WO2001056921A3 - Vacuum package fabrication of microelectromechanical system devices with integrated circuit components - Google Patents

Vacuum package fabrication of microelectromechanical system devices with integrated circuit components Download PDF

Info

Publication number
WO2001056921A3
WO2001056921A3 PCT/US2001/003371 US0103371W WO0156921A3 WO 2001056921 A3 WO2001056921 A3 WO 2001056921A3 US 0103371 W US0103371 W US 0103371W WO 0156921 A3 WO0156921 A3 WO 0156921A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
devices
sealing ring
circuit components
vacuum package
Prior art date
Application number
PCT/US2001/003371
Other languages
French (fr)
Other versions
WO2001056921A2 (en
Inventor
Roland W Gooch
Thomas R Schimert
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/496,826 external-priority patent/US6479320B1/en
Priority claimed from US09/496,820 external-priority patent/US6521477B1/en
Application filed by Raytheon Co filed Critical Raytheon Co
Priority to JP2001556778A priority Critical patent/JP2003531475A/en
Priority to AU2001234750A priority patent/AU2001234750A1/en
Priority to EP01906897A priority patent/EP1272422A2/en
Publication of WO2001056921A2 publication Critical patent/WO2001056921A2/en
Publication of WO2001056921A3 publication Critical patent/WO2001056921A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)

Abstract

A method for vacuum packaging MEMS devices is provided that comprises forming a plurality of MEMS devices (12) on a device wafer (10). A first sealing ring (16) is formed surrounding one of the MEMS devices (12) and any associated mating pads (70). A plurality of integrated circuit devices (80) is formed on a lid wafer (30) where each integrated circuit device (80) has one or more associated mating pads (82) and one or more associated bonding pads (86). A plurality of second sealing rings (32) is formed on the lid wafer (30) where each of the second sealing rings (32) surrounds one of the integrated circuit devices (80) and any associated bonding pads (82). The second sealing ring (32) is positioned between the perimeter of the integrated circuit device (80) and the associated bonding pads (86). A sealing layer is formed on either each first sealing ring (16) or each second sealing ring (32). The device wafer (10) is mated with the lid wafer (30) in a vacuum environment to form a plurality of vacuum packages where each vacuum package encloses one or more of the MEMS devices (12) and one or more of the integrated circuit devices (80).
PCT/US2001/003371 2000-02-02 2001-02-01 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components WO2001056921A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001556778A JP2003531475A (en) 2000-02-02 2001-02-01 Manufacture of vacuum package for micro-electromechanical system devices with integrated circuit components
AU2001234750A AU2001234750A1 (en) 2000-02-02 2001-02-01 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
EP01906897A EP1272422A2 (en) 2000-02-02 2001-02-01 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/496,826 US6479320B1 (en) 2000-02-02 2000-02-02 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
US09/496,820 US6521477B1 (en) 2000-02-02 2000-02-02 Vacuum package fabrication of integrated circuit components
US09/496,826 2000-02-02
US09/496,820 2000-02-02

Publications (2)

Publication Number Publication Date
WO2001056921A2 WO2001056921A2 (en) 2001-08-09
WO2001056921A3 true WO2001056921A3 (en) 2002-03-07

Family

ID=27052296

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/003371 WO2001056921A2 (en) 2000-02-02 2001-02-01 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components

Country Status (5)

Country Link
EP (1) EP1272422A2 (en)
JP (1) JP2003531475A (en)
KR (1) KR20030023613A (en)
AU (1) AU2001234750A1 (en)
WO (1) WO2001056921A2 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPR245401A0 (en) 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM07)
AUPR245601A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM09)
AUPR245701A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM10)
US6744114B2 (en) 2001-08-29 2004-06-01 Honeywell International Inc. Package with integrated inductor and/or capacitor
KR100442830B1 (en) 2001-12-04 2004-08-02 삼성전자주식회사 Low temperature hermetic sealing method having a passivation layer
US7026223B2 (en) 2002-03-28 2006-04-11 M/A-Com, Inc Hermetic electric component package
DE10214769A1 (en) * 2002-04-03 2003-10-16 Bosch Gmbh Robert Device and sensor for recording light signals and manufacturing process
US6929974B2 (en) * 2002-10-18 2005-08-16 Motorola, Inc. Feedthrough design and method for a hermetically sealed microdevice
EP1460037A1 (en) * 2003-03-18 2004-09-22 SensoNor asa A multi-layer device and method for producing the same
US6897469B2 (en) * 2003-05-02 2005-05-24 Athanasios J. Syllaios Sub-wavelength structures for reduction of reflective properties
US7045868B2 (en) * 2003-07-31 2006-05-16 Motorola, Inc. Wafer-level sealed microdevice having trench isolation and methods for making the same
US6774327B1 (en) * 2003-09-24 2004-08-10 Agilent Technologies, Inc. Hermetic seals for electronic components
US7034393B2 (en) 2003-12-15 2006-04-25 Analog Devices, Inc. Semiconductor assembly with conductive rim and method of producing the same
US7608534B2 (en) 2004-06-02 2009-10-27 Analog Devices, Inc. Interconnection of through-wafer vias using bridge structures
US20070004079A1 (en) * 2005-06-30 2007-01-04 Geefay Frank S Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips
US8217473B2 (en) 2005-07-29 2012-07-10 Hewlett-Packard Development Company, L.P. Micro electro-mechanical system packaging and interconnect
US7569926B2 (en) * 2005-08-26 2009-08-04 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
US7491567B2 (en) * 2005-11-22 2009-02-17 Honeywell International Inc. MEMS device packaging methods
FI119728B (en) 2005-11-23 2009-02-27 Vti Technologies Oy Process for manufacturing microelectromechanical component and microelectromechanical component
FI119729B (en) * 2005-11-23 2009-02-27 Vti Technologies Oy A method of making a microelectromechanical component and a microelectromechanical component
US7867807B2 (en) 2006-03-29 2011-01-11 Hamamatsu Photonics K.K. Method for manufacturing photoelectric converting device
WO2007119206A2 (en) 2006-04-13 2007-10-25 Nxp B.V. A method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate
KR100846569B1 (en) * 2006-06-14 2008-07-15 매그나칩 반도체 유한회사 Package of mems device and method for manufacturing the same
WO2008086537A2 (en) 2007-01-11 2008-07-17 Analog Devices, Inc. Aluminum based bonding of semiconductor wafers
EP2246881A4 (en) * 2008-02-22 2014-07-30 Barun Electronics Co Ltd Joining structure and a substrate-joining method using the same
US8618670B2 (en) 2008-08-15 2013-12-31 Qualcomm Incorporated Corrosion control of stacked integrated circuits
US7943411B2 (en) 2008-09-10 2011-05-17 Analog Devices, Inc. Apparatus and method of wafer bonding using compatible alloy
US8956904B2 (en) 2008-09-10 2015-02-17 Analog Devices, Inc. Apparatus and method of wafer bonding using compatible alloy
US8809784B2 (en) * 2010-10-21 2014-08-19 Raytheon Company Incident radiation detector packaging
US8742570B2 (en) * 2011-09-09 2014-06-03 Qualcomm Mems Technologies, Inc. Backplate interconnect with integrated passives
KR101471386B1 (en) * 2012-12-21 2014-12-11 포항공과대학교 산학협력단 Wafer Level Hermetic Package and Wafer Level Hermetic Packaging Method
KR101450012B1 (en) * 2013-02-12 2014-10-15 한국과학기술원 MEMS package having capping member having different thickness, MEMS package having the same, MEMS wafer level package having the same, and method of manufacturing the same
US10329142B2 (en) * 2015-12-18 2019-06-25 Samsung Electro-Mechanics Co., Ltd. Wafer level package and method of manufacturing the same
JP7292077B2 (en) * 2018-07-11 2023-06-16 三菱電機株式会社 Package element manufacturing method and package element
JPWO2022239153A1 (en) 2021-05-12 2022-11-17

