WO2001081171A1 - Etage de plaquette a supports magnetiques - Google Patents

Etage de plaquette a supports magnetiques Download PDF

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Publication number
WO2001081171A1
WO2001081171A1 PCT/US2000/010831 US0010831W WO0181171A1 WO 2001081171 A1 WO2001081171 A1 WO 2001081171A1 US 0010831 W US0010831 W US 0010831W WO 0181171 A1 WO0181171 A1 WO 0181171A1
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WO
WIPO (PCT)
Prior art keywords
stage
electromagnetic actuator
supporting
freedom
force
Prior art date
Application number
PCT/US2000/010831
Other languages
English (en)
Inventor
Andrew J. Hazelton
Akimitsu Ebihara
W. Thomas Novak
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to AU2000243673A priority Critical patent/AU2000243673A1/en
Priority to PCT/US2000/010831 priority patent/WO2001081171A1/fr
Publication of WO2001081171A1 publication Critical patent/WO2001081171A1/fr
Priority to US10/272,930 priority patent/US20030173833A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving

Definitions

  • This invention relates to alignment and isolation apparatus and methods for use particularly in microlithography, among other applications. More particularly, this invention is directed to an apparatus which efficiently, electromagnetically supports a stage for aligning a stage in a microlithography machine.
  • the bearings for a stage should have infinite stiffness in the directions for which position of the stage is to remain fixed, and zero stiffness along the directions in which the stage is to be moved, to maximize precision and efficiency.
  • Flexural bearings fall far short of the ideal and generally have a stiffness ratio (stiffness in directions to be fixed to stiffness in directions to be moved) of only about 100:1 and possibly up to about 1000:1 , but the price of the latter is likely prohibitive in practice. Moreover, a much greater stiffness ratio is desirable.
  • U.S. Patent 4,952,858 invented by Galburt describes a wafer fine stage that is supported and positioned in 6 DOF by electromagnetic voice coil motors.
  • the motion of the wafer fine stage is entirely constrained using voice coil motors, and this design does not utilize any flexural bearings.
  • Voice coil motors require relatively large amounts of power to generate a given amount of force.
  • the high power requirements of voice coil motors can generate sufficient heat to change the index of refraction of the environment sufficiently to induce error in an interferometer system. Additionally, heat generation can cause expansion of the stage leading to further errors in alignment and control.
  • U.S. Patent 4,952,858 discloses the use of permanent magnets to counterbalance the weight of the fine stage. This counterbalance force is a nonlinear function of stage position, and is thus quite difficult to control accurately.
  • the counterbalance forces in the Trumper patents may be provided by permanent magnets or by floating the stage in oil.
  • utilization of permanent magnets results in a nonlinear force curve and corresponding control problems.
  • floating the stage in oil oil presents significant problems for a clean room environment typically used for semiconductor processing.
  • U.S. Patent 5,528,118, invented by Lee describes a guideless stage for aligning a wafer in a microlithography system, and a reaction frame which isolates both external vibrations as well as vibrations caused by reaction forces from an object stage.
  • U.S. Patent 5,623,853 invented by Novak et al., describes a wafer coarse and fine stage for a lithography machine.
  • the coarse stage is a stacked arrangement of linear motor-driven air bearing slides.
  • the fine stage is driven in 3 DOF using voice coil motors.
  • the remaining DOF of the fine stage are constrained using flexural bearings.
  • DOF limits the servo bandwidth of the stage because the flexural bearings have a limited stiffness in the plane.
  • the finite stiffness of the flexural bearings out of the plane distorts the out of plane motion of the stage.
  • a stage device which has a main surface positionally controllable in at least one degree of freedom. At least one pair of electromagnetic actuator devices couples the stage to a supporting stage for controlling movement of the stage in at least one degree of freedom. Both actuating portions of each pair of electromagnetic actuator devices are mounted adjacent to a single side of the stage so as not to distort the stage during controlling movements thereof.
  • Both of the actuating portions of each pair are mounted on the supporting stage in close opposition to one another, and a pair of corresponding targets are mounted on the stage adjacent one another and within a predefined gap defined by the pair of mounted electromagnetic actuator devices.
  • the stage is magnetically coupled, born and positionally controlled in 3 DOF by three pairs of electromagnetic actuator devices which electromagnetically couple the stage to the support stage. Two of the pairs are preferably aligned substantially parallel to a first direction, and the third pair is aligned in a second direction substantially perpendicular to the first direction. The first and second directions are substantially within the plane of the main surface of the stage.
