WO2000051168A3 - Slurry delivery control apparatus and method - Google Patents

Slurry delivery control apparatus and method Download PDF

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Publication number
WO2000051168A3
WO2000051168A3 PCT/US2000/004787 US0004787W WO0051168A3 WO 2000051168 A3 WO2000051168 A3 WO 2000051168A3 US 0004787 W US0004787 W US 0004787W WO 0051168 A3 WO0051168 A3 WO 0051168A3
Authority
WO
WIPO (PCT)
Prior art keywords
valve
control apparatus
delivery control
slurry delivery
upstream
Prior art date
Application number
PCT/US2000/004787
Other languages
French (fr)
Other versions
WO2000051168A2 (en
WO2000051168A9 (en
Inventor
William L Vetter
Ernie Marks
Original Assignee
Thoroughbred Lc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thoroughbred Lc filed Critical Thoroughbred Lc
Priority to AU36054/00A priority Critical patent/AU3605400A/en
Publication of WO2000051168A2 publication Critical patent/WO2000051168A2/en
Publication of WO2000051168A3 publication Critical patent/WO2000051168A3/en
Publication of WO2000051168A9 publication Critical patent/WO2000051168A9/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching

Abstract

An apparatus and method for controlling a flow of a slurry (54) having an outer bypass loop (76) configured to carry the slurry from a source (52) and containing a first upstream valve (66) and a first downstream valve (82) connected by an outer conduit (70). A splitter valve (120) is positioned between the first upstream valve (66) and the first downstream valve (82) to receive aflow from the outer conduit. An inner bypass loop (88) is provided containing an upstream portion of the outer conduit (70) in fluid communication with a second upstream valve (96) and a second downstream valve (100).
PCT/US2000/004787 1999-02-26 2000-02-25 Slurry delivery control apparatus and method WO2000051168A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU36054/00A AU3605400A (en) 1999-02-26 2000-02-25 Slurry delivery control apparatus and method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12214999P 1999-02-26 1999-02-26
US60/122,149 1999-02-26
US51325400A 2000-02-24 2000-02-24
US09/513,254 2000-02-24

Publications (3)

Publication Number Publication Date
WO2000051168A2 WO2000051168A2 (en) 2000-08-31
WO2000051168A3 true WO2000051168A3 (en) 2002-01-17
WO2000051168A9 WO2000051168A9 (en) 2002-06-20

Family

ID=26820211

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/004787 WO2000051168A2 (en) 1999-02-26 2000-02-25 Slurry delivery control apparatus and method

Country Status (2)

Country Link
AU (1) AU3605400A (en)
WO (1) WO2000051168A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6939210B2 (en) 2003-05-02 2005-09-06 Applied Materials, Inc. Slurry delivery arm

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4059929A (en) * 1976-05-10 1977-11-29 Chemical-Ways Corporation Precision metering system for the delivery of abrasive lapping and polishing slurries
US5791970A (en) * 1997-04-07 1998-08-11 Yueh; William Slurry recycling system for chemical-mechanical polishing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4059929A (en) * 1976-05-10 1977-11-29 Chemical-Ways Corporation Precision metering system for the delivery of abrasive lapping and polishing slurries
US5791970A (en) * 1997-04-07 1998-08-11 Yueh; William Slurry recycling system for chemical-mechanical polishing apparatus

Also Published As

Publication number Publication date
AU3605400A (en) 2000-09-14
WO2000051168A2 (en) 2000-08-31
WO2000051168A9 (en) 2002-06-20

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