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0828346A2 (en) * 1996-08-29 1998-03-11 Harris Corporation Lid wafer bond packaging and micromachining
WO1999050905A1 (en) * 1998-03-31 1999-10-07 Honeywell Inc. Wafer-pair having deposited layer sealed chambers
EP0951069A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Microelektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
FR2780200A1 (en) * 1998-06-22 1999-12-24 Commissariat Energie Atomique Sealed cavity for electronic or electromagnetic component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0828346A2 (en) * 1996-08-29 1998-03-11 Harris Corporation Lid wafer bond packaging and micromachining
WO1999050905A1 (en) * 1998-03-31 1999-10-07 Honeywell Inc. Wafer-pair having deposited layer sealed chambers
EP0951069A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Microelektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
FR2780200A1 (en) * 1998-06-22 1999-12-24 Commissariat Energie Atomique Sealed cavity for electronic or electromagnetic component

Also Published As

Publication number Publication date
AU2001234750A1 (en) 2001-08-14
KR20030023613A (en) 2003-03-19
JP2003531475A (en) 2003-10-21
EP1272422A2 (en) 2003-01-08
WO2001056921A2 (en) 2001-08-09

Similar Documents

Publication Publication Date Title
WO2001056921A3 (en) Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
US7015074B2 (en) Vacuum package fabrication of integrated circuit components
KR100271386B1 (en) Sealed cavity device and forming method
US7196410B2 (en) Wafer packaging and singulation method
US6828674B2 (en) Hermetically sealed microstructure package
US7859093B2 (en) Method for protecting encapsulated sensor structures using stack packaging
US6767764B2 (en) Microelectromechanical system device packaging method
US7682934B2 (en) Wafer packaging and singulation method
US5965933A (en) Semiconductor packaging apparatus
US20030116825A1 (en) Wafer-level package with silicon gasket
US6856014B1 (en) Method for fabricating a lid for a wafer level packaged optical MEMS device
EP1167281A3 (en) Chip scale surface-mountable packaging method for electronic and MEMS devices
MY123187A (en) Semiconductor device having a sub- chip- scale package structure and method for forming same
EP0828346A3 (en) Lid wafer bond packaging and micromachining
EP1515364A3 (en) Device package and methods for the fabrication and testing thereof
EP1070677A3 (en) Microcap wafer-level package
EP1071126A3 (en) Microcap wafer-level package with vias
SG111972A1 (en) Wafer-level package for micro-electro-mechanical systems
CN109962041B (en) Ambient light sensor with light protection
WO1999019906A3 (en) Method and apparatus for packaging high temperature solid state electronic devices
EP1251557A3 (en) Method of manufacturing semiconductor devices and semiconductor device
US6770503B1 (en) Integrated packaging of micromechanical sensors and associated control circuits
WO2002058107A3 (en) Method for producing an optical semiconductor box and optical semiconductor box
Weiss et al. Integrated cavity wafer level chip size package for MEMS applications
GB2439403B (en) Method and system for hermetically sealing packages for optics

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 1020027009867

Country of ref document: KR

ENP Entry into the national phase

Ref country code: JP

Ref document number: 2001 556778

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 2001906897

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2001906897

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWP Wipo information: published in national office

Ref document number: 1020027009867

Country of ref document: KR

WWW Wipo information: withdrawn in national office

Ref document number: 2001906897

Country of ref document: EP