WO2000065393A1 - Circuit photonique integre comprenant un composant optique resonant et procedes de fabrication de ce circuit - Google Patents
Circuit photonique integre comprenant un composant optique resonant et procedes de fabrication de ce circuit Download PDFInfo
- Publication number
- WO2000065393A1 WO2000065393A1 PCT/FR2000/001062 FR0001062W WO0065393A1 WO 2000065393 A1 WO2000065393 A1 WO 2000065393A1 FR 0001062 W FR0001062 W FR 0001062W WO 0065393 A1 WO0065393 A1 WO 0065393A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- optical component
- light guide
- integrated photonic
- photonic circuit
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12166—Manufacturing methods
- G02B2006/12176—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
Definitions
- the present invention relates to integrated photonic circuits.
- the subject of the present invention is an integrated photonic circuit in which a resonant optical component, for example a laser emitter, is optically coupled to a light guide formed on a substrate, with a coupling efficiency greater than that of the coupling mentioned above, between the laser of the VCSEL type and the light guide.
- a resonant optical component for example a laser emitter
- the subject of the present invention is an integrated photonic circuit formed on a substrate and comprising at least one light guide integrated into this substrate, this circuit being characterized in that it further comprises at least one resonant optical component which is integrated into the substrate and intended to emit or detect light or both, this resonant optical component being placed above a photon collector formed at the end of the light guide, and a means of vertical optical coupling between the resonant optical component and the photon collector, the latter being provided to ensure the transfer of light between the resonant optical component and the rest of the light guide by means of the vertical optical coupling means.
- the vertical optical coupling means comprises a layer of a material which is transparent to light and whose optical index is lower than that of the light guide thus than that of the material of the resonant optical component.
- the light guide is made of silicon. The invention makes it possible to efficiently couple a resonant optical component to a silicon light guide whose small cross section, although it is compatible with the dimensions required by microelectronics on silicon, does not allow, when a method is used conventional coupling, sufficient light insertion efficiency.
- silicon light guide use is preferably made, as a substrate, of a structure of silicon on insulator type or SOI structure (for “Silicon On Insulator”).
- Such structures are almost the only ones to allow the production of passive photonic circuits having dimensions compatible with microelectronics. It should in fact be noted that a strong confinement of the light in the silicon guides is obtained due to the high index contrast between the silicon and the insulator constituted by silica.
- the vertical optical coupling means comprises a layer of silica.
- a layer is well suited to the use of a silicon light guide and of a substrate having a structure of silicon on insulator type.
- the resonant optical component comprises a microresonator.
- a laser transmitter comprising a microresonator or resonant microcavity (resonator or resonant cavity whose dimensions are of the order of a few micrometers) makes it possible, by confining the photons produced, to promote the rate of spontaneous emission in the desired mode and therefore lower the stimulated emission threshold of the laser transmitter.
- Such a laser transmitter is compatible with the size requirements of photonic integration on silicon.
- the density of photonic states of the laser mode is reinforced so that the photons are compelled to occupy this mode.
- the microresonator is a microdisc microresonator ("microdisk”) or micro ring (“microring”) or a microstructure based on a two-dimensional photonic crystal.
- a microdisk or micro-ring resonator, exploiting gallery modes (called “Whispering gallery modes” in the articles in English) allows to obtain a strong confinement of photons. The same is true for a microresonator constituted by a microstructure based on two-dimensional photonic crystal.
- the material of the resonant optical component is chosen from III-V semiconductor compounds which are among the most efficient emitter and / or detector materials.
- This material may be a III-V semiconductor heterostructure with quantum wells (“quantum wells”) or with quantum dots (“quantum dots”). This allows, in the case where the resonant optical component is a laser emitter, to lower the threshold of this laser emitter by increasing the confinement of excitons in the latter.
- the stimulated emission is all the more favored when the density of convolved exciton-photon states is high in the desired laser mode.
- a one or two dimensional laser transmitter thus has a very low threshold.
- quantum wells are simpler to form than quantum dots but that the latter allow optimal confinement of excitons.
- a well-based III-V semiconductor heterostructure quantum or quantum dots can emit at wavelengths that are in the range from 1.3 ⁇ m to 1.5 ⁇ m, wavelengths at which the silicon is transparent.
- passive optical components the “silicon on insulator” technology allows, thanks to the high optical index contrast between, on the one hand, silicon and, on the other hand, silica and air, d '' ensure the strong confinement of the light which is necessary for the miniaturization of these components.
- the present invention also relates to a method of manufacturing the integrated photonic circuit object of the invention, in which a substrate is formed comprising a first layer intended for the manufacture of the light guide and a second layer intended for the manufacture of the optical coupling means and a third layer or portion of layer is added to this second layer by a technique called wafer bonding, this third layer or portion of layer being intended for the manufacture of the resonant optical component or comprising this latest.
- the present invention further relates to another method of manufacturing the integrated photonic circuit object of the invention, in which a substrate is formed comprising a first layer intended for the manufacture of the light guide and a second layer intended for the manufacture of the means of optical coupling and a heterostructure is formed on this second layer based on an active material comprising nanocrystals of InAs (forming quantum dots) in an Si or Si 3 N 4 matrix, this heterostructure being intended for the manufacture of the resonant optical component.
- Figure 1 is a schematic longitudinal sectional view of an integrated photonic circuit according to the invention
- Figure 2 is a schematic top view of a first particular embodiment of the integrated photonic circuit object of the invention , comprising a microdisc type microdisc
- Figure 3 is a schematic longitudinal sectional view of the circuit of Figure 2
- Figure 4 is a schematic top view of a second particular embodiment of the integrated photonic circuit object of the invention, comprising a microresonator based on two-dimensional photonic crystal
- Figure 5 is a schematic longitudinal sectional view of the circuit of Figure 4, and
- Figure 6 is a schematic longitudinal sectional view of a structure used for the manufacture of a circuit according to the invention.
- a laser microsource 2 with resonant microcavity is associated with a light guide 4 so as to allow the transfer of the light generated by the microsource in this light guide.
- the latter can be optically connected to other passive optical components (not shown) of the photonic circuit, which then receive the light generated by the microsource and transmitted by the light guide.
- the light guide 4 is formed, in the example shown, from a structure of silicon on insulator type.
- This structure comprises a silicon substrate 6, on which a layer of silica 8 has been formed, as well as a layer of silicon formed on this layer of silica 8 and treated to form the light guide 4.
- the laser microsource 2 is formed above one end 10 of this light guide and a layer intermediate silica 12 is interposed between the laser microsource and this end of the light guide.
- the function of the intermediate layer 12 is to transfer the light emitted by the laser microsource to the end 10 of the light guide by vertical evanescent coupling, which is symbolized by the arrow FI in FIG. 1.
- the end 10 of the waveguide which is located below this intermediate layer, is provided for recovering the light thus transferred.
- the latter then propagates in the rest 14 of the light guide (which is symbolized by the horizontal arrow F2) to be optionally sent to other passive components (not shown) of the integrated photonic circuit.
- the use of the laser microsource with a resonant microcavity 2 and the silicon-on-insulator type structure makes light transfer from the microsource to the light guide particularly efficient due to the compatibility, in terms of optical confinement, of such a laser source and such a structure.
- the end of the waveguide intended to recover the light emitted by the laser microsource and to redirect it towards the guide light must be what is called a “photon collector” and then the rest 14 of the waveguide should be sufficiently coupled to this photon collector to inhibit the resonant nature of the latter which would otherwise cause a additional light filtering (not desired).
- the laser microsource has a configuration of microdisc type 2a.
