WO2002008486A3 - Electrode apparatus and method for plasma processing - Google Patents

Electrode apparatus and method for plasma processing Download PDF

Info

Publication number
WO2002008486A3
WO2002008486A3 PCT/US2001/022510 US0122510W WO0208486A3 WO 2002008486 A3 WO2002008486 A3 WO 2002008486A3 US 0122510 W US0122510 W US 0122510W WO 0208486 A3 WO0208486 A3 WO 0208486A3
Authority
WO
WIPO (PCT)
Prior art keywords
plasma processing
electrode
electrode apparatus
source electrode
metal drive
Prior art date
Application number
PCT/US2001/022510
Other languages
French (fr)
Other versions
WO2002008486A2 (en
Inventor
Murray D Sirkis
Wayne L Johnson
Steven T Fink
Original Assignee
Tokyo Electon Ltd
Murray D Sirkis
Wayne L Johnson
Steven T Fink
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electon Ltd, Murray D Sirkis, Wayne L Johnson, Steven T Fink filed Critical Tokyo Electon Ltd
Priority to AU2001273538A priority Critical patent/AU2001273538A1/en
Publication of WO2002008486A2 publication Critical patent/WO2002008486A2/en
Publication of WO2002008486A3 publication Critical patent/WO2002008486A3/en
Priority to US10/345,232 priority patent/US20030106644A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/3255Material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/32605Removable or replaceable electrodes or electrode systems

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Cleaning In General (AREA)

Abstract

A plasma processing system includes an electrode assembly (150) having a metal drive electrode (154) coupled to a source electrode (152) using fasteners (132) which not introduce contaminants into the plasma processing chamber. In addition, the source electrode (152) is provided with at least a partially metallized surface (151) that serves as the interface between the metal drive electrode (154) and the source electrode material (153).
PCT/US2001/022510 2000-07-20 2001-07-19 Electrode apparatus and method for plasma processing WO2002008486A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2001273538A AU2001273538A1 (en) 2000-07-20 2001-07-19 Electrode apparatus and method for plasma processing
US10/345,232 US20030106644A1 (en) 2001-07-19 2003-01-16 Electrode apparatus and method for plasma processing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21945300P 2000-07-20 2000-07-20
US60/219,453 2000-07-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/345,232 Continuation US20030106644A1 (en) 2001-07-19 2003-01-16 Electrode apparatus and method for plasma processing

Publications (2)

Publication Number Publication Date
WO2002008486A2 WO2002008486A2 (en) 2002-01-31
WO2002008486A3 true WO2002008486A3 (en) 2002-06-20

Family

ID=22819317

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/022510 WO2002008486A2 (en) 2000-07-20 2001-07-19 Electrode apparatus and method for plasma processing

Country Status (2)

Country Link
AU (1) AU2001273538A1 (en)
WO (1) WO2002008486A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0095200A2 (en) * 1982-05-21 1983-11-30 Tegal Corporation Plasma reactor removeable insert
US5074456A (en) * 1990-09-18 1991-12-24 Lam Research Corporation Composite electrode for plasma processes
US5569356A (en) * 1995-05-19 1996-10-29 Lam Research Corporation Electrode clamping assembly and method for assembly and use thereof
US6073577A (en) * 1998-06-30 2000-06-13 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0095200A2 (en) * 1982-05-21 1983-11-30 Tegal Corporation Plasma reactor removeable insert
US5074456A (en) * 1990-09-18 1991-12-24 Lam Research Corporation Composite electrode for plasma processes
US5569356A (en) * 1995-05-19 1996-10-29 Lam Research Corporation Electrode clamping assembly and method for assembly and use thereof
US6073577A (en) * 1998-06-30 2000-06-13 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof

Also Published As

Publication number Publication date
WO2002008486A2 (en) 2002-01-31
AU2001273538A1 (en) 2002-02-05

Similar Documents

Publication Publication Date Title
AU5169699A (en) Method and device for surface processing with plasma at atmospheric pressure
AU2001224729A1 (en) Segmented electrode assembly and method for plasma processing
GB2358982A (en) A general image enhancement framework
AU7221294A (en) Methods for processing semiconductors to reduce surface particles
WO2002084291A1 (en) Specimen analyzing implement
EP1110669A3 (en) Apparatus and method for cutting workpieces by flushing working liquid to the tool-and-workpiece interface
HUP0101824A3 (en) Semiconductor process chamber electrode and method for making the same
AU2001259557A1 (en) Method of adjusting the thickness of an electrode in a plasma processing system
EP0641020A3 (en) Multiple-scan method for wafer particle analysis.
MY122917A (en) Vibrating screen separator
WO2004030012A3 (en) Improved bellows shield in a plasma processing system,and method of manufacture of such bellows shield
AU1937400A (en) Process and apparatus for processing and transporting flat glass workpieces
AU2261199A (en) Method and apparatus for processing krill hydrolysates
AU2003234019A1 (en) Process for processing carbon material
WO2002060788A3 (en) Device and method for conveying work pieces
EP0942453A3 (en) Monitoring of plasma constituents using optical emission spectroscopy
EP0964425A3 (en) Apparatus for processing a work piece with a uniformly neutralised ion beam
AU2001235755A1 (en) Assembling composite structures
AU5066099A (en) Method for processing soybean by using enzyme, processed soybean thus obtained and foods containing the thus processed soybean
CA2272037A1 (en) Flotation and cyanidation process control
EP0680075A4 (en) Electrode for generating plasma, element for burying electrode, and method for manufacturing the electrode and the element.
TW256779B (en)
ES2150822A1 (en) Cabinet for monitor device
EP0911862A3 (en) Apparatus and method for microwave plasma process
WO2002008486A3 (en) Electrode apparatus and method for plasma processing

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 10345232

Country of ref document: US

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP