WO2001022501A1 - Electronic component and coating agent - Google Patents

Electronic component and coating agent Download PDF

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Publication number
WO2001022501A1
WO2001022501A1 PCT/DE2000/003290 DE0003290W WO0122501A1 WO 2001022501 A1 WO2001022501 A1 WO 2001022501A1 DE 0003290 W DE0003290 W DE 0003290W WO 0122501 A1 WO0122501 A1 WO 0122501A1
Authority
WO
WIPO (PCT)
Prior art keywords
coating agent
aqueous solution
stick layer
radiation
solder
Prior art date
Application number
PCT/DE2000/003290
Other languages
German (de)
French (fr)
Inventor
Klaus Höhn
Günther Waitl
Original Assignee
Osram Opto Semiconductors Gmbh & Co. Ohg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh & Co. Ohg filed Critical Osram Opto Semiconductors Gmbh & Co. Ohg
Priority to KR1020017006316A priority Critical patent/KR20010107975A/en
Priority to JP2001525774A priority patent/JP2003510818A/en
Priority to EP00971253A priority patent/EP1133800A1/en
Publication of WO2001022501A1 publication Critical patent/WO2001022501A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to an electronic component, in particular to an optoelectronic component, with a plastic housing that has at least one metallic contact surface. It also relates to a coating agent for such a component and to a method for producing such a component.
  • the object of the invention is to provide an electronic component in which the adhesion of solder residues or solder to surfaces of the component housing which are not provided for this purpose is largely prevented.
  • a surface-mountable component is to be developed that can be packaged in straps and by means of conventional pick-and-place processes of surface mounting technology (SMT technology) can be further processed.
  • SMT technology surface mounting technology
  • the plastic housing with the exception of the metallic soldering area, is coated with a non-stick solder layer.
  • the invention proposes to avoid those that occur in particular in solder baths or a wave soldering process
  • Soldering residues in the form of small solder accumulations at locations of the electrical component which are not provided for this purpose, provide a solder non-stick layer on the areas of the surface of the electrical component which are not intended for soldering, which prevents the solder from adhering.
  • solder non-stick layer consists essentially of siloxane.
  • solder non-stick layer is particularly preferably a siloxane layer based on polyether-modified dimethylpolysiloxane.
  • solder non-stick layer is preferably applied by a 0.01-5% aqueous solution and particularly preferably by a 0.01-2.5% aqueous solution. brings, which preferably contains no further solvent additives.
  • a 0.01-2.5% aqueous solution advantageously ensures that the coating is non-tacky, which is of crucial importance for the use of pick-and-place processes in surface mounting technology.
  • the solder non-stick layer is applied at room temperature.
  • the thickness of the non-stick solder layer in particular in the case of the optoelectronic transmitting and / or receiving components, is particularly preferably less than 3 ⁇ m and consequently has as far as possible no influence on the optical properties of the coated components.
  • a highly effective, homogeneous solder non-stick layer is produced, which advantageously does not use any nonvolatile solubilizers due to the special chemical structure and the use of aqueous systems.
  • a particular advantage that results from this is that environmentally friendly solvents are no longer used. Also, no droplet residues can occur due to highly volatile solubilizers, which complicate or prevent the perfect soldering of the electrical component.
  • a conventional thermal post-processing step is no longer required, which increases the yield and reduces production times. Functional impairments of the coated components do not occur.
  • the coatings obtained are also characterized by high storage stability and homogeneity, which improves the quality of the components and reduces the failure rate.
  • the invention further relates to a coating agent for reducing solder residues on surfaces not intended for soldering of an electrical see component that is to be soldered to at least one surface, wherein the coating agent is to be applied to the surfaces of the electrical component that are not intended for the soldering, the coating agent being a siloxane.
  • the coating composition consists of a polyether-modified dirnethyl polysiloxane.
  • the coating agent is advantageously dissolved in a 0.01-5% strength, particularly preferably in a 0.01-2.5% strength aqueous solution for application to a surface provided for this purpose, preferably without further solvent additions.
  • a uniform application of the coating agent is ensured without other difficult-to-evaporate solvent residues remaining.
  • a resultant advantage is that by using an aqueous solution, environmentally friendly solvents are no longer used.
  • the coating agent shows no other usual discolouration or residues on the component surface due to thermal decomposition reactions, which were caused by the previously required heat treatment to evaporate the solvents.
  • the aqueous solution is preferably applied to the whole by stamping (for example using a tampon, roller or sponge), dipping (for pulling through a dipping bath), spraying or application by microdosing with fine needles
  • the film is advantageously dried in an air stream which does not have to be at elevated temperatures.
  • the coating material also shows a low hazard potential for humans and the environment, in particular a low vapor pressure. Used coating solutions can consequently be disposed of without any problems and coated components can be used in particularly critical application areas, such as, for example, automotive applications in the interior, consumer electronics and medical areas, in particular because of the low vapor pressure.
  • Buffered coating solutions with a pH between approx. 5.0 and approx. 7.0 can advantageously be kept and used for up to three months.
  • the solder non-stick layer is advantageously very light-stable and can be further increased by adding light stabilizers and UV absorbers (for example benzophenones, benzoriazoles, sterically hindered amines with a pH preferably between 6.0 and 7.5), as a result of which the radiation and weather stability of the plastic housing is improved.
  • the coating is advantageously also suitable for optoelectronic components with intensive and / or more energy-producing radiation, eg. B. blue light and UV radiation emitting LEDs and high-performance LEDs.
  • the coating solutions are preferably on thermoplastic housings made of LCP, PBT, PET, PC, PA and / or particularly preferably on polyphthalamide with or without filler additive (such as
  • Titanium oxide, silicon oxide, aluminum oxide etc. and / or epoxy resin, silicone or acrylate casting compounds (preferably Epoxy anhydride molding materials) used.
  • the epoxy resin, silicone or acrylate casting compounds can contain diffuser materials such as calcium fluoride, barium sulfate, silicon oxide, aluminum oxide, glass spheres etc. and luminescence conversion pigments.
  • Figure 1 is a schematic sectional view of an embodiment of a soldered electrical component according to the invention with a solder non-stick layer;
  • Figure 2 is a schematic sectional view of a soldered, conventional electrical component with solder residues.
  • FIG. 1 shows a surface-mountable radiation-emitting and / or radiation-sensing optoelectronic component 1 in the soldered state.
  • the component 1 is in this case soldered to the metallic soldering areas 4 to be soldered by means of the solder 3 to the conductor tracks 8 printed on a circuit board 7.
  • the other areas 5 of the surface 2 of a plastic housing 14 of the component 1, which are not intended for soldering, are coated with a solder non-stick layer 6.
  • polyether-modified dimethylpolysiloxane according to the invention as an essential component of the solder non-stick layer 6, wetting of surfaces 5 of the plastic housing 14 with solder is largely prevented.
  • FIG. 1 Chen-mountable radiation-emitting and / or radiation-sensing optoelectronic component 1 without solder non-stick layer is shown schematically.
  • the component 1 is again shown in the soldered state.
  • the component 1 is in turn soldered to the soldering areas 4 to be soldered by means of the solder 3 to the conductor tracks 8 printed on a circuit board 7.
  • An aqueous solution of the material of the solder non-stick layer is preferably applied to the whole by stamping (for example using a tampon, roller or sponge), dipping (for pulling through a dipping bath), spraying or application by microdosing with fine needles
  • stamping for example using a tampon, roller or sponge
  • dipping for pulling through a dipping bath
  • the film is advantageously dried in an air stream which does not have to have elevated temperatures.
  • the aqueous solution of the polyether-modified dimethylpolysiloxane is composed of 0.1-5% polyethermo- dified dimethylpolysiloxane, for example BYK348 from Byk-Chemie GmbH, and deionized water together.
  • polyethermo- dified dimethylpolysiloxane for example BYK348 from Byk-Chemie GmbH
  • the solder non-stick layer preferably contains a light stabilizer and / or a UV absorber (for example benzophenones, benzoriazoles, sterically hindered amines with a pH preferably between 6.0 and 7.5), as a result of which the radiation and Weather stability of the plastic housing is improved.
  • a light stabilizer and / or a UV absorber for example benzophenones, benzoriazoles, sterically hindered amines with a pH preferably between 6.0 and 7.5

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Paints Or Removers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Light Receiving Elements (AREA)

Abstract

The invention relates to an electronic component comprising, in predetermined areas, soldered regions that are arranged on at least one outer surface, whereby the component is coated on its surface that is not formed by the soldered regions with a layer that prevents the adherence of soldering agents thereto. The invention also relates to a coating agent for reducing the amount of solder tailings.

Description

Beschreibungdescription
Elektronisches Bauelement und Beschichtungs-MittelElectronic component and coating agent
Die Erfindung bezieht sich auf ein elektronisches Bauelement, insbesondere auf ein optoelektronisches Bauelement, mit einem Kunststoffgehäuse, das mindestens eine metallische Kontaktfläche aufweist. Sie bezieht sich weiterhin auf ein Beschich- tungsmittel für ein derartiges Bauelment und auf ein Verfah- ren zur Herstellung eines derartigen Bauelements.The invention relates to an electronic component, in particular to an optoelectronic component, with a plastic housing that has at least one metallic contact surface. It also relates to a coating agent for such a component and to a method for producing such a component.
Beim Ein- oder Verlöten elektronischer Bauelemente treten häufig Lötrückstände auf nicht zur Verlötung vorgesehen Flächen auf. Dies stellt insbesondere bei den relativ kleinen SMD-Bauelementen ein besonderes Problem dar. Bei optoelektronischen Bauelementen und hier insbesondere bei Empfangs- oder Sendebausteinen wie beispielsweise Lumineszenzdioden (LED) kann durch Lötrückstände auf dem Gehäuse die Funktion des lichtabstrahlenden bzw. -empfangenden Halblei- terbauelementε beeinträchtigt und die Licht- bzw. Signalausbeute heruntergesetzt werden. Auch kann es bei engliegenden Anschluss-Kontakten oder Lötflächen leicht zu Kurzschlüssen durch das Lot gebildete Brücken entstehen.When electronic components are soldered in or soldered on, solder residues often occur on surfaces not intended for soldering. This is a particular problem, particularly in the case of the relatively small SMD components. In the case of optoelectronic components and here in particular in the case of reception or transmission components such as luminescent diodes (LEDs), the function of the light-emitting or receiving semiconductor component can be impaired by solder residues on the housing and the light or signal yield are reduced. Also, short-circuiting due to the bridges formed by the solder can easily occur in the case of connecting contacts or solder surfaces.
Insbesondere bei vollautomatisierten Bestückungen von Platinen mit SMD-Bauelementen vermittels eines sogenannten Pick- and-Place Prozesses treten Lötrückstände auf den Bauelementen auf. Ansätze mit lösungsmittelhaltigen Lacken oder Beschich- tungen haben hier zu keinem befriedigenden Ergebnis geführt.Particularly in the case of fully automated assembly of circuit boards with SMD components using a so-called pick-and-place process, solder residues occur on the components. Approaches with solvent-based paints or coatings have not led to a satisfactory result.
