WO2002017377A1 - Metallischer hohlkörper und verfahren zu seiner herstellung - Google Patents
Metallischer hohlkörper und verfahren zu seiner herstellung Download PDFInfo
- Publication number
- WO2002017377A1 WO2002017377A1 PCT/AT2001/000211 AT0100211W WO0217377A1 WO 2002017377 A1 WO2002017377 A1 WO 2002017377A1 AT 0100211 W AT0100211 W AT 0100211W WO 0217377 A1 WO0217377 A1 WO 0217377A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hollow body
- inserts
- supports
- column
- boundary walls
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a method for producing a metallic hollow body, in particular a micro-heat exchanger through which heat transfer medium can flow through inlets and outlets, with spaced-apart boundary walls, between which a number of spaced-apart, column-like supports extend at least in regions, one in place of the columnar supports with continuous recesses, the hollow body, electrically poorly conductive molded body, this is electrochemically coated with wall material and then the molded body is removed destructively from the cavity.
- the invention also relates to a metallic hollow body itself, in particular a micro-heat exchanger through which heat transfer medium can flow through inlet and outlet openings, with spaced-apart boundary walls, between which a number of spaced-apart, column-like supports extend at least in regions.
- Hollow bodies of the type mentioned and the aforementioned method for their production are known, for example, from US Pat. No. 3,308,879 or from EP 0 728 229 A1.
- the columnar supports of the spaced boundary walls of the hollow body give it the required mechanical stability on the one hand and on the other hand at least partially also have functional functions - for example as flow openings or flow directors or swirlers, or can also be used to provide larger sealed openings e.g. serve to attach the hollow body.
- the resulting column-like supports are either hollow or solid on the inside.
- the materials used for the production of the shaped bodies which are of course very small, in particular for the micro-heat exchangers mentioned, have to meet and come from a wide variety of requirements, such as, for example, easy formability and workability, dimensional stability and dimensional stability, easy and complete removability from the cavity, and the like mostly from the group: plastic, wax, resin or the like. Since these materials mostly have no electrical conductivity, a starting layer must be applied to the shaped body in a suitable manner (for example graphite, carbon black or else) before the actual electrochemical wall coating metal layers applied with chemical methods), this starting layer only offering low electrical conductivity, so that electrical contacting is of increasing importance for the actual electrochemical wall coating.
- a starting layer must be applied to the shaped body in a suitable manner (for example graphite, carbon black or else) before the actual electrochemical wall coating metal layers applied with chemical methods), this starting layer only offering low electrical conductivity, so that electrical contacting is of increasing importance for the actual electrochemical wall coating.
- the object of the present invention is to improve a method for producing a metallic hollow body of the type mentioned at the outset and also the metallic hollow body itself in such a way that the disadvantages mentioned of the known methods and hollow bodies are avoided and that contacting or contacting is particularly simple and expedient Power supply for the electrochemical coating is possible. Furthermore, the possible problems mentioned at the transitions between the columnar supports and the boundary walls of the hollow body should also be avoided.
- this object is achieved in a method of the type mentioned at the outset in that, before the electrochemical coating of the shaped body, massive conductive inserts are introduced into the recesses as column-like supports and are used at least partially in the electrochemical coating for electrical contacting. Due to these previously introduced massive conductive inserts, electrical contacting can take place directly and at any number of arbitrarily spaced locations of the hollow body in the electrochemical coating, so that there is corresponding potential from the outset at least several individual points without too much via the poorly conductive starting layer disabling waste would be feared.
- tubes or similar partial hollow bodies can also be provided as solid conductive inserts if the use at the respective location e.g. requires a through opening.
- the electrochemical coating originates from the point of the potential supply, in this case from at least a part of the inserted massive inserts at the transition from these inserts to the surrounding wall material, solid and tight connections in any case. Furthermore, since the column-like supports - as mentioned at the beginning - are available anyway for functional reasons, the fact that the electrochemical coatability makes it possible to insert the solid conductive inserts in a much better and more uniform manner has no influence whatsoever on the basic construction and design of the hollow body, the overall solid and is also easier to manufacture tightly.
