WO2000049651A9 - Improved masking methods and etching sequences for patterning electrodes of high density ram capacitors - Google Patents
Improved masking methods and etching sequences for patterning electrodes of high density ram capacitorsInfo
- Publication number
- WO2000049651A9 WO2000049651A9 PCT/US2000/004240 US0004240W WO0049651A9 WO 2000049651 A9 WO2000049651 A9 WO 2000049651A9 US 0004240 W US0004240 W US 0004240W WO 0049651 A9 WO0049651 A9 WO 0049651A9
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- noble metal
- residual
- mask
- etching
- Prior art date
Links
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- 239000000203 mixture Substances 0.000 claims abstract description 66
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 56
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
Definitions
- 09/251,633 is a continuation-in-part patent application of copending patent application entitled "ETCHING METHODS FOR ANISOTROPIC PLATINUM PROFILE, Serial No. 009/006,092, filed January 13, 1998. Benefit of all earlier filing dates with respect to all common subject matter is claimed.
- This invention relates to plasma etching of a noble metal (e.g., Pt, Ir, Ru, Pd, etc.). More specifically, this invention provides masking methods and etching sequences for plasma etching of a noble metal, such as platinum and/or iridium, for producing semiconductor integrated circuits containing noble metal (e.g., platinum, iridium, or an oxide or alloy of platinum and/or iridium) electrodes.
- a noble metal such as platinum and/or iridium
- semiconductor integrated circuits containing noble metal e.g., platinum, iridium, or an oxide or alloy of platinum and/or iridium
- DRAM dynamic random access memory
- the high dielectric constant materials or ferroelectric materials are made primarily of sintered metal oxide and contain a substantial amount of very reactive oxygen.
- the electrodes In the formation of capacitors with such ferroelectric materials or films, the electrodes must be composed of materials with least reactivity to prevent oxidation of the electrodes which would decrease the capacitance of storage capacitors. Therefore, precious metals, such as platinum (Pt), palladium (Pd), iridium (Ir), ruthenium (Ru), etc., are preferred metals used in the manufacture of capacitors for high density DRAM.
- platinum and iridium have emerged as an attractive candidate because they are inert to oxidation and are known to have a leakage current ( ⁇ 10 "9 amps/cm 2 ) lower than other electrodes such as Ru0 and Pd. Platinum and iridium also are good conductors.
- platinum and iridium etching has been conducted by means of isotropic etching, such as wet etching with aqua regia, or by anisotropic etching, such as ion milling with Ar gas or by other means. Because of the nature of isotropic etching, using wet etching with aqua regia causes deteriorated processing accuracy. The grade of precision in isotropic etching is not high enough for fine pattern processing. Therefore, it is difficult to perform submicron patterning of platinum electrodes due to its isotropic property.
- ion milling i.e., anisotropic etching
- etching speed on platinum and iridium which is to form the electrode
- etchant gases e.g., Cl 2 , HBr, O 2 , etc.
- U.S. Patent No. 5,492,855 to Matsumoto et al. discloses a semiconductor device manufacturing method, wherein an insulation layer, a bottom electrode Pt layer, a dielectric film and a top electrode Pt layer are provided on top of a substrate having already-completed circuit elements and wiring, and then, a capacitor is formed by selectively dry etching the bottom electrode Pt layer after selectively dry etching the top electrode Pt layer and the dielectric film.
- the manufacturing method uses a gas containing an S component as etching gas for Pt etching, or an etching gas containing S component as an additive gas; and also it implants S into the Pt layer before the Pt dry etching process by means of ion implantation to compose a S and Pt compound, and then dry etches the Pt compound thus composed.
- U.S. Patent No. 5,527,729 to Matsumoto et al. discloses process steps to form on a substrate in which circuit elements and wirings, etc., are already shaped, an insulation layer, a first metal layer, a dielectric film and a second metal layer.
- a top electrode and a capacitance film are formed by dry etching the second metal layer and the dielectric film.
- a bottom electrode is formed by dry etching the first metal layer.
- the etching gas for dry etching the second metal layer is a mixed gas containing hydrogen halide (e.g., HBr) and oxygen, having a ratio of oxygen against the total of hydrogen halide and oxygen set at about 10%-35%.
- the etching gas is also taught as a gas containing hydrocarbon, such as chloroform.
- a gas containing hydrocarbon such as chloroform.
- Matsumoto et al. employs a silicon oxide layer as the insulation layer on the substrate, and a platinum layer or palladium layer as the first and second metal layers. Dry etching of the second metal layer and dielectric film is conducted in a low pressure region not higher than about 5 Pa, where the etching speed is high. Matsumoto et al.
- the etching speed on the silicon oxide layer can be made sufficiently low relative to that on the second metal layer made of a platinum layer or a palladium layer; in this way, the excessive etching of the silicon oxide layer underlying the first metal layer is avoided, and damage to the circuit elements and wiring, etc. underneath the silicon oxide layer can be prevented.
- the ratio of etching speed of the platinum and dielectric material to the resist can be increased by lowering the etching speed on the resist.
- etching of the platinum and dielectric material may be conducted by using a mask of normal lay- thickness resist (generally speaking, about 1.2 ⁇ m to about 2.0 ⁇ m thick), instead of using a conventional thick-layer resist (about 3 ⁇ m and thicker).
- a mask of normal lay- thickness resist generally speaking, about 1.2 ⁇ m to about 2.0 ⁇ m thick
- a conventional thick-layer resist about 3 ⁇ m and thicker
- Nishikawa et al. in an article entitled "Platinum Etching and Plasma Characteristics in RF Magnetron and Electron Cyclotron Resonance Plasmas", Jpn. J. Appl. Phys., Vol. 34 (1995), pages 767-770, discloses a study wherein the properties of platinum etching were investigated using both RF magnetron and electron cyclotron resonance (ECR) plasmas, together with measurement of the plasma parameters (neutral concentration, plasma density, etc.).
- ECR electron cyclotron resonance
- Nishikawa et al. performed experiments in Cl 2 plasmas over a pressure ranging from 0.4 to 50 mTorr. In RF magnetron plasmas, the etch rate of Pt was constant at the substrate temperature of from 20 to 160°C.
- Nishikawa et al. found that the etch rate of Pt was almost constant ( ⁇ 100 nm/min) with gas pressure decreasing from 5 to 0.4 mTorr, while the plasma electron density gradually increased with decreasing gas pressure.
- the study by Nishikawa et al. discusses these experimental results with respect to the relationship between the etch yield and the ratio of neutral Cl 2 flux and ion flux incident on the substrate.
- PZT/Pt/TiN/Ti structure with a spin on glass (SOG) mask are demonstrated using a high- density electron cyclotron resonance (ECR) plasma and a high substrate temperature above 300°C.
- ECR electron cyclotron resonance
- a 30%-Cl 2 /Ar gas was used to etch a lead zirconate titanate (PZT) film. No deposits remained, which resulted in an etched profile of more than 80°.
- a 40%- O 2 /Cl 2 gas was used to etch a Pt film. The etching was completely stopped at the Ti layer. 30-nm-thick deposits remained on the sidewall. They were removed by Yokoyama et al. after dipping in hydrochloric acid.
- the etched profile of a Pt film was more than 80°.
- the Ti/TiN/Ti layer was etched with pure Cl 2 gas.
- the size shift from the SOG mask was less than 0.1 ⁇ m. Yokoyama et al. did not detect any interdiffusion between SOG and PZT by transmission electron microscopy and energy dispersive x-ray spectroscopy (TEM-EDX) analysis.
- Yoo et al. in an article entitled "Control of Etch Slope During Etching of Pt in Ar/Cl 2 /O 2 Plasmas", Jpn. J. Appl. Phys., Vol. 35 (1996), pages 2501-2504, teaches etching of Pt patterns of the 0.25 ⁇ m design rule at 20°C using a magnetically enhanced reactive ion etcher (MERIE).
- MERIE magnetically enhanced reactive ion etcher
- the redeposits of the etch products onto the sidewall were reduced by the addition of Cl to Ar, although the etched slope was lowered to 45°.
- the redeposits were removed by an HCl cleaning process.
- Kotecki teaches that when considering the use of high-dielectric materials in a stack capacitor structure, the following issues need to be addressed: electrode patterning, high-dielectric material/barrier interaction, electrode/high-dielectric material interaction, surface roughness (e.g., hilocking, etc.), step coverage, high-dielectric material uniformity (e.g., thickness, composition, grain size/orientation, etc.), and barrier (e.g., O 2 and Si diffusion, conductivity, contact resistance and interactions, etc.).
- Milkove et al. reported in a paper entitled "New Insight into the Reactive Ion Etching of Fence-Free Patterned Platinum Structures" at the 43rd Symposium of AVS, October 1996, Philadelphia, PA, that an investigation was undertaken to characterize the time progression of the Pt etch process during the reactive ion etching (RIE) offence-free patterned structures.
- the experiment by Milkove et al. consisted of coprocessing two oxidized Si wafers possessing identical 2500 A thick Pt film layers, but different photoresist (PR) mask thicknesses. Etching was suspended at 20, 40, 60 and 80%) of the full etch process in order to cleave off small pieces of wafer for analysis by a scanning electron microscopy (SEM).
- SEM scanning electron microscopy
- Keil et al. teaches in an article entitled "The Etching of Platinum Electrodes for PZT Based Ferroelectric Devices", Electrochemical Society Proceedings, Vol. 96-12 (1996), pages 515-520, that the technical difficulties of fabricating capacitors employing platinum Pt etching is most often dominated by sputtering processes. While oxygen and/or various gaseous chlorides or fluorides are used to chemically enhance the etch process, the products of both etch mechanisms are usually of low volatility and tend to redeposit on the wafer. After etching, large wall-like structures extend up from the edges of the Pt region.
- noble metal e.g., platinum, iridium, ruthenium, etc. and oxides and/or alloys of noble metals
- a semiconductor device including a plurality of platinum or iridium electrodes having a platinum or iridium profile equal to or greater than about 85° and separated by a distance equal to or less than about 0.35 ⁇ m, preferably equal to or less than about 0.3 ⁇ m, with each electrode having a critical dimension (e.g., a width) equal to or less than about 0.35 ⁇ m, preferably equal to or less than about 0.3 ⁇ m.
- a critical dimension e.g., a width
- the present invention broadly provides a method of etching a platinum layer disposed on a substrate comprising the steps of: a) providing a substrate supporting a platinum layer; b) heating the substrate (such as with a pedestal supporting the substrate) of step (a) to a temperature greater than about 150°C; and c) etching the platinum layer including employing a high density plasma of an etchant gas comprising a halogen-containing gas (e.g., a halogen such as chlorine) and a noble gas (e.g., argon) to produce the substrate supporting at least one etched platinum layer.
- a halogen-containing gas e.g., a halogen such as chlorine
- a noble gas e.g., argon
- the present invention broadly provides: a) providing a substrate supporting an iridium layer; b) heating the substrate of step (a) to a temperature greater than about 150°C; and c) etching the iridium layer including employing a high density plasma of an etchant gas comprising a halogen-containing gas, and a noble gas to produce said substrate supporting at least one etched iridium layer.
- the etchant gas may additionally include a gas selected from the group consisting of O 2 and BC1 3 .
- the etchant gas may additionally include a gas selected from the group consisting of O 2 , HCl, HBr, and mixtures thereof.
- the substrate of step (a) may be heated by heating the pedestal supporting the substrate to a sufficient temperature to cause the substrate to possess a temperature greater than about 150°C.
- the platinum layers are preferably a platinum electrode layer and an iridium electrode layer, respectively.
- the high density plasma of an etchant gas is a plasma of an etchant gas having an ion density greater than about 10 9 /cm 3 , preferably greater than about 10 ⁇ /cm 3 .
- the etchant gas may also include a gas selected from the group consisting of BC1 3 , HBr, SiC-U and mixtures thereof.
- the platinum layer and the iridium layer may each additionally comprise a mask layer disposed on a selected part of the particular respective layer to selectively protect the particular respective layer during the etching step above.
- the etchant gas having Ar/Cl 2 /O chemistry with high O concentration produces an iridium to Ti and/or TiN selectivity of greater than about 8 (preferably greater than about 10) during etching of iridium.
- the platinum layer and the iridium layer may each also additionally comprise a protective layer disposed on the selected part of the particular respective layer between the mask layer and the particular respective layer.
- the mask layer may be removed during or after the etching step.
- the protective layer may be removed during or after the etching step.
- the platinum layer is part of or is contained in a platinum wafer, and the method of etching a platinum layer additionally comprises disposing the platinum wafer including the platinum layer in a high density plasma chamber having a coil inductor and a wafer pedestal; and performing the etching step in the high density plasma chamber under the following process conditions:
- Halogen Gas e.g., Cl 2 20% to 95% by vol.
- RF Frequency of Wafer Pedestal 100 K to 300 MHz there is broadly provided a method of etching a platinum electrode layer disposed on a substrate comprising the steps of:
- step (b) heating said substrate of step (a) to a temperature greater than about 150°C;
- the plasma may be a low density plasma or a high density plasma and the etchant gas may additionally comprise a gas selected from the group consisting of a noble gas (e.g., argon), HBr, BC1 3 , SiCL, and mixtures thereof.
- the etching step (c) may be performed in a low density (or high density) plasma chamber under the following process conditions:
- Halogen Gas e.g., Cl 40% to 90% by vol.
- Nitrogen gas 0.1% to 60% by vol.
- the etched platinum layer includes a platinum profile equal to or greater than about 80°, preferably equal to or greater than about 85°, more preferably equal to or greater than about 87°, most preferably equal to or greater than about 88.5°.
- the etchant gas for the process conditions immediately above may alternatively comprise from about 10% to about 90% by vol. of a halogen (e.g., Cl 2 ), from about 5% to about 80% by vol. of a noble gas (e.g., argon), and from about 4% to about 25%) by vol. HBr and/or BC1 3 .
- the etchant gas may alternatively comprise from about 0.1% to about 60% by volume nitrogen, from about 40% to about 90% by volume of a halogen (e.g., Cl 2 ), from about 0.1% to about 40% by volume of a noble gas (e.g., argon), and from about 1% to about 30%) by volume of a gas selected from the group of combining HBr, BC1 3 , SiCl 4 , and mixtures thereof.
- a halogen e.g., Cl 2
- a noble gas e.g., argon
- the iridium layer is part of or is contained in an iridium wafer, and the method of etching an iridium layer additionally comprises disposing the iridium wafer including the iridium layer in a high density plasma chamber having a coil inductor and a wafer pedestal; and performing the etching step (c) in the high density plasma chamber under the following process conditions:
- Halogen Gas e.g., Cl 2 ) 10% to 60% by vol.
- the etched iridium layer includes an iridium profile equal to or greater than about 80°, more preferably equal to or greater than about 82°, most preferably equal to or greater than about 85.0°.
- the etchant gas for the process conditions immediately above may alternatively comprise from about 5% to about 20%> by vol. oxygen, from about 10%> to about 60%) by vol. of a halogen (e.g., Cl 2 ), from about 30% to about 80% by vol. of a noble gas (e.g., argon), and from about 5% to about 20% by vol. HBr and/or HCl.
- the present invention also broadly provides a method for producing a capacitance structure including an electrode (i.e., a platinum electrode or an iridium electrode layer) comprising the steps of: a) providing a substrate supporting a layer (i.e., a platinum electrode layer or an iridium electrode layer), and at least one mask layer disposed on a selected part of said layer; b) heating the substrate of step (a) to a temperature greater than about 150°C; and c) .
- an electrode i.e., a platinum electrode or an iridium electrode layer
- etching the layer including employing a plasma of an etchant gas comprising a halogen (e.g., chlorine) and a noble gas (e.g., argon) to produce a capacitance structure having at least one electrode (i.e., the platinum electrode or iridium electrode).
- an etchant gas comprising a halogen (e.g., chlorine) and a noble gas (e.g., argon) to produce a capacitance structure having at least one electrode (i.e., the platinum electrode or iridium electrode).
- the etchant gas may also comprise nitrogen.
- the at least one mask layer is removed during or after the etching step (c) immediately above.
- the layer of step (a) immediately above may additionally comprise a protective layer disposed on the selected part of the layer between the mask layer and the layer.
- the etched layer (i.e., the etched platinum layer or the etched iridium layer) produced by the etching step (c) immediately above includes a profile (i.e., a platinum profile or an iridium profile) equal to or greater than about.80° (particularly for iridium), preferable equal to or greater than about 85°, more preferably equal to or greater than about 87°, most preferably equal to or greater than about 88.5°.
- the etchant gas of the plasma of step (c) more specifically includes a halogen (e.g., chlorine), a noble gas (e.g., argon), and a gas selected from the group consisting of HBr, BC1 3 and mixtures thereof.
- the etchant gas of the plasma of step (c) includes nitrogen (N ) and a halogen (e.g., chlorine).
- the etchant gas of the plasma of step (c) more specifically includes nitrogen (N 2 ), a halogen (e.g., chlorine), a noble gas (e.g., argon), and a gas selected from the group consisting of HBr, BC1 3 , SiCl , and mixtures thereof.
- the platinum electrode layer is part of or is contained in a platinum electrode wafer, and the method for producing a capacitance structure including a platinum electrode layer additionally comprises disposing, prior to the etching step (c), the platinum electrode wafer in a high density plasma chamber having a coil inductor and a wafer pedestal; and performing the etching step (c) in the high density plasma chamber under the following previously indicated process conditions:
- Halogen Gas e.g., Cl 2 ) about 10% to about 90% by vol.
- Noble Gas e.g., Ar
- Noble Gas about 5% to about 80% by vol.
- HBr and or BC1 3 about 4% to about 25% by vol.
- the produced platinum electrodes are separated by a distance or space having a dimension equal to or less than about 0.35 ⁇ m, preferably equal to or less than about 0.3 ⁇ m.
- Each of the platinum electrodes include a dimension having a value equal to or less than about 0.6 ⁇ m, preferably equal to or less than about 0.35 ⁇ m, more preferably equal to or less than about 0.3 ⁇ m. More preferably, each of the platinum electrodes have a width equal to or less than about 0.35 ⁇ m, preferably equal to or less than about 0.3 ⁇ m, a length equal to or less than about 1.0 ⁇ m, preferably equal to or less than about 0.6 ⁇ m, and a height equal to or less than about 0.6 ⁇ m.
- the plasma of the etchant gas for etching any of the metals of any of the embodiments of the present invention comprises a high density inductively coupled plasma.
- the etchant gas preferably comprises a noble gas selected from the group consisting of helium, neon, argon, krypton, xenon, radon, and mixtures thereof. More preferably, the noble gas is selected from the group consisting of helium, neon, argon, and mixtures thereof. Most preferably, the noble gas is argon.
- the etchant gas of the high density inductively coupled plasma most preferably comprises, or preferably consists of or consists essentially of, chlorine, argon, and BC1 3 and/or HBr.
- the etchant gas of the plasma of step (c) more specifically includes oxygen, a halogen (e.g., chlorine), a noble gas (e.g., argon), and a gas selected from the group consisting of HBr, HCl and mixtures thereof.
- a halogen e.g., chlorine
- a noble gas e.g., argon
- the iridium electrode layer is part of or is contained in an iridium electrode wafer, and the method for producing a capacitance structure including an iridium electrode layer additionally comprises disposing, prior to the etching step (c), the iridium electrode wafer in a high density plasma chamber having a coil inductor and a wafer pedestal; and performing the etching step (c) in the high density plasma chamber under the following previously indicated process conditions:
- Oxygen about 5% to about 20% by vol.
- Halogen Gas e.g., Cl ) about 10% to about 60% by vol.
- HBr and/or HCl about 5% to about 20% by vol.
- Iridium Electrode Wafer about 150° to about 500° C
- the plasma of the etchant gas for etching iridium comprises a high density inductively coupled plasma.
- the etchant gas preferably comprises a noble gas selected from the group consisting of helium, neon, argon, krypton, xenon, radon, and mixtures thereof. More preferably, the noble gas is selected from the group consisting of helium, neon, argon, and mixtures thereof. Most preferably, the noble gas is argon.
- the etchant gas of the high density inductively coupled plasma for etching iridium most preferably comprises, or preferably consists of or consists essentially of, chlorine, argon, and oxygen or BC1 3 ; alternatively, oxygen, chlorine, argon, and HCl and/or HBr.
- the present invention further broadly provides a method of manufacturing a semiconductor device comprising the steps of: a) forming a patterned resist layer, a mask layer and an electrode layer (e.g., a platinum electrode layer or an iridium electrode layer) on a substrate having circuit elements formed thereon; b) etching a portion of the mask layer including employing a plasma of an etchant gas to break through and to remove the portion of the mask layer from the electrode layer to produce the substrate supporting the patterned resist layer, a residual mask layer, and the electrode layer; c) removing the resist layer of step (b) to produce the substrate supporting the residual mask layer and the electrode layer; d) heating the substrate of step (c) to a temperature greater than about 150° C; and e) etching the electrode layer of step (d) including employing a high density plasma of an etchant gas.
- an electrode layer e.g., a platinum electrode layer or an iridium electrode layer
- the etchant gas preferably comprises a halogen gas (e.g., chlorine) and a noble gas (e.g., argon) to produce a semiconductor device having at least one platinum electrode.
- the etchant gas comprises oxygen, a halogen gas (e.g., chlorine) and a noble gas (e.g., argon) to produce a semiconductor device having at least one iridium electrode.
- the present invention also further broadly provides a method of etching an electrode layer (e.g.
- a noble metal disposed on a substrate comprising the steps of: a) providing a substrate (e.g., a SiO 2 substrate) supporting an electrode layer (e.g., a noble metal including a platinum electrode layer or an iridium electrode layer), a protective layer (e.g., TiN and/or Ti) on the electrode layer, and a mask layer (e.g., BSG oxide, BPSG oxide, PSG oxide, Si 3 N 4 , TEOS, CVD SiO 2 , and mixtures thereof) on the protective layer, and a patterned resist layer on the mask layer; b) etching a portion of the mask layer including employing a plasma of an etchant gas to break through and to remove the portion of the mask layer from the protective layer to expose part of the protective layer and to produce the substrate supporting the electrode layer, the protective layer on the electrode layer, a residual mask layer on the elecfrode layer, and the patterned resist layer on the residual mask layer; c) removing the patterned resist layer from
- the exposed part of the protective layer includes a high density plasma of an etchant gas.
- the elecfrode layer being etched comprises a platinum
- the etchant gas comprises a halogen gas (e.g., chlorine) and a noble gas (e.g., argon) to produce the substrate supporting an etched platinum electrode layer having the residual protective layer on the etched platinum layer, and the residual mask layer on the residual protective layer.
- the etchant gas comprises oxygen, a halogen gas (e.g., chlorine) and a noble gas (e.g., argon) to produce the subsfrate supporting an etched iridium electrode layer having the residual protective layer on the etched iridium electrode layer, and the residual mask layer on the residual protective layer.
- a halogen gas e.g., chlorine
- a noble gas e.g., argon
- the electrode layer (e.g., the noble metal including a platinum elecfrode layer or an iridium electrode layer) is part of or is contained in a wafer (e.g., the noble metal including a platinum electrode wafer or an iridium elecfrode wafer).
- the purpose of the protective layer is to ensure the adhesion between the mask layer and the elecfrode layer (e.g., the profile of a platinum electrode layer or the profile of an iridium elecfrode layer), and also to maintain the profile of the layer (e.g., a platinum electrode layer or an iridium electrode layer), especially during the etching process of the present invention.
- the residual protective layers are removed from the etched layer (e.g., etched platinum layer and/or etched iridium layer), after the etching step (e.g., the platinum etching step or the iridium etching step).
- the etched layer e.g., etched platinum layer and/or etched iridium layer
- the etching step e.g., the platinum etching step or the iridium etching step.
- one or more barrier layers may be disposed on the substrate to separate the electrode layer (e.g. a noble metal layer) from the substrate.
- the barrier layer may include TiN and/or Ti and/or BST (barium titanate and/or strontium titanate) and/or Si 3 N 4 .
- the barrier layer may also include two or more barrier layers such as a SiN-containing layer (e.g., Si 3 N ) disposed on the substrate and a barrier protective layer (e.g., TiN and/or Ti) disposed on the SiN-containing layer.
- the electrode layer e.g. the noble metal layer
- a method of etching a noble metal (Pt, Ir, Ru, Pd etc.) layer disposed on a subsfrate comprising the steps of: a) providing a substrate supporting a barrier layer (e.g., TiN, TiSiN, Ti, WN, TaN, TaSiN, Ta), a noble metal (e.g., Pt, Ir, Pd, Ru, etc.) layer on the barrier layer, a protective layer (e.g., TiN, TiSiN, Ti, WN, TaN, TaSiN, Ta) on the noble metal layer, a mask layer, preferably a mask layer having a thickness ranging from about 6000A to about 9,OO ⁇ A, on the protective layer, and a patterned resist layer on the mask layer; b) etching a portion of the mask layer including employing a plasma of a mask etchant gas to break through and to remove the portion of the mask layer from the protective layer to expose part of
- step (d) etching the exposed part of the noble metal layer of step (d) including employing plasma of an etchant gas selected from the group consisting of a halogen-containing gas, a noble gas, nitrogen, oxygen, and mixtures thereof, to produce the substrate supporting the barrier layer, an etched noble metal layer on the barrier layer, the residual protective layer on the etched noble metal layer, and the residual mask layer on the residual protective layer; g) removing the residual mask layer from the residual protective layer to produce the subsfrate supporting the barrier layer, the etched noble metal layer on the barrier layer, and the residual protective layer on the etched noble metal layer; and h) etching a portion of the barrier layer including employing a plasma of a barrier etchant gas to expose part of the subsfrate to produce the substrate supporting a residual barrier layer, the etched noble metal layer on the residual barrier layer, and the residual protective layer on the etched noble metal layer.
- an etchant gas selected from the group consisting of a halogen-containing gas, a
- the step (f) etching of the noble metal layer of step (d) additionally produces a remaining noble metal layer on the barrier layer.
- the step (g) removing of the residual mask layer additionally produces the remaining noble metal layer on the barrier layer, and the method additionally comprises etching the remaining noble metal layer on the barrier layer prior to the step (h) etching.
- the mask layer comprises a compound selected from the group consisting of BSG oxide, PSG oxide, Si 3 N 4 , TEOS, CVD SiO 2 , a low dielectric constant material with a dielecfric constant of less than 3.0, and mixtures thereof.
- the foregoing method may be conducted without the protective layer.
- the foregoing method may also be conducted by etching the barrier layer prior to removing the residual mask layer.
- the method of etching a noble metal layer disposed on a subsfrate would comprise the following step (g) and step (h): (g) etching a portion of the barrier layer including employing a plasma of a barrier etchant gas to expose part of the substrate to produce the subsfrate supporting a residual barrier layer, the etched noble metal layer on the residual barrier layer, the residual protective layer on the etched noble metal layer, and the residual mask layer on the residual protective layer; and (h) removing the residual mask layer from the residual protective layer to produce the substrate supporting the residual barrier layer, the etched noble metal layer on the residual barrier layer, and the residual protective layer on the etched noble metal layer.
- a method of etching a noble metal (Pt, Ir, Ru, Pd etc.) layer disposed on a substrate comprising the steps of: a) providing a subsfrate supporting an etch-stop layer (e.g., Si 3 N 4 , TiO 2 , RuO 2 , and IrO 2 ), a barrier layer on the etch-stop layer, a noble metal layer on the barrier layer, a protective layer on the noble metal layer, a mask layer, preferably a mask layer having a thickness ranging from about 6000A to about 9000A, on the protective layer, and a patterned resist layer on the mask layer; b) etching a portion of the mask layer including employing a plasma of a mask etchant gas to break through and to remove the portion of the mask layer from the protective layer to expose part of the protective layer and to produce the substrate supporting the etch-stop layer, the barrier layer on the etch-stop layer, the noble metal layer on the
- the foregoing method may be conducted without the protective layer.
- the method of etching additionally comprises etching the exposed part of the barrier layer to expose part of the etch-stop layer to produce the substrate supporting the etch-stop layer, a residual barrier layer on the etch-stop layer, and the etched noble metal layer on the residual barrier layer.
- a method of etching a noble metal (Pt, Ir, Ru, Pd etc.) layer disposed on a substrate comprising the steps of: a) providing a substrate supporting an etch-stop layer, a barrier layer on the etch-stop layer, a noble metal layer on the barrier layer, a mask layer on the noble metal layer, and a patterned resist layer on the mask layer; b) etching a portion of the mask layer including a plasma of a mask- etchant gas to break through and to remove the portion of the mask layer from the noble metal layer to expose part of the noble metal layer and to produce the substrate supporting the etch-stop layer, the barrier layer on the etch-stop layer, the noble metal layer on the barrier layer, a residual mask layer on the noble metal layer, and the patterned resist layer on the residual mask layer; c) removing the patterned resist layer from the residual mask layer of step (b) to produce the substrate supporting the etch-stop layer, the barrier layer on the a barrier layer on the barrier layer on the barrier layer
- the method of etching additionally includes etching the exposed part of the barrier layer, preferably prior to the removing step (f), to expose part of the etch-stop layer to produce the substrate supporting the etch-stop layer, a residual barrier layer on the etch-stop layer, and the etched noble metal layer on the residual barrier layer.
- Also provided in accordance with an embodiment of the present invention is a method of etching a noble metal layer disposed on a substrate comprising the steps of: a) providing a subsfrate supporting a barrier layer, a noble metal layer on the barrier layer, a first mask layer on the noble metal layer, a second mask layer on the first mask layer, and a patterned resist layer on the second mask layer; b) etching a portion of the second mask layer including employing a plasma of a mask etchant gas to break through and to remove the portion of the second mask layer from the first mask layer to expose part of the first mask layer and to produce the subsfrate supporting the barrier layer, the noble metal layer on the barrier layer, the first mask layer on the noble metal layer, a residual second mask layer on the first mask layer, and the patterned resist layer on the residual second mask layer; c) etching the exposed part of the first mask layer to expose part of the noble metal layer and to produce the substrate supporting the barrier layer, the noble metal layer on the barrier layer, a residual
- the residual second mask layer in step(f) is removed and/or etched simultaneously with the step(f) etching and/or removal of the exposed part of the noble metal layer.
- the patterned resist layer may be removed from the residual second mask layer during the etching step (c).
- the etching step (h) additionally comprises etching into the substrate.
- the first mask layer comprises a compound selected from the group consisting of Si 3 N , BSG, PSG, BPSG, an organic polymer, a low dielectric constant material having a dielectric constant of less than about 3.0, and mixtures thereof.
- the second mask layer comprises a compound selected from the group consisting of CVD SiO 2 , TEOS, Si 3 N 4 , BSG, PSG, BPSG, SiC, and mixtures thereof.
- the first mask layer has a thickness ranging from about 3000A to about 8000A, and the second mask layer has a thickness ranging from about 500A to about 4000 A.
- etching of the platinum electrode layer to produce the platinum electrodes of the present invention is preferably performed in a high density plasma chamber.
- the platinum etching step employs a high density plasma of an etchant gas preferably consisting of, or consisting essentially of, a halogen gas (e.g., chlorine), a noble gas (i.e., argon) and HBr and/or BC1 3 .
- a halogen gas e.g., chlorine
- a noble gas i.e., argon
- BC1 3 a halogen gas
- the high density plasma chamber possesses a separate control for ion flux and a separate control for ion energy.
- the ion density of the high density plasma in the high density plasma chamber is greater than about 10 9 /cm 3 .
- the high density plasma chamber for the method of manufacturing a semiconductor device and for the method of etching a platinum electrode layer disposed on a subsfrate includes a coil inductor and a wafer pedestal; and the platinum etching step in both of the methods is performed in the high density plasma chamber under the following previously mentioned process conditions:
- Halogen Gas e.g., Cl ) about 10% to about 90% by vol.
- Noble Gas e.g., argon
- HBr and or BC1 3 about 4% to about 25% by vol.
- the etching step may be performed in a low density (or high density) plasma chamber under the following process conditions:
- Halogen Gas e.g., Cl 2
- Cl 2 Halogen Gas
- Noble Gas e.g., argon
- etching of the iridium electrode layer to produce the iridium electrodes of the present invention is performed in a high density plasma chamber.
- the iridium etching step employs a high density plasma or a low density plasma of an etchant gas preferably consisting of, or consisting essentially of, or consisting essentially of, a halogen gas (e.g., chlorine) and a noble gas (i.e., argon), more preferably a halogen gas (e.g., chlorine), a noble gas (i.e., argon) and oxygen or BC1 3 , or oxygen (O 2 ), a halogen gas (e.g., Cl 2 ), a noble gas (e.g., Ar), and HCl and/or HBr.
- the high density plasma chamber possesses a separate control for ion flux and a separate control for ion energy.
- the ion density of the high density plasma in the high density plasma chamber is greater than about 10 9
- the high density plasma chamber for the method of manufacturing a semiconductor device and for the method of etching an iridium elecfrode layer disposed on a subsfrate includes a coil inductor and a wafer pedestal; and the iridium etching step in both of the methods is performed in a high density plasma chamber under the following previously mentioned process conditions:
- Halogen Gas e.g., Cl 2 ) about 10% to about 60% by vol.
- Iridium Electrode Wafer about 150° to about 500°C
- the present invention also provides a method of processing a layer on a substrate comprising the steps of: a) providing a substrate; b) disposing the substrate in a reactor chamber comprising a dielectric window including a deposit-receiving surface having a peak-to- valley roughness height with an average height value of greater than about 1000 A; c) introducing a processing gas into the reactor chamber of step (b); and d) introducing processing power into the reactor chamber of step (b) to process a layer on the substrate in a plasma of the processing gas.
- the present invention further provides a dielectric member comprising a dielectric structure including a surface finish having a peak-to-valley roughness height with an average height value of greater than about 1000 A.
- a pedestal assembly is disposed in the processing zone.
- the chamber assembly also comprises a processing power source; a processing gas-introducing assembly, engaged to the chamber wall, for introducing a processing gas into the processing zone of the chamber wall; and a processing power- transmitting member connected to the processing power source for transmitting power into the processing zone to aid in sustaining a plasma from a processing gas within the processing zone of the processing chamber wall.
- the present invention yet also further broadly provides a semiconductor device, more specifically a capacitance structure, comprising a subsfrate, and at least two noble metal electrodes (e.g., platinum elecfrodes or iridium elecfrodes) supported by the substrate.
- the electrodes have a profile equal to or greater than about 80°, such as equal to or greater than about 85°, preferably equal to or greater than about 87°, more preferably equal to or greater than about 88.5°.
- the electrodes are separated by a distance or space having a dimension equal to or less than about 0.35 ⁇ m, preferably equal to or less than about 0.3 ⁇ m.
- Each of the electrodes include a dimension having a value equal to or less than about 1.0 ⁇ m, preferably equal to or less than about 0.6 ⁇ m, more preferably equal to or less than about 0.35 ⁇ m, most preferably equal to or less than about 0.3 ⁇ m. More preferably, each of the elecfrodes have a width equal to or less than about 0.35 ⁇ m, preferably equal to or less than about 0.3 ⁇ m, a length equal to or less than about 1.0 ⁇ m, preferably equal to or less than about 0.6 ⁇ m, and a height equal to or less than about 0.6 ⁇ m.
- a method of etching an iridium (i.e., a noble metal layer) layer disposed on a substrate comprising the steps of: a) providing a substrate supporting an iridium layer; b) heating the subsfrate of step (a) of a temperature greater than about 150°C; and c) etching the iridium layer including employing a plasma of an etchant gas (i.e., a low density or high density plasma of an etchant gas) comprising a halogen containing gas (e.g., chlorine) and a noble gas (e.g., argon) to produce the subsfrate supporting at least one etched iridium layer.
- an etchant gas i.e., a low density or high density plasma of an etchant gas
- a halogen containing gas e.g., chlorine
- a noble gas e.g., argon
- the etchant gas additionally comprises a gas selected from the group consisting of O 2 and BC1 3 .
- the etchant gas additionally comprises a gas selected from the group consisting of O , HCl, HBr, and mixtures thereof.
- the halogen containing gas comprises or consists essentially of chlorine and the noble gas comprises or consists essentially of argon.
- the etchant gas comprises or consists essentially of chlorine, argon and O 2 .
- the iridium layer of step (a) additionally comprises a mask layer (e.g., a TiN or Ti mask layer) disposed on a selected part of the iridium layer to selectively protect the iridium layer during the etching step (c).
- a mask layer e.g., a TiN or Ti mask layer
- the present invention also provides a method of etching an iridium electrode layer disposed on a substrate comprising the steps of: a) providing a substrate supporting an iridium electrode layer, a protective layer on the iridium electrode layer, a Ti mask layer on the protective layer, and a patterned resist layer on the mask layer; b) etching a portion of the Ti mask layer including employing a plasma of an etchant gas to break through and to remove the portion of the Ti mask layer from the iridium elecfrode layer to expose part of the protective layer and to produce the subsfrate supporting the iridium elecfrode layer, the protective layer on the iridium electrode layer, a residual Ti mask layer on the protective layer, and the patterned resist layer on the residual Ti mask layer; c) removing the patterned resist layer from the residual Ti mask layer of step (b) to produce the substrate supporting the iridium electrode layer, the protective layer on the iridium elecfrode layer, and the residual mask layer on
- the present invention further also provides a method of etching an iridium electrode layer disposed on a substrate comprising the steps of: a) providing a subsfrate supporting an iridium electrode layer, a protective layer on the iridium electrode layer, a mask layer on the protective layer, and a patterned resist layer on the mask layer; b) etching a portion of the mask layer including employing a plasma of an etchant gas to break through and to remove the portion of the mask layer from the iridium electrode layer to expose part of the protective layer and to produce the substrate supporting the iridium electrode layer, the protective layer on the iridium electrode layer, a residual mask layer on the protective layer, and the patterned resist layer on the residual mask layer; c) etching the exposed part of the protective layer to expose part of the iridium electrode layer and to produce the substrate supporting the iridium elecfrode layer, a residual protective layer on the iridium electrode layer, the residual mask layer on the residual protective layer, and the
- the etchant gas of step (f) additionally comprises a gas selected from the group consisting of oxygen, HCl, HBr and mixtures thereof. More specifically the etchant gas comprises, preferably consists of or consists essentially of, oxygen, the halogen (i.e., chlorine), the noble gas (i.e., argon), and a gas selected from the group consisting of HBr, HCl and mixtures thereof.
- the halogen i.e., chlorine
- the noble gas i.e., argon
- the etchant gas more specifically comprises, or consists of or consists essentially of, from about 5%> by volume to about 20% by volume oxygen, from about 10% by volume to about 60%> by volume of the halogen gas (i.e., chlorine) and from about 30% by volume to about 80% by volume of the noble gas (i.e., argon) and from about 5% by volume to about 20% by volume of HBr and/or HCl; preferably from about 5% by volume to about 15% by volume oxygen, from about 20% by volume to about 50% by volume of the halogen gas (i.e., chlorine) and from about 40% by volume to about 70% by volume of the noble gas (i.e., argon) and from about 5% by volume to about 15%> by volume of HBr and/or HCl; and more preferably from about 5% by volume to about 10% by volume oxygen, from about 20% by volume to about 35% by volume of the halogen gas (i.e., chlorine) and from about 40%> by volume to about 60%) by volume of the
- the process parameters for etching an elecfrode layer in a suitable inductively coupled plasma reactor fall into the ranges as Hsted below on the basis of rates of the gases, including oxygen, the halogen gas(es) (i.e., Cl 2 ), the noble gas(ses) (i.e., Ar), and HBr and/or HCl.
- FIG. 1 is a side elevational view of a semiconductor wafer having a semiconductor substrate, a banier layer disposed on the semiconductor substrate, a platinum elecfrode layer disposed on the barrier layer, a mask layer disposed on the platinum elecfrode layer, and a patterned resist disposed on the mask layer;
- Fig. 2 is a side elevational view of the semiconductor wafer of Fig. 1 additionally including a protective layer disposed on the platinum electrode layer between the mask layer and the platinum elecfrode layer;
- Fig. 3 is a vertical sectional view of a prior art plasma processing apparatus including a plasma etching reactor with an electromagnetic unit for enhancing a plasma;
- Fig. 4 is a diagram of a flux produced by a magnetic field and illustrated as rotating around a center axis
- Fig. 5 is a side elevational view of the semiconductor wafer of Fig. 1 after etching and removing a portion of the mask layer from the surface of the platinum elecfrode layer to expose the platinum elecfrode layer;
- Fig. 6 is a side elevational view of the semiconductor wafer of Fig. 2 after etching and removing a portion of the mask layer from the surface of the protective layer to expose the protective layer;
- Fig. 7 is a side elevational view of the semiconductor wafer of Fig. 5 after the patterned resist layer has been removed from a portion of the mask layer with the removed patterned resist layer being represented as broken lines;
- Fig. 8 is a side elevational view of the semiconductor wafer of Fig. 6 after etching and removing a portion of the protective layer off of the surface of the platinum layer, and after removing the patterned resist layer from a portion of the mask layer with the removed patterned resist layer being represented as broken lines;
- Fig. 9 is a side elevational view of the semiconductor wafer of Fig. 7 after the platinum electrode layer has been etched to produce an etched platinum electrode layer
- Fig. 10 is a side elevational view of the semiconductor wafer of Fig. 8 after the platinum elecfrode layer has been etched to produce an etched platinum elecfrode layer;
- Fig. 11 is a side elevational view of the semiconductor wafer of Fig. 7 after the platinum elecfrode layer has been etched to produce an etched platinum elecfrode layer with a residual mask layer on top thereof;
- Fig. 12 is a side elevational view of the semiconductor wafer of Fig. 8 after the platinum electrode layer has been etched to produce an etched platinum electrode layer with a residual mask layer on top of the residual protective layer;
- Fig. 13 is a side elevational view of the semiconductor wafer of Fig. 11 with the residual mask layer removed from the surface of the etched platinum elecfrode layer;
- Fig. 14 is a side elevational view of the semiconductor wafer of Fig. 12 with the residual mask layer and the residual protective layer removed from the surface of the etched platinum electrode layer;
- Fig. 15 is a side elevational view of semiconductor wafer of Fig. 11 after the residual mask layer has been removed from the surface of the etched platinum elecfrode layer and with the banier layer having been etched;
- Fig. 16 is a side elevational view of semiconductor wafer of Fig. 12 after the residual mask layer and the residual protective layer have been removed from the surface of the etched platinum electrode layer and with the barrier layer having been etched;
- Fig. 17 is a simplified cut-away view of an inductively coupled RF plasma reactor which may be employed in etching the platinum elecfrode layer to produce a semiconductor device;
- Fig. 18 is a simplified cut-away view of another inductively coupled RF plasma reactor which may be employed in etching the platinum elecfrode layer to produce a semiconductor device;
- Fig. 19 is a picture showing an elevational view of a test semiconductor wafer for Example I after the platinum elecfrode layer was etched in accordance with the process conditions listed in Example I;
- Fig. 20 is a picture showing an elevational view of the test semiconductor wafer of Fig. 19 after the oxide mask was removed;
- Fig. 21 is a drawing representing the elevational view in the picture of Fig.