  • a pair of corresponding targets are peripherally mounted on the stage for interaction with each electromagnetic pair mounted on the supporting stage.
  • the pairs of electromagnetic actuator devices preferably comprise variable reluctance actuating portions which provide a very favorable force to surface area capability compared to other types of electromagnetic actuator devices, resulting in less heat generation.
  • the three pairs of electromagnetic actuator devices interconnecting the stage and the supporting stage are actuable to control the stage in 3 DOF.
  • the additional electromagnetic actuator devices are mounted between the stage and the supporting stage, which are actuable to control the stage in three additional DOF.
  • the additional electromagnetic actuator devices preferably comprise voice coil motors, since the requirements for control in the three additional degrees of freedom are less stringent than those required of the electromagnetic pairs.
  • the stage is levitated above the support stage by at least one non- contact vertical support member which is preferably three non-contact vertical support members for controlling the position of the stage in three vertical degrees of freedom.
  • the non-contact vertical support members are preferably electromagnetic actuator devices, most preferably voice coil motors.
  • supplemental vertical supports are preferably mounted between the stage and the supporting stage for supporting the dead weight of the stage.
  • the supplemental vertical supports preferably comprise air bellows, but may also be air cylinders or the like.
  • the targets are preferably mounted peripherally of the main surface of the stage, on target mounts which may be U-shaped, or the like, webs of material extending from the stage. Pairs of targets are mounted on each of the target mounts such that only a resultant force from actuation of the pair of corresponding electromagnetic actuator devices is transferred to the stage through each target mount.
  • the lithography system includes an illumination system mounted on a frame, a supporting stage mounted on the frame which is substantially aligned with the illumination system, a stage having a main surface positionally controllable in at least one DOF, and at least one pair of electromagnetic actuator devices coupling the stage to the supporting stage for control in at least one of the degrees of freedom. Both actuating portions of the pair of electromagnetic actuator devices are mounted adjacent a single side of the stage.
  • the lithography system further includes a mask pattern positioned between the illumination system and the stage, a reticle supporting the mask, and an optical system positioned between the reticle and the stage.
  • the stage is preferably positionally controllable in at least 3 DOF by three pairs of electromagnetic actuator devices.
  • Figure 1 is a schematic view illustrating a photolithographic instrument incorporating a wafer positioning stage in accordance with principles of the present invention.
  • Figure 2 is a perspective view of a stage system according to principles of the present invention.
  • Figure 3 is a perspective view of an upper portion of the stage system shown in Figure 2, emphasizing the finely controlled stage.
  • Figure 4 is another perspective view of the fine stage mounted on the coarse stage according to principles of the present invention.
  • Figure 5 is a top view of the fine stage mounted on the coarse stage.
  • Figure 6 is a perspective view of a lithography system according to principles of the present invention.
  • Figure 7 is a schematic describing the sensing and control functions of the present device.
  • Figure 8 is another schematic view illustrating a photolithographic instrument incorporating an additional embodiment of a wafer stage according to principles of the present invention.
  • Figure 9 is a flow chart that outlines a process for manufacturing a device in accordance with the present invention.
  • Figure 10 is a flow chart that outlines device processing in more detail.
  • FIG. 1 is a schematic view illustrating a photolithographic instrument 1000 incorporating a wafer positioning stage driven by a linear motor coil array or planar motor coil array in accordance with the principles of the present invention.
  • Photolithographic instrument 1000 generally comprises an illumination system 1002 and at least one linear or planar motor for wafer support and positioning.
  • Illumination system 1002 projects radiant energy (e.g. light) through a mask pattern (e.g., a circuit pattern for a semiconductor device) on a reticle (mask) 1006 that is supported by and scanned using a reticle stage (mask stage) 1010.
  • a mask pattern e.g., a circuit pattern for a semiconductor device
  • Reticle stage 1010 is supported by a frame 1032.
  • the radiant energy is focused through a projection optical system (lens system) 1004 supported on a frame 1026, which is in turn anchored to the ground through a support 1028.
  • Optical system 1004 is also connected to illumination system 1002 through frames 1026, 1030, 1032 and 1034.
  • the radiant energy exposes the mask pattern onto a layer of photoresist on a wafer 1008.
  • Wafer (object) 1008 is supported by and scanned using a fine wafer stage 1.
  • the fine stage 1 is limited in travel to about 400 microns total stroke in each of the X and Y directions.
  • the fine stage 1 is in turn supported by a lower stage (supporting stage) 18 (shown in Figs. 2-5).
  • the lower stage 18 has a much longer stroke and is used for coarse positioning.
  • the lower stage 18 is substantially aligned with the optical system 1004.
  • the lower stage translates in the Y direction along a beam 30, by pushing on a follower frame 60.
  • the follower frame 60 and the beam 30 move together in the X direction along X beam guide 54 and X follower guide 56.
  • the entire assembly is guided in the Z direction by a base 50.
  • the base 50 provides a smooth surface for the Z bearings, which are preferably air bearings, to ride upon.
  • the base 50 is preferably formed of granite or other very planar and very dimensionally stable material.
  • the Z bearings guide movements of the entire assembly to remain constant in the Z direction (X-Y plane).
  • the beam 30 runs through the center of the lower stage 18 ( Figure 3), and has a flat, smooth and preferably polished guide surface 31 that guides the lower stage as it moves in the Y direction.
  • Air bearings are preferred for guiding the lower stage 18 along the guide surface 31 to permit low friction movement of the lower stage 18 along the beam 30.
  • at least one air bearing is preferably attached to the inside of the lower stage 18 opposing the guide surface 31.
  • Z air bearings 38 are attached to the base of the lower stage 18 to guide the stage motion in the plane.
  • Electromagnetic motor coils 34 are provided at opposite ends of the beam 30.
  • X magnets 52 (figure 2) are provided to interact with motor coils 34 to provide the driving force for the beam 30 and the follower frame 60 in the X direction.
  • linear motors are preferred as shown by the motor coils and magnets, but other alternative drives could be employed, although not as preferred, such as screw drives, rotary motors or other planar force motors, such as those described in copending U.S. patent application serial no. 09/192,637, filed on November 16, 1998, and entitled "A Platform Positionable In At Least Three Degrees Of Freedom By Interaction With Coils," for example.
  • Application serial no. 09/192,637 is hereby incorporated by reference in its entirety by specific reference thereto. Examples of photolithographic instruments that may incorporate a linear or planar motor of the present invention are described in Nakasuji, U.S. Patent No. 5,773,837; Nishi, U.S. Patent No.
  • An X beam guide 54 and an X beam or follower guide 56 are aligned above respective X magnets 52, as shown in Figure 2.
  • a linear bearing 32 which is preferably a vacuum preloaded air bearing, is provided adjacent an X motor coil 34 ( Figure 3). Upon insertion of the X motor coils 34 into the slots provided in the X magnets therefor, the linear bearing 32 closely approximates the guide surface of X beam guide 54, where the guide surface is provided with a very smooth surface against which the air bearing rides for guidance of the beam 30 in the X direction.
  • the follower frame 60 is guided in the X direction via the attachment to the X follower guide 56 through X follower bearings 58, which are also preferably air bearings.
  • X follower bearings 58 which are also preferably air bearings.
  • Follower Z bearings 64 also preferably an air bearing, rides along the base 50 and supports the follower frame 60 in the Z direction.
  • the beam 30 is actuated in the X direction through X motor coils 34.
  • the lower stage 18 being mounted on the beam 30 follows the motion.
  • the beam 30 does not move in the Y direction.
  • the invention can also be configured with the beam 30 moving in the Y direction. When the construction has the beam 30 moving in the Y direction, there is a possibility that yawing will occur.
  • the output from the linear motors located at both ends of the beam 30 can be suitably distributed to correct for yawing.
  • Y motor coils 36 are provided on opposite sides of the lower stage 18
  • both the X magnets 52, as well as X beam guide 54 and X beam follower guide 56 are mounted to reaction force supports 66, which are mounted directly to ground and which do not contact the base 50. Therefore, when the X motor coils are actuated to provide a driving force in the X direction, the equal and opposite force that is generated is applied against the reaction force supports 66 and transferred to ground without disturbing the base 50. Likewise, when the Y motor coils 36 are actuated to push on the Y magnet tracks 62, the equal and opposite reaction forces generated thereby are applied against the reaction force supports 66 and transferred to ground, without disturbing the base 50.
