WO2002008309A3 - Use of cross-linker and compositions made therefrom - Google Patents
Use of cross-linker and compositions made therefrom Download PDFInfo
- Publication number
- WO2002008309A3 WO2002008309A3 PCT/EP2001/007912 EP0107912W WO0208309A3 WO 2002008309 A3 WO2002008309 A3 WO 2002008309A3 EP 0107912 W EP0107912 W EP 0107912W WO 0208309 A3 WO0208309 A3 WO 0208309A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- initiator
- linker
- cross
- electron beam
- disclosed
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Polymerization Catalysts (AREA)
- Polymerisation Methods In General (AREA)
- Materials For Photolithography (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001279729A AU2001279729A1 (en) | 2000-07-17 | 2001-07-10 | Use of cross-linker and compositions made therefrom |
EP01957942A EP1309645A2 (en) | 2000-07-17 | 2001-07-10 | Use of cross-linker and compositions made therefrom |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US62020400A | 2000-07-17 | 2000-07-17 | |
US09/620,204 | 2000-07-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002008309A2 WO2002008309A2 (en) | 2002-01-31 |
WO2002008309A3 true WO2002008309A3 (en) | 2002-05-16 |
Family
ID=24485003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2001/007912 WO2002008309A2 (en) | 2000-07-17 | 2001-07-10 | Use of cross-linker and compositions made therefrom |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1309645A2 (en) |
AU (1) | AU2001279729A1 (en) |
WO (1) | WO2002008309A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6708382B2 (en) * | 2015-09-03 | 2020-06-10 | サンアプロ株式会社 | Curable composition and cured product using the same |
EP3327091B1 (en) | 2016-11-23 | 2023-01-18 | Essilor International | Epoxy functional composition protecting dyes from photo-degradation and cured coatings prepared therefrom |
WO2019111796A1 (en) * | 2017-12-06 | 2019-06-13 | 日本化薬株式会社 | Photosensitive resin composition, dry film resist, and cured objects obtained therefrom |
WO2019208443A1 (en) * | 2018-04-23 | 2019-10-31 | 住友ベークライト株式会社 | Photosensitive resin composition for bump protecting films, semiconductor device, method for manufacturing semiconductor device, and electronic device |
CN111333880B (en) * | 2020-04-21 | 2022-04-22 | 万华化学集团股份有限公司 | Super water-absorbing polymer and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5124417A (en) * | 1990-02-12 | 1992-06-23 | Minnesota Mining And Manufacturing Company | Initiators for cationic polymerization |
US6166233A (en) * | 1999-08-17 | 2000-12-26 | Spectra Group Limited, Inc. | Onium gallates cationic initiators |
EP1136533A1 (en) * | 2000-01-28 | 2001-09-26 | General Electric Company | Curable silicone compositions incorporating photoactive onium salts |
-
2001
- 2001-07-10 EP EP01957942A patent/EP1309645A2/en not_active Withdrawn
- 2001-07-10 AU AU2001279729A patent/AU2001279729A1/en not_active Abandoned
- 2001-07-10 WO PCT/EP2001/007912 patent/WO2002008309A2/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5124417A (en) * | 1990-02-12 | 1992-06-23 | Minnesota Mining And Manufacturing Company | Initiators for cationic polymerization |
US6166233A (en) * | 1999-08-17 | 2000-12-26 | Spectra Group Limited, Inc. | Onium gallates cationic initiators |
EP1136533A1 (en) * | 2000-01-28 | 2001-09-26 | General Electric Company | Curable silicone compositions incorporating photoactive onium salts |
Non-Patent Citations (1)
Title |
---|
NECKERS DOUGLAS C ET AL: "Tetrakis(pentafluorophenyl)gallates (I)", TETRAHEDRON LETTERS, ELSEVIER SCIENCE PUBLISHERS, AMSTERDAM, NL, vol. 41, no. 45, November 2000 (2000-11-01), pages 8669 - 8672, XP002160995, ISSN: 0040-4039 * |
Also Published As
Publication number | Publication date |
---|---|
AU2001279729A1 (en) | 2002-02-05 |
WO2002008309A2 (en) | 2002-01-31 |
EP1309645A2 (en) | 2003-05-14 |
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