- the silicon-on-insulator type structure further comprising the silicon substrate 6, the silica layer 8 formed on the latter and, on this silica layer, the silicon light guide 4 whose end 10 constitutes then a photon collector (made of silicon).
- the intermediate layer of silica 12 On this latter is the intermediate layer of silica 12.
- the microsource of microdisk 2a type is formed on this intermediate layer.
- the width L of the light guide is 0.3 ⁇ m
- the diameter D of the microdisk microsource is approximately 5 ⁇ m
- the thickness El of the silica layer 8 is 0.5 ⁇ m
- l thickness E2 of the silicon layer, from which the collector 10 and the rest 14 of the light guide are formed is 0.2 ⁇ m
- the thickness E3 of the intermediate silica layer 12 is 0.2 ⁇ m
- the thickness E4 of the microdisc laser microsource is 0.2 ⁇ m.
- the laser microsource comprises a resonator 2b based on a two-dimensional photonic crystal.
- the end 10 of this light guide is a photon collector which is formed like a microcavity based on a two-dimensional photonic crystal and extends the rest 14
- the surface Si of this microsource based on photonic crystals is worth approximately 10 ⁇ m 2 while the surface S 2 of the photon collector is of the order of 20 ⁇ m 2 , the width L of the guide light is 0.3 ⁇ m, the thickness El of the silica layer 8 is 0.5 ⁇ m, the thickness E2 of the silicon layer, from which the end 10 and the rest 14 of the guide are formed. light is 0.2 ⁇ m, the thickness E3 of the intermediate layer 12 is 0.2 ⁇ m and the thickness E4 of the microsource based on photonic crystal is 0.2 ⁇ m.
- FIGS. 2 and 3 In the particular configuration of FIGS. 2 and 3 and in the other particular configuration of FIGS. 4 and 5 there are found the important elements of the diagram of FIG. 1, which are the resonant microcavity source, the intermediate evanescent coupling layer and the guide. light (in silicon in the examples considered).
- the free spectral interval between the cavity modes is appreciable: in the case of FIGS. 2 and 3, the free spectral interval between two modes is of the order of a few tens of nanometers for a microdisc whose radius is worth a few micrometers (see on this subject the document [2]) and, in the case of FIGS. 4 and 5, where one uses a crystal two-dimensional photonics, this interval can exceed one hundred nanometers (see document [3] on this subject).
- the laser microsource can be pumped either optically or electrically, but pumping optically is easier to set up. pumping by electric means because the latter requires the deposition of metal layers (to form electrical contacts) as well as the doping of semiconductor materials.
- the integrated photonic circuits of FIGS. 2 to 5 have the advantage of allowing the exploitation of electro-optical materials, such as InP, which have high refractive indices and are in contact with air and with materials, such as for example silica, which have low refractive indices, which ensures excellent optical confinement.
- the methods of manufacturing the active and passive parts of the integrated photonic circuits of FIGS. 2 to 5 are sufficiently independent to retain all the achievements of the techniques of manufacturing photonic circuits on structures of silicon on insulator type.
- a III-V semiconductor compound having a direct gap is preferably used, a material which is perfectly mastered for manufacturing the lasers conventionally used in the field of optical telecommunications at 1, 3 ⁇ m and 1.55 ⁇ m.
- a structure of silicon on insulator type is made up comprising a silicon substrate 6, on which a layer of silica 8 is formed, as well as a layer of silicon 16 formed on this layer of silica 8 , or a commercially available structure of this kind is used.
- This layer 20 or this portion of layer of InP is applied to this layer of silica 18 by the technique called wafer bonding.
- the laser microsource 2 is then produced from this layer 20 in InP, by epitaxy of InP / GaInAsP and known techniques for manufacturing laser microsources, so as to obtain a GaInAsP / InP heterostructure (with quantum wells or quantum dots).
- the intermediate vertical coupling layer 12 is then produced from the silica layer 18 and then the light microguide 4 (including the end 10 of the latter which is located under the layer 12) is produced from the layer of silicon 16 of the silicon on insulator structure.