Aufgabe der Erfindung ist es, ein elektronisches Bauelement zur Verfügung zu stellen, bei dem das Anhaften von Lötrück- ständen bzw. Lot an hierzu nicht vorgesehenen Flächen des Bauelement-Gehäuses weitestgehend verhindert ist. Im Besonde- ren soll ein derartiges oberflächenmontierbares Bauelement entwickelt werden, das in Gurten verpackbar und mittels her- kömmlichen Pick-and-Place Prozessen der Oberflächenmontage- technik (SMT-Technologie) weiterverarbeitbar ist.The object of the invention is to provide an electronic component in which the adhesion of solder residues or solder to surfaces of the component housing which are not provided for this purpose is largely prevented. In particular, such a surface-mountable component is to be developed that can be packaged in straps and by means of conventional pick-and-place processes of surface mounting technology (SMT technology) can be further processed.
Weiterhin soll ein Verfahren zur Herstellung des Bauelements angegeben werden.Furthermore, a method for producing the component is to be specified.
Die Lösung dieser Aufgabe erfolgt mit einem Baulement mit den Merkmalen des Patentanspruches 1, mit einem Verfahren mit den Merkmalen des Patentanspruches 8 und mit einem Beschichtungs- Mittel mit den Merkmalen des Patentanspruches 15.This object is achieved with a construction element with the features of claim 1, with a method with the features of claim 8 and with a coating agent with the features of claim 15.
Bevorzugte Weiterbildungen und Ausführungsformen sind Gegenstand der Patentansprüche 2 bis 7, 9 bis 14 bzw. 16 bis 25.Preferred developments and embodiments are the subject of claims 2 to 7, 9 to 14 and 16 to 25.
Erfindungsgemäß ist vorgesehen, dass das Kunststoffgehäuse, ausgenommen der metallische Lötbereich mit einer Lötmittel- Antihaft-Schicht überzogen ist.According to the invention, it is provided that the plastic housing, with the exception of the metallic soldering area, is coated with a non-stick solder layer.
Die Erfindung schlägt vor, zur Vermeidung der insbesondere bei Lötbädern oder einem Schwalllötvorgang auftretendenThe invention proposes to avoid those that occur in particular in solder baths or a wave soldering process
Lötrückstände, in Form kleiner Lotansammlungen an nicht hierfür vorgesehenen Stellen des elektrischen Bauelements, eine Lötmittel-Antihaft-Schicht auf den nicht zur Verlötung vorgesehenen Bereichen der Oberfläche des elektrischen Bauelements vorzusehen, die das Anhaften des Lots verhindert.Soldering residues, in the form of small solder accumulations at locations of the electrical component which are not provided for this purpose, provide a solder non-stick layer on the areas of the surface of the electrical component which are not intended for soldering, which prevents the solder from adhering.
Nach einer besonders bevorzugten Ausgestaltung der Erfindung ist vorgesehen, dass die Lötmittel-Antihaft-Schicht im wesentlichen aus Siloxan besteht.According to a particularly preferred embodiment of the invention, it is provided that the solder non-stick layer consists essentially of siloxane.
Dem folgend ist besonders bevorzugt die Lötmittel-Antihaft- Schicht eine auf polyethermodifiziertem Dimethylpolysiloxan basierende Siloxanschicht .Following this, the solder non-stick layer is particularly preferably a siloxane layer based on polyether-modified dimethylpolysiloxane.
Dem folgend ist die Lötmittel-Antihaft-Schicht bevorzugterweise durch eine 0,01 - 5%ige wässrige Lösung und besonders bevorzugt durch eine 0,01 - 2,5%ige wässrige Lösung aufge- bracht, die vorzugsweise keine weiteren Lösungsmittelzusätze enthält. Bei einer 0,01 - 2,5%igen wässrigen Lösung ist vorteilhafterweise die Klebfreiheit der Beschichtung gewährleistet, was für die Verwendung von Pick-and-Place-Prozesse der Oberflächenmontagetechnik von ausschlaggebender Bedeutung ist .Following this, the solder non-stick layer is preferably applied by a 0.01-5% aqueous solution and particularly preferably by a 0.01-2.5% aqueous solution. brings, which preferably contains no further solvent additives. A 0.01-2.5% aqueous solution advantageously ensures that the coating is non-tacky, which is of crucial importance for the use of pick-and-place processes in surface mounting technology.
Die Aufbringung der Lötmittel-Antihaft-Schicht erfolgt nach einer besonders bevorzugten Ausgestaltung der Erfindung bei Raumtemperatur.According to a particularly preferred embodiment of the invention, the solder non-stick layer is applied at room temperature.
Die Dicke der Lötmittel-Antihaft-Schicht , insbesondere bei den optoelektronischen Sende- und/oder Empfangsbauelementen betragt besonders bevorzugt weniger 3μm und hat folglich wei- testgehend keinen Einfluß auf die optische Eigenschaften der beschichteten Bauelemente.The thickness of the non-stick solder layer, in particular in the case of the optoelectronic transmitting and / or receiving components, is particularly preferably less than 3 μm and consequently has as far as possible no influence on the optical properties of the coated components.
Gemäß der Erfindung wird eine hocheffektive homogene Lötmittel-Antihaft-Schicht erzeugt, die vorteilhafterweise durch die spezielle chemische Struktur und durch den Einsatz wäss- riger Systeme keine schwerflüchtigen Lösungsvermittler mehr zum Einsatz bringt. Ein sich hieraus ergebender besonderer Vorteil liegt darin, dass nunmehr keine umweltunverträglichen Lösungsmittel mehr zum Einsatz kommen. Auch können keine Tropfenrückstände durch hochflüchtige Lösungsvermittler auftreten, die die einwandfreie Verlötung des elektrischen Bauteils erschweren oder verhindern. Ein bisher üblicher, thermischer Nachbearbeitungsschritt entfällt, was die Ausbeute erhöht und Produktionszeiten verringert. Funktionale Beein- trächtigungen der beschichteten Bauelemente treten nicht auf.According to the invention, a highly effective, homogeneous solder non-stick layer is produced, which advantageously does not use any nonvolatile solubilizers due to the special chemical structure and the use of aqueous systems. A particular advantage that results from this is that environmentally friendly solvents are no longer used. Also, no droplet residues can occur due to highly volatile solubilizers, which complicate or prevent the perfect soldering of the electrical component. A conventional thermal post-processing step is no longer required, which increases the yield and reduces production times. Functional impairments of the coated components do not occur.
Die erhaltenen Beschichtungen zeichnen sich weiterhin durch hohe Lagerstabilität und Homogenität aus, was die Qualität der Bauteile verbessert und die Ausfallquote verringert.The coatings obtained are also characterized by high storage stability and homogeneity, which improves the quality of the components and reduces the failure rate.
Weiterhin betrifft die Erfindung ein Beschichtungs-Mittel zur Verminderung von Lötrückständen auf nicht zur Verlötung vorgesehenen Flächen eines mehrere Flächen aufweisenden elektri- sehen Bauelements, das an mindestens einer Fläche zu verlöten ist, wobei auf den nicht für die Verlötung vorgesehenen Flächen des elektrischen Bauelements das Beschichtungs-Mittel aufzubringen ist, wobei das Beschichtungs-Mittel ein Siloxan ist .The invention further relates to a coating agent for reducing solder residues on surfaces not intended for soldering of an electrical see component that is to be soldered to at least one surface, wherein the coating agent is to be applied to the surfaces of the electrical component that are not intended for the soldering, the coating agent being a siloxane.
Dem folgend besteht nach einer weiteren Ausgestaltung der Erfindung das Beschichtungs-Mittel aus einem polyethermodifi- zierten Dirnethylpolysiloxan.Following this, according to a further embodiment of the invention, the coating composition consists of a polyether-modified dirnethyl polysiloxane.
Vorteilhafterweise ist das Beschichtungs-Mittel in einer 0,01 - 5%igen, besonders bevorzugt in einer 0,01 - 2,5%igen wäss- rigen Lösung zum Auftrag auf eine hierfür vorgesehene Fläche vorzugsweise ohne weitere Lösungsmittelzusätze gelöst. Hier- durch ist nach dem Aufbringen des Beschichtungs-Mittels und dem Verdampfen des Wassers der wässrigen Lösung ein gleichmäßiger Auftrag des Beschichtungs-Mittels gewährleistet, ohne dass sonstige schwerverdampfbare Lösungsmittelrückstände zurückbleiben. Ein sich hieraus ergebender Vorteil liegt darin, dass durch Einsatz einer wässrigen Lösung keine umweltunverträglichen Lösungsmittel mehr zum Einsatz kommen. Das Beschichtungs-Mittel zeigt keine sonst üblichen Verfärbungen oder Rückstände auf der Bauteiloberfläche aufgrund thermischer Zersetzungsreaktionen, die durch die früher notwendige Wärmebehandlung zur Verdampfung der Lösungsmittel entstanden.The coating agent is advantageously dissolved in a 0.01-5% strength, particularly preferably in a 0.01-2.5% strength aqueous solution for application to a surface provided for this purpose, preferably without further solvent additions. In this way, after the coating agent has been applied and the water in the aqueous solution has evaporated, a uniform application of the coating agent is ensured without other difficult-to-evaporate solvent residues remaining. A resultant advantage is that by using an aqueous solution, environmentally friendly solvents are no longer used. The coating agent shows no other usual discolouration or residues on the component surface due to thermal decomposition reactions, which were caused by the previously required heat treatment to evaporate the solvents.
Die wässrige Lösung wird vorzugsweise durch Stempeln (zum Beispiel mittels Tampon, Walze oder Schwamm), Tauchen (zum Durchziehen durch ein Tauchbad) , Sprühen oder Applizieren durch Mikrodosierverfahren mit feinen Nadeln auf das gesamteThe aqueous solution is preferably applied to the whole by stamping (for example using a tampon, roller or sponge), dipping (for pulling through a dipping bath), spraying or application by microdosing with fine needles
Gehäuse des Bauelements aufgebracht. Eine mit der erfindungsgemäßen wässrigen Lösung mögliche kurze Einwirkzeit von vorzugsweise zwischen ca. 1 und 30 Sekunden verhindert vorteilhafterweise weitestgehend ein schädigendes Eindringen der Lösung in das Kunststoffgehäuse . Dadurch können mechanische Schädigungen im Kunststoffgehäuse während des Lötprozesses sowie während des Betriebs, wie zum Beispiel Delamination, reduziert werden.Housing of the component applied. A short exposure time of preferably between approximately 1 and 30 seconds, which is possible with the aqueous solution according to the invention advantageously advantageously largely prevents the solution from penetrating into the plastic housing. This can cause mechanical damage in the plastic housing during the soldering process as well as during operation, such as delamination.
Die Trocknung des Films erfolgt vorteilhafterweise in einem Luftstrom, der keine erhöhten Temperaturen aufweisen muss .The film is advantageously dried in an air stream which does not have to be at elevated temperatures.
Durch Verwendung der wässrigen Lösung ohne Lösungsmittelzusätze werden gesundheitsgefährdende Ausgasungen größtenteils vermieden. Das Beschichtungsmaterial zeigt weiterhin ein ge- ringes Gefährdungspotential für Mensch und Umwelt, insbesondere einen geringen Dampfdruck. Verbrauchte Beschichtungslö- sungen können folglich problemlos entsorgt werden und beschichteten Bauelemente können inbesondere wegen des geringen Dampfdruckes in besonders kritischen Anwendungsbereichen, wie zum Beispiel Automobilanwendungen im Innenraum, Consumerelek- tronik und Medizinbereich eingesetzt werden.By using the aqueous solution without the addition of solvents, harmful gas emissions are largely avoided. The coating material also shows a low hazard potential for humans and the environment, in particular a low vapor pressure. Used coating solutions can consequently be disposed of without any problems and coated components can be used in particularly critical application areas, such as, for example, automotive applications in the interior, consumer electronics and medical areas, in particular because of the low vapor pressure.
Abgepufferte Beschichtungslösungen mit einem pH-Wert zwischen ca. 5,0 und ca. 7,0 sind vorteilhafterweise bis zu drei Mona- ten haltbar und einsetzbar.Buffered coating solutions with a pH between approx. 5.0 and approx. 7.0 can advantageously be kept and used for up to three months.
Die Lötmittel-Antihaft-Schicht ist vorteilhafterweise sehr lichtstabil und kann durch Zugabe von Lichtschutzmitteln und UV-Absorbern (z. B. Benzophenone, Benzoriazole, sterisch- gehinderte Amine mit pH vorzugsweise zwischen 6,0 und 7,5) weiter gesteigert werden, wodurch die Strahlungs- und Witterungsstabilität des Kuntstoffgehäuses verbessert ist. Die Beschichtung eignet sich vorteilhafterweise auch für optoelektronische Bauelemente mit intensiver und/oder energierei- eher Strahlung, z. B. blaues Licht und UV-Strahlung emittierender Leuchtdioden und Hochleistungs-Leuchtdioden.The solder non-stick layer is advantageously very light-stable and can be further increased by adding light stabilizers and UV absorbers (for example benzophenones, benzoriazoles, sterically hindered amines with a pH preferably between 6.0 and 7.5), as a result of which the radiation and weather stability of the plastic housing is improved. The coating is advantageously also suitable for optoelectronic components with intensive and / or more energy-producing radiation, eg. B. blue light and UV radiation emitting LEDs and high-performance LEDs.
Die Beschichtungslösungen werden bevorzugt auf Thermoplastgehäusen aus LCP, PBT, PET, PC, PA und/oder besonders bevorzugt auf Polyphtalamid mit oder ohne Füllstoffzusatz (wie z. B.The coating solutions are preferably on thermoplastic housings made of LCP, PBT, PET, PC, PA and / or particularly preferably on polyphthalamide with or without filler additive (such as
Titanoxid, Siliziumoxid, Aluminiumoxid etc.) und/oder Epoxidharz-, Silikon- oder Acrylatvergussmassen (vorzugsweise Epoxid-Anhydrid-Formstoffe) eingesetzt. Die Epoxidharz-, Silikon- oder Acrylatvergussmassen können Diffusormaterialien wie Calziumfluorid, Bariumsulfat, Siliziumoxid, Aluminiumoxid, Glaskugeln etc. sowie Lumineszenzkonverionspigmente enthalten.Titanium oxide, silicon oxide, aluminum oxide etc.) and / or epoxy resin, silicone or acrylate casting compounds (preferably Epoxy anhydride molding materials) used. The epoxy resin, silicone or acrylate casting compounds can contain diffuser materials such as calcium fluoride, barium sulfate, silicon oxide, aluminum oxide, glass spheres etc. and luminescence conversion pigments.
Weitere Vorteile, Besonderheiten und zweckmäßige Weiterbildungen der Erfindung ergeben sich aus den Unteransprüchen und dem im Folgenden in Verbindung mit der Zeichnung erläuterten Ausführungsbeispiel. Es zeigen:Further advantages, special features and expedient developments of the invention result from the subclaims and the exemplary embodiment explained below in conjunction with the drawing. Show it:
Figur 1 eine schematische Schnittdarstellung eines Ausführungsbeispieles eines verlöteten, erfindungsgemäßen elektrischen Bauelements mit einer Lötmittel- Antihaft-Schicht; undFigure 1 is a schematic sectional view of an embodiment of a soldered electrical component according to the invention with a solder non-stick layer; and
Figur 2 eine schematische Schnittdarstellung eines verlöteten, herkömmlichen elektrischen Bauelements mit Lötrückständen.Figure 2 is a schematic sectional view of a soldered, conventional electrical component with solder residues.
In Figur 1 ist ein oberflächenmontierbares strahlungsemittie- rendes und/oder strahlungsempfandendes optoelektronisches Bauelement 1 in verlötetem Zustand dargestellt. Das Bauelement 1 ist hierbei mit zu verlötenden metallischen Lötberei- chen 4 vermittels des Lotes 3 mit den auf einer Platine 7 gedruckten Leiterbahnen 8 verlötet. Die anderen Bereiche 5 der Oberfläche 2 eines Kunststoffgehäuses 14 des Bauelements 1, die nicht zur Verlötung vorgesehen sind, sind mit einer Lötmittel-Antihaft-Schicht 6 überzogen. Bei dem erfindungsge- mäßen Einsatz von polyethermodifiziertem Dimethylpolysiloxan als wesentlichem Bestandteil der Lötmittel-Antihaft-Schicht 6 ist ein Benetzen von Oberflächen 5 des Kuntstoffgehäuses 14 mit Lot, weitestgehend verhindert.FIG. 1 shows a surface-mountable radiation-emitting and / or radiation-sensing optoelectronic component 1 in the soldered state. The component 1 is in this case soldered to the metallic soldering areas 4 to be soldered by means of the solder 3 to the conductor tracks 8 printed on a circuit board 7. The other areas 5 of the surface 2 of a plastic housing 14 of the component 1, which are not intended for soldering, are coated with a solder non-stick layer 6. When using polyether-modified dimethylpolysiloxane according to the invention as an essential component of the solder non-stick layer 6, wetting of surfaces 5 of the plastic housing 14 with solder is largely prevented.