  • the fine stage 1 is mounted to the lower stage 18 for small and precise movements in the X, Y and Theta Z (i.e. rotation in the X-Y plane) directions, as shown in Figures 4 and 5.
  • the fine stage 1 includes a wafer chuck 2 (holding portion) on which a wafer can be mounted for precise positioning.
  • Mirrors 4 are mounted on the fine stage 1 and aligned with the X and Y axes.
  • the mirrors 4 provide reflective reference surfaces off of which laser light is reflected to determine a precise X-Y position of the fine stage 1 using a laser interferometer system as a position detection device.
  • the position of the fine stage 1 in three planar degrees of freedom, X, Y and Theta Z, is actuated using three pairs of electromagnets (actuating portions) 6 that are mounted to the lower stage 18.
  • the electromagnets 6 are preferably formed as E-shaped laminated cores made of silicon steel or preferably Ni-Fe steel, that each have an electrical wire winding around the center section.
  • Electromagnetic targets (relative moving portions) 8 preferably in the form of an l-shaped piece of magnetic material, and preferably made up of the same material or materials used to make the corresponding E-shaped laminated cores, are placed oppositely each of the electromagnets 6, respectively.
  • Each electromagnet 6 and target 8 is separated by an air gap g (which is very small and therefore difficult to see in the figures).
  • the electromagnets 6 are variable reluctance actuating portions and the reluctance varies with the distance defined by the gap g, which, of course also varies the flux and force applied to the target 8.
  • K an electromagnetic constant which is dependent upon the geometries of the E-shaped electromagnet 6, l-shaped target 8 and number of coil turns about the magnet.
  • the electromagnet 6 When the coil of an electromagnet is energized, the electromagnet 6 generates a flux which produces an attractive force on the target 8 in accordance with the formula given above, thereby functioning as a linear actuating portion. Because the electromagnets 6 can only attract the targets 8, they must be assembled in pairs that can pull in opposition.
  • the targets 8 are fixed to the fine stage 1 which is movable relative to the lower stage 18. Opposing pairs of electromagnets 6 are fixed on the relatively non-moveable (with respect to controlling movements of the fine stage 1 ) lower stage 18 on opposite sides of the targets 8.
  • a differential force can be produced to draw the targets in one direction or its opposing direction.
  • the electromagnets' targets 8 are attached to the fine stage 1 in such a way that the pulling forces of the opposing pair of electromagnets 6 do not distort the fine stage 1. This is preferably accomplished by mounting the targets 8 for an opposing pair of electromagnets 6 very close to one another, preferably peripherally of the fine stage 1. Most preferred is to extend a thin web 9 of material (Figure 5), which is preferably made of the same material that the fine stage 1 is made of, preferably ceramic, such as silicon carbide or alumina, for example, from the periphery of the fine stage 1 , onto which the targets 8 are mounted.
  • the opposing electromagnets 6 are mounted on the lower stage 18 by a predetermined distance so that when the web 9 and targets 8 are positioned therebetween, a predetermined gap g is formed between each set of electromagnet 6 and target 8.
  • a predetermined gap g is formed between each set of electromagnet 6 and target 8.
  • each pair of electromagnetic actuator devices is comprised of two actuating portions (electromagnets 6) and two moving portions (targets 8).
  • the present invention is not restricted to this configuration.
  • the invention can use a combination of two actuating portions (electromagnets) and one moving portion (target).
  • the web 9 is provided with only one moving portion (target 8), and the moving portion (target 8) is interposed between two actuating portions
  • FIG. 5 shows a preferred arrangement of the electromagnets 6 and targets 8 in which one opposing pair is mounted so that the attractive forces produced thereby are substantially parallel with the X direction of the stage. Two opposing pairs are mounted so that attractive forces from each pair are produced substantially parallel with the Y direction of the stage. With this arrangement, control of three DOF of the fine stage 1 can be accomplished, namely fine movements in the X, Y and Theta Z directions.
  • two opposing pairs could be mounted parallel with the X direction and one pair parallel with the Y direction, to work equally as well as the shown preferred arrangement. Other arrangements are also possible, but the preferred arrangement minimizes the number of actuating portions/bearings required for the necessary degrees of control.
  • the lines of force of the actuating portions are arranged to act through the center of gravity (CG) of the fine stage 1.
  • the two Y actuating portions are typically equidistant from the CG.