- Fig. 22 is a drawing representing the elevational view in the picture of Fig.
- Fig. 23 is a picture showing an elevational view of a test semiconductor wafer for Example II after the platinum elecfrode layer was etched in accordance with the process conditions listed in Example II;
- Fig. 24 is a drawing representing the elevational view on the picture of
- Fig. 25 is a side elevational view of a semiconductor wafer having a semiconductor substrate, an etch-stop layer disposed on the semiconductor substrate, a barrier layer disposed on the etch-stop layer, a platinum elecfrode layer disposed on the barrier layer, a protective layer disposed on the platinum electrode layer and a patterned mask layer disposed on the protective layer;
- Fig. 26 is a schematic diagram illustrating masking and etching sequences for another embodiment of the invention.
- Fig. 27 is a schematic diagram illustrating masking and etching sequences for a further embodiment of the invention.
- Fig. 28 is a schematic diagram illustrating masking and etching sequences for yet another embodiment of the invention.
- Fig. 29 is a schematic diagram illustrating masking and etching sequences for yet a further embodiment of the invention.
- Fig. 30 is a picture show the test semiconductor wafer of Example III after the TEOS mask layer was removed;
- Fig. 31 is a picture of an elevational view of the test semiconductor wafer of Example IV after the SiLK® brand mask layer of the test semiconductor was etched in the DPSTM brand chamber;
- Fig. 32 is a picture of an elevational view of the test semiconductor wafer of Example IN after the platinum layer and the Ti ⁇ (i.e., a barrier layer) was etched in the DPSTM brand chamber;
- Fig. 33 is a picture of an elevational view of the test semiconductor wafer of Example IN after the SiLK® brand mask layer was removed or stripped from the etched platinum layer in an ASP chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus;
- Fig. 34 is a top plan view picture of the etched platinum layer of Fig. 33;
- Fig. 35 is a partial exploded sectional view of the inductively coupled RF plasma reactor of Fig. 17 illustrating the dome-shaped dielectric ceiling;
- Fig. 36 is a partial side elevational view of a surface finish of a deposit- receiving surface of a dielectric member (i.e., a dielecfric window or the dome-shaped dielecfric ceiling);
- Fig. 37 is a picture showing an elevational view of a test semiconductor wafer for Example N after the platinum elecfrode layer was etched in accordance with the process conditions listed in Example N;
- Fig. 38 is a drawing representing the elevational view of the picture of Fig. 37 with the respective parts identified by reference numerals;
- Fig. 39 is a picture showing an elevational view of a test semiconductor wafer for Example NI after the platinum elecfrode layer was etched in accordance with the process conditions listed in Example VI;
- Fig. 40 is a drawing partially representing the elevational view of the picture of Fig. 39 with the respective parts identified by reference numerals;
- Fig. 41 is a partial perspective view of a dome-shaped dielectric ceiling having an inside concave surface
- Fig. 42 is a partial sectional view of the dome-shaped dielectric ceiling of Fig. 41 after its associated inside concave surface has received a deposit of by-product materials in accordance with Example VII;
- Fig. 43 is a partial sectional view of the dome-shaped dielecfric ceiling of Fig. 41 after its associated inside concave surface has received a deposit of by-product materials in accordance with Example VIII;
- Fig.44 is a partial exploded sectional view of a dome-shaped dielectric ceiling having a roughened inside concave surface that has received a deposit of byproduct materials in accordance with Example IX;
- Fig. 45 is a picture showing an elevational view of a test semiconductor wafer for Example X after an iridium electrode layer was etched in accordance with the process conditions listed in Example X;
- Fig. 46 is a drawing representing the elevational view in the picture of Fig. 45 with respective parts identified by a reference numeral;
- Fig. 47 is a picture showing an elevational view of a test semiconductor wafer for Example XI after an iridium elecfrode layer was etched in accordance with the process conditions listed in Example XI;
- Fig. 48 is a drawing representing the elevational view in the picture of Fig. 47 with the respective parts identified by a reference numeral.
- a wafer generally illustrated as 10, having a semiconductor subsfrate, generally illustrated as 12.
- the semiconductor substrate 12 preferably comprises silicon dioxide (SiO 2 ) and includes regions of circuit elements which do not appear in the drawings, but are well known to those skilled in the art.
- the semiconductor substrate 12 comprises a compound selected from the group consisting of tetraethylorthosilicate (TEOS), silicon dioxide, and mixtures thereof.
- TEOS tetraethylorthosilicate
- a barrier layer 14 is disposed over the semiconductor substrate 12 and a layer (e.g., an elecfrical conductive layer, such as a noble metal layer [or an oxide or alloy of same] including a platinum layer or an iridium layer, etc.), generally illustrated as 15, is disposed over the barrier layer 14.
- a layer e.g., an elecfrical conductive layer, such as a noble metal layer [or an oxide or alloy of same] including a platinum layer or an iridium layer, etc.
- an etch-stop layer 17 is disposed on the semiconductor substrate 12 between the semiconductor substrate 12 and the banier layer 14.
- the layer 15 is preferably an elecfrode layer 16 as shown in Fig. 1. Because the elecfrode layer 16 is a prefened layer 15, the remaining description of the present invention will use only the term "electrode layer 16" in describing the present invention.
- electrode layer 16 is stated hereinafter, it is to also have the equivalence of "layer 15" for purposes of the present invention. It is also to be understood that in one prefened embodiment of the present invention "elecfrode layer 16" may be a "platinum elecfrode layer 16" or an "iridium elecfrode layer 16," unless otherwise indicated. Thus, whenever “platinum elecfrode layer 16" is stated or mentioned hereinafter for a prefened embodiment of the invention, it is to be understood that the electrode layer 16 includes platinum and the prefened embodiment of the present invention relates to etching platinum to produce the desired features of the present invention as set forth hereinafter.
- the elecfrode layer 16 includes iridium and the prefened embodiment of the present invention relates to etching iridium to produce the desired features of the present invention as set forth hereinafter. Because the elecfrode layer 16 easily diffuses or reacts with certain elements (e.g., a poly-Si plug) within the semiconductor substrate 12, the barrier layer 14 is required between the electrode layer 16 and the semiconductor subsfrate 12. The banier layer 14 also functions as an adhesive for coupling the semiconductor subsfrate 12 to the electrode layer 16.
- a mask 18 is disposed over the elecfrode layer 16 and a patterned resist (i.e., a photoresist), generally illustrated as 20, is selectively positioned on the mask layer 18 as best shown in Fig. 1.
- the patterned resist 20 includes a plurality of resist members 20a, 20b, 20c, and 20d.
- a protective layer 22 is disposed between the electrode layer 16 and the mask layer 18.
- the barrier layer 14 may be any suitable layer which is capable of dually functioning as an adhesive and a diffusion barrier to the electrode layer 16.
- the barrier layer 14 may be of any suitable thickness.
- the barrier layer 14 comprises Ta and/or TaN and/or TaSiN and/or WN X and/or titanium and/or a titanium alloy, such as TiN and TiSiN, and possesses a thickness ranging from about 50 Angstroms to about 600 Angsfroms, more preferably from about 200 Angsfroms to about 400 Angsfroms, most preferably about 300 Angsfroms.
- the barrier layer 14 comprises BST (i.e., barium titanate (BaTiO 3 ) and strontium titanate (SrTiO 3 )).
- the barrier layer 14 may comprise PZT (Pb(Zr ⁇ - x Ti x )0 3 ) and SBT (SrBi 2 Ti 2 0 9 ).
- the banier layer 14 functions as a dielecfric for a capacitor.
- the banier layer 14 is preferably disposed on the semiconductor substrate 12 by the RF magnetron sputtering method.
- the etch-stop layer 17 as best shown in Fig. 25 may be any suitable layer which is capable of functioning as an adhesive, and, optionally, in conjunction with barrier layer 14 being a diffiision barrier to the elecfrode layer 16.
- Etch-stop layer 17 may be of any suitable thickness.
- the etch-stop layer 17 comprises a compound selected from the group consisting of silicon nitride (Si 3 N 4 ), titanium dioxide (TiO 2 ), ruthenium dioxide (RuO 2 ), iridium dioxide (IrO 2 ), and possesses a thickness ranging from about 50 Angsfroms to about 1000 Angsfroms, more preferably from about 200 Angsfroms to about 700 Angstroms, most preferably from about 300 Angsfroms to about 500 Angsfroms, e.g., about 400 Angsfroms.
- the etch-stop layer 17 is preferably disposed on the semiconductor subsfrate 12 by chemical vapor deposition.
- the elecfrode layer 16 may be any suitable one or more noble metal (or oxide or alloy of same), such as platinum or iridium as one prefened elecfrode material because they are inert to oxidation which tends to occur in the subsequent high temperature processes of depositing the high dielectric constant fenoelectric materials.
- the electrode layer 16 comprising platinum or iridium is also used as the electrode material because platinum and iridium are good electric conductors. The thickness of the electrode layer 16 would depend upon the end use of the semiconductor or capacitance device which is to contain the electrode layer 16.
- the thickness of the elecfrode layer 16 ranges from about 500 Angstroms to about 5000 Angstroms, more preferably from about 1000 Angstroms to about 4000 Angstroms, most preferably from about 2000 Angstroms to about 3000 Angstroms, e.g., about 2000 Angstroms.
- the electrode layer 16 is preferably disposed on the banier layer 14 by the RF magnetron sputtering method.
- the mask layer 18 may be any suitable insulation or metallic material that is capable of being etched in accordance with the procedure described hereinafter such that all traces of the mask layer 18 are essentially removed from the surface platinum electrode layer 16 except that portion (identified as “18a,” “18b,” “18c,” and “18d” below) of the mask layer 18 remaining under the patterned resist 20.
- the mask layer 18 may also be of any suitable thickness.
- the mask layer 18 comprises silicon dioxide (SiO 2 ) and/or silicon nitride (Si 3 N 4 ) or any other suitable dielectric material. The thickness of the mask layer 18 would depend on constituency of the mask layer 18, as well as the constituency of the layer 15 or electrode layer 16.
- a prefened thickness for the mask layer 18 ranges from about 1,000 Angsfroms to about 15,000 Angstroms, more preferably from about 3,000 Angsfroms to about 12,000 Angsfroms, most preferably from about 6,000 Angstroms to about 9,000 Angsfroms, e.g., about 7,000 Angstroms.
- the ratio of the thickness of the mask layer 18 to the thickness of the layer 15, or the electrode layer 16, ranges from about 0.2 to about 5.0, preferably from about 0.5 to about 4.0, more preferably from about 1.0 to about 3.0.
- the mask layer 18 comprises a compound selected from the group consisting of organic polymers, chemical vapor deposited (CVD) Si0 2 , doped CVD Si0 2 tefraethyorthosilicate (TEOS), CVD Si 3 N and mixtures thereof.
- the organic polymer is a high temperature polymer capable of standing up to 400°C, such as amorphous carbon, polyamide, parylene and aromatic hydrocarbons.
- a suitable organic polymer has been determined to be an organic polymer sold by Dow Chemical Co. of Midland, MI, under the registered trademark SiLK®.
- the doped CVD Si0 2 is a CVD Si0 2 film having doping gases added to the CVD reactant gases, such as adding phosphorus dopant to form phosphosilicate glass (PSG), adding boron dopant to form borosilicate glass (BSG), or adding both phosphorus and boron dopants to form borophosphosilicate (BGSG).
- the mask layer 18 is preferably disposed on the platinum elecfrode layer 16 by chemical vapor deposition. In another embodiment of the present invention, the mask layer 18 comprises
- Ti and/or TiN preferably TiN.
- a clean iridium surface is produced after removal of the mask layer 18 with no fence or veil formation.
- the etch selectivity of iridium to the TiN is greater than about 8.0, preferably greater than about 10.0.
- the spirit and scope of the present invention includes etching of a platinum electrode layer 16, or any other noble metal elecfrode layer 16, while supporting a mask layer 18 comprising TiN, with the etching of the platinum electrode layer 16 being conducted in a high density plasma of an etchant gas comprising oxygen, a halogen gas (e.g., Cl 2 ), and a noble gas (e.g., argon).
- an etchant gas comprising oxygen, a halogen gas (e.g., Cl 2 ), and a noble gas (e.g., argon).
- the thickness for the mask layer 18 for this embodiment of the invention ranges from about 500 Angstroms to about 9000 Angstroms, preferably from about 2000 Angsfroms to about 7000 Angstroms, more preferably about 3000 Angstroms.
- the ratio of the thickness of the mask layer 18 to the thickness of the layer 15, or the electrode layer 16 ranges from about 0.2 to about 5.0, preferably from about 0.5 to about 4.0, more preferably from about 1.0 to about 3.0.
- the mask layer 18 is preferably disposed on the electrode layer 16 by chemical vapor deposition.
- the patterned resist 20 may be any suitable layer of material(s) that is capable of protecting any underlying material (e.g., the mask layer 18) from being etched during the etching process of the present invention.
- Suitable materials for the patterned resist 20 include resist systems consisting of novolac resin and a photoactive dissolution inhibitor (all based on S ⁇ ss's discovery).
- Other suitable materials for the resist 20 are listed in an article from the July 1996 edition of Solid State Technology entitled "Deep-UV Resists: Evolution and Status" by Hiroshi Ito.
- the patterned resist 20 may have any suitable thickness; preferably, the thickness of the patterned resist 20 ranges from about 0.3 ⁇ m to about 1.40 ⁇ m, more preferably from about 0.5 m to about 1.2 ⁇ m, most preferably about 0.8 ⁇ m.
- the patterned resist 20 is preferably disposed on the mask layer 18 by the spin coating method.
- Fig. 2 is for protecting the corners (identified as “16g” below) of an etched elecfrode layer (generally identified as “16e” below) during the overetching process of the present invention.
- Another purpose of the protective layer 22 is for providing good adhesion to the mask layer 18 and the elecfrode layer 16.
- the protective layer 22 may comprise any suitable materials or chemicals, such as titanium and/or titanium nitride etc., and may be conveniently disposed on the surface of the electrode layer 16, such as by the RF magnetron sputtering method.
- the thickness of the protective layer 22 may be any suitable thickness, preferably ranging from about 50 Angsfroms to about 1000 Angsfroms, more preferably ranging from about 100 Angsfroms to about 600 Angsfroms, most preferably from about 100 Angstroms to about 400 Angsfroms, e.g., about 300 Angsfroms.
- the multilayered structure is initially placed in a suitable plasma processing apparatus to break through and remove or etch away from the surface of the electrode layer 16 the mask layer 18, except those mask layers 18a, 18b, 18c and 18d that are respectively below the resist members 20a, 20b, 20c and 20d, as best shown in Fig. 5, or as best shown in Fig. 6 if the embodiment of the invention depicted in Fig. 2 or Fig. 25 is being employed.
- the plasma process apparatus of Fig. 3 comprises a plasma reactor, generally illustrated as 30 and including walls, generally illustrated as 31 for forming and housing a reactor chamber 32 wherein a plasma 33 of neutral (n) particles, positive (+) particles, and negative (-) particles are found.
- Walls 31 include cylindrical wall 54 and cover 56.
- Plasma processing gases are introduced via inlets 34 into reactor chamber 32.
- Plasma etching gases are introduced into chamber 32 through inlets 44-44.
- a water cooled cathode 36 is connected to an RF power supply 38 at 13.56 MHz.
- An anode 39 is connected to the walls 31 which are grounded by line 40.
- Helium gas is supplied through passageway 50 through cathode 36 to the space beneath wafer 10 which is supported peripherally by lip seal 52 so that the helium gas cools the wafer 10.
- the wafer 10 is supported by a wafer support 46 that includes a plurality of clamps (not shown) which hold down the upper surface of wafer 10 at its periphery, as is well known to those skilled in the art.
- a pair of helmholtz configured elecfromagnetic coils 42 and 43 provide north and south poles within the chamber 32 and are disposed at opposite ends of the lateral cylindrical wall 54 and the walls 31.
- the elecfromagnetic coils 42 and 43 provide a fransverse magnetic field with the north and south poles at the left and right providing a horizontal magnetic field axis parallel to the surface of the wafer 10.
- the transverse magnetic field is applied to slow the vertical velocity of the electrons which are accelerated radially by the magnetic field as they move towards the wafer 10. Accordingly, the quantity of electrons in the plasma 33 is increased by means of the fransverse magnetic field and the plasma 33 is enhanced as is well known to these skilled in the art.
- the electromagnetic coils 42 and 43 which provide the magnetic field are independently controlled to produce a field intensity orientation which is uniform.
- the field can be stepped angularly around the wafer 10 by rotating the energization of the elecfromagnetic coils 42 and 43, sequentially.
- the fransverse magnetic field provided by the elecfromagnetic coils 42 and 43 is directed parallel to the surface of the wafer 10 being treated by the plasma 33, and the cathode 36 of the plasma reactor 30 increases ionization efficiently of the electrons in the plasma 33.
- This provides the ability to decrease the potential drop across the sheath of the cathode 36 and to increase the ion cunent flux present on the surface of the wafer 10, thereby permitting higher rates of etching without requiring higher ion energies to achieve the result otherwise.
- the prefened magnetic source employed to achieve magnetically enhanced reactive ion etcher (MERIE) used in practicing the present invention is a variable rotational field provided by the elecfromagnetic coils 42 and 43 ananged in a Helmholtz configuration.
- the elecfromagnetic coils 42 and 43 are driven by 3 -phase AC cunents.
- the magnetic field with Flux B is parallel to the wafer 10, and perpendicular to the elecfrical field as shown in Fig. 4. Refening to Fig.
- the vector of the magnetic field H which produces flux B is rotating around the center axis of the elecfrical field by varying the phases of cunent flowing through the elecfromagnetic coils 42 and 43 at a typical rotational frequency of 0.01 to 1 Hz, particularly at 0.5 Hz.
- the strength of the magnetic flux B typically varies from 0 Gauss to about 150 Gauss and is determined by the quantities of the cunents supplied to the elecfromagnetic coils 42 and 43. While Fig.
- FIG. 3 illustrates one plasma processing apparatus that is suitable for removing the mask layer 18 (except mask layers 18a, 18b, 18c and 18d), it is to be understood that other plasma etchers may be employed, such as electron cyclotron resonance (ECR), helicon resonance or inductively coupled plasma (ICP), triode etchers, etc.
- ECR electron cyclotron resonance
- ICP inductively coupled plasma
- triode etchers etc.
- the plasma 33 may employ any suitable etchant gas to break through (i.e., to clean and etch away) the mask layer 18 except those mask layers 18a, 18b, 18c and 18d that are respectively below the resist members 20a, 20b, 20c and 20d, as best shown in Figs. 5 and 6.
- suitable etchant gas(es) may be selected from the group consisting of fluorine-containing gases (e.g., CHF 3 , SF 6 , C 2 F 6 , NF 3 , etc.), bromine-containing gases (e.g., HBr, etc.), chlorine- containing gases (e.g., CHC1 3 , etc.), rare or noble gases (e.g., argon, etc.), and mixtures thereof.
- fluorine-containing gases e.g., CHF 3 , SF 6 , C 2 F 6 , NF 3 , etc.
- bromine-containing gases e.g., HBr, etc.
- chlorine- containing gases e.g., CHC1 3 , etc.
- rare or noble gases e.g., argon, etc.
- the etchant does not include an oxidant, such as oxygen, since the purpose of this step is to remove the mask layer 18 (except those mask layers 18a, 18b, 18c and 18d which are respectively protected by resist members 20a, 20b, 20c and 20d) and not to remove the patterned resist 20.
- the etchant gas comprises from about 20% by volume to about 40% by volume CHF 3 and from about 60% by volume to about 80% by volume argon.
- the prefened reactor conditions for a suitable plasma processing apparatus (such as the plasma processing apparatus of Fig. 3) in removing the mask layer 18 (except mask layers 18a, 18b, 18c and 18d) are as follows:
- the selectivity of mask layer 18 to patterned resist 20 is better than 3:1, depending on the materials employed for the mask layer 18 and the patterned resist 20.
- the process parameters for removing the mask layer 18 in a suitable plasma process apparatus fall into ranges as listed in the following Table III and based on flow rates of the gases CHF 3 and Ar also listed in the following Table HI:
- Ar 50 to 90 60 to 80% by vol. 60 to 80
- suitable etchant gas(es) to break through (i.e., to clean and etch away) the Ti TiN-containing mask layer 18 except for those mask layers 18a, 18b, 18c and 18d that are respectively below the resist numbers 20a, 20b, 20c and 20d, as best shown Figs. 5 and 6, may be selected from the group consisting of a noble gas (e.g., argon), a halogen (e.g., Cl 2 ), and a gas selected from the group consisting of HBr, BC1 3 , and mixtures thereof.
- a noble gas e.g., argon
- a halogen e.g., Cl 2
- the etchant gas comprises from about 10% by volume to about 30% by volume argon, from about 20% by volume to about 60% by volume chlorine, and from about 20% by volume to about 60% by volume HBr and/or BC1 3 .
- the prefened reactor conditions for a suitable plasma processing apparatus such as the plasma processing apparatus of Fig. 3) in removing the mask layer 18 (except mask layer 18a, 18b, 18c and 18d) comprising Ti and/or TiN are as follows: Pressure 10-150 mTon
- the selectivity of the Ti/TiN-containing mask layer 18 to patterned resist 20 is better than 3:1, depending on the materials employed for the patterned resist 20. More generally, the process parameters for removing the Ti/TiN-containing mask layer 18 in a suitable plasma process apparatus (such as the plasma processing apparatus of Fig. 3) fall into ranges as listed in the following Table IV and based on flow rates of the gases argon, chlorine and HBr and/or BC1 3 also listed in the following Table IV:
- HBr and/or BC1 3 30 to 100 (20 to 60% by vol.) 50 to 70
- the protective layer 22 has to be removed or etched after removal of the mask layer 18 in order to expose the platinum elecfrode layer 16.
- the protective layer 22 may be etched and removed by any suitable manner and/or with any suitable plasma processing apparatus (such as with the plasma processing apparatus of Fig. 3) including the plasma 33 employing a suitable etchant gas to break through and etch away the protective layer 22 except those protective layers 22a, 22b, 22c and 22d (see Figs. 6 and 8) immediately below mask layers 18a, 18b, 18c and 18d, respectively.
- suitable etchant gas(es) may be selected from the group consisting of Cl 2 , HBr, BC1 3 , noble gases (e.g., Ar), and mixtures thereof.
- the etchant gas for breaking through and etching away the protective layer 22, except protective layers 22a, 22b, 22c and 22d comprises from about 20% by volume to about 60% by volume Cl 2 , from about 20% by volume to about 60% by volume HBr and/or BC1 3 , and from about 10% by volume to about 30% by volume of a noble gas which is preferably Ar.
- Suitable reactor conditions for a suitable plasma processing apparatus such as the plasma processing apparatus of Fig.
- protective layer 22 except protective layers 22a, 22b, 22c and 22d
- protective layers 22a, 22b, 22c and 22d may be the same as those previously stated reactor conditions for the removal of the mask layer 18 (except mask layers 18a, 18b, 18c and 18d).
- other plasma etchers may be employed to remove the protective layer 20, such as ECR, ICP, Helicon Resonance, etc.
- the protective layers 22a, 22b, 22c and 22d are for protecting the corners (identified as "16g” below) of an etched elecfrode layer (generally identified as "16e” below) during the etching process of the present invention.
- the protective layers 22a, 22b, 22c and 22d not only protect the corners of an etched platinum electrode layer during the etching process, but also assist in maintaining an existing profile and/or improves a profile (e.g., an etched platinum or iridium profile).
- the protective layer 22 may be etched and removed by the high temperatures and etchant gases employed in the noble metal-etching process (e.g., platinum-etching process) of the present invention. More specifically and as will be further explained below, because the elecfrode layer 16 (e.g., platinum elecfrode layer 16) is preferably etched under the following process conditions in a high density plasma chamber containing a high density inductively coupled plasma:
- Halogen Gas e.g., Cl 2 20% to 95% by vol.
- Temperature (°C) of Wafer about 150 to about 500°C
- the protective layer 22 may be etched and removed under the same foregoing conditions.
- the same apparatus and process conditions may be employed to etch and remove selective parts of the protective layer 22, as well as to etch the electrode layer 16.
- the protective layer 22 and the elecfrode layer 16 e.g., platinum elecfrode layer 16
- Halogen Gas e.g., Cl 2
- Cl 2 Halogen Gas
- Temperature (°C) of Wafer about 150 to 500°C
- the protective layer 22 (except protective layers 22a, 22b, 22c and 22d) may be etched by the high temperatures and etchant gases employed in the iridium-etching process of the present invention. More specifically and as will be further explained below, because the iridium electrode layer 16 is preferably etched under the following process conditions in a high density plasma chamber containing a high density inductively coupled plasma: Process Parameters
- the protective layer 22 may be etched and removed under the same foregoing conditions.
- the same apparatus and process conditions may be employed to etch and remove selective parts of the protective layer 22, as well as to etch the iridium electrode layer 16.
- the protective layer 22 and the iridium electrode layer 16 may be removed and etched respectively in a high density plasma chamber containing a high density inductively coupled plasma under the following process conditions:
- Halogen Gas e.g., Cl 2 ) 10% to 60% by vol.
- the resist members 20a, 20b, 20c and 20d are to be removed.
- the resist members 20a, 20b, 20c and 20d may be removed at any suitable time, preferably before the etching of the electrode layer 16 and before the heating of the semiconductor subsfrate 12 to a temperature greater than about 150° C. The same would hold true with respect to the embodiment of the invention illustrated in Figs.
- the resist members 20a, 20b, 20c and 20d may be removed before the etching away of selective parts of the protective layer 22.
- the resist members 20a, 20b, 20c and 20d may be removed after (or simultaneously during) the removal of selective parts of the protective layer 22 and before the heating of the semiconductor substrate 12 to a temperature greater than about 150° C for purposes of etching the elecfrode layer 16.
- the resist members 20a, 20b, 20c and 20d would be removed while selective parts of the protective layer 22 are being etched away to expose the elecfrode layer 16 that is not superimposed by the protective layers 22a, 22b, 22c and 22d.
- the resist members 20a, 20b, 20c and 20d may be removed in any suitable manner such as by using oxygen plasma ashing which is well known to those skilled in the art.
- the resist members 20a, 20b, 20c and 20d may be respectively stripped from the mask layers 18a, 18b, 18c and 18d with any suitable plasma processing apparatus, such as the plasma processing apparatus shown in Fig. 3 and employing a plasma containing an etchant gas comprising oxygen.
- the resist members 20a, 20b, 20c and 20d have been respectively removed from the mask layers 18a, 18b, 18c and 18d in an advanced strip passivation (ASP) chamber of a plasma processing apparatus sold under the frademark metal etch MxP Centura to Applied Materials, Inc.
