WO2001097270A3 - Substrate cleaning apparatus and method - Google Patents
Substrate cleaning apparatus and method Download PDFInfo
- Publication number
- WO2001097270A3 WO2001097270A3 PCT/US2001/019218 US0119218W WO0197270A3 WO 2001097270 A3 WO2001097270 A3 WO 2001097270A3 US 0119218 W US0119218 W US 0119218W WO 0197270 A3 WO0197270 A3 WO 0197270A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- cleaning apparatus
- substrate cleaning
- exposing
- maintaining
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 8
- 238000004140 cleaning Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/427—Stripping or agents therefor using plasma means only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002511375A JP2004514272A (en) | 2000-06-14 | 2001-06-14 | Apparatus and method for cleaning substrate |
EP01944538A EP1297566A2 (en) | 2000-06-14 | 2001-06-14 | Substrate cleaning apparatus and method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59533600A | 2000-06-14 | 2000-06-14 | |
US09/595,336 | 2000-06-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001097270A2 WO2001097270A2 (en) | 2001-12-20 |
WO2001097270A3 true WO2001097270A3 (en) | 2003-01-23 |
Family
ID=24382834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/019218 WO2001097270A2 (en) | 2000-06-14 | 2001-06-14 | Substrate cleaning apparatus and method |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1297566A2 (en) |
JP (1) | JP2004514272A (en) |
WO (1) | WO2001097270A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8980045B2 (en) | 2007-05-30 | 2015-03-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7758763B2 (en) | 2006-10-31 | 2010-07-20 | Applied Materials, Inc. | Plasma for resist removal and facet control of underlying features |
JP2008235562A (en) * | 2007-03-20 | 2008-10-02 | Taiyo Nippon Sanso Corp | Method for cleaning plasma cvd deposition device |
EP2077467B9 (en) | 2008-01-04 | 2014-09-03 | Adixen Vacuum Products | Method for manufacturing photo masks and device for implementing same |
CN101925860B (en) * | 2008-03-05 | 2012-12-12 | 阿尔卡特朗讯公司 | Method of fabricating photomasks and device for implementing the same |
US9176398B2 (en) | 2008-06-10 | 2015-11-03 | Asml Netherlands B.V. | Method and system for thermally conditioning an optical element |
JP6165518B2 (en) * | 2013-06-25 | 2017-07-19 | 株式会社日立ハイテクノロジーズ | Plasma processing method and vacuum processing apparatus |
KR102614922B1 (en) * | 2020-12-30 | 2023-12-20 | 세메스 주식회사 | Apparatus and method for treating substrate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0489179A1 (en) * | 1990-06-27 | 1992-06-10 | Fujitsu Limited | Method of manufacturing semiconductor integrated circuit and equipment for the manufacture |
US5221424A (en) * | 1991-11-21 | 1993-06-22 | Applied Materials, Inc. | Method for removal of photoresist over metal which also removes or inactivates corosion-forming materials remaining from previous metal etch |
US5545289A (en) * | 1994-02-03 | 1996-08-13 | Applied Materials, Inc. | Passivating, stripping and corrosion inhibition of semiconductor substrates |
WO1998057366A1 (en) * | 1997-06-11 | 1998-12-17 | Lam Research Corporation | Methods and compositions for post-etch layer stack treatment in semiconductor fabrication |
-
2001
- 2001-06-14 EP EP01944538A patent/EP1297566A2/en not_active Withdrawn
- 2001-06-14 WO PCT/US2001/019218 patent/WO2001097270A2/en not_active Application Discontinuation
- 2001-06-14 JP JP2002511375A patent/JP2004514272A/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0489179A1 (en) * | 1990-06-27 | 1992-06-10 | Fujitsu Limited | Method of manufacturing semiconductor integrated circuit and equipment for the manufacture |
US5221424A (en) * | 1991-11-21 | 1993-06-22 | Applied Materials, Inc. | Method for removal of photoresist over metal which also removes or inactivates corosion-forming materials remaining from previous metal etch |
US5545289A (en) * | 1994-02-03 | 1996-08-13 | Applied Materials, Inc. | Passivating, stripping and corrosion inhibition of semiconductor substrates |
WO1998057366A1 (en) * | 1997-06-11 | 1998-12-17 | Lam Research Corporation | Methods and compositions for post-etch layer stack treatment in semiconductor fabrication |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8980045B2 (en) | 2007-05-30 | 2015-03-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
Also Published As
Publication number | Publication date |
---|---|
WO2001097270A2 (en) | 2001-12-20 |
JP2004514272A (en) | 2004-05-13 |
EP1297566A2 (en) | 2003-04-02 |
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