  • Actuation of the single pair of electromagnets 6 can achieve fine movements in either X direction. Actuation of the two pairs of electromagnets aligned along the Y axis can control fine movements of the fine stage 1 in either Y direction, or in rotation (clockwise or counterclockwise) in the X-Y plane (i.e., Theta Z control). Y axis movements are accomplished by resultant forces from both pairs which are substantially equal and in the same direction. Theta Z movements are generally accomplished by producing opposite directional forces from the two pairs of electromagnets, although unequal forces in the same direction will also cause some Theta Z adjustment.
  • Three short range sensors 10 measure the distance between the fine stage 1 and the lower stage 18 in the three planar degrees of freedom.
  • the fine stage 1 is also levitated in the three vertical degrees of freedom, Z, Theta X and Theta Y.
  • control in the three vertical degrees of freedom requires less dynamic performance (e.g., acceleration requirements are relatively low) and is easier to accomplish, lower force requirements exist than in the previously described X, Y and Theta Z degrees of freedom.
  • the use of three VCM (voice coil motor) magnets 12 attached to the lower stage 18 and three VCM coils 14 attached to the fine stage 1 are satisfactory for the vertical levitation.
  • the relative position in the three vertical degrees of freedom is measured using three linear sensors 16.
  • the dead weight of the fine stage 1 is supported by air bellows 20.
  • air bellows 20 Preferably, three air bellows are employed and respectively located next to the VCMs.
  • the bellows 20 have very low stiffness in all degrees of freedom so they do not significantly interfere with the control of the fine stage 1.
  • the base 50 is rigidly attached to the body 1024.
  • the complete body assembly is isolated from the ground by vibration isolators 90. Isolation mounts that are typically used are the "Electro-Damp Active Vibration Control System," available from Newport Corporation of Irvine, California.
  • the planar position of the fine stage 1 , relative to the lens 1004, is measured using interferometers 88 which reflects laser light from interferometer mirrors 4, as alluded to above.
  • the vertical position of the stage is measured using a focus and level sensor (not shown) which reflects light from the wafer surface.
  • FIG. 7 is a schematic which describes the sensing and control functions of the present device.
  • the sensing and control functions are more thoroughly described in copending U.S. patent application Serial Numbers 09/022,713 filed February 12, 1998, 09/139,954 filed August 25, 1998, and 09/141,762 filed August 27, 1998, each of which is hereby incorporated by reference thereto, in their entireties.
  • a trajectory 100, or desired path for the focused optical system to follow is determined based on the desired path of the wafer or other object to which the focused optical system is to be applied.
  • the trajectory 100 is next fed into the control system.
  • the trajectory 100 is compared with a sensor signal vector S which is generated from the output of interferometer 88 and focus and level sensor.
  • the vector for vertical motion is fed to the CG to VCM transformation 106. This transforms the CG signal to a value of force to be generated by the VCMs, which is then fed to the VCM gain 110, and output to the stage hardware 114.
  • the vector for planar motion is fed to the CG to El-core transformation 108. This transforms the CG signal to a force to be generated by the El-core force (i.e., electromagnet and target arrangements 6, 8). Because the El-core force depends upon the gap squared, it is compensated by the short range sensor vector g' through the compensation block 112, to produce a linear output to the stage hardware 114.
  • the stage hardware 114 responds to the input and is measured in the sensor frame S.
  • FIG. 8 is a schematic view illustrating an additional embodiment of an exposure apparatus 800 useful with the present invention.
  • a motor 850 (for coarse positioning) for driving the fine wafer stage 1 includes a support plate and a coil array (not separately shown).
  • the support plate portion of the motor 850 is supported by a base 858 coupled to the ground by damping means 860, such as air or oil dampers, voice coil motors , actuating portions, or other known vibration isolation systems.
  • the coil array portion of the motor 850 is separately and rigidly coupled to the ground by reaction force supports 66 previously described hereinabove.
  • An illumination system 814, reticle stage 818 and projection optics 824 are respectively supported by an illumination system frame 838, reticle stage frame 840 and projection optics frame 842 which may also be coupled to the ground by similar damping means 860.
  • the damping means 860 to couple the base 858 and the illumination system frame 838, the reticle stage frame 840 and the projection optics frame 842 to the ground, any vibration that may be induced by the reaction forces through the ground is isolated from the rest of the exposure apparatus 800.