- ASP advanced strip passivation
- the ASP chamber may employ microwave downstream O 2 /N 2 plasma with the following recipe: 120 seconds, 250°C, 1400W, 3000cc O 2 , 300cc N 2 and 2Ton.
- the electrode layer 16 After the electrode layer 16 has been exposed as represented in Figs. 7 and 8, it is etched to develop a submicron pattern with a profile. As will be further stated below, before the elecfrode layer 16 is etched, the semiconductor subsfrate 12 supporting the elecfrode layer 16 is heated to a temperature greater than about 150° C, preferably greater than about 150° C up to about 500° C, more preferably from about 200° C to about 400° C, most preferably from about 250° C to about 350° C. The semiconductor substrate 12 is heated by the pedestal which supports the wafer 10 during the etching process (e.g., the noble metal etching process).
- the etching process e.g., the noble metal etching process
- the elecfrode layer 16 may be etched in any suitable plasma processing apparatus, such as in the reactive ion etching (RIE) plasma processing apparatus sold under the trademark AME8100 EtchTM, or under the frademark Precision Etch 5000TM, or under the frademark Precision Etch 8300TM, all trademarks owned by Applied Materials Inc., 3050 Bowers Avenue, Santa Clara, CA 95054-3299.
- RIE reactive ion etching
- Another suitable plasma processing apparatus for etching the elecfrode layer 16 is that plasma processing apparatus sold under the trademark Metal Etch DPS CenturaTM also owned by Applied Materials, Inc. It is also to be understood that other plasma etchers may be employed, such as ECR, ICP, Helicon Resonance, etc.
- the dielectric member has an inside surface which functions as a deposit- receiving surface where noble metal by-products, such as platinum by-products, form during plasma etching.
- the inside deposit-receiving surface of the dielectric member includes a surface finish having a peak-to valley roughness height with an average height value of more than about lOOOA; more preferably, an average height value of more than about 1800A, such as ranging from about 1800 A to about 4000A; most preferably, an average height value of more than about 4000A, such as ranging from about 4000A to about 8000A.
- Roughness may be defined as relatively finely spaced surface irregularities. On surfaces produced by machining and abrading operations, the inegularities produced by the cutting action of tool edges and abrasive grains and by the feed of the machine tool are roughness. Roughness deviations are measured perpendicular to a nominal surface NS (see Fig. 36).
- roughness height R H is measured from a peak P to a valley V.
- the nominal surface NS is the surface that would result if the peaks P were leveled off to fill the valleys V.
- the roughness height R H (sometimes designated in the art as R A ) values are average height values resulting from calculating the arithmetical average of all R H values on a deposit-receiving surface of a dielectric member obtained with a suitable instrument for measuring roughness of a surface.
- a suitable instrument for measuring an average R H value on the deposit-receiving surface may be obtained commercially from WYKO Corporation, Arlington, AZ under model No.
- PZ- 06-SC-SF which is a non-contact optical surface profiler that employs phase-shifting interferometry (PSI) modes for measuring smooth surfaces and vertical-scanning interferomefry (VSI) modes for measuring rough surfaces and steps.
- PSI phase-shifting interferometry
- VSI vertical-scanning interferomefry
- Suitable procedures for calculating an average R H value on the deposit-receiving surface is described in a technical manual entitled WYKO Surface Profilers Technical Reference Manual, published by WYKO Corporation, and fully incorporated herein by reference thereto.
- a prefened procedure for finishing the deposit-receiving surface to obtain desirable average roughness height values includes bead blasting with 36-grid alumina.
- wafers 10, such as semiconductor substrates 12, are processed within a plasma processing chamber, preferably such as by plasma etching for patterning integrated circuit (TC) metal interconnect devices.
- plasma etching is one of the prefened plasma processes for the embodiment of the invention employing a dielectric member (or window) including an inside surface (i.e., a deposit-receiving surface) having a surface finish having a peak-to-valley roughness height with an average height value of more than about 1000 A
- plasma etching is one of the prefened plasma processes for the embodiment of the invention employing a dielectric member (or window) including an inside surface (i.e., a deposit-receiving surface) having a surface finish having a peak-to-valley roughness height with an average height value of more than about 1000 A
- the spirit and scope of this embodiment of the invention includes other forms of processing subsfrates, such as chemical vapor deposition and physical vapor deposition.
- processing power e.g., RF power, magnetron power, microwave power, etc.
- a dielectric member which includes a dielectric window of a nonconductive material such as a ceramic dome, etc., and becomes coupled to a plasma of the proceeding gas.
- metal etching of metals e.g., platinum, copper, aluminum, titanium, ruthenium, iridium, etc.
- a deposit of materials occurs on an inside surface of the dielecfric member, as disclosed in copending patent application Serial No. 08/920,283, filed August 26, 1997, and fully incorporated herein by reference thereto.
- the deposit is located between the plasma and the power source. If the plasma process for this embodiment of the present invention is plasma etching, the deposit results from etching a metal layer on the subsfrate; and, thus, the deposit could be electrically conductive, and includes, by way of example only, metal, metal oxide(s), metal nitride(s), etc.
- the metal conesponds to the metal which is being etched within the process chamber and includes, also by way of example only, platinum, copper, aluminum, titanium, ruthenium, iridium, etc.
- the deposit When the deposit is electrically conductive and is between the plasma and the power source, a decay in processing power transmission occurs and continues until the electrically conductive deposit reaches a certain thickness (i.e., skin depth), such as from about 0.001 in. to about 0.5 in., whereafter the processing power transmission becomes very low or even nil.
- the deposit therefore, behaves as a Faraday shield to reduce the efficiency of processing power transmission into the plasma of the processing gas within the process chamber.
- the processing e.g., the etch rate
- the inside deposit-receiving surface of the dielectric member includes, as was more specifically discussed above, a surface finish having a peak-to-valley roughness height with an average height value of more than about 1000 A.
- the etchant gas broadly comprises a halogen containing gas, such as a halogen gas (e.g., fluorine, chlorine, bromine, iodine, and astatine) and a noble gas such as helium, neon, argon, krypton, xenon, and radon.
- a halogen gas e.g., fluorine, chlorine, bromine, iodine, and astatine
- a noble gas such as helium, neon, argon, krypton, xenon, and radon.
- the etchant gas comprises or consists of or consists essentially of a halogen (preferably chlorine) and a noble gas selected from the group consisting of helium, neon, and argon.
- the noble gas is preferably argon.
- the etchant gas more specifically comprises, or consists of or consists essentially of, preferably from about 20% by volume to about 95% by volume of the halogen gas (i.e., chlorine) and from about 5% by volume to about 80%> by volume of the noble gas (i.e., argon); more preferably from about 40% by volume to about 80%> by volume of the halogen gas (i.e., chlorine) and from about 20% by volume to about 60% by volume of the noble gas (i.e., argon); most preferably from about 55% by volume to about 65%> by volume of the halogen gas (i.e., chlorine) and from about 35% by volume to about 45% by volume of the noble gas (i.e., argon).
- the etchant gas may also broadly comprise oxygen, a halogen containing gas, such as a halogen gas (e.g., fluorine, chlorine, bromine, iodine, and astatine), and a noble gas such as helium, neon, argon, krypton, xenon, and radon.
- a halogen gas e.g., fluorine, chlorine, bromine, iodine, and astatine
- a noble gas such as helium, neon, argon, krypton, xenon, and radon.
- the etchant gas comprises, or consists of or consists essentially of, a halogen (preferably chlorine) and a noble gas selected from the group consisting of helium, neon and argon.
- the noble gas is preferably argon.
- the etchant gas more specifically comprises, or consists of or consists essentially of, preferably from about 5% by volume to about 40% by volume oxygen, from about 10% by volume to about 60% by volume of the halogen gas (i.e., chlorine), and from about 30% by volume to about 80%) by volume of the noble gas (i.e., argon); more preferably from about 10% by volume to about 30% by volume oxygen, from about 20% by volume to about 50% by volume of the halogen gas (i.e., chlorine), and from about 40%> by volume to about 70% of the noble gas (i.e., argon); most preferably from about 10% by volume to about 20% by volume oxygen, from about 20% by volume to about 30% by volume halogen gas (i.e., chlorine), and from about 50% by volume to about 70% by volume of noble gas (i.e., argon).
- the etchant gas comprises, preferably consists of or consists essentially of, the halogen (i.e., chlorine), the noble gas (i.e., argon), and a gas selected from the group consisting of HBr, BC1 3 and mixtures thereof.
- the halogen i.e., chlorine
- the noble gas i.e., argon
- the etchant gas more specifically comprises, or consists of or consists essentially of, from about 10% by volume to about 90% by volume of the halogen gas (i.e., chlorine) and from about 5% by volume to about 80% by volume of the noble gas (i.e., argon) and from about 4% by volume to about 25% by volume of HBr and/or BC1 3 ; preferably from about 40% by volume to about 70% by volume of the halogen gas (i.e., chlorine) and from about 25% by volume to about 55% by volume of the noble gas (i.e., argon) and from about 5% by volume to about 20% by volume of HBr and/or BC1 ; and more preferably from about 50%> by volume to about 60% by volume of the halogen gas (i.e., chlorine) and from about 35% by volume to about 45% by volume of the noble gas (i.e., argon) and from about 5% by volume to about 15% by volume of HBr and/or BC1 3 .
- HBr and/or BC1 3 are for removal of residue (e.g. platinum or iridium residue) during etching of the electrode layer 16 (e.g., the platinum or iridium elecfrode layer).
- residue e.g. platinum or iridium residue
- the electrode layer 16 e.g., the platinum or iridium elecfrode layer.
- Plasmas containing argon are known to have a high energetic ion concentration and are often used for physical sputtering. The sputtering effect due to the ions is a function of the accelerating potential which exist between the plasma and the sample.
- the etchant gas comprises, preferably consists of or consists essentially of, oxygen, the halogen (i.e., chlorine), the noble gas (i.e., argon), and a gas selected from the group consisting of HBr, HCl and mixtures thereof.
- the halogen i.e., chlorine
- the noble gas i.e., argon
- the etchant gas more specifically comprises, or consists of or consists essentially of, from about 5%> by volume to about 20% by volume oxygen, from about 10% by volume to about 60%> by volume of the halogen gas (i.e., chlorine) and from about 30% by volume to about 80% by volume of the noble gas (i.e., argon) and from about 5% by volume to about 20% by volume of HBr and/or HCl; preferably from about 5% by volume to about 15% by volume oxygen, from about 20% by volume to about 50% by volume of the halogen gas (i.e., chlorine) and from about 40% by volume to about 70% by volume of the noble gas (i.e., argon) and from about 5% by volume to about 15% by volume of HBr and/or HCl; and more preferably from about 5% by volume to about 10% by volume oxygen, from about 20% by volume to about 35% by volume of the halogen gas (i.e., chlorine) and from about 40% by volume to about 60% by volume of the noble gas (
- the etchant gas flow rate ranges from about 50 seem to about 500 seem.
- the etchant gas broadly comprises nifrogen, a halogen (e.g., fluorine, chlorine, bromine, iodine, and astatine) and a noble gas such as helium, neon, argon, krypton, xenon, and radon.
- a halogen e.g., fluorine, chlorine, bromine, iodine, and astatine
- a noble gas such as helium, neon, argon, krypton, xenon, and radon.
- the etchant gas comprises or consists of or consists essentially of nitrogen, a halogen (preferably chlorine) and a noble gas selected from group consisting of helium, neon, and argon.
- the noble gas is preferably argon.
- the etchant gas more specifically comprises, or consists of or consists essentially of, preferably from about 0.1% by volume to about 60% by volume nitrogen, from about 40% by volume to about 90%> by volume of the halogen gas (i.e., chlorine), and from about 0.1% by volume to about 40% by volume of the noble gas (i.e., argon); more preferably from about 5% by volume to about 40% by volume nifrogen, from about 50% by volume to about 80%> by volume of the halogen gas (i.e., chlorine), and from about 5% by volume to about 30% by volume of the noble gas (i.e., argon); most preferably from about 10% by volume to about 30% by volume nitrogen, from about 60% by volume to about 70% by volume of the halogen gas (i.e., chlorine), and from about 10% by volume to about 20%) by volume of the noble gas (i.e., argon).
- the plasma of the etchant gas may be a high density plasma or a low-density
- the etchant gas comprises, preferably consists of or consists essentially of, nitrogen, the halogen (i.e., chlorine), the noble gas (i.e., argon), and a gas selected from the group consisting of HBr, BC1 3 , SiCL, and mixtures thereof.
- the halogen i.e., chlorine
- the noble gas i.e., argon
- the etchant gas more specifically comprises, or consists of or consists essentially of, from about 0.1 % by volume to about 60% by volume nifrogen, from about 40% by volume to about 90% by volume of the halogen gas (i.e., chlorine), and from about 0.1% by volume to about 40%> by volume of the noble gas (i.e., argon), and from about 1%) by volume to about 30% by volume of HBr and/or BC1 3 and/or SiCl 4 ; preferably from about 5% by volume to about 40% by volume nifrogen, from about 50% by volume to about 80%) by volume of the halogen gas (i.e., chlorine), and from about 5% by volume to about 30%) by volume of the noble gas (i.e., argon), and from about 5% by volume to about 20% by volume of HBr and/or BC1 3 and/or SiCl 4 ; and more preferably from about 10% by volume to about 30% by volume nitrogen, from about 60% by volume to about 70% by volume of the
- the etchant gas comprises or consists of or consists essentially of nitrogen and a halogen (preferably chlorine).
- the etchant gas more specifically comprises, or consists of or consists essentially of, preferably from about 10% by volume to about 90%) by volume nitrogen and from about 10% by volume to about 90% by volume of the halogen gas (i.e., chlorine); more preferably from about 20% by volume to about 60% by volume nifrogen and from about 40%> by volume to about 80% by volume of the halogen gas (i.e., chlorine); most preferably from about 30%> by volume to about 40% by volume nitrogen, and from about 60% by volume to about 70% by volume of the halogen gas (i.e., chlorine).
- the plasma of the etchant gas may be a high density plasma or a low-density plasma having a density of less than about 10 1 Vcm 3 , preferably less than about 10 9 /cm 3 .
