WO2002015281A3 - Reseau de diodes electroluminescentes a joint hermetique verre sur metal utilise dans un dispositif lumineux a semi-conducteurs etanche - Google Patents

Reseau de diodes electroluminescentes a joint hermetique verre sur metal utilise dans un dispositif lumineux a semi-conducteurs etanche Download PDF

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Publication number
WO2002015281A3
WO2002015281A3 PCT/US2001/025750 US0125750W WO0215281A3 WO 2002015281 A3 WO2002015281 A3 WO 2002015281A3 US 0125750 W US0125750 W US 0125750W WO 0215281 A3 WO0215281 A3 WO 0215281A3
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WO
WIPO (PCT)
Prior art keywords
led
glass
plastic
light output
aluminum
Prior art date
Application number
PCT/US2001/025750
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English (en)
Other versions
WO2002015281A2 (fr
Inventor
Michael C Hutchison
Original Assignee
Power Signal Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Power Signal Technologies Inc filed Critical Power Signal Technologies Inc
Priority to AU2001283424A priority Critical patent/AU2001283424A1/en
Publication of WO2002015281A2 publication Critical patent/WO2002015281A2/fr
Publication of WO2002015281A3 publication Critical patent/WO2002015281A3/fr

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F21W2111/02—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for roads, paths or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

La présente invention concerne un appareil lumineux à semi-conducteurs adapté pour être utilisé dans des dispositifs lumineux de signalisation routière comprenant des diodes électroluminescentes (DEL) hermétiquement enfermées à joint verre sur métal. Les dispositifs à semi-conducteurs de l'état actuel de la technique utilisent des DEL à joint plastique/époxyde. Un joint hermétique verre sur métal est plus de 1000 fois plus efficace pour enfermer hermétiquement des DEL qu'un joint plastique/époxyde. Les joints plastique/époxyde permettent à l'oxygène et à d'autres contaminants de venir en contact avec le matériau semi-conducteur des DEL. Les semi-conducteurs des DEL sont constitués d'éléments chimiques tels que l'aluminium (par exemple AlInGaP est une des matières utilisées pour les DEL rouge et jaune) qui au fil du temps et suite à une exposition à l'oxygène, transforme chimiquement le matériau des DEL, qui est de l'aluminium, en oxyde d'aluminium. Une température plus élevée accélère les transformations chimiques, et par conséquent le fait de maintenir les DEL froides et hermétiques réduit fortement la dégradation de l'émission de lumière permanente. La transformation chimique du matériau semi-conducteur des DEL est une des principales causes de la dégradation de l'émission de lumière permanente des DEL. La combinaison d'un joint hermétique verre sur métal et d'une conception thermique supérieure produit un effet exponentiel sur le MTBF du rendement lumineux du réseau de DEL.
PCT/US2001/025750 2000-08-17 2001-08-17 Reseau de diodes electroluminescentes a joint hermetique verre sur metal utilise dans un dispositif lumineux a semi-conducteurs etanche WO2002015281A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001283424A AU2001283424A1 (en) 2000-08-17 2001-08-17 Glass-to-metal hermetically led array in a sealed solid state light

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64041600A 2000-08-17 2000-08-17
US09/640,416 2000-08-17

Publications (2)

Publication Number Publication Date
WO2002015281A2 WO2002015281A2 (fr) 2002-02-21
WO2002015281A3 true WO2002015281A3 (fr) 2002-05-23

Family

ID=24568140

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/025750 WO2002015281A2 (fr) 2000-08-17 2001-08-17 Reseau de diodes electroluminescentes a joint hermetique verre sur metal utilise dans un dispositif lumineux a semi-conducteurs etanche

Country Status (2)

