WO2002006645A3 - Reconfigurable system and method for cooling heat generating objects - Google Patents

Reconfigurable system and method for cooling heat generating objects Download PDF

Info

Publication number
WO2002006645A3
WO2002006645A3 PCT/US2001/022398 US0122398W WO0206645A3 WO 2002006645 A3 WO2002006645 A3 WO 2002006645A3 US 0122398 W US0122398 W US 0122398W WO 0206645 A3 WO0206645 A3 WO 0206645A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat generating
heat exchanger
fan unit
cooling heat
generating object
Prior art date
Application number
PCT/US2001/022398
Other languages
French (fr)
Other versions
WO2002006645A2 (en
Inventor
Stahl Lennart
Christian Belady
Original Assignee
Emerson Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/617,213 external-priority patent/US6564858B1/en
Priority claimed from US09/617,391 external-priority patent/US6705389B1/en
Application filed by Emerson Electric Co filed Critical Emerson Electric Co
Priority to AU2001276944A priority Critical patent/AU2001276944A1/en
Publication of WO2002006645A2 publication Critical patent/WO2002006645A2/en
Publication of WO2002006645A3 publication Critical patent/WO2002006645A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/206—Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method and system are disclosed for cooling a heat generating object. A coolant is passed through a heat exchanger so that heated air passing through a first portion of the heat exchange is cooled. A fan unit is selectively positioned relative to the heat exchanger. When activated, the fan unit draws the cooled air through a second portion of the heat exchanger and directs the twice cooled air towards the heat generating object. The fan unit may be repositioned along a different portion of the heat exchanger so as to redefine the flow of air drawn from and directed towards the heat generating object.
PCT/US2001/022398 2000-07-17 2001-07-17 Reconfigurable system and method for cooling heat generating objects WO2002006645A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001276944A AU2001276944A1 (en) 2000-07-17 2001-07-17 Reconfigurable system and method for cooling heat generating objects

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/617,213 2000-07-17
US09/617,213 US6564858B1 (en) 2000-07-17 2000-07-17 Overhead cooling system with selectively positioned paths of airflow
US09/617,391 US6705389B1 (en) 2000-07-17 2000-07-17 Reconfigurable system and method for cooling heat generating objects
US09/617,391 2000-07-17

Publications (2)

Publication Number Publication Date
WO2002006645A2 WO2002006645A2 (en) 2002-01-24
WO2002006645A3 true WO2002006645A3 (en) 2002-05-02

Family

ID=27087974

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2001/022419 WO2002007492A2 (en) 2000-07-17 2001-07-17 Overhead cooling system with selectively positioned paths of airflow
PCT/US2001/022398 WO2002006645A2 (en) 2000-07-17 2001-07-17 Reconfigurable system and method for cooling heat generating objects

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/US2001/022419 WO2002007492A2 (en) 2000-07-17 2001-07-17 Overhead cooling system with selectively positioned paths of airflow

Country Status (2)

Country Link
AU (2) AU2001273519A1 (en)
WO (2) WO2002007492A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2135495A1 (en) * 2007-03-09 2009-12-23 Ul Tech Ag Method and device for heat removal at computer workstations

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0458770A1 (en) * 1990-05-21 1991-11-27 Telefonaktiebolaget L M Ericsson An arrangement for convection cooling of apparatus rooms
EP0985889A2 (en) * 1998-07-29 2000-03-15 Hitachi, Ltd. Ceiling embedded type indoor unit

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5669229A (en) * 1995-05-30 1997-09-23 Mitsubishi Jukogyo Kabushiki Kaisha Ceiling-mounted type air conditioner
JP2993412B2 (en) * 1995-11-20 1999-12-20 三菱電機株式会社 Air outlet and air conditioner provided with the air outlet
TW384374B (en) * 1996-10-03 2000-03-11 Toshiba Corp Indoor unit of air-conditioner

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0458770A1 (en) * 1990-05-21 1991-11-27 Telefonaktiebolaget L M Ericsson An arrangement for convection cooling of apparatus rooms
EP0985889A2 (en) * 1998-07-29 2000-03-15 Hitachi, Ltd. Ceiling embedded type indoor unit

Also Published As

Publication number Publication date
WO2002007492A3 (en) 2002-04-25
WO2002006645A2 (en) 2002-01-24
WO2002007492A2 (en) 2002-01-24
AU2001273519A1 (en) 2002-01-30
AU2001276944A1 (en) 2002-01-30

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