WO2001065482A1 - Method for fixing a module to a smart card body - Google Patents

Method for fixing a module to a smart card body Download PDF

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Publication number
WO2001065482A1
WO2001065482A1 PCT/FR2001/000556 FR0100556W WO0165482A1 WO 2001065482 A1 WO2001065482 A1 WO 2001065482A1 FR 0100556 W FR0100556 W FR 0100556W WO 0165482 A1 WO0165482 A1 WO 0165482A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
card body
resin
integrated circuit
injection
Prior art date
Application number
PCT/FR2001/000556
Other languages
French (fr)
Inventor
Jean-Noël AUDOUX
Original Assignee
Schlumberger Systemes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Systemes filed Critical Schlumberger Systemes
Publication of WO2001065482A1 publication Critical patent/WO2001065482A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Definitions

  • the present invention relates to a method of fixing a module to a card body.
  • This method can for example be used for the manufacture of integrated circuit cards such as bank or telephone cards.
  • a module generally comprises an integrated circuit mounted on a support provided with conductive pads to which the integrated circuit is connected by conductors.
  • the integrated circuit is encapsulated in a resin block ensuring mechanical protection of the integrated circuit and of the conductors connecting it to the conductive pads.
  • the card body in which the module is intended to be installed includes a cavity arranged to receive the integrated circuit encapsulated in the resin block.
  • the module is commonly fixed to the card body by gluing a peripheral surface of the support on the periphery of the cavity of the card body.
  • This bonding mode ensures effective fixing of the module on the card body but does not allow the resin block to be joined to the card body and in particular the bottom of the cavity. There is therefore a risk of accidental takeoff of the module when the card is subjected to bending.
  • An object of the invention is to propose a new means of fixing by gluing a module in a card body ensuring better fixing.
  • a method of fixing a module to a card body comprising the steps of:
  • the resin injected into the cavity can be chosen to ensure, in addition to the bonding of the module to the card body, mechanical protection of the integrated circuit and of the connection of the latter to the conductive pads as well as the tightness of the fixing. so that it is not necessary to encapsulate the integrated circuit before mounting the module on the card body.
  • the injection makes it possible in a simple manner to completely fill the free volume in the cavity.
  • - Figure 1 is a partial top view of an integrated circuit card produced according to a method according to a first embodiment of the invention
  • - Figure 2 is a partial view in cross section of a card with an integrated circuit in progress by means of the method according to the first embodiment
  • FIG. 3 is a view similar to Figure 2 of an integrated circuit card during manufacture at means of a method in accordance with a second embodiment of the invention
  • FIG. 4 is a cross-sectional view of a variant of a module more particularly suitable for being fixed using a method according to the first embodiment.
  • the method according to the invention is intended for fixing a module generally designated in 1 to a card body 2 which comprises a cavity 7 opening onto one face of the card body 2 by a counterbore 8.
  • the module comprises an integrated circuit 3 mounted on a support here comprising a sheet 4 of thermoplastic material and a metal sheet which is fixed on the sheet 4 and defines conductive areas 5 to which the integrated circuit 3 is connected by conductors 6 extending through holes made in the sheet 4.
  • the integrated circuit 3 is here mounted on the metal sheet defining the conductive areas 5 but can also be fixed directly on the sheet 4.
  • Two orifices 9 and an orifice 10 are formed between the conductive pads 5 in the sheet 4.
  • This method is a bonding method using a two-component resin 17 of known type.
  • the resin used here is an epoxy resin which has a viscosity of the order of a few hundred centipoises and polymerizes in a few hours at a temperature between -20 and 60 ° C.
  • This process is carried out by means of a tool generally designated at 11, comprising a plate 12 crossed by an injection cannula 13, a needle injection 14 and two exhaust channels 15 (only one of which is visible in FIG. 2).
  • the injection cannula 13 and the injection needle 14 are each connected to a circuit for supplying one of the components of the resin.