  • the reaction force supports 66 may include at least one actuator system that generates a force to cancel the reaction force created between the coil array and the magnet array. By providing the actuator system, the vibration transferred to the ground is decreased.
  • the actuator system may be an actuator which can generate a force in six degrees of freedom (6-DOF).
  • Additional features of the exposure apparatus 800 shown in Fig. 8 include interferometers (position detection devices) 871 and 872 supported by the projection optics frame 842.
  • a first interferometer 871 detects the position of the fine stage 1 and outputs the information of the position of the fine stage to a main controller (not shown).
  • a second interferometer 872 detects the position of the reticle stage 818 and outputs the information of the position of the reticle stage 818 to the main controller.
  • the main controller drives the wafer fine stage 1 for coarse and /or fine positioning via a wafer drive controller based on the information outputted from the first interferometer 871. Further, the main controller drives the reticle stage 818 via a reticle drive controller based on the information ouputted from the second interferometer 872.
  • position information of the fine stage 1 and the reticle stage 818 are unaffected by vibration in the fine stage 1 and the reticle stage 818, since the interferometers 871 and 872 are isolated with respect to the stages.
  • reaction forces generated by movement of the reticle stage 1010 can be mechanically released to the ground (floor) by using a support frame member such as the reaction force support frame 66 previously described.
  • the support frame member is isolated from the frames 1026, 1030, 1032 and 1034, the illumination system 1002, the optical system 1004, the body 1024 and the wafer fine stage 1.
  • the stator (coil member or magnet member) of the motor of the reticle stage 1010 is fixed to the frame support member.
  • the actuating portions (electromagnets) of the electromagnetic actuating devices are mounted on the supporting stage and the relative moving portions (targets) of the electromagnetic actuating devices are mounted on the stage (fine stage).
  • the actuating portions (electromagnets) could be mounted on the stage (fine stage), and the relative moving portions (targets) could be mounted on the supporting stage.
  • the exposure apparatus can be used as scanning type exposure device that provides synchronized movement of the mask (reticle) and wafer for exposure of the mask pattern.
  • scanning can be conducted in either the X direction or the Y direction.
  • the scanning type exposure device can be, for example, that disclosed in U.S. Patent No. 5,473,410. As far as is permitted, the disclosure of U.S. Patent No. 5,473,410 is incorporated herein by reference.
  • the exposure apparatus can be a step-and-repeat type exposure device that exposes the mask (reticle) while the reticle and the wafer are stationary.
  • the wafer is in a constant position relative to the reticle and the lens assembly during the exposure of an individual field.
  • the wafer is consecutively moved by the wafer stage perpendicular to the optical axis of the lens assembly so that the next field of the wafer is brought into position relative to the lens assembly and the reticle for exposure.
  • the images on the reticle are sequentially exposed onto the fields of the wafer so that the next field of the wafer is brought into position relative to the lens assembly and the reticle.
  • the use of the exposure apparatus provided herein is not limited to a photolithography system for semiconductor manufacturing.
  • the exposure apparatus for example, can be used as an LCD photolithography system that exposes a liquid crystal display device pattern onto a rectangular glass plate or a photolithography system for manufacturing a thin film magnetic head.
  • the present invention can also be applied to a proximity photolithography system that exposes a mask pattern by closely locating a mask and a substrate without the use of a lens assembly.
  • the present invention provided herein can be used in other devices, including other semiconductor processing equipment, elevators, electric razors, machine tools, metal cutting machines, inspection machines and disk drives.
  • the illumination source of the illumination system 1002 or 814 can be g- line (436 nm), Mine (365 nm), KrF excimer laser (248 nm), ArF excimer laser
  • the illumination source can also use charged particle beams such as x-ray and electron beam.
  • charged particle beams such as x-ray and electron beam.
  • thermionic emission type lanthanum hexaboride (LaB 6 ) or tantalum (Ta) can be used as an electron gun.
  • the structure could be such that either a mask is used or a pattern can be directly formed on a substrate without the use of a mask.
  • magnification of the lens assembly of the lens system 1004 or the projection optics 824 included in the photolithography system the lens assembly need not be limited to a reduction system. It could also be a 1x or magnification system.