- the second particular implementation mode also uses a silicon on insulator type substrate.
- a silica layer is formed intended for the formation of the intermediate coupling layer and, on this silica layer, a chemical vapor deposition is produced and epitaxy a heterostructure based on 'an active material, called SIA material and made up of InAs nanocrystals distributed in an Si or Si 3 N 4 matrix.
- This SIA material is manufactured by a combination of chemical vapor deposition techniques, to obtain the Si or Si 3 N matrix, and molecular beam epitaxy, to obtain the nanocrystals of InAs.
- the intermediate vertical coupling layer 12 and the light guide 4 are manufactured as before.
- an integrated microresonator according to the invention can be used not only as a laser emitter but also as a light amplifier or as a resonant photodetector or even as a laser emitter and resonant photodetector, alternating these two uses.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00922715A EP1173788A1 (fr) | 1999-04-23 | 2000-04-21 | Circuit photonique integre comprenant un composant optique resonant et procedes de fabrication de ce circuit |
CA002367708A CA2367708A1 (fr) | 1999-04-23 | 2000-04-21 | Circuit photonique integre comprenant un composant optique resonant et procedes de fabrication de ce circuit |
JP2000614077A JP2002543452A (ja) | 1999-04-23 | 2000-04-21 | 共振光学コンポーネントを含む集積型フォトニック回路とその製造方法 |
AU43019/00A AU4301900A (en) | 1999-04-23 | 2000-04-21 | Photonic integrated circuit comprising a resonant optical component and methods for making same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9905176A FR2792734A1 (fr) | 1999-04-23 | 1999-04-23 | Circuit photonique integre comprenant un composant optique resonant et procedes de fabrication de ce circuit |
FR99/05176 | 1999-04-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000065393A1 true WO2000065393A1 (fr) | 2000-11-02 |
Family
ID=9544793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2000/001062 WO2000065393A1 (fr) | 1999-04-23 | 2000-04-21 | Circuit photonique integre comprenant un composant optique resonant et procedes de fabrication de ce circuit |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1173788A1 (fr) |
JP (1) | JP2002543452A (fr) |
AU (1) | AU4301900A (fr) |
CA (1) | CA2367708A1 (fr) |
FR (1) | FR2792734A1 (fr) |
WO (1) | WO2000065393A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004004545A (ja) * | 2002-05-31 | 2004-01-08 | Matsushita Electric Ind Co Ltd | バンドギャップおよび構造内の伝達をチューニングするためにレーザ微細加工によって光結晶の屈折率を調整する方法 |
EP2685297A1 (fr) | 2012-07-13 | 2014-01-15 | Caliopa NV | Procédé de fabrication d'un circuit photonique avec structures actives et passives |
US8767792B2 (en) | 2006-06-30 | 2014-07-01 | Intel Corporation | Method for electrically pumped semiconductor evanescent laser |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2521660A1 (fr) * | 2003-04-23 | 2004-11-04 | Sioptical, Inc. | Dispositifs a ondes lumineuses plans et submicroniques formes sur une plate-forme optique soi (silicium sur isolant) |
US20060078254A1 (en) * | 2004-10-08 | 2006-04-13 | Djordjev Kostadin D | Vertically coupling of resonant cavities to bus waveguides |
EP2396861B1 (fr) | 2009-02-11 | 2013-08-28 | Danmarks Tekniske Universitet | Laser à cavité verticale hybride |
TWI436114B (zh) | 2010-05-24 | 2014-05-01 | Univ Nat Central | 具有光波導結構之發射端模組和接收端模組 |