  • the method according to the first embodiment begins with the step of mounting the module 1 on the card body 2 so that the sheet 4 rests on the bottom of the counterbore 8 and the integrated circuit 3 is received in the cavity 7 and leaves a free volume 16 therein.
  • the plate 12 is then applied against the surface of the card body 2 in which the cavity 7 is formed and against the conductive pads 5.
  • the injection cannula 13 is then received in the orifice 10, the exhaust channels 15 extend opposite the orifices 9 and the injection needle 14 perforates the sheet 4 between the conductive pads 5.
  • the cannula d injection 13, the injection needle 14 and the exhaust channels 15 thus open into the free volume 16.
  • the resin components 17 are injected into the free volume 16 by means of the injection cannula 13 and the injection needle 14.
  • the orifices 9 and the exhaust channels 15 allow the air which was trapped in the cavity 7 during assembly of the module 1 to escape as the free volume 16 fills with the components of the resin 17.
  • the resin 17 begins to polymerize and harden.
  • the application of the plate 12 against the module 1 during the injection of the components of the resin 17 and the polymerization of the latter makes it possible to prevent the module 1 from rising under the injection pressure or due to the stresses related to hardening of the resin.
  • the plate 12 is detached from the conductive pads 5 of module 1.
  • the hardening of the resin 17 allows the module 1 to be fixed to the card body 2.
  • the resin 17 also provides mechanical protection for the integrated circuit 3 and the conductors 6.
  • the integrated circuit 3 and the conductors 6 are encapsulated in a block of resin 18 before mounting of the module 1.
  • the orifices 9 and 10 are then positioned so that once the module 1 is mounted on the card body 2, the orifices 9, 10 extend opposite the free volume 16 which extends between the walls of the cavity 7 and the resin block 18.
  • the free volume 16 thus corresponds substantially to the clearance reserved to facilitate mounting of the module 1 on the card body 2.
  • the injection needle 14 is positioned so that the perforation of the sheet 4 is produced between the wall of the cavity 7 and the resin block 18. This also makes it possible to limit the risk of degradation of the resin block 18 and of the conductors 6.
  • a layer of adhesive 25 is interposed between the bottom of the counterbore 8 and the sheet 4 prior to mounting of the module 1 on the card body 2. It is thus ensured that the module is held in position on the body of card 2 prior to injection.
  • the module 1 fixing resin is injected as previously described.
  • the resin injected then essentially secures the module 1 to the card body 2.
  • the module 1 comprises a metal grid generally designated at 19 comprising a central part 20 forming the support of the integrated circuit 3 and a peripheral part 21 partially embedded in a block of thermoplastic material 22 (for example polycarbonate) which leaves exposed surfaces 23 of the grid to form the conductive pads.
  • a metal grid generally designated at 19 comprising a central part 20 forming the support of the integrated circuit 3 and a peripheral part 21 partially embedded in a block of thermoplastic material 22 (for example polycarbonate) which leaves exposed surfaces 23 of the grid to form the conductive pads.
  • the module comprises channels 24 (only one of which is visible here) produced in the block of thermoplastic material 22 near the central part 20. These channels 24 are arranged opposite one another and form for the 'one a resin injection channel and for the other an air exhaust channel during the injection.
  • the resin injection is carried out as previously.
  • the tool 11 may also include two injection needles of the type of those referenced in 14
  • the tool 11 may also comprise only an injection element and an exhaust element preferably arranged opposite each other.
  • a hot-polymerizable resin can be used for filling the free volume 16 in place of the two-component resin. Once such a resin has been injected into the cavity, heating is carried out to polymerize the resin.

Abstract

The invention concerns a method for fixing a module (1) to a card body (2), the module comprising an integrated circuit (3) mounted on a support (4) provided with conductive pads (5) and the card body comprising a cavity (7) for receiving the integrated circuit. Said method comprises the following steps: mounting the module on the card body such that the integrated circuit is housed in the cavity and leaves a free volume (16) therein; injecting a resin (17) into the free volume; polymerising the resin.

Description

PROCEDE DE FIXATION D ' UN MODULE A UN CORPS DE CARTE A PUCE METHOD FOR ATTACHING A MODULE TO A CHIP CARD BODY
La présente invention concerne un procédé de fixation d'un module à un corps de carte. Ce procédé est par exemple utilisable pour la fabrication de cartes à circuit intégré telles que des cartes bancaires ou téléphoniques .The present invention relates to a method of fixing a module to a card body. This method can for example be used for the manufacture of integrated circuit cards such as bank or telephone cards.
Un module comprend généralement un circuit intégré monté sur un support pourvu de plages conductrices auxquelles le circuit intégré est relié par des conducteurs. Le circuit intégré est encapsulé dans un bloc de résine assurant une protection mécanique du circuit intégré et des conducteurs le reliant aux plages conductrices . Le corps de carte dans lequel le module est destiné à être implanté comprend une cavité agencée pour recevoir le circuit intégré encapsulé dans le bloc de résine.A module generally comprises an integrated circuit mounted on a support provided with conductive pads to which the integrated circuit is connected by conductors. The integrated circuit is encapsulated in a resin block ensuring mechanical protection of the integrated circuit and of the conductors connecting it to the conductive pads. The card body in which the module is intended to be installed includes a cavity arranged to receive the integrated circuit encapsulated in the resin block.
Le module est couramment fixé au corps de carte par collage d'une surface périphérique du support sur le pourtour de la cavité du corps de carte. Ce mode de collage assure une fixation efficace du module sur le corps de carte mais ne permet pas de solidariser le bloc de résine avec le corps de carte et notamment le fond de la cavité. Il existe donc un risque de décollage accidentel du module lorsque la carte est soumise à des flexions .The module is commonly fixed to the card body by gluing a peripheral surface of the support on the periphery of the cavity of the card body. This bonding mode ensures effective fixing of the module on the card body but does not allow the resin block to be joined to the card body and in particular the bottom of the cavity. There is therefore a risk of accidental takeoff of the module when the card is subjected to bending.
Pour résoudre ce problème, on a envisagé de déposer dans la cavité une goutte de résine préalablement au montage du module sur le corps de carte. Cependant, il est difficile d'obtenir une goutte ayant un volume précis correspondant exactement au volume à remplir, ce qui engendre des défauts .To solve this problem, it has been envisaged to deposit a drop of resin in the cavity before mounting the module on the card body. However, it is difficult to obtain a drop having a precise volume corresponding exactly to the volume to be filled, which gives rise to defects.
Un but de 1 ' invention est de proposer un nouveau moyen de fixation par collage d'un module dans un corps de carte assurant une meilleure fixation.An object of the invention is to propose a new means of fixing by gluing a module in a card body ensuring better fixing.
En vue de la réalisation de ce but, on prévoit, selon l'invention, un procédé de fixation d'un module à un corps de carte, le module comprenant un circuit intégré monté sur un support pourvu de plages conductrices et le corps de carte comportant une cavité pour recevoir le circuit intégré, le procédé comprenant les étapes de :In order to achieve this goal, there is provided, according to the invention, a method of fixing a module to a card body, the module comprising an integrated circuit mounted on a support provided with conductive pads and the card body comprising a cavity for receiving the integrated circuit, the method comprising the steps of:
- monter le module sur le corps de carte de manière que le circuit intégré soit reçu dans la cavité et laisse un volume libre dans celle-ci,- mount the module on the card body so that the integrated circuit is received in the cavity and leaves a free volume in it,
- injecter une résine dans le volume libre,- inject a resin into the free volume,