  • the lens assembly when far ultra-violet rays such as the excimer laser is used, glass materials such as quartz and fluorite that transmit far ultra-violet rays is preferable to be used.
  • the lens assembly should preferably be either catadioptric or refractive (a reticle should also preferably be a reflective type), and when an electron beam is used, electron optics should preferably consist of electron lenses and deflectors. The optical path for the electron beams should be in a vacuum.
  • the catadioptric type optical system can be considered.
  • the catadioptric type of optical system include the disclosure Japan Patent Application Disclosure No.8-171054 published in the Official Gazette for Laid-Open Patent Applications and its counterpart U.S. Patent No, 5,668,672, as well as Japan Patent Application Disclosure No.10-20195 and its counterpart U.S. Patent No. 5,835,275.
  • the reflecting optical device can be a catadioptric optical system incorporating a beam splitter and concave mirror.
  • Japan Patent Application Disclosure No.8-334695 published in the Official Gazette for Laid-Open Patent Applications and its counterpart U.S.
  • Patent No. 5,689,377 as well as Japan Patent Application Disclosure No.10-3039 and its counterpart U.S. Patent Application No. 873,605 (Application Date: 6-12- 97) also use a reflecting-refracting type of optical system incorporating a concave mirror, etc., but without a beam splitter, and can also be employed with this invention.
  • the disclosures in the above-mentioned U.S. patents, as well as the Japan patent applications published in the Official Gazette for Laid-Open Patent Applications are incorporated herein by reference.
  • linear motors see US Patent Numbers 5,623,853 or 5,528,118
  • the linear motors can be either an air levitation type employing air bearings or a magnetic levitation type using Lorentz force or reactance force.
  • the stage could move along a guide, or it could be a guideless type stage which uses no guide.
  • US Patent Numbers 5,623,853 and 5,528,118 are incorporated herein by reference.
  • Reaction forces generated by the reticle (mask) stage motion can be mechanically released to the floor (ground) by use of a frame member as described in US Patent 5,874,820 and published Japanese Patent Application Disclosure No. 8-330224. As far as is permitted, the disclosures in US Patent Numbers 5,874,820 and Japanese Patent Application Disclosure No. 8-330224 are incorporated herein by reference.
  • a photolithography system according to the above described embodiments can be built by assembling various subsystems, including each element listed in the appended claims, in such a manner that prescribed mechanical accuracy, electrical accuracy and optical accuracy are maintained. In order to maintain the various accuracies, prior to and following assembly, every optical system is adjusted to achieve its optical accuracy.
  • Every mechanical system and every electrical system are adjusted to achieve their respective mechanical and electrical accuracies.
  • the process of assembling each subsystem into a photolithography system includes mechanical interfaces, electrical circuit wiring connections and air pressure plumbing connections between each subsystem. Needless to say, there is also a process where each subsystem is assembled prior to assembling a photolithography system from the various subsystems. Once a photolithography system is assembled using the various subsystems, total adjustment is performed to make sure that every accuracy is maintained in the complete photolithography system. Additionally, it is desirable to manufacture an exposure system in a clean room where the temperature and cleanliness are controlled.
  • step 301 the device's function and performance characteristics are designed.
  • step 302 a mask (reticle) having a pattern is designed according to the previous designing step, and in a parallel step 303 a wafer is made from a silicon material.
  • the mask pattern designed in step 302 is exposed onto the wafer from step 303 in step 304 by a photolithography system described hereinabove in accordance with the present invention.
  • step 305 the semiconductor device is assembled (including the dicing process, bonding process and packaging process), then finally the device is inspected in step 306.
  • FIG 10 illustrates a detailed flowchart example of the above-mentioned step 304 in the case of fabricating semiconductor devices.
  • step 311 oxidation step
  • step 312 CVD step
  • step 313 electrode formation step
  • step 314 ion implantation step
  • steps 311 - 314 form the preprocessing steps for wafers during wafer processing, and selection is made at each step according to processing requirements. At each stage of wafer processing, when the above-mentioned preprocessing steps have been completed, the following post-processing steps are implemented.
  • step 315 photoresist formation step
  • step 316 exposure step
  • step 317 developing step
  • step 318 etching step
  • circuit patterns are formed by repetition of these preprocessing and post-processing steps.