- the reactor conditions for a suitable plasma processing apparatus such as the plasma processing apparatus of Fig. 3, in etching the elecfrode layer 16 (e.g., platinum elecfrode layer 16) are as follows: Pressure 0.1-300 mTon
- the selectivity of elecfrode layer 16 to mask 18 is better than 2:1, depending on the materials employed for the mask layer 18.
- the process parameters for etching the elecfrode 16 in a suitable plasma processing apparatus fall into ranges as listed in the following Table V and based on the flow rate of etchant gas as also listed in Table V below: TABLE V
- RF Power 50 to 3000 500 to 2000 700 to 1200
- a prefened etchant gas for etching the elecfrode layer 16 is a mixture of chlorine and argon, or a mixture of chlorine, argon and HBr and/or BC1 3 .
- Another prefened etchant gas for etching the elecfrode layer 16 is a mixture of oxygen, chlorine and argon, or a mixture of oxygen, chlorine, argon and HBr and/or HCl.
- the etchant gas is a mixture of chlorine and argon (i.e., from about 20% > by volume to about 95% by volume chlorine and from about 5% by volume to about 80% by volume argon), or a mixture of chlorine, argon and HBr and/or BC1 3 (i.e., from about 10% by volume to about 90%> by volume chlorine and from about 5% by volume to about 80% by volume argon and from about 4% by volume to about 25% by volume HBr and/or BC1 3 ), and if the semiconductor subsfrate 12 is heated to a temperature greater than about 150°C, preferably to a temperature ranging from about 150°C to about 500°C, the plasma processing apparatus for etching the elecfrode layer 16 (e.g., the platinum elecfrode layer 16 or the iridium elecfrode layer 16) etches the elecfrode layer 16 in a high density plasma of the etchant gas at a high etch rate (e.g., an
- the produced elecfrodes (e.g., produced platinum electrodes) are separated by a distance or space having a dimension equal to or less than about 0.35 ⁇ m, preferably equal to or less than about 0.3 ⁇ m.
- Each of the electrodes include a dimension having a value equal to or less than about 1.0 ⁇ m, preferably equal to or less than about 0.6 ⁇ m, more preferably equal to or less than about 0.35 ⁇ m, most preferably equal to or less than about 0.3 ⁇ m. More preferably, each of the elecfrodes (e.g., produced platinum electrodes) have a width equal to or less than about 1.0 ⁇ m, preferably equal to or less than about 0.6 ⁇ m, and a height equal to or less than about 0.6 ⁇ m.
- the etched electrode layer 16e i.e., etched electrode layers 16a, 16b, 16c and 16d
- the method of the present invention produces etched elecfrode layers 16a, 16b, 16c and 16d which are essentially veil-less.
- the produced etched electrode layers 16a, 16b, 16c and 16d are essentially veil-less and have no “fences” or “rabbit ears,” they are ideally suited for receiving a dielecfric BST or PZT or SBT layer and functioning as elecfrodes in a semiconductor device (i.e., a capacitance structure).
- the high density plasma of the present invention may be defined as a plasma of the etchant gas of the present invention having an ion density greater than about 10 9 /cm 3 , preferably greater than about 10 ⁇ /cm 3 .
- the source of the high density plasma may be any suitable high density source, such as electron cyclotron resonance (ECR), helicon resonance or inductively coupled plasma (ICP)-type sources. All three are in use on production equipment today. The main difference is that ECR and helicon sources employ an external magnetic field to shape and contain the plasma, while ICP sources do not.
- the high density plasma for the present invention is more preferably produced or provided by inductively coupling a plasma in a decoupled plasma source etch chamber, such as that sold under the frademark DPSTM owned by Applied Materials, Inc. which decouples or separates the ion flux to the wafer 10 and the ion acceleration energy.
- a decoupled plasma source etch chamber such as that sold under the frademark DPSTM owned by Applied Materials, Inc. which decouples or separates the ion flux to the wafer 10 and the ion acceleration energy.
- the design of the etch chamber provides fully independent control of ion density of an enlarged process window. This is accomplished by producing plasma via an inductive source. While a cathode within the etch chamber is still biased with RF electric fields to determine the ion acceleration energy, a second RF source (i.e., an inductive source) determines the ion flux.
- This second RF source is not capacitive (i.e., it does not use electric fields like the cathode) since a large sheath voltage would be produced, interfering with the cathode bias and effectively coupling the ion energy and ion flux.
- the inductive plasma source couples RF power through a dielecfric window rather than an elecfrode.
- the power is coupled via RF magnetic fields (not electric fields) from RF current in a coil. These RF magnetic fields penetrate into the plasma and induce RF electric fields (therefore the term "inductive source") which ionize and sustain the plasma.
- the induced elecfric fields do not produce large sheath voltages like a capacitive elecfrode and therefore the inductive source predominantly influences ion flux.
- the cathode bias power plays little part in determining ion flux since most of the RF power (typically an order of magnitude less than the source power) is used in accelerating ions.
- the combination of an inductive plasma source and a capacitive wafer bias allows independent control of the ion flux and ion energy reaching the wafer 10 in the etch chamber, such as the DPSTM brand etch chamber.
- DPSTM brand etch chambers for producing the high density plasma of the present invention for etching the elecfrode layer 16 to produce the etched electrode layers 16a, 16b, 16c and 16d may be any of the DPSTM brand etch chambers of the inductively coupled plasma reactor disclosed in U.S. Patent No. 5,753,044, entitled "RF PLASMA REACTOR WITH HYBRID CONDUCTOR AND MULTI-RADIUS DOME CEILING" and assigned to the present assignee and fully incorporated herein by reference thereto as if repeated verbatim immediately hereinafter.
- an inductively coupled RF plasma reactor generally illustrated as 90, having a reactor chamber, generally illustrated as 92, wherein a high density plasma 94 of neutral (n) particles, positive (+) particles, and negative (-) particles are found.
- the reactor chamber 92 has a grounded conductive cylindrical sidewall 60 and a dielecfric ceiling 62 having an inside concave surface 62a which would receive deposits of by- products from plasma processing of wafers 10.
- the inductively coupled RF plasma reactor 90 further comprises a wafer pedestal 64 for supporting the (semiconductor) wafer 10 in the center of the chamber 92, a cylindrical inductor coil 68 surrounding an upper portion of the chamber 92 beginning near the plane of the top of the wafer 10 or wafer pedestal 64 and extending upwardly therefrom toward the top of the chamber 92, an etching gas source 72 and gas inlet 74 for furnishing an etching gas into the interior of the chamber 92, and a pump 76 for controlling the pressure in the chamber 92.
- the coil inductor 68 is energized by a plasma source power supply or RF generator 78 through a conventional active RF match network 80, the top winding of the coil inductor 68 being "hot" and the bottom winding being grounded.
- the wafer pedestal 64 includes an interior conductive portion 82 connected to the bias RF power supply or generator 84 and an exterior grounded conductor 86 (insulated from the interior conductive portion 82).
- the plasma source power applied to the coil inductor 68 by the RF generator 78 and the DC bias RF power applied to the wafer pedestal 64 by generator 84 are separately controlled RF supplies. Separating the bias and source power supplies facilitates independent control of ion density and ion energy, in accordance with well-known techniques.
- the coil inductor 68 is adjacent to the chamber 92 and is connected to the RF source power supply or the RF generator 78.
- the coil inductor 68 provides the RF power which ignites and sustains the high ion density of the high density plasma 94.
- the geometry of the coil inductor 68 can in large part determine spatial distribution of the plasma ion density of the high density plasma 94 within the reactor chamber 92.
- Uniformity of the plasma density spatial distribution of the high density plasma 94 across the wafer 10 is improved (relative to conical or hemispherical ceilings) by shaping the ceiling 62 in a multi-radius dome and individually determining or adjusting each one of the multiple radii of the ceiling 62.
- the multiple-radius dome shape in the particular embodiment of Fig. 17 somewhat flattens the curvature of the ceiling 62 around the center portion of the ceiling 62, the peripheral portion of the ceiling 62 having a steeper curvature.
- the coil inductor 68 may be coupled to the RF power source 78, 80 in a minor coil configuration that is known to those skilled in the art.
- the RF source 78, 80 is connected to the center winding of the coil inductor 68 while the top and bottom ends of the coil inductor 68 are both grounded.
- the minor coil configuration has the advantage of reducing the maximum potential on the coil inductor 68.
- a semiconductor device is produced with electrodes (e.g., noble metal electrodes such as platinum elecfrodes or iridium) having a profile with an angular value which is equal to or greater than about 80 degrees (e.g., equal to greater than about 80 degrees for iridium), preferably equal to or greater than about 85 degrees (e.g., equal to or greater than 85 degrees for platinum), more preferably equal to or greater than about 87 degrees, most preferably equal to or greater than about 88.5 degrees.
- electrodes e.g., noble metal electrodes such as platinum elecfrodes or iridium
- the electrodes are essentially veil- less; that is, they have no "fences” or "rabbit ears.”
- the elecfrodes are preferably separated by a distance or space having a dimension equal to or less than about 0.35 ⁇ m, preferably equal to or less than about 0.3 ⁇ m.
- Each of the electrodes include a dimension having a value equal to or less than about 1.0 ⁇ m, preferably equal to or less than about 0.6 ⁇ m, more preferably equal to or less than about 0.35 ⁇ m, most preferably equal to or less than about 0.3 ⁇ m.
- each of the elecfrodes have a width equal to or less than about 0.35 ⁇ m, more preferably equal to or less than about 0.3 ⁇ m, a length equal to or less than about 1.0 ⁇ m, more preferably equal to or less than about 0.6 ⁇ m, and a height equal to or less than about 0.6 ⁇ m.
- the prefened reactor conditions for a suitable inductively coupled RF plasma reactor such as the inductively coupled RF plasma reactor 90 in Figs. 17 and 18, in etching the elecfrode layer 16 (e.g., platinum electrode layer 16) are as follows: Pressure 0.1 to 300 mTon
- the process parameters for etching the elecfrode layer 16 e.g., platinum elecfrode layer 16
- a suitable inductively coupled plasma reactor such as the inductively coupled plasma reactor 90 in Figs. 17 and 18, fall into ranges as listed on the basis of flow rates of the gases, including the halogen gas(es) (i.e., Cl 2 ) and the noble gas(es) (i.e., argon), as listed in Table VI below.
- the process parameters for etching the electrode layer 16 e.g. an iridium elecfrode layer 16
- a suitable inductively coupled plasma reactor such as the inductively coupled plasma reactor 90 in Figs. 17 and 18, fall into ranges as listed on the basis of flow rates of the gases, including oxygen, the halogen gas(es) (i.e., Cl 2 ), and the noble gas(es) (i.e., argon), as listed in Table Nil below.
- the etchant gases are a mixture of the halogen gas(es) (i.e., chlorine), the noble gas(es) (i.e., argon), and HBr and/or BC1 3
- the process parameters for etching the elecfrode layer 16 e.g., platinum elecfrode layer 16
- a suitable inductively coupled plasma reactor such as the inductively coupled plasma reactor 90 in Figs.
- Cla 30 to 400 50 to 250 60 to 150
- Temperature of Wafer about 150 to about 500 200 to 400 250 to 350
- the etchant gases are a mixture of oxygen, the halogen gas(es) (i.e., chlorine), the noble gas(es) (i.e., argon), and HBr and/or BC1 3 , the process parameters for etching elecfrode layer 16 (e.g., iridium electrode layer 16) in a suitable inductively coupled plasma reactor, such as the inductively coupled plasma reactor 90 in Figs.
- the foregoing process conditions are preferably based on flow rates of etchant gas(es) having a flow rate value ranging from about 5 to about 500 seem.
- the process parameters of the Tables may vary in accordance with the size of the wafer 10.
- the etchant gas comprises or consists of or consists essentially of a halogen (preferably chlorine) and a noble gas selected from the group consisting of helium, neon, and argon.
- the etchant gas comprises, or consists of or consists essentially of, oxygen, a halogen (preferably chlorine) and a noble gas selected from the group consisting of helium, neon, and argon.
- the noble gas is preferably argon.
- the etchant gas more specifically comprises or consists of or consists essentially of from about 20% by volume to about 95% by volume of the halogen gas (i.e., chlorine) and from about 5% by volume to about 80% by volume of the noble gas (i.e., argon); preferably from about 40% by volume to about 80% by volume of the halogen gas (i.e., chlorine) and from about 20%> by volume to about 60% by volume of the noble gas (i.e., argon); more preferably from about 55% by volume to about 65% by volume of the halogen gas (i.e., chlorine) and from about 35% by volume to about 45% > by volume of the noble gas (i.e., argon).
- the halogen gas i.e., chlorine
- the noble gas i.e., argon
- the etchant gas more specifically comprises, or consists of or consists essentially of, from about 5% by volume to about 40% by volume oxygen, from about 10% by volume to about 60%) by volume of the halogen gas (i.e., chlorine) and from about 30% by volume to about 80%) by volume of the noble gas (i.e., argon); preferably from about 10%) by volume to about 30% by volume oxygen, from about 20%> by volume to about 50%> by volume of the halogen gas (i.e., chlorine) and from about 40% by volume to about 70% by volume of the noble gas (i.e., argon); more preferably from about 10%> by volume to about 20% by volume oxygen, from about 20% by volume to about 30% by volume of the halogen gas (i.e., chlorine) and from about 50% by volume to about 70% by volume of the noble gas (i.e., argon).
- the halogen gas i.e., chlorine
- the noble gas i.e., argon
- the etchant gas comprises, preferably consists of or consists essentially of, the halogen (i.e., chlorine), the noble gas (i.e., argon), and a gas selected from the group that consists of HBr, BC1 3 and mixtures thereof.
- the etchant gas comprises, preferably consists of or consists essentially of, oxygen, the halogen (i.e., chlorine), the noble gas (i.e., argon), and a gas selected from the group that consists of HBr, BC1 3 and mixtures thereof.