- polymériser la résine.- polymerize the resin.
Ainsi, il est possible de fixer le module aux parois et au fond de la cavité, ce qui améliore la résistance de la fixation. De plus, la résine injectée dans la cavité peut être choisie pour assurer, outre le collage du module au corps de carte, une protection mécanique du circuit intégré et de la connexion de celui-ci aux plages conductrices ainsi que 1 ' étanchéité de la fixation de sorte qu'il n'est pas nécessaire d'encapsuler le circuit intégré préalablement au montage du module sur le corps de carte.Thus, it is possible to fix the module to the walls and to the bottom of the cavity, which improves the strength of the fixing. In addition, the resin injected into the cavity can be chosen to ensure, in addition to the bonding of the module to the card body, mechanical protection of the integrated circuit and of the connection of the latter to the conductive pads as well as the tightness of the fixing. so that it is not necessary to encapsulate the integrated circuit before mounting the module on the card body.
Par ailleurs, l'injection permet d'assurer de manière simple le remplissage complet du volume libre dans la cavité.Furthermore, the injection makes it possible in a simple manner to completely fill the free volume in the cavity.
D'autres caractéristiques et avantages de 1 ' invention ressortiront à la lecture de la description qui suit de modes de mise en oeuvre particuliers non limitatifs de 1 ' invention . II sera fait référence aux dessins annexés, parmi lesquels :Other characteristics and advantages of the invention will become apparent on reading the following description of particular non-limiting embodiments of the invention. Reference will be made to the appended drawings, among which:
- la figure 1 est une vue partielle de dessus d'une carte à circuit intégré réalisée selon un procédé conforme à un premier mode de mise en oeuvre de l'invention, - la figure 2 est une vue partielle en coupe transversale d'une carte à circuit intégré en cours de réalisation au moyen du procédé selon le premier mode de mise en oeuvre,- Figure 1 is a partial top view of an integrated circuit card produced according to a method according to a first embodiment of the invention, - Figure 2 is a partial view in cross section of a card with an integrated circuit in progress by means of the method according to the first embodiment,
- la figure 3 est une vue analogue à la figure 2 d'une carte à circuit intégré en cours de fabrication au moyen d'un procédé conforme à un deuxième mode de mise en oeuvre de l'invention,- Figure 3 is a view similar to Figure 2 of an integrated circuit card during manufacture at means of a method in accordance with a second embodiment of the invention,
- la figure 4 est une vue en coupe transversale d'une variante d'un module plus particulièrement adapté pour être fixé à l'aide d'un procédé conforme au premier mode de mise en oeuvre.- Figure 4 is a cross-sectional view of a variant of a module more particularly suitable for being fixed using a method according to the first embodiment.
En référence aux figures 1 à 3 , le procédé conforme à l'invention est destiné à la fixation d'un module généralement désigné en 1 à un corps de carte 2 qui comprend une cavité 7 débouchant sur une face du corps de carte 2 par un lamage 8.Referring to Figures 1 to 3, the method according to the invention is intended for fixing a module generally designated in 1 to a card body 2 which comprises a cavity 7 opening onto one face of the card body 2 by a counterbore 8.
Le module comprend un circuit intégré 3 monté sur un support comportant ici une feuille 4 en matière thermoplastique et une feuille métallique qui est fixée sur la feuille 4 et définit des plages conductrices 5 auxquelles le circuit intégré 3 est raccordé par des conducteurs 6 s ' étendant au travers de perçages ménagés dans la feuille 4. Le circuit intégré 3 est ici monté sur la feuille métallique définissant les plages conductrices 5 mais peut aussi être fixé directement sur la feuille 4.The module comprises an integrated circuit 3 mounted on a support here comprising a sheet 4 of thermoplastic material and a metal sheet which is fixed on the sheet 4 and defines conductive areas 5 to which the integrated circuit 3 is connected by conductors 6 extending through holes made in the sheet 4. The integrated circuit 3 is here mounted on the metal sheet defining the conductive areas 5 but can also be fixed directly on the sheet 4.
