2001-09-20 Semiconductor product with a silver and gold alloy

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66589800A 2000-09-20 2000-09-20
US09/665,898 2000-09-20

Publications (2)

Publication Number Publication Date
WO2002025702A2 WO2002025702A2 (fr) 2002-03-28
WO2002025702A3 true WO2002025702A3 (fr) 2002-08-01

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PCT/US2001/027723 WO2002025702A2 (fr) 2000-09-20 2001-09-20 Semi-conducteur a alliage d'argent et d'or

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091818A (ja) * 2006-10-05 2008-04-17 Matsushita Electric Ind Co Ltd 光半導体装置用リードフレームおよびこれを用いた光半導体装置、並びにこれらの製造方法

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US3342568A (en) * 1965-03-16 1967-09-19 Engelhard Ind Inc Composite material of a ceramic silver gold alloy, and a nickel alloy
US3568096A (en) * 1969-08-11 1971-03-02 Bell Telephone Labor Inc Apparatus for automatically switching high frequency signals
US3600794A (en) * 1968-06-18 1971-08-24 Chugai Electric Ind Co Ltd Method and apparatus for producing electrical contacts
US3634048A (en) * 1968-02-14 1972-01-11 Mallory & Co Inc P R Solderable stainless steel
US3668355A (en) * 1971-01-27 1972-06-06 Northern Electric Co Reed material for sealed contact application
US5035656A (en) * 1990-05-15 1991-07-30 E. I. Du Pont De Nemours And Company Connector, circuit board contact element and retention portion
JPH05117898A (ja) * 1991-10-29 1993-05-14 Furukawa Electric Co Ltd:The 半導体チツプ実装用リードフレームとその製造方法
JPH118341A (ja) * 1997-06-18 1999-01-12 Mitsui High Tec Inc 半導体装置用リードフレーム
US5981090A (en) * 1996-02-20 1999-11-09 Berkenhoff Gmbh Pins for electronic assemblies
US6054761A (en) * 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
US6081310A (en) * 1997-11-25 2000-06-27 Sharp Kabushiki Kaisha Reflection-type liquid crystal display having a silver or silver alloy upper electrode layer

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3251121A (en) * 1962-08-07 1966-05-17 Bell Telephone Labor Inc Method of making reed-type switch contacts
US3342568A (en) * 1965-03-16 1967-09-19 Engelhard Ind Inc Composite material of a ceramic silver gold alloy, and a nickel alloy
US3634048A (en) * 1968-02-14 1972-01-11 Mallory & Co Inc P R Solderable stainless steel
US3600794A (en) * 1968-06-18 1971-08-24 Chugai Electric Ind Co Ltd Method and apparatus for producing electrical contacts
US3568096A (en) * 1969-08-11 1971-03-02 Bell Telephone Labor Inc Apparatus for automatically switching high frequency signals
US3668355A (en) * 1971-01-27 1972-06-06 Northern Electric Co Reed material for sealed contact application
US5035656A (en) * 1990-05-15 1991-07-30 E. I. Du Pont De Nemours And Company Connector, circuit board contact element and retention portion
JPH05117898A (ja) * 1991-10-29 1993-05-14 Furukawa Electric Co Ltd:The 半導体チツプ実装用リードフレームとその製造方法
US5981090A (en) * 1996-02-20 1999-11-09 Berkenhoff Gmbh Pins for electronic assemblies
JPH118341A (ja) * 1997-06-18 1999-01-12 Mitsui High Tec Inc 半導体装置用リードフレーム
US6081310A (en) * 1997-11-25 2000-06-27 Sharp Kabushiki Kaisha Reflection-type liquid crystal display having a silver or silver alloy upper electrode layer
US6054761A (en) * 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors

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AU2001294526A1 (en) 2002-04-02

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