WO2001078108A3 - Wafer chuck having piezoelectric elements and method - Google Patents

Wafer chuck having piezoelectric elements and method Download PDF

Info

Publication number
WO2001078108A3
WO2001078108A3 PCT/IB2001/000587 IB0100587W WO0178108A3 WO 2001078108 A3 WO2001078108 A3 WO 2001078108A3 IB 0100587 W IB0100587 W IB 0100587W WO 0178108 A3 WO0178108 A3 WO 0178108A3
Authority
WO
WIPO (PCT)
Prior art keywords
piezoelectric elements
pins
backside
wafer chuck
chuck
Prior art date
Application number
PCT/IB2001/000587
Other languages
French (fr)
Other versions
WO2001078108A2 (en
Inventor
Karl Mautz
John George Maltabes
Alain Bernard Charles
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/546,203 external-priority patent/US6313567B1/en
Priority claimed from US09/606,996 external-priority patent/US6650135B1/en
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of WO2001078108A2 publication Critical patent/WO2001078108A2/en
Publication of WO2001078108A3 publication Critical patent/WO2001078108A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight

Abstract

A process chuck (100) for lithography, metrology or probing holds a flat object (150), such as a semiconductor wafer (150) at the backside (152). The chuck has, supported on a base plate (105), a plurality of pins (110-n) to receive partial forces (Fn) from the backside (152) and a plurality of piezoelectric elements (120-n) attached to the pins to sense the partial forces (Fn) applied from the object (150) to the pins (110-n). The piezoelectric elements (120-n) apply partial displacements (Bn) of the pins (110-n) to act on selected areas of the object (150) and thereby compensate for irregularities in the backside contour.
PCT/IB2001/000587 2000-04-10 2001-04-10 Wafer chuck having piezoelectric elements and method WO2001078108A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/546,203 2000-04-10
US09/546,203 US6313567B1 (en) 2000-04-10 2000-04-10 Lithography chuck having piezoelectric elements, and method
US09/606,996 2000-06-29
US09/606,996 US6650135B1 (en) 2000-06-29 2000-06-29 Measurement chuck having piezoelectric elements and method

Publications (2)

Publication Number Publication Date
WO2001078108A2 WO2001078108A2 (en) 2001-10-18
WO2001078108A3 true WO2001078108A3 (en) 2002-04-04

Family

ID=27068152

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2001/000587 WO2001078108A2 (en) 2000-04-10 2001-04-10 Wafer chuck having piezoelectric elements and method

Country Status (1)

Country Link
WO (1) WO2001078108A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1953812A1 (en) * 2007-01-31 2008-08-06 PROFACTOR Produktionsforschungs GmbH Substrate support
KR101866622B1 (en) * 2010-12-20 2018-06-11 에베 그룹 에. 탈너 게엠베하 Receiving means for mounting of wafers

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506184A (en) * 1984-01-10 1985-03-19 Varian Associates, Inc. Deformable chuck driven by piezoelectric means
US4666291A (en) * 1985-04-17 1987-05-19 Hitachi, Ltd. Light-exposure apparatus
US5094536A (en) * 1990-11-05 1992-03-10 Litel Instruments Deformable wafer chuck
JPH05129421A (en) * 1991-11-07 1993-05-25 Fujitsu Ltd Electrostatic chuck
US5996415A (en) * 1997-04-30 1999-12-07 Sensys Instruments Corporation Apparatus and method for characterizing semiconductor wafers during processing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506184A (en) * 1984-01-10 1985-03-19 Varian Associates, Inc. Deformable chuck driven by piezoelectric means
US4666291A (en) * 1985-04-17 1987-05-19 Hitachi, Ltd. Light-exposure apparatus
US5094536A (en) * 1990-11-05 1992-03-10 Litel Instruments Deformable wafer chuck
JPH05129421A (en) * 1991-11-07 1993-05-25 Fujitsu Ltd Electrostatic chuck
US5996415A (en) * 1997-04-30 1999-12-07 Sensys Instruments Corporation Apparatus and method for characterizing semiconductor wafers during processing

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 504 (E - 1430) 10 September 1993 (1993-09-10) *

Also Published As

Publication number Publication date
WO2001078108A2 (en) 2001-10-18

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