Deux orifices 9 et un orifice 10 sont ménagés entre les plages conductrices 5 dans la feuille 4.Two orifices 9 and an orifice 10 are formed between the conductive pads 5 in the sheet 4.
Le procédé de fixation du module 1 au corps de carte 2 conformément au premier mode de mise en oeuvre de l'invention va maintenant être décrit en référence plus particulièrement aux figures 1 et 2.The method of fixing the module 1 to the card body 2 in accordance with the first embodiment of the invention will now be described with more particular reference to FIGS. 1 and 2.
Ce procédé est un procédé de collage utilisant une résine 17 bi-composant de type connu. A titre d'exemple, la résine utilisée ici est une résine époxy qui possède une viscosité de l'ordre de quelques centaines de centipoises et polymérise en quelques heures à une température comprise entre -20 et 60°C.This method is a bonding method using a two-component resin 17 of known type. For example, the resin used here is an epoxy resin which has a viscosity of the order of a few hundred centipoises and polymerizes in a few hours at a temperature between -20 and 60 ° C.
Ce procédé est réalisé au moyen d'un outil généralement désigné en 11, comprenant une plaque 12 traversée par une canule d'injection 13, une aiguille d'injection 14 et deux canaux d'échappement 15 (dont un seul est visible à la figure 2) . La canule d'injection 13 et l'aiguille d'injection 14 sont chacune reliée à un circuit d'alimentation en l'un des composants de la résine. Le procédé conforme au premier mode de mise en oeuvre débute par 1 ' étape de monter le module 1 sur le corps de carte 2 de manière que la feuille 4 repose sur le fond du lamage 8 et le circuit intégré 3 soit reçu dans la cavité 7 et laisse un volume libre 16 dans celle-ci. La plaque 12 est ensuite appliquée contre la surface du corps de carte 2 dans laquelle est ménagée la cavité 7 et contre les plages conductrices 5.This process is carried out by means of a tool generally designated at 11, comprising a plate 12 crossed by an injection cannula 13, a needle injection 14 and two exhaust channels 15 (only one of which is visible in FIG. 2). The injection cannula 13 and the injection needle 14 are each connected to a circuit for supplying one of the components of the resin. The method according to the first embodiment begins with the step of mounting the module 1 on the card body 2 so that the sheet 4 rests on the bottom of the counterbore 8 and the integrated circuit 3 is received in the cavity 7 and leaves a free volume 16 therein. The plate 12 is then applied against the surface of the card body 2 in which the cavity 7 is formed and against the conductive pads 5.
La canule d'injection 13 est alors reçue dans l'orifice 10, les canaux d'échappement 15 s'étendent en regard des orifices 9 et l'aiguille d'injection 14 perfore la feuille 4 entre les plages conductrices 5. La canule d'injection 13, l'aiguille d'injection 14 et les canaux d'échappement 15 débouchent ainsi dans le volume libre 16.The injection cannula 13 is then received in the orifice 10, the exhaust channels 15 extend opposite the orifices 9 and the injection needle 14 perforates the sheet 4 between the conductive pads 5. The cannula d injection 13, the injection needle 14 and the exhaust channels 15 thus open into the free volume 16.
Les composants de la résine 17 sont injectés dans le volume libre 16 au moyen de la canule d'injection 13 et de l'aiguille d'injection 14. Les orifices 9 et les canaux d'échappement 15 permettent à l'air qui était emprisonné dans la cavité 7 lors du montage du module 1 de s ' échapper au fur et à mesure que le volume libre 16 se remplit des composants de la résine 17.The resin components 17 are injected into the free volume 16 by means of the injection cannula 13 and the injection needle 14. The orifices 9 and the exhaust channels 15 allow the air which was trapped in the cavity 7 during assembly of the module 1 to escape as the free volume 16 fills with the components of the resin 17.
