WO2001014618A3 - Apparatus and method for electroplating a material layer onto a wafer - Google Patents

Apparatus and method for electroplating a material layer onto a wafer Download PDF

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Publication number
WO2001014618A3
WO2001014618A3 PCT/US2000/022312 US0022312W WO0114618A3 WO 2001014618 A3 WO2001014618 A3 WO 2001014618A3 US 0022312 W US0022312 W US 0022312W WO 0114618 A3 WO0114618 A3 WO 0114618A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
anode
electroplating
material layer
electrical current
Prior art date
Application number
PCT/US2000/022312
Other languages
French (fr)
Other versions
WO2001014618A2 (en
Inventor
Ajit P Paranjpe
Mehrdad M Moslehi
Original Assignee
Cvc Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cvc Products Inc filed Critical Cvc Products Inc
Priority to AU67730/00A priority Critical patent/AU6773000A/en
Publication of WO2001014618A2 publication Critical patent/WO2001014618A2/en
Publication of WO2001014618A3 publication Critical patent/WO2001014618A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

An apparatus and method for electroplating a material layer onto a wafer is disclosed. The apparatus comprises a wafer support for maintaining a wafer within an electrolyte solution during electroplating. A probe, proximate the wafer support, receives an electrical current and is operable to electrically couple to the wafer. An anode comprising the material is proximate the wafer support. An anode source is electrically coupled to the anode. The anode source induces electrical current between the wafer and the anode by providing a potential difference to the anode such that the anode is positively charged relative to the wafer. A current controller varies the induced electrical current as the material is deposited upon the wafer.
PCT/US2000/022312 1999-08-26 2000-08-14 Apparatus and method for electroplating a material layer onto a wafer WO2001014618A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU67730/00A AU6773000A (en) 1999-08-26 2000-08-14 Apparatus and method for electroplating a material layer onto a wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38366199A 1999-08-26 1999-08-26
US09/383,661 1999-08-26

Publications (2)

Publication Number Publication Date
WO2001014618A2 WO2001014618A2 (en) 2001-03-01
WO2001014618A3 true WO2001014618A3 (en) 2001-07-26

Family

ID=23514120

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/022312 WO2001014618A2 (en) 1999-08-26 2000-08-14 Apparatus and method for electroplating a material layer onto a wafer

Country Status (2)

Country Link
AU (1) AU6773000A (en)
WO (1) WO2001014618A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10100297A1 (en) * 2001-01-04 2002-07-18 Gesimat Gmbh Device and method for electrochemical coating

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04143299A (en) * 1990-10-03 1992-05-18 Fujitsu Ltd Electroplating method
JPH05243183A (en) * 1992-02-28 1993-09-21 Nec Corp Manufacture of semiconductor device
JPH07197299A (en) * 1993-12-29 1995-08-01 Casio Comput Co Ltd Plating method and plating device
JPH11135462A (en) * 1997-10-28 1999-05-21 Shinjiro Suganuma Semiconductor manufacturing device
WO1999031304A1 (en) * 1997-12-16 1999-06-24 Ebara Corporation Plating device and method of confirming current feed
WO1999031299A1 (en) * 1997-09-30 1999-06-24 Semitool, Inc. Electrodes for semiconductor electroplating apparatus and their application
WO2000003426A1 (en) * 1998-07-09 2000-01-20 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6074544A (en) * 1998-07-22 2000-06-13 Novellus Systems, Inc. Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04143299A (en) * 1990-10-03 1992-05-18 Fujitsu Ltd Electroplating method
JPH05243183A (en) * 1992-02-28 1993-09-21 Nec Corp Manufacture of semiconductor device
JPH07197299A (en) * 1993-12-29 1995-08-01 Casio Comput Co Ltd Plating method and plating device
WO1999031299A1 (en) * 1997-09-30 1999-06-24 Semitool, Inc. Electrodes for semiconductor electroplating apparatus and their application
JPH11135462A (en) * 1997-10-28 1999-05-21 Shinjiro Suganuma Semiconductor manufacturing device
WO1999031304A1 (en) * 1997-12-16 1999-06-24 Ebara Corporation Plating device and method of confirming current feed
WO2000003426A1 (en) * 1998-07-09 2000-01-20 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6074544A (en) * 1998-07-22 2000-06-13 Novellus Systems, Inc. Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Derwent World Patents Index; AN 1999-363171, XP002158735 *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 419 (C - 0981) 3 September 1992 (1992-09-03) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 702 (E - 1482) 21 December 1993 (1993-12-21) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 11 26 December 1995 (1995-12-26) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 10 31 August 1999 (1999-08-31) *

Also Published As

Publication number Publication date
AU6773000A (en) 2001-03-19
WO2001014618A2 (en) 2001-03-01

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