KR20130085763A (ko) * | 2012-01-20 | 2013-07-30 | 삼성전자주식회사 | 광 집적 회로용 혼성 레이저 광원 |
GB2555100B (en) * | 2016-10-14 | 2020-07-08 | Toshiba Res Europe Limited | A photon source and a method of fabricating a photon source |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3820171A1 (de) * | 1988-06-14 | 1989-12-21 | Messerschmitt Boelkow Blohm | Wellenleiter/detektor-kombination |
US5513288A (en) * | 1992-06-15 | 1996-04-30 | Robert Bosch Gmbh | Optical polymer element for coupling photoelements onto integrated-optical circuits |
US5787105A (en) * | 1995-01-20 | 1998-07-28 | Nikon Corporation | Integrated semiconductor laser apparatus |
US5838870A (en) * | 1997-02-28 | 1998-11-17 | The United States Of America As Represented By The Secretary Of The Air Force | Nanometer-scale silicon-on-insulator photonic componets |
-
1999
- 1999-04-23 FR FR9905176A patent/FR2792734A1/fr active Pending
-
2000
- 2000-04-21 JP JP2000614077A patent/JP2002543452A/ja not_active Withdrawn
- 2000-04-21 WO PCT/FR2000/001062 patent/WO2000065393A1/fr not_active Application Discontinuation
- 2000-04-21 CA CA002367708A patent/CA2367708A1/fr not_active Abandoned
- 2000-04-21 EP EP00922715A patent/EP1173788A1/fr not_active Withdrawn
- 2000-04-21 AU AU43019/00A patent/AU4301900A/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3820171A1 (de) * | 1988-06-14 | 1989-12-21 | Messerschmitt Boelkow Blohm | Wellenleiter/detektor-kombination |
US5513288A (en) * | 1992-06-15 | 1996-04-30 | Robert Bosch Gmbh | Optical polymer element for coupling photoelements onto integrated-optical circuits |
US5787105A (en) * | 1995-01-20 | 1998-07-28 | Nikon Corporation | Integrated semiconductor laser apparatus |
US5838870A (en) * | 1997-02-28 | 1998-11-17 | The United States Of America As Represented By The Secretary Of The Air Force | Nanometer-scale silicon-on-insulator photonic componets |
Non-Patent Citations (2)
Title |
---|
BABA T: "Photonic crystals and microdisk cavities based on GaInAsP-InP system", IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, JUNE 1997, IEEE, USA, vol. 3, no. 3, pages 808 - 830, XP002127166, ISSN: 1077-260X * |
ZHANG J P ET AL: "DIRECTIONAL LIGHT OUTPUT FROM PHOTONIC-WIRE MICROCAVITY SEMICONDUCTOR LASERS", IEEE PHOTONICS TECHNOLOGY LETTERS,US,IEEE INC. NEW YORK, vol. 8, no. 8, pages 968-970, XP000621629, ISSN: 1041-1135 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004004545A (ja) * | 2002-05-31 | 2004-01-08 | Matsushita Electric Ind Co Ltd | バンドギャップおよび構造内の伝達をチューニングするためにレーザ微細加工によって光結晶の屈折率を調整する方法 |
US8767792B2 (en) | 2006-06-30 | 2014-07-01 | Intel Corporation | Method for electrically pumped semiconductor evanescent laser |
EP2685297A1 (fr) | 2012-07-13 | 2014-01-15 | Caliopa NV | Procédé de fabrication d'un circuit photonique avec structures actives et passives |
WO2014009029A1 (fr) | 2012-07-13 | 2014-01-16 | Caliopa Nv | Procédé de fabrication d'un circuit photonique à structures actives et passives |
US9799791B2 (en) | 2012-07-13 | 2017-10-24 | Huawei Technologies Co., Ltd. | Process for manufacturing a photonic circuit with active and passive structures |
Also Published As
Publication number | Publication date |
---|---|
AU4301900A (en) | 2000-11-10 |
FR2792734A1 (fr) | 2000-10-27 |
CA2367708A1 (fr) | 2000-11-02 |
JP2002543452A (ja) | 2002-12-17 |
EP1173788A1 (fr) | 2002-01-23 |
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