Dès que les composants de la résine 17 amenés par la canule d'injection 13 et l'aiguille d'injection 14 sont en présence l'un de l'autre, la résine 17 commence à polymériser et à durcir. L'application de la plaque 12 contre le module 1 lors de l'injection des composants de la résine 17 et la polymérisation de celle-ci permet d'éviter que le module 1 se soulève sous la pression d'injection ou du fait des contraintes liées au durcissement de la résine. Après l'injection, la plaque 12 est décollée des plages conductrices 5 du module 1.As soon as the components of the resin 17 supplied by the injection cannula 13 and the injection needle 14 are in the presence of each other, the resin 17 begins to polymerize and harden. The application of the plate 12 against the module 1 during the injection of the components of the resin 17 and the polymerization of the latter makes it possible to prevent the module 1 from rising under the injection pressure or due to the stresses related to hardening of the resin. After the injection, the plate 12 is detached from the conductive pads 5 of module 1.
Le durcissement de la résine 17 permet la fixation du module 1 au corps de carte 2. En outre, la résine 17 assure également la protection mécanique du circuit intégré 3 et des conducteurs 6.The hardening of the resin 17 allows the module 1 to be fixed to the card body 2. In addition, the resin 17 also provides mechanical protection for the integrated circuit 3 and the conductors 6.
Selon un deuxième mode de mise en oeuvre et en référence à la figure 3, le circuit intégré 3 et les conducteurs 6 sont encapsulés dans un bloc de résine 18 préalablement au montage du module 1. Les orifices 9 et 10 sont alors positionnés de manière qu'une fois le module 1 monté sur le corps de carte 2, les orifices 9, 10 s'étendent en regard du volume libre 16 qui s'étend entre les parois de la cavité 7 et le bloc de résine 18. Le volume libre 16 correspond ainsi sensiblement au jeu réservé pour faciliter le montage du module 1 sur le corps de carte 2. De même, l'aiguille d'injection 14 est positionnée de manière que la perforation de la feuille 4 soit réalisée entre la paroi de la cavité 7 et le bloc de résine 18. Ceci permet en outre de limiter le risque d'une dégradation du bloc de résine 18 et des conducteurs 6.According to a second mode of implementation and with reference to FIG. 3, the integrated circuit 3 and the conductors 6 are encapsulated in a block of resin 18 before mounting of the module 1. The orifices 9 and 10 are then positioned so that once the module 1 is mounted on the card body 2, the orifices 9, 10 extend opposite the free volume 16 which extends between the walls of the cavity 7 and the resin block 18. The free volume 16 thus corresponds substantially to the clearance reserved to facilitate mounting of the module 1 on the card body 2. Likewise, the injection needle 14 is positioned so that the perforation of the sheet 4 is produced between the wall of the cavity 7 and the resin block 18. This also makes it possible to limit the risk of degradation of the resin block 18 and of the conductors 6.
Dans cette mise en oeuvre, une couche de colle 25 est interposée entre le fond du lamage 8 et la feuille 4 préalablement au montage du module 1 sur le corps de carte 2. Il est ainsi assuré un maintien en position du module sur le corps de carte 2 préalablement à l'injection.In this implementation, a layer of adhesive 25 is interposed between the bottom of the counterbore 8 and the sheet 4 prior to mounting of the module 1 on the card body 2. It is thus ensured that the module is held in position on the body of card 2 prior to injection.
Le module 1 une fois monté sur le corps de carte 2, la résine de fixation du module 1 est injectée comme précédemment décrit. La résine injectée assure alors pour l'essentiel la fixation du module 1 au corps de carte 2.Once the module 1 is mounted on the card body 2, the module 1 fixing resin is injected as previously described. The resin injected then essentially secures the module 1 to the card body 2.
