WO2001036320A3 - Micromachine package - Google Patents

Micromachine package Download PDF

Info

Publication number
WO2001036320A3
WO2001036320A3 PCT/US2000/041483 US0041483W WO0136320A3 WO 2001036320 A3 WO2001036320 A3 WO 2001036320A3 US 0041483 W US0041483 W US 0041483W WO 0136320 A3 WO0136320 A3 WO 0136320A3
Authority
WO
WIPO (PCT)
Prior art keywords
micromachine
coupon
chip
bead
area
Prior art date
Application number
PCT/US2000/041483
Other languages
French (fr)
Other versions
WO2001036320A2 (en
Inventor
Thomas P Glenn
Original Assignee
Amkor Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/440,808 external-priority patent/US6415505B1/en
Application filed by Amkor Technology Inc filed Critical Amkor Technology Inc
Priority to AU26166/01A priority Critical patent/AU2616601A/en
Publication of WO2001036320A2 publication Critical patent/WO2001036320A2/en
Publication of WO2001036320A3 publication Critical patent/WO2001036320A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/04—Networks or arrays of similar microstructural devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/004—Testing during manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

A micromachine package (800) includes a micromachine chip (412) having a micromachine area (414) in an upper surface of micromachine chip (412). A coupon (452) is attached above micromachine area (414) by a bead (450). Coupon (452) and bead (450) form an enclosure, which defines a free space (454) above micromachine area (414). This enclosure has sufficient structural integrity to withstand the injection of plastic encapsulant (814) around micromachine chip (412), bead (450), and coupon (452). Further, by forming coupon (452) of ceramic, coupon (452) does not accumulate static charge which would render micromachine chip (412) inoperable, and coupon (452) does not have to be grounded.
PCT/US2000/041483 1999-11-15 2000-10-24 Micromachine package WO2001036320A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU26166/01A AU2616601A (en) 1999-11-15 2000-10-24 Micromachine package

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US44080599A 1999-11-15 1999-11-15
US09/440,808 US6415505B1 (en) 1999-11-15 1999-11-15 Micromachine package fabrication method
US09/440,808 1999-11-15
US09/440,805 1999-11-15

Publications (2)

Publication Number Publication Date
WO2001036320A2 WO2001036320A2 (en) 2001-05-25
WO2001036320A3 true WO2001036320A3 (en) 2002-05-30

Family

ID=27032562

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/041483 WO2001036320A2 (en) 1999-11-15 2000-10-24 Micromachine package

Country Status (3)

Country Link
AU (1) AU2616601A (en)
TW (1) TW473903B (en)
WO (1) WO2001036320A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10258478A1 (en) * 2002-12-10 2004-07-08 Fh Stralsund Top-bottom ball grid array package for a micro-system construction kit, has metal top and bottom parts with electric wiring/connection structures
DE102006019080B3 (en) 2006-04-25 2007-08-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Housing manufacturing method for e.g. infrared sensor, involves enclosing electrical circuit along metal frame, where circuit is isolated along isolating contour that does not cut surface of substrate
DE102010031055B4 (en) * 2010-07-07 2023-02-23 Robert Bosch Gmbh Sensor module and method of manufacturing a sensor module
TWI455266B (en) * 2010-12-17 2014-10-01 矽品精密工業股份有限公司 Package structure having micro-electro-mechanical elements and manufacturing method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2100521A (en) * 1981-05-13 1982-12-22 Plessey Co Plc Electrical device package
US5414300A (en) * 1993-12-10 1995-05-09 Sumitomo Metal Ceramics Inc. Lid for semiconductor package and package having the lid
US5597767A (en) * 1995-01-06 1997-01-28 Texas Instruments Incorporated Separation of wafer into die with wafer-level processing
EP0828346A2 (en) * 1996-08-29 1998-03-11 Harris Corporation Lid wafer bond packaging and micromachining
US5742007A (en) * 1996-08-05 1998-04-21 Motorola, Inc. Electronic device package and method for forming the same
WO1998048461A1 (en) * 1997-04-18 1998-10-29 Amkor Technology, Inc. Integrated circuit package
US5860210A (en) * 1996-09-30 1999-01-19 Motorola, Inc. Method of manufacturing an electronic component
WO1999050913A1 (en) * 1998-03-31 1999-10-07 Honeywell Inc. A method of making a wafer-pair having sealed chambers

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2100521A (en) * 1981-05-13 1982-12-22 Plessey Co Plc Electrical device package
US5414300A (en) * 1993-12-10 1995-05-09 Sumitomo Metal Ceramics Inc. Lid for semiconductor package and package having the lid
US5597767A (en) * 1995-01-06 1997-01-28 Texas Instruments Incorporated Separation of wafer into die with wafer-level processing
US5742007A (en) * 1996-08-05 1998-04-21 Motorola, Inc. Electronic device package and method for forming the same
EP0828346A2 (en) * 1996-08-29 1998-03-11 Harris Corporation Lid wafer bond packaging and micromachining
US5860210A (en) * 1996-09-30 1999-01-19 Motorola, Inc. Method of manufacturing an electronic component
WO1998048461A1 (en) * 1997-04-18 1998-10-29 Amkor Technology, Inc. Integrated circuit package
WO1999050913A1 (en) * 1998-03-31 1999-10-07 Honeywell Inc. A method of making a wafer-pair having sealed chambers

Also Published As

Publication number Publication date
AU2616601A (en) 2001-05-30
WO2001036320A2 (en) 2001-05-25
TW473903B (en) 2002-01-21

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