WO2001087765A3 - Mikromechanisches bauelement und entsprechendes herstellungsverfahren - Google Patents

Mikromechanisches bauelement und entsprechendes herstellungsverfahren Download PDF

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Publication number
WO2001087765A3
WO2001087765A3 PCT/DE2001/001073 DE0101073W WO0187765A3 WO 2001087765 A3 WO2001087765 A3 WO 2001087765A3 DE 0101073 W DE0101073 W DE 0101073W WO 0187765 A3 WO0187765 A3 WO 0187765A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
functional layer
micromechanical functional
micromechanical
closing
Prior art date
Application number
PCT/DE2001/001073
Other languages
English (en)
French (fr)
Other versions
WO2001087765A2 (de
Inventor
Markus Lutz
Original Assignee
Bosch Gmbh Robert
Markus Lutz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Markus Lutz filed Critical Bosch Gmbh Robert
Priority to EP01921222A priority Critical patent/EP1296886B1/de
Priority to US10/296,021 priority patent/US7063796B2/en
Priority to DE50114390T priority patent/DE50114390D1/de
Priority to JP2001584169A priority patent/JP4886147B2/ja
Publication of WO2001087765A2 publication Critical patent/WO2001087765A2/de
Publication of WO2001087765A3 publication Critical patent/WO2001087765A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)

Abstract

Die Erfindung schafft ein mikromechanisches Bauelement mit einem Substrat (1); einer beweglischen Sensorstruktur (6) in einer über dem Substrat liegenden ersten mikromechanischen Funktionsschicht (5); einer ersten Verschlussschicht (8) auf der ersten mikromechanischen Funktionsschicht (5), die zumindest teilweise strukturiert ist; einer zweiten mikromechanischen Funktionsschicht (10) auf der ersten Verschlussschicht (8), welche zumindest eine Abdeckfunktion aufweist und zumindest teilweise in der ersten mikromechanischen Funktionsschicht (5) verankert ist; und einer zweiten Verschlussschicht (8) auf der zweiten mikromechanischen Funktionsschicht (10). Die Sensorstruktur (6) ist mit Gräben (7) versehen, deren Breite nicht grösser ist als eine maximale Grabenbreite (66), welche durch die erste Verschlussschicht (8) in Form von Pfropfen (9) verschliessbar ist, welche die Grabenböden nicht erreichen.
PCT/DE2001/001073 2000-05-18 2001-03-21 Mikromechanisches bauelement und entsprechendes herstellungsverfahren WO2001087765A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP01921222A EP1296886B1 (de) 2000-05-18 2001-03-21 Herstellungsverfahren für ein mikromechanisches bauelement
US10/296,021 US7063796B2 (en) 2000-05-18 2001-03-21 Micromechanical component and method for producing the same
DE50114390T DE50114390D1 (de) 2000-05-18 2001-03-21 Herstellungsverfahren für ein mikromechanisches bauelement
JP2001584169A JP4886147B2 (ja) 2000-05-18 2001-03-21 微細加工構成素子及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10024697.4 2000-05-18
DE10024697A DE10024697B4 (de) 2000-05-18 2000-05-18 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren

Publications (2)

Publication Number Publication Date
WO2001087765A2 WO2001087765A2 (de) 2001-11-22
WO2001087765A3 true WO2001087765A3 (de) 2003-01-16

Family

ID=7642732

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/001073 WO2001087765A2 (de) 2000-05-18 2001-03-21 Mikromechanisches bauelement und entsprechendes herstellungsverfahren

Country Status (5)

Country Link
US (1) US7063796B2 (de)
EP (1) EP1296886B1 (de)
JP (1) JP4886147B2 (de)
DE (2) DE10024697B4 (de)
WO (1) WO2001087765A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10231729B4 (de) * 2002-07-13 2011-08-11 Robert Bosch GmbH, 70469 Bauelement mit einer oberflächenmikromechanischen Struktur
JP4337511B2 (ja) * 2003-02-12 2009-09-30 株式会社デンソー 静電アクチュエータおよびその製造方法
US7115436B2 (en) * 2004-02-12 2006-10-03 Robert Bosch Gmbh Integrated getter area for wafer level encapsulated microelectromechanical systems
DE102009047628B4 (de) 2009-12-08 2018-05-09 Robert Bosch Gmbh Bauelement mit einer mikromechanischen Struktur und Verfahren zu dessen Herstellung
DE102010001021B4 (de) * 2010-01-19 2019-05-09 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
DE102011006412B4 (de) 2011-03-30 2019-09-05 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches System und mikromechanisches System
US8673756B2 (en) * 2011-04-14 2014-03-18 Robert Bosch Gmbh Out-of-plane spacer defined electrode
DE102018200377A1 (de) * 2018-01-11 2019-07-11 Robert Bosch Gmbh Verfahren zum Herstellen einer mikromechanischen Schichtstruktur

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4332843A1 (de) * 1993-09-27 1995-04-20 Siemens Ag Mikromechanische Vorrichtung und Verfahren zu deren Herstellung
DE19537814A1 (de) * 1995-10-11 1997-04-17 Bosch Gmbh Robert Sensor und Verfahren zur Herstellung eines Sensors
DE10017422A1 (de) * 2000-04-07 2001-10-11 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungverfahren

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US534064A (en) * 1895-02-12 Wrench
US5427975A (en) * 1993-05-10 1995-06-27 Delco Electronics Corporation Method of micromachining an integrated sensor on the surface of a silicon wafer
JPH07241088A (ja) * 1993-12-10 1995-09-12 Mega Chips:Kk マイクロマシンの製造方法
DE19509868A1 (de) * 1995-03-17 1996-09-19 Siemens Ag Mikromechanisches Halbleiterbauelement
DE19700290A1 (de) * 1997-01-03 1998-07-16 Siemens Ag Mikromechanische Halbleiteranordnung und Verfahren zur Herstellung einer mikromechanischen Halbleiteranordnung
JP4168497B2 (ja) * 1998-10-13 2008-10-22 株式会社デンソー 半導体力学量センサの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4332843A1 (de) * 1993-09-27 1995-04-20 Siemens Ag Mikromechanische Vorrichtung und Verfahren zu deren Herstellung
DE19537814A1 (de) * 1995-10-11 1997-04-17 Bosch Gmbh Robert Sensor und Verfahren zur Herstellung eines Sensors
DE10017422A1 (de) * 2000-04-07 2001-10-11 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungverfahren

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KNIFFIN M L ET AL: "PACKAGING FOR SILICON MICROMACHINED ACCELEROMETERS", INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, INTERNATIONAL MICROELECTRONICS & PACKAGING SOCIETY, US, vol. 19, no. 1, 1996, pages 75 - 86, XP000639470, ISSN: 1063-1674 *

Also Published As

Publication number Publication date
DE50114390D1 (de) 2008-11-20
US7063796B2 (en) 2006-06-20
JP2003533360A (ja) 2003-11-11
EP1296886B1 (de) 2008-10-08
US20040050161A1 (en) 2004-03-18
JP4886147B2 (ja) 2012-02-29
DE10024697A1 (de) 2001-11-22
DE10024697B4 (de) 2008-08-21
EP1296886A2 (de) 2003-04-02
WO2001087765A2 (de) 2001-11-22

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