- the metallic hollow body itself is characterized according to the invention in that the columnar supports are formed by massive inserts and are connected to the boundary walls when the hollow body is being assembled. This connection takes place, as mentioned, in the electrolytic coating or in the manufacture of the boundary walls itself, in that the massive conductive inserts connect successively to the correspondingly deposited wall material.
- the solid inserts are allowed to protrude on at least one side to such an extent that surface areas protrude after the electrochemical coating, which are preferably revised together to adapt to a contact surface upstream of the other surface.
- independent isolated contact areas can be provided independently of or at a certain distance from the spaced boundary walls of the hollow body, which e.g. in the mentioned embodiment of the hollow body as a micro-heat exchanger, advantageously reduce or avoid contact thermal stresses between the boundary walls of the heat exchanger and the component to be temperature-controlled.
- the hollow body itself is further developed according to the invention in such a way that at least some of the solid inserts protrude above the surface of the hollow body on at least one side of the hollow body.
- a further embodiment of the invention provides that the same material, preferably copper or a copper alloy, is used for the wall material and the massive inserts, which simplifies the electrochemical coating and ensures better connections between the wall material and conductive inserts.
- FIGS. 1 to 3 show an example of a shaped body for producing a micro-heat exchanger according to the invention in a first manufacturing step in plan view, front view and oblique view
- FIGS. 4 to 6 show corresponding representations of the same shaped body in a further manufacturing step
- FIG. 7 to 9 show a corresponding, partially sectioned representation with 1 to 6 manufactured micro-heat exchanger
- FIG. 10 shows a further schematic representation of the micro-heat exchanger according to FIGS. 7 to 9 attached to a component to be tempered.
- the molded body according to FIGS. 1 to 6 usually consists of poorly conductive, but easily machinable and easily removable material after the electrochemical coating from the resulting hollow body, for example from polymers such as PMMA. 4 to 6, holes or continuous recesses 2 are drilled in the U-shaped, trough-like shaped body 1 in a grid-like pattern (here cylindrical - but deviating from this, for example, triangular, hexagonal or elongated recesses could also be used with melting processes or the like be attached). Before the electrochemical coating of the molded body 1, suitable, massive conductive inserts 3 are introduced into the recesses 2 as column-like supports 4 (see FIGS. 7 to 10) and are used at least partially in the electrochemical coating for electrical contacting.
- the solid inserts 3 arranged on the lower base surface 5 protrude from the molded body 1 according to FIGS. 5, 8 and 10 to such an extent that surface areas 6 protruding after the electrochemical coating remain, which preferably together to adapt to a contact surface upstream of the other surface (according to 10, the surface 7 of the component 8) to be temperature-controlled are revised.
- This processing can be carried out, for example, by grinding all the above surface areas 6 (see FIG. 8) and ensures that the micro-heat exchanger produced in this way does not lie on the entire surface of the component 8 to be temperature-controlled, but only in the area of the individual contact surfaces which arise, which results in superficial thermal stresses between the two Reduced components or excludes their adverse effects.
- the entire assembly is provided on the surface with a conductive starting layer (for example graphite or carbon black), the inserts 3 only on the exposed ones Places are coated. At least some of the inserts 3 are then used (possibly on correspondingly outwardly projecting extensions) for the subsequent electrochemical coating for electrical contacting, for which purpose strategically located inserts 3 are used, which preferably also fix the assembly in a holder. If a metallic starting layer is also possible (through chemical metallization), the initial conductivity is sufficient so that only a few uses (e.g. only one on each side) are sufficient to be able to carry out a subsequent chemical surface coating (e.g.
- the distance between two contacted solid inserts 3 is selected to be smaller, if necessary, since the maximum two-dimensional propagation speed of the electrochemical coating must be taken into account so that it does not there are too great differences in the density of the coating material.
- this hollow body 9 can be provided on both sides with attached connections 11 for inlets and outlets of a heat transfer medium and can be fastened (e.g. glued) to a component 8 to be temperature-controlled in a manner not shown here.
- the connections 11 can, for example, be soldered onto corresponding openings or at least partly also formed during the production of the hollow body as described.