Selon une variante du module 1 représentée à la figure 4, le module 1 comprend une grille métallique généralement désignée en 19 comprenant une partie centrale 20 formant le support du circuit intégré 3 et une partie périphérique 21 partiellement enrobée dans un bloc de matériau thermoplastique 22 (par exemple du polycarbonate) qui laisse des surfaces 23 de la grille découvertes pour former les plages conductrices.According to a variant of the module 1 shown in FIG. 4, the module 1 comprises a metal grid generally designated at 19 comprising a central part 20 forming the support of the integrated circuit 3 and a peripheral part 21 partially embedded in a block of thermoplastic material 22 (for example polycarbonate) which leaves exposed surfaces 23 of the grid to form the conductive pads.
Le module comprend des canaux 24 (dont un seul est visible ici) réalisés dans le bloc de matériau thermoplastique 22 à proximité de la partie centrale 20. Ces canaux 24 sont disposés à l'opposé l'un de l'autre et forment pour l'un un canal d'injection de la résine et pour l'autre un canal d'échappement de l'air lors de 1 ' injection.The module comprises channels 24 (only one of which is visible here) produced in the block of thermoplastic material 22 near the central part 20. These channels 24 are arranged opposite one another and form for the 'one a resin injection channel and for the other an air exhaust channel during the injection.
L'injection de la résine est réalisée comme précédemment .The resin injection is carried out as previously.
L'injection de la résine alors que le module est monté sur le corps de carte permet d'une part d'assurer la fixation du module au corps de carte et d'autre part de protéger mécaniquement le circuit intégré et la connexion de celui-ci aux plages conductrices. Cette protection est réalisée de manière particulièrement simple alors qu'auparavant l'encapsulage du circuit intégré dans un bloc de résine (de manière similaire au module représenté à la figure 3) posait des problèmes de réalisation du fait du risque de fuites de la résine entre le bloc de matériau thermoplastique et la partie centrale de la grille.The injection of the resin while the module is mounted on the card body makes it possible on the one hand to ensure the fixing of the module to the card body and on the other hand to mechanically protect the integrated circuit and the connection thereof. ci to the conductive areas. This protection is carried out in a particularly simple manner whereas previously the encapsulation of the integrated circuit in a block of resin (in a similar manner to the module represented in FIG. 3) posed problems of realization because of the risk of leakage of the resin between the block of thermoplastic material and the central part of the grid.
Bien entendu, l'invention n'est pas limitée au mode de réalisation décrit et on peut y apporter des variantes de réalisation sans sortir du cadre de 1 ' invention tel que défini par les revendications .Of course, the invention is not limited to the embodiment described and it is possible to add variants without departing from the scope of the invention as defined by the claims.
En particulier, il est possible d'utiliser pour l'injection deux canules du type de celles référencées en 13, le module comprenant alors deux orifices 10. L'outil 11 peut également comprendre deux aiguilles d'injection du type de celles référencée en 14. L'outil 11 peut aussi ne comprendre qu'un élément d'injection et un élément d'échappement de préférence disposés à l'opposé l'un de l'autre. En outre, une résine polymerisable à chaud peut être utilisée pour le comblement du volume libre 16 aux lieu et place de la résine bi-composant . Une fois une telle résine injectée dans la cavité, il est procédé à un chauffage pour polymériser la résine. In particular, it is possible to use for injection two cannulas of the type of those referenced in 13, the module then comprising two orifices 10. The tool 11 may also include two injection needles of the type of those referenced in 14 The tool 11 may also comprise only an injection element and an exhaust element preferably arranged opposite each other. In addition, a hot-polymerizable resin can be used for filling the free volume 16 in place of the two-component resin. Once such a resin has been injected into the cavity, heating is carried out to polymerize the resin.