In Figur 2 ist eine solche ungewollte Benetzung bzw. Anhaf- tung 10, 11, 12 und 13 von Lot 3 auf nicht hierfür vorgesehenen Flächen 5 eines Gehäuses 14 eines herkömmlichen oberflä- chenmontierbaren strahlungsemittierenden und/oder strahlungs- empfandenden optoelektronischen Bauelements 1 ohne Lötmittel- Antihaft-Schicht schematisch dargestellt. Wieder ist das Bauelement 1 in verlötetem Zustand dargestellt. Das Bauelement 1 ist wiederum mit den zu verlötenden Lötbereichen 4 vermittels des Lotes 3 mit den auf einer Platine 7 gedruckten Leiterbahnen 8 verlötet. Hierbei kommt es zu vereinzelten Anhaftungen von Lötrückständen 10 (Lot, Flussmittel, etc.) auf rauen oder leicht benetzbaren Stellen, beispielsweise der Linse einer LED, zu Anhaftungen von Lötrückständen 11 in Winkeln oderSuch an unwanted wetting or adhesion 10, 11, 12 and 13 of solder 3 on surfaces 5 of a housing 14 of a conventional surface not provided for this purpose is shown in FIG. Chen-mountable radiation-emitting and / or radiation-sensing optoelectronic component 1 without solder non-stick layer is shown schematically. The component 1 is again shown in the soldered state. The component 1 is in turn soldered to the soldering areas 4 to be soldered by means of the solder 3 to the conductor tracks 8 printed on a circuit board 7. This leads to isolated buildup of solder residues 10 (solder, flux, etc.) on rough or easily wettable areas, for example the lens of an LED, to buildup of solder residues 11 at angles or
Ecken der Oberfläche 2 des Bauelements 1, sowie zu Überhängen von Lot 12, die durch eine teilweise Benetzung der nicht zur Verlötung vorgesehenen Bereiche 5 entstehen, und sowie zu Kurzschlussbrücken 13, die durch auf der Oberfläche 2 zusam- menfließendes Lot 3 zwischen einzelnen Kontakt- bzw. Lötflächen 4 entstehen.Corners of the surface 2 of the component 1, as well as overhangs of solder 12, which are caused by partial wetting of the areas 5 not intended for soldering, and short-circuit bridges 13, which are caused by solder 3 flowing together on the surface 2 between individual contacts or solder pads 4 arise.
Eine wässrige Lösung des Materials der Lötmittel-Antihaft- Schicht wird vorzugsweise durch Stempeln (zum Beispiel mit- tels Tampon, Walze oder Schwamm), Tauchen (zum Durchziehen durch ein Tauchbad) , Sprühen oder Applizieren durch Mikrodo- sierverfahren mit feinen Nadeln auf das gesamte Oberflächen- montierbare Strahlungsemittierende und/oder strahlungsempfan- dende optoelektronische Bauelement aufgebracht. Eine mit der erfindungsgemäßen wässrigen Lösung mögliche kurze Einwirkzeit von vorzugsweise zwischen ca. 1 und 30 Sekunden verhindert vorteilhafterweise weitestgehend ein schädigendes Eindringen der Lösung in das Kunststoffgehäuse . Dadurch können mechanische Schädigungen im Kunststoffgehäuse während des Lötprozes- ses sowie während des Betriebs, wie zum Beispiel Delaminati- on, reduziert werden.An aqueous solution of the material of the solder non-stick layer is preferably applied to the whole by stamping (for example using a tampon, roller or sponge), dipping (for pulling through a dipping bath), spraying or application by microdosing with fine needles Surface-mountable radiation-emitting and / or radiation-sensing optoelectronic components are applied. A short contact time of preferably between approximately 1 and 30 seconds, which is possible with the aqueous solution according to the invention advantageously advantageously largely prevents the solution from penetrating into the plastic housing. This can reduce mechanical damage in the plastic housing during the soldering process and during operation, such as delamination.
Die Trocknung des Films erfolgt vorteilhafterweise in einem Luftstrom, der keine erhöhten Temperaturen aufweisen uss .The film is advantageously dried in an air stream which does not have to have elevated temperatures.
Die wässrige Lösung des polyethermodifizierten Dimethylpolysiloxan setzt sich erfindungsgemäß aus 0,1 - 5% polyethermo- difizierten Dimethylpolysiloxan, beispielsweise BYK348 der Firma Byk-Chemie GmbH, und deionisiertem Wasser zusammen. Hierdurch wird ein optimal trockenes Leadframe und ein homogen beschichtetes Gehäuse erreicht, ohne, dass hierfür spezi- eile Masken oder sonstige Hilfsmittel zur Anwendung kommen müssen.According to the invention, the aqueous solution of the polyether-modified dimethylpolysiloxane is composed of 0.1-5% polyethermo- dified dimethylpolysiloxane, for example BYK348 from Byk-Chemie GmbH, and deionized water together. In this way, an optimally dry lead frame and a homogeneously coated housing is achieved without the need for special masks or other aids.
Besonders bevorzugt wird auf spezielle Wärmeeinwirkungen zur Trocknung oder zur Homogenisierung der Beschichtung verzich- tet . Hierdurch wird eine höhere Ausbeute und eine schnellere Produktion ermöglicht.Special heat effects for drying or for homogenizing the coating are particularly preferably dispensed with. This enables a higher yield and faster production.
Die Lötmittel-Antihaft-Schicht enthält vorzugsweise ein Lichtschutzmittel und/oder einen UV-Absorber (z. B. Benzophe- none, Benzoriazole, sterisch-gehinderte Amine mit pH vorzugsweise zwischen 6,0 und 7,5), wodurch die Strahlungs- und Witterungsstabilität des Kuntstoffgehäuses verbessert ist. The solder non-stick layer preferably contains a light stabilizer and / or a UV absorber (for example benzophenones, benzoriazoles, sterically hindered amines with a pH preferably between 6.0 and 7.5), as a result of which the radiation and Weather stability of the plastic housing is improved.