Abstract

L'invention concerne un étage de haute précision supporté par des supports électromagnétiques à six degrés de liberté. Les mouvements de l'étage sur le plan horizontal sont supportés par des actionneurs à réluctance variable qui sont montés entre l'étage de haute précision et un étage brut, de façon à ne pas déformer l'étage de haute précision lors de ses mouvements. L'étage de haute précision est supporté en six degrés verticaux de liberté par des dispositifs électromagnétiques d'actionnement qui sont, de préférence, des moteurs à bobine mobile placés entre l'étage brut et l'étage de haute précision. Des supports à poids mort sont prévus entre les deux étages afin de supporter verticalement le poids mort de l'étage de haute précision. Ces supports sont de préférence des soufflets à air.
PCT/US2000/010831 2000-04-21 2000-04-21 Etage de plaquette a supports magnetiques WO2001081171A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2000243673A AU2000243673A1 (en) 2000-04-21 2000-04-21 Wafer stage with magnetic bearings
PCT/US2000/010831 WO2001081171A1 (fr) 2000-04-21 2000-04-21 Etage de plaquette a supports magnetiques
US10/272,930 US20030173833A1 (en) 2000-04-21 2002-10-18 Wafer stage with magnetic bearings

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2000/010831 WO2001081171A1 (fr) 2000-04-21 2000-04-21 Etage de plaquette a supports magnetiques

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/272,930 Continuation-In-Part US20030173833A1 (en) 2000-04-21 2002-10-18 Wafer stage with magnetic bearings

Publications (1)

Publication Number Publication Date
WO2001081171A1 true WO2001081171A1 (fr) 2001-11-01

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Family Applications (1)

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PCT/US2000/010831 WO2001081171A1 (fr) 2000-04-21 2000-04-21 Etage de plaquette a supports magnetiques

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AU (1) AU2000243673A1 (fr)
WO (1) WO2001081171A1 (fr)

Cited By (4)

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Publication number Priority date Publication date Assignee Title
EP1418017A2 (fr) * 2002-08-29 2004-05-12 Canon Kabushiki Kaisha Dispositif de positionnement, appareil d'exposition par faisceau de particules chargés et procédé de fabrication d'un dispositif semiconducteur
US6870600B2 (en) 2003-01-13 2005-03-22 Nikon Corporation Vibration-attenuation devices and methods using pressurized bellows exhibiting substantially zero lateral stiffness
US6906334B2 (en) 2000-12-19 2005-06-14 Nikon Corporation Curved I-core
USRE41232E1 (en) 2000-04-24 2010-04-20 Nikon Corporation Wafer positioner with planar motor and mag-lev fine stage

Citations (4)

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Publication number Priority date Publication date Assignee Title
US4017001A (en) * 1975-01-10 1977-04-12 Maurice Barthalon Electromagnetic system for propulsion and programmed positioning
US5780943A (en) * 1996-04-04 1998-07-14 Nikon Corporation Exposure apparatus and method
US5991005A (en) * 1996-04-11 1999-11-23 Nikon Corporation Stage apparatus and exposure apparatus having the same
US6036162A (en) * 1996-09-10 2000-03-14 Nikon Corporation Vibration isolator and method of isolating vibration

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4017001A (en) * 1975-01-10 1977-04-12 Maurice Barthalon Electromagnetic system for propulsion and programmed positioning
US5780943A (en) * 1996-04-04 1998-07-14 Nikon Corporation Exposure apparatus and method
US5991005A (en) * 1996-04-11 1999-11-23 Nikon Corporation Stage apparatus and exposure apparatus having the same
US6036162A (en) * 1996-09-10 2000-03-14 Nikon Corporation Vibration isolator and method of isolating vibration

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE41232E1 (en) 2000-04-24 2010-04-20 Nikon Corporation Wafer positioner with planar motor and mag-lev fine stage
US6906334B2 (en) 2000-12-19 2005-06-14 Nikon Corporation Curved I-core
SG112819A1 (en) * 2000-12-19 2005-07-28 Nikon Corp Curved i-core
EP1418017A2 (fr) * 2002-08-29 2004-05-12 Canon Kabushiki Kaisha Dispositif de positionnement, appareil d'exposition par faisceau de particules chargés et procédé de fabrication d'un dispositif semiconducteur
US6870600B2 (en) 2003-01-13 2005-03-22 Nikon Corporation Vibration-attenuation devices and methods using pressurized bellows exhibiting substantially zero lateral stiffness

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