Country Link
AU (1) AU2001283424A1 (fr)
WO (1) WO2002015281A2 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070001177A1 (en) * 2003-05-08 2007-01-04 Koninklijke Philips Electronics N.V. Integrated light-emitting diode system
AU2003229241A1 (en) * 2003-06-03 2005-01-21 Asetronics Ag Insulated metal substrate with at least one light diode, light diode matrix and production method
EP1735844B1 (fr) * 2004-03-18 2019-06-19 Phoseon Technology, Inc. Utilisation d'un réseau de diodes électroluminescentes à haute densité comprenant des micro-réflecteurs pour des procédés de durcissement
WO2005109529A1 (fr) * 2004-05-07 2005-11-17 Koninklijke Philips Electronics N.V. Boitier de puce a diode electroluminescente et collimateur
US7329982B2 (en) 2004-10-29 2008-02-12 3M Innovative Properties Company LED package with non-bonded optical element
DE102010009429A1 (de) * 2010-02-24 2011-08-25 Siemens Aktiengesellschaft, 80333 Symbolanzeiger
US8876322B2 (en) 2012-06-20 2014-11-04 Journée Lighting, Inc. Linear LED module and socket for same
US9565782B2 (en) 2013-02-15 2017-02-07 Ecosense Lighting Inc. Field replaceable power supply cartridge
US9976710B2 (en) 2013-10-30 2018-05-22 Lilibrand Llc Flexible strip lighting apparatus and methods
US10477636B1 (en) 2014-10-28 2019-11-12 Ecosense Lighting Inc. Lighting systems having multiple light sources
US9869450B2 (en) 2015-02-09 2018-01-16 Ecosense Lighting Inc. Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector
US11306897B2 (en) 2015-02-09 2022-04-19 Ecosense Lighting Inc. Lighting systems generating partially-collimated light emissions
US9651216B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Lighting systems including asymmetric lens modules for selectable light distribution
US9568665B2 (en) 2015-03-03 2017-02-14 Ecosense Lighting Inc. Lighting systems including lens modules for selectable light distribution
US9651227B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Low-profile lighting system having pivotable lighting enclosure
US9746159B1 (en) 2015-03-03 2017-08-29 Ecosense Lighting Inc. Lighting system having a sealing system
USD785218S1 (en) 2015-07-06 2017-04-25 Ecosense Lighting Inc. LED luminaire having a mounting system
USD782093S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
USD782094S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
US9651232B1 (en) 2015-08-03 2017-05-16 Ecosense Lighting Inc. Lighting system having a mounting device
WO2017156189A1 (fr) 2016-03-08 2017-09-14 Lilibrand Llc Système d'éclairage comprenant un ensemble lentille
WO2018140727A1 (fr) 2017-01-27 2018-08-02 Lilibrand Llc Systèmes d'éclairage à indice élevé de rendu des couleurs et éclairage planaire uniforme
US20180328552A1 (en) 2017-03-09 2018-11-15 Lilibrand Llc Fixtures and lighting accessories for lighting devices
US11041609B2 (en) 2018-05-01 2021-06-22 Ecosense Lighting Inc. Lighting systems and devices with central silicone module
US11353200B2 (en) 2018-12-17 2022-06-07 Korrus, Inc. Strip lighting system for direct input of high voltage driving power

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1360073A (en) * 1970-11-30 1974-07-17 Western Electric Co Semiconductor devices
US4225380A (en) * 1978-09-05 1980-09-30 Wickens Justin H Method of producing light emitting semiconductor display
JPS5674985A (en) * 1979-11-24 1981-06-20 Sharp Corp Forming method for protective film for luminous element
JPS60143982A (ja) * 1983-12-29 1985-07-30 Sanyo Electric Co Ltd 発光ダイオ−ドヘツド
EP0404565A1 (fr) * 1989-06-21 1990-12-27 Mitsubishi Kasei Corporation Dispositif semi-conducteur composé et méthode de traitement de sa surface
JPH0519705A (ja) * 1991-07-12 1993-01-29 Takiron Co Ltd 発光表示体及びその製造方法
EP0741419A2 (fr) * 1995-05-02 1996-11-06 Motorola, Inc. Passivation de dispositifs organiques
JPH11163410A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1360073A (en) * 1970-11-30 1974-07-17 Western Electric Co Semiconductor devices
US4225380A (en) * 1978-09-05 1980-09-30 Wickens Justin H Method of producing light emitting semiconductor display
JPS5674985A (en) * 1979-11-24 1981-06-20 Sharp Corp Forming method for protective film for luminous element
JPS60143982A (ja) * 1983-12-29 1985-07-30 Sanyo Electric Co Ltd 発光ダイオ−ドヘツド
EP0404565A1 (fr) * 1989-06-21 1990-12-27 Mitsubishi Kasei Corporation Dispositif semi-conducteur composé et méthode de traitement de sa surface
JPH0519705A (ja) * 1991-07-12 1993-01-29 Takiron Co Ltd 発光表示体及びその製造方法
EP0741419A2 (fr) * 1995-05-02 1996-11-06 Motorola, Inc. Passivation de dispositifs organiques
JPH11163410A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 005, no. 141 (E - 073) 5 September 1981 (1981-09-05) *
PATENT ABSTRACTS OF JAPAN vol. 009, no. 307 (M - 435) 4 December 1985 (1985-12-04) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 293 (P - 1550) 4 June 1993 (1993-06-04) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30) *

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Publication number Publication date
AU2001283424A1 (en) 2002-02-25
WO2002015281A2 (fr) 2002-02-21

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