Claims

Patentansprüche claims
1. Elektronisches, insbesondere oberflächenmontierbares strahlungsemittierendes und/oder Strahlungsempfandendes opto- elektronisches Bauelement (1) , mit einem Kunststoffgehäuse (10), das mindestens einen metallischen Lötbereich (4) aufweist, d a d u r c h g e k e n n z e i c h n e t, dass die Oberfläche des Kunststoffgehäuses (10), ausgenommen der metallische Lötbereich (4) , zumindest teilweise mit einer Lötmittel-Antihaft-Schicht (6) überzogen ist.1. Electronic, in particular surface-mountable, radiation-emitting and / or radiation-sensing optoelectronic component (1), with a plastic housing (10) which has at least one metallic soldering area (4), characterized in that the surface of the plastic housing (10), with the exception of the metallic one Soldering area (4), at least partially covered with a solder non-stick layer (6).
2. Elektronisches Bauelement nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, dass die Lötmittel-Antihaft-Schicht (6) im wesentlichen Si- loxan aufweist.2. The electronic component as claimed in claim 1, so that the solder non-stick layer (6) essentially has siloxane.
3. Elektronisches Bauelement nach Anspruch 1 oder 2 , d a d u r c h g e k e n n z e i c h n e t, dass die Lötmittel-Antihaft-Schicht (6) im wesentlichen Poly- siloxan aufweist.3. Electronic component according to claim 1 or 2, so that the solder non-stick layer (6) essentially has polysiloxane.
4. Elektronisches Bauelement nach einem der vorherigen Ansprüche, d a d u r c h g e k e n n z e i c h n e t, dass die Lötmittel-Antihaft-Schicht (6) im wesentlichen auf Methylpolysiloxan basiert.4. Electronic component according to one of the preceding claims, that the solder non-stick layer (6) is essentially based on methyl polysiloxane.
5. Elektronisches Bauelement nach einem der vorherigen An- sprüche, d a d u r c h g e k e n n z e i c h n e t, dass die Lötmittel-Antihaft-Schicht (6) im wesentlichen auf Dimethylpolysiloxan basiert.5. Electronic component according to one of the preceding claims, ie that the solder non-stick layer (6) is essentially based on dimethylpolysiloxane.
6. Elektronisches Bauelement nach einem der vorherigen An- sprüche, d a d u r c h g e k e n n z e i c h n e t, dass die Lötmittel-Antihaft-Schicht (6) im wesentlichen auf polyethermodifiziertem Dimethylpolysiloxan basiert.6. Electronic component according to one of the preceding claims, characterized in that the solder non-stick layer (6) is essentially based on polyether-modified dimethylpolysiloxane.
7. Elektronisches Bauelement nach einem der vorherigen Ansprüche, d a d u r c h g e k e n n z e i c h n e t, dass das Kunststoffgehäuse (14) einen Strahlungsemittierenden und/oder strahlungsdetektierenden Halbleiterkörper enthält, der in einen für die emittierte und/oder empfangene Strahlung transparenten Kunststoff eingebettet ist.7. Electronic component according to one of the preceding claims, that the plastic housing (14) contains a radiation-emitting and / or radiation-detecting semiconductor body which is embedded in a plastic which is transparent to the emitted and / or received radiation.
8. Verfahren Herstellen eines elektronischen, insbesondere eines oberflächenmontierbaren Strahlungsemittierenden und/oder Strahlungsempfandenden optoelektronischen Bauelements (1) mit einem Kunstsfoffgehäuse (14), das mindestens einen metallischen Lötbereich (4) aufweist, d a d u r c h g e k e n n z e i c h n e t, dass ausschließlich das Kunststoffgehäuse oder ein Teil des Kunststoffgehäuses mit einer Lötmittel-Antihaft-Schicht (6) beschichtet wird, die im wesentlichen Siloxan aufweist und in einer wässrigen Lösung ohne weitere Lösungsmittelzusätze auf das Kunststoffgehäuse (14) aufgebracht wird.8. Method of producing an electronic, in particular a surface-mountable, radiation-emitting and / or radiation-receiving optoelectronic component (1) with a plastic housing (14) which has at least one metallic soldering area (4), characterized in that only the plastic housing or a part of the plastic housing with a Solder non-stick layer (6) is coated, which essentially has siloxane and is applied to the plastic housing (14) in an aqueous solution without further solvent additives.
9. Verfahren nach Anspruch 8, d a d u r c h g e k e n n z e i c h n e t, dass eine 0,01 - 5%ige wässrige Lösung des Materials der Lötmittel-Antihaft-Schicht (6) verwendet wird.9. The method according to claim 8, so that a 0.01 - 5% aqueous solution of the material of the solder non-stick layer (6) is used.
10. Verfahren nach Anspruch 9, d a d u r c h g e k e n n z e i c h n e t, dass zur Herstellung einer weitestgehend klebfreien Lötmittel-Antihaftschicht eine 0,01 - 2,5%ige wässrige Lösung des Materials der Lötmittel-Antihaft-Schicht (6) verwendet wird.10. The method according to claim 9, so that a 0.01-2.5% aqueous solution of the material of the solder non-stick layer (6) is used to produce a largely non-tacky solder non-stick layer.
11. Verfahren nach Anspruch 8, 9 oder 10, d a d u r c h g e k e n n z e i c h n e t, dass die gesamte Oberfläche des Gehäuses (14) einschließlich der Lötbereiche (4) mit der wässrigen Lösung, insbesondere durch Tauchen, Besprühen, Auftropfen und/oder mittels eines Schwamms oder dergleichen, beaufschlagt wird.11. The method according to claim 8, 9 or 10, characterized in that the entire surface of the housing (14) including the soldering areas (4) is acted upon by the aqueous solution, in particular by dipping, spraying, dripping on and / or by means of a sponge or the like.
12. Verfahren nach Anspruch 10, d a d u r c h g e k e n n z e i c h n e t, dass die Einwirkzeit bei der Beaufschlagung zwischen ca. 112. The method according to claim 10, d a d u r c h g e k e n n z e i c h n e t that the action time when applied between about 1
Sekunde und ca. 30 Sekunden liegt.Second and about 30 seconds.