- inserts 3 or the supports 4 obtained therewith could also have other suitable shapes which are arbitrary within wide limits. If, for example, tubular inserts 3 are used, closed through holes are created through the hollow body - flow-guiding surfaces in the interior of the hollow body could be realized by means of inserts 3 extended in a sheet-like manner.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Electroplating Methods And Accessories (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001267126A AU2001267126A1 (en) | 2000-08-23 | 2001-06-27 | Metallic hollow bodies and method for the production thereof |
EP01944724A EP1312111A1 (de) | 2000-08-23 | 2001-06-27 | Metallischer hohlkörper und verfahren zu seiner herstellung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATA1451/2000 | 2000-08-23 | ||
AT14512000A AT408809B (de) | 2000-08-23 | 2000-08-23 | Metallischer hohlkörper und verfahren zu seiner herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002017377A1 true WO2002017377A1 (de) | 2002-02-28 |
Family
ID=3688245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/AT2001/000211 WO2002017377A1 (de) | 2000-08-23 | 2001-06-27 | Metallischer hohlkörper und verfahren zu seiner herstellung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1312111A1 (de) |
AT (1) | AT408809B (de) |
AU (1) | AU2001267126A1 (de) |
WO (1) | WO2002017377A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT6358U3 (de) * | 2003-04-09 | 2003-11-25 | Cool Structures Production And | Mikro-wärmetauscher und verfahren zu seiner herstellung |
DE102004017984A1 (de) * | 2003-04-16 | 2004-12-30 | AB Mikroelektronik Ges.m.b.H. | Elektrische Baugruppe und Verfahren zu ihrer Herstellung |
CN100380472C (zh) * | 2003-05-16 | 2008-04-09 | 汤姆森特许公司 | 用于调整用于生成聚焦误差信号的增益的方法和设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4938280A (en) * | 1988-11-07 | 1990-07-03 | Clark William E | Liquid-cooled, flat plate heat exchanger |
US5199487A (en) * | 1991-05-31 | 1993-04-06 | Hughes Aircraft Company | Electroformed high efficiency heat exchanger and method for making |
US5249358A (en) * | 1992-04-28 | 1993-10-05 | Minnesota Mining And Manufacturing Company | Jet impingment plate and method of making |
US5317805A (en) * | 1992-04-28 | 1994-06-07 | Minnesota Mining And Manufacturing Company | Method of making microchanneled heat exchangers utilizing sacrificial cores |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3308879A (en) * | 1964-06-10 | 1967-03-14 | Maddocks Herbert Fernyhough | Heat exchangers |
-
2000
- 2000-08-23 AT AT14512000A patent/AT408809B/de not_active IP Right Cessation
-
2001
- 2001-06-27 WO PCT/AT2001/000211 patent/WO2002017377A1/de not_active Application Discontinuation
- 2001-06-27 EP EP01944724A patent/EP1312111A1/de not_active Withdrawn
- 2001-06-27 AU AU2001267126A patent/AU2001267126A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4938280A (en) * | 1988-11-07 | 1990-07-03 | Clark William E | Liquid-cooled, flat plate heat exchanger |
US5199487A (en) * | 1991-05-31 | 1993-04-06 | Hughes Aircraft Company | Electroformed high efficiency heat exchanger and method for making |
US5249358A (en) * | 1992-04-28 | 1993-10-05 | Minnesota Mining And Manufacturing Company | Jet impingment plate and method of making |
US5317805A (en) * | 1992-04-28 | 1994-06-07 | Minnesota Mining And Manufacturing Company | Method of making microchanneled heat exchangers utilizing sacrificial cores |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT6358U3 (de) * | 2003-04-09 | 2003-11-25 | Cool Structures Production And | Mikro-wärmetauscher und verfahren zu seiner herstellung |
DE102004017984A1 (de) * | 2003-04-16 | 2004-12-30 | AB Mikroelektronik Ges.m.b.H. | Elektrische Baugruppe und Verfahren zu ihrer Herstellung |
CN100380472C (zh) * | 2003-05-16 | 2008-04-09 | 汤姆森特许公司 | 用于调整用于生成聚焦误差信号的增益的方法和设备 |
Also Published As
Publication number | Publication date |
---|---|
ATA14512000A (de) | 2001-07-15 |
EP1312111A1 (de) | 2003-05-21 |
AT408809B (de) | 2002-03-25 |
AU2001267126A1 (en) | 2002-03-04 |
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