Claims

REVENDICATIONS
1. Procédé de fixation d'un module (1) à un corps de carte (2), le module comprenant un circuit intégré (3) monté sur un support (4) pourvu de plages conductrices (5) et le corps de carte comportant une cavité (7) pour recevoir le circuit intégré, caractérisé en ce que le procédé comprend les étapes de :1. Method for fixing a module (1) to a card body (2), the module comprising an integrated circuit (3) mounted on a support (4) provided with conductive pads (5) and the card body comprising a cavity (7) for receiving the integrated circuit, characterized in that the method comprises the steps of:
- monter le module sur le corps de carte de manière que le circuit intégré soit reçu dans la cavité et laisse un volume libre (16) dans celle-ci,- mount the module on the card body so that the integrated circuit is received in the cavity and leaves a free volume (16) in it,
- injecter une résine (17) dans le volume libre,- inject a resin (17) into the free volume,
- polymériser la résine.- polymerize the resin.
2. Procédé selon la revendication 1, caractérisé en ce que la résine injectée (17) est du type bi-composant.2. Method according to claim 1, characterized in that the injected resin (17) is of the two-component type.
3. Procédé selon la revendication 1 ou la revendication 2, caractérisé en ce qu'il comprend l'étape de ménager dans le support (4) au moins un évent (9) et un orifice d'injection (10) préalablement au montage du module (1) sur le corps de carte (2) .3. Method according to claim 1 or claim 2, characterized in that it comprises the step of providing in the support (4) at least one vent (9) and an injection orifice (10) before mounting the module (1) on the card body (2).
4. Procédé selon la revendication 3, caractérisé en ce que le module comprend une grille métallique (19) ayant une partie centrale (20) formant le support de circuit intégré et une partie périphérique (21) au moins partiellement enrobée dans un matériau thermoplastique (22), et en ce que l'orifice d'injection et 1 ' évent (24) sont ménagés dans le bloc de matériau thermoplastique à proximité de la partie centrale de la grille.4. Method according to claim 3, characterized in that the module comprises a metal grid (19) having a central part (20) forming the integrated circuit support and a peripheral part (21) at least partially coated in a thermoplastic material ( 22), and in that the injection orifice and the vent (24) are formed in the block of thermoplastic material near the central part of the grid.
5. Procédé selon la revendication 1 ou la revendication 2, caractérisé en ce que l'injection de la résine (17) est effectuée en perforant le support (4) entre les plages conductrices (5) au moyen d'une aiguille d' injection (14) .5. Method according to claim 1 or claim 2, characterized in that the injection of the resin (17) is carried out by perforating the support (4) between the conductive pads (5) by means of an injection needle (14).
6. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que le support (4) a une partie périphérique ayant une surface qui est collée sur le corps de carte (2) lors du montage du module (1) sur le corps de carte (2) . 6. Method according to any one of the preceding claims, characterized in that the support (4) has a peripheral part having a surface which is glued to the card body (2) when the module (1) is mounted on the card body (2).
PCT/FR2001/000556 2000-02-29 2001-02-26 Method for fixing a module to a smart card body WO2001065482A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR00/02522 2000-02-29
FR0002522A FR2805639B1 (en) 2000-02-29 2000-02-29 METHOD FOR ATTACHING A MODULE TO A CARD BODY

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7586113B2 (en) 2006-06-01 2009-09-08 Carl Zeiss Smt Ag EUV illumination system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5272374A (en) * 1990-07-25 1993-12-21 Mitsubishi Denki Kabushiki Kaisha Production method for an IC card and its IC card
US5477611A (en) * 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
DE19828653A1 (en) * 1998-06-26 2000-01-05 Siemens Ag Chip module for installation in a chip card carrier and method for its production

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5272374A (en) * 1990-07-25 1993-12-21 Mitsubishi Denki Kabushiki Kaisha Production method for an IC card and its IC card
US5477611A (en) * 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
DE19828653A1 (en) * 1998-06-26 2000-01-05 Siemens Ag Chip module for installation in a chip card carrier and method for its production

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7586113B2 (en) 2006-06-01 2009-09-08 Carl Zeiss Smt Ag EUV illumination system
US8227770B2 (en) 2006-06-01 2012-07-24 Carl Zeiss Smt Gmbh EUV illumination system

Also Published As

Publication number Publication date
FR2805639B1 (en) 2002-05-24
FR2805639A1 (en) 2001-08-31

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