13. Verfahren nach einem der Ansprüche 8 bis 11, d a d u r c h g e k e n n z e i c h n e t, dass die wässrige Lösung bei Raumtemperatur aufgebracht wird und nachfolgend eine Trocknung in Luft erfolgt ohne dass ein thermischer Nachbearbeitungsschritt erfolgt.13. The method according to any one of claims 8 to 11, that the aqueous solution is applied at room temperature and subsequently dried in air without a thermal post-processing step.
14. Verfahren nach einem der Ansprüche 8 bis 12, d a d u r c h g e k e n n z e i c h n e t, dass eine wässrige Lösung mit einem Phosphatpufferzusatz in einer Konzentration von 0,01 mmol/1 bis 0,1 mmol/1 verwendet wird.14. The method according to any one of claims 8 to 12, so that an aqueous solution with an addition of phosphate buffer is used in a concentration of 0.01 mmol / 1 to 0.1 mmol / 1.
15. Verfahren nach einem der Ansprüche 8 bis 13, d a d u r c h g e k e n n z e i c h n e t, dass die wässrige Lösung einen Fungizidzusatz aufweist.15. The method according to any one of claims 8 to 13, d a d u r c h g e k e n e z e i c h n e t that the aqueous solution has a fungicide additive.
16. Beschichtungs-Mittel zur Verminderung von Lötrückständen auf nicht zur Verlötung vorgesehenen Flächen (5) eines mehrere Flächen aufweisenden elektronischen, insbesondere oberflä- chenmontierbaren Strahlungsemittierenden und/oder strahlungs- empfandenden optoelektronischen Bauelements (1) mit einem Kunstsfoffgehäuse (14), das mindestens einen metallischen Lötbereich (4) aufweist, wobei das Beschichtungs-Mittel (9) im Wesentlichen ein Siloxan ist.16. Coating agent for reducing solder residues on surfaces (5) not intended for soldering of an electronic, in particular surface-mountable, radiation-emitting and / or radiation-sensing optoelectronic component (1) with a plastic housing (14) which has at least one Has metallic soldering area (4), wherein the coating agent (9) is essentially a siloxane.
17. Beschichtungs-Mittel nach Anspruch 15, wobei das Beschichtungs-Mittel (9) ein Polysiloxan ist 17. A coating agent according to claim 15, wherein the coating agent (9) is a polysiloxane
18. Beschichtungs-Mittel nach Anspruch 16, wobei das Beschichtungs-Mittel (9) ein Methylpolysiloxan ist.18. A coating agent according to claim 16, wherein the coating agent (9) is a methylpolysiloxane.
19. Beschichtungs-Mittel nach Anspruch 17, wobei das Beschichtungs-Mittel (9) ein Dimethylpolysiloxan ist .19. The coating agent according to claim 17, wherein the coating agent (9) is a dimethylpolysiloxane.
20. Beschichtungs-Mittel nach Anspruch 18, wobei das Beschichtungs-Mittel (9) ein polyethermodifiziertes Dimethylpolysiloxan ist.20. The coating agent according to claim 18, wherein the coating agent (9) is a polyether-modified dimethylpolysiloxane.
21. Beschichtungs-Mittel nach einem der Ansprüche 12 bis 19, wobei das Beschichtungs-Mittel (9) in einer 0,01 - 5%igen wässrigen Lösung ohne weitere Lösungsmittelzusätze zum Auf- trag auf eine hierfür vorgesehene Fläche gelöst ist.21. Coating agent according to one of claims 12 to 19, wherein the coating agent (9) is dissolved in a 0.01-5% aqueous solution without further solvent additives for application to a surface provided for this purpose.
22. Beschichtungs-Mittel nach Anspruch 20, wobei die wässrige Lösung einen Phosphatpufferzusatz in einer Konzentration von 0,01 mmol/1 bis 0,1 mmol/1 aufweist.22. Coating composition according to claim 20, wherein the aqueous solution has a phosphate buffer additive in a concentration of 0.01 mmol / 1 to 0.1 mmol / 1.
23. Beschichtungs-Mittel nach Anspruch 20 oder 21, wobei die wässrige Lösung einen Fungizidzusatz aufweist.23. A coating composition according to claim 20 or 21, wherein the aqueous solution has a fungicide additive.
24. Beschichtungs-Mittel nach nach einem der Ansprüche 12 bis 22, wobei die wässrige Lösung und folglich die fertige Lötmittel-Antihaft-Schicht (6), ein Antikorrosionsmittel aufweist .24. Coating agent according to one of claims 12 to 22, wherein the aqueous solution and consequently the finished solder non-stick layer (6) comprises an anti-corrosion agent.
25. Beschichtungs-Mittel nach nach einem der Ansprüche 12 bis 23, wobei die wässrige Lösung einen pH-Wert zwischen ca. 5,0 und ca. 7,0 aufweist.25. Coating composition according to one of claims 12 to 23, wherein the aqueous solution has a pH between about 5.0 and about 7.0.
26. Beschichtungs-Mittel nach einem der Ansprüche 12 bis 24, wobei die wässrige Lösung und folglich die fertige Lötmittel- Antihaft-Schicht (6), Lichtschutzmittel und/oder UV-Absorber, bevorzugt mit einer Konzentration bis 1%, aufweist. 26. Coating agent according to one of claims 12 to 24, wherein the aqueous solution and consequently the finished solder non-stick layer (6), light stabilizers and / or UV absorbers, preferably at a concentration up to 1%.
PCT/DE2000/003290 1999-09-21 2000-09-21 Electronic component and coating agent WO2001022501A1 (en)

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WO2014037263A1 (en) * 2012-09-05 2014-03-13 Osram Opto Semiconductors Gmbh Housing for an optical component, assembly, method for producing a housing and method for producing an assembly

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DE19945131A1 (en) 2001-04-12

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