- the etchant gas more specifically comprises, or consists of or consists essentially of from about 10% by volume to about 90% by volume of the halogen gas (i.e., chlorine) and from about 5% by volume to about 80% by volume of the noble gas (i.e., argon) and from about 4% by volume to about 25%> by volume of HBr and/or BC1 3 ; preferably from about 40% by volume to about 70% by volume of the halogen gas (i.e., chlorine) and from about 25%> by volume to about 55% by volume of the noble gas (i.e., argon) and from about 5% by volume to about 20%> by volume of HBr and/or BC1 3 ; and more preferably from about 50% by volume to about 60% by volume of the halogen gas (i.e., chlorine) and from about 35% by volume to about 45% by volume of the noble gas (i.e., argon) and from about 5% by volume to about 15% by volume of HBr and/or BC1 3 .
- the etchant gas more specifically comprises, or consists of or consists essentially of, from about 5% by volume to about 20%) by volume oxygen, from about 10%> by volume to about 60%> by volume of the halogen gas (i.e., chlorine) and from about 30% by volume to about 80% by volume of the noble gas (i.e., argon) and from about 5% by volume to about 20% by volume of HBr and/or HCl; preferably from about 5% by volume to about 15% by volume oxygen, from about 20%) by volume to about 50% by volume of the halogen gas (i.e., chlorine), from about 40% by volume to about 70% by volume of the noble gas (i.e., argon) and from about 5% by volume to about 15% by volume of HBr and/or HCl; and more preferably from about 5% by volume to about 10% by volume oxygen, from about 20%> by volume to about 35%> by volume of the halogen gas (i.e., chlorine) and from about 40%) by
- the process parameters for etching the iridium electrode layer 16 in a suitable inductively coupled plasma reactor fall into ranges as listed on the basis of flow rates of the gases, including oxygen, the halogen gas(es), (i.e., Cl 2 ), and the noble gas(es) (i.e., argon), as hsted in Table X below.
- Temperature of Wafer about 150 to about 500 200 to 400 250 to 350
- the etchant gases are a mixture of oxygen, the halogen gas(es) (i.e., chlorine), the noble gas(es) (i.e., argon), and HBr and/or HCl
- the process parameters for etching iridium electrode layer 16 supporting a Ti/TiN mask layer 18 in a suitable inductively coupled plasma reactor fall into the ranges as listed on the basis of rates of the gases, including oxygen, the halogen gas(es) (i.e., Cl 2 ), the noble gas(ses) (i.e., Ar), and HBr and/or HCl, as Hsted in Table XI below:
- the process parameters for etching in a low density (or high density) plasma the elecfrode layer 16 (e.g., platinum electrode layer 16) in a suitable inductively coupled plasma reactor fall into ranges as listed on the basis of flow rates of the gases, including nitrogen (N 2 ), the halogen gas(es) (i.e., Cl 2 ), and the noble gas(es) (i.e., argon), as hsted in Table XII below.
- C-2 30 to 400 50 to 300 100 to 200
- Temperature of Wafer about 150 to about 500 200 to 400 250 to 350
- RIE reactive ion etch
- Cl 2 30 to 400 50 to 300 100 to 200
- Temperature of Wafer about 150 to 200 to 400 250 to 350 about 500
- RIE reactive ion etch
- Cl 2 30 to 600 100 to 400 150 to 200
- the etchant gases are a mixture of nitrogen (N 2 ), the halogen gas(es) (i.e., chlorine), the noble gas(es) (i.e., argon), and HBr and/or BC1 and/or SiCl 4
- the process parameters for etching in a low density (or high density) plasma the electrode layer 16 (e.g., platinum electrode layer 16) in a suitable inductively coupled plasma reactor fall into the ranges as listed on the basis of flow rates of the gases, including nitrogen (N 2 ), the halogen gas(es) (i.e., Cl 2 ), the noble gas(es) (i.e., Ar), and HBr and/or BC1 3 and/or SiCl 4 , as listed in Table XV below:
- Cl 2 30 to 400 50 to 300 100 to 200
- RIE reactive ion etch
- Cl 2 30 to 400 50 to 300 100 to 200
- the foregoing process conditions are preferably based on flow rates of etchant gas(es) having a flow rate value ranging from about 5 to about 500 seem.
- the etchant gas comprises or consists of or consists essentially of nitrogen, a halogen (preferably chlorine) and a noble gas selected from the group consisting of helium, neon, and argon.
- the noble gas is preferably argon.
- the etchant gas more specifically comprises, or consists of or consists essentially of, preferably from about 0.1 %> by volume to about 60%> by volume nitrogen, from about 40% by volume to about 90% by volume of the halogen gas (i.e., chlorine), and from about 0.1% by volume to about 40% by volume of the noble gas (i.e., argon); more preferably from about 5% by volume to about 40% by volume nitrogen, from about 50% by volume to about 80%> by volume of the halogen gas (i.e., chlorine), and from about 5% by volume to about 30% by volume of the noble gas (i.e., argon); most preferably from about 10% by volume to about 30%> by volume nifrogen, from about 60% by volume to about 70% by volume of the halogen gas (i.e., chlorine), and from about 10%) by volume to about 20% by volume of the noble gas (i.e., argon).
- the halogen gas i.e., chlorine
- the noble gas i.e.,
- the etchant gas comprises or consists of or consists essentially of a nitrogen and halogen (preferably chlorine).
- the etchant gas more specifically comprises, or consists of or consists essentially of, preferably from about 10% by volume to about 90%> by volume nifrogen and from about 10% by volume to about 90% by volume of the halogen gas (i.e., chlorine); more preferably from about 20%> by volume to about 60% by volume nitrogen and from about 40% by volume to about 80% by volume of the halogen gas (i.e., chlorine); most preferably from about 30%> by volume to about 40% by volume nitrogen and from about 60% by volume to about 70%) by volume of the halogen gas (i.e., chlorine).
- the etchant gas comprises, preferably consists of or consists essentially of, nifrogen, the halogen (i.e., chlorine), the noble gas (i.e., argon), and a gas selected from the group consisting of HBr, BC1 3 , SiCL, and mixtures thereof.
- the halogen i.e., chlorine
- the noble gas i.e., argon
- the etchant gas more specifically comprises, or consists of or consists essentially of, from about 0.1% by volume to about 60%> by volume nitrogen, from about 40% by volume to about 90% by volume of the halogen gas (i.e., chlorine), and from about 0.1% by volume to about 40% by volume of the noble gas (i.e., argon), and from about 1% by volume to about 30% by volume of HBr and/or BC1 3 and/or SiCL; preferably from about 5%> by volume to about 40% by volume nitrogen, from about 50% by volume to about 80% by volume of the halogen gas (i.e., chlorine), and from about 5% by volume to about 30% by volume of the noble gas (i.e., argon), and from about 5% by volume to about 20% by volume of HBr and/or BC1 3 and/or SiCl 4 ; and more preferably from about 10% by volume to about 30% by volume nitrogen, from about 60%> by volume to about 70% by volume of the halogen gas (i.e., chlorine), and from
- noble metal etch by-products may become less conductive electrically, and the stability of RF power transmission through the dielectric window becomes more stable, by operating the platinum etch process in a high Cl 2 /Ar ratio and a high pressure regime.
- the Cl 2 /Ar ratio may be any suitable elevated or high gas volume ratio, preferably a Cl 2 /Ar volume ratio of greater than 2(>2): 1 , more preferably greater than 4(>4): 1.
- the high pressure may be any suitable elevated or high pressure, preferably greater than 10 mTon (>10 mTon), more preferably greater than 24 mTon (>24).
- the etchant gases are a mixture of the halogen gas(es) (i.e., chlorine) and the noble gas(es) (i.e., argon)
- the process parameters for etching the electrode layer 16 e.g., platinum electrode layer 16
- a suitable inductively coupled plasma reactor for reducing the electrical conductivity of layer 16 by-products fall into the ranges as listed on the basis of flow rates of the gases, including the halogen gas(es) (i.e., Cl 2 ) and the noble gas(es) (i.e., Ar), as hsted in Table XVII below:
- Halogen e.g., Cl 2
- Noble gas e.g., Ar
- Ar Noble gas
- Temperature of Wafer about 150 to about 200 to 400 250 to 350 (°C) 500
- the foregoing process conditions stated in Table XVII above may be based on the following etchant gas constituency for reducing the electrical conductivity of noble metal by-products (e.g., platinum etch by-products): preferably from about 50%> to about 96% by volume of the halogen gas(es) (i.e., chlorine) and from about 4% to about 50% by volume of the noble gas(es) (i.e., argon); more preferably from about 60% to about 90% by volume of the halogen gas(es) (i.e., chlorine) and from about 10% to about 40%> by volume of the noble gas(es) (i.e., argon); most preferably from about 70% to about 85% by volume of the halogen gas(es) (i.e., chlorine) and from about 15% to about 30% by volume of the noble gas(es).
- noble metal by-products e.g., platinum etch by-products
- the protective layers 22a, 22b, 22c and 22d protect the corners 16g of the etched elecfrode layers 16a, 16b, 16c and 16d during the etching process.
- some of the mask layers 18a, 18b, 18c and 18d would be etched during the etching process, leaving residual mask layers 18r on top of etched electrode layers 16a, 16b, 16c and 16d, or on top of the protective layers 22a, 22b, 22c and 22d.
- the protective layers 22a, 22b, 22c and 22d respectively, insure that the corners 16g of the etched electrode layers 16a, 16b, 16c and 16d are protected during etching, especially in the event that the etching process removes essentially all of the mask layers 18a, 18b, 18c and 18d. Maintaining the corners 16g of the etched elecfrode layers 16a, 16b, 16c and 16d protects the quality of the profile formed during etching of the electrode layer 16 to produce the etched electrode layers 16a, 16b, 16c and 16d.
- the residual mask layers 18r (if not completely removed during the etching process) typically remain on top of the veil-less etched electrode layers 16a, 16b, 16c and 16d, or on top of the protective layers 22a, 22b, 22c and 22d which are respectively supported by the essentially veil-less etched electrode layers 16a, 16b, 16c and 16d, all as best shown in Figs. 11 and 12.
- the residual mask layers 18r are to be removed by any suitable means and/or in any suitable manner, such as by CHF 3 /Ar plasma. Likewise for the embodiment of the invention depicted in Fig.
- the protective layers 22a, 22b, 22c and 22d are to be removed after removal of the residual mask layers 18r from the protective layers 22a, 22b, 22c and 22d.
- the protective layers 22a, 22b, 22c and 22d may be removed by any suitable means and/or in any suitable manner.
- the protective layers 22a, 22b, 22c and 22d comprise TiN removal is by Ar/Cl 2 plasma in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following apparatus and process conditions as listed in Table XVIII below. TABLE XV ⁇ i
- the veil-less etched elecfrode layered structure of Fig. 13 or Fig. 14 remains. It should be noted, as best shown in Figs. 15 and 16, respectively, that the barrier layer 14 could be etched simultaneously during or after removal of the residual mask layers 18r (see Fig. 15), or etched simultaneously during or after removal of the residual mask layers 18r and the protective layers 22a, 22b, 22c and 22d (see Fig. 16). It is to be understood that the patterned resist 20 (i.e., resist members 20a,
- the patterned resist 20 i.e., resist numbers 20a, 20b, 20c and 20d
- the mask layers 18a, 18b, 18c and 18d for the embodiment of the invention depicted in Fig. 2 may be removed at any suitable time, preferably before the etching of the electrode layer 16.
- the protective layers 22a, 22b, 22c and 22d and/or mask layers 18a, 18b, 18c and 18d for the embodiment of the invention depicted in Fig. 2 may also be removed at any suitable time, such as during the etching process or after the etching process.
- the wafer 10 of Fig. 2 is provided with the semiconductor substrate 12, the banier layer 14 (e.g., TiN, TiSiN, Ti, WN, TaN, TaSiN, Ta, etc.) and the protective layer 22 comprising a compound selected from the group consisting of TiN, TiSiN, Ti, WN, TaN, TaSiN, Ta, and mixtures thereof, and the mask layer 18 selected from the group consisting of CVD SiO 2 , TEOS, Si 3 N 4 , BSG, PSG, BPSG, a low dielecfric constant material with a low dielectric constant of less than about 3.0, and mixtures thereof.
- the banier layer 14 e.g., TiN, TiSiN, Ti, WN, TaN, TaSiN, Ta, etc.
- the protective layer 22 comprising a compound selected from the group consisting of TiN, TiSiN, Ti, WN, TaN, TaSiN, Ta, and mixtures thereof
- the elecfrode layer 16 is a noble metal such as Pt, Ir, Pd, and Ru, or any oxide or alloy of a noble metal.
- This multilayered structure is initially placed in a suitable plasma processing apparatus to selectively break through and etch away from the surface of the elecfrode layer 16, the mask layer 18 except those mask layers 18a, 18b, 18c and 18d that are respectively below the resist members 20a, 20b, 20c and 20d as best shown in Fig. 6.
- the plasma for any suitable plasma processing apparatus may employ any suitable etchant gas.
- the resist members 20a, 20b, 20c and 20d are removed in accordance with any of the previously mentioned procedures such that masking and etching sequence of Fig. 26 may be conducted.
- the resist 20 i.e., resist members 20a, 20b, 20c and 20d
- the protective layer 22 and the elecfrode layer 16 are etched.
- etching continues into the barrier layer 14. Stated alternatively, etching stops in the barrier layer 14.
- the mask layers 18a, 18b, 18c and 18d are selectively removed, preferably without etching the barrier layer 14.
- the protective layers 22a, 22b, 22c and 22d are then removed, and the remaining part of the barrier layer 14 is thereafter etched with the etching process stopping in the subsfrate 12.
- the protective layer 22 may be selectively etched in accordance with any of the previously mentioned procedures such as with a Cl 2 /HBr and/or BCl 3 /Ar gas chemistry in the same plasma processing apparatus that selectively etched the mask layer 18.
- the protective layer 22 may be selectively etched in the same chamber and under the same conditions for etching the elecfrode layer 16, i.e., in a high density plasma chamber containing a high density inductively coupled plasma. Etching of the protective layer 22 produced protective layers 22a, 22b, 22c and 22d. If the protective layer 22 is etched in accordance with the same procedure(s) for etching the elecfrode layer 16, the resist members 20a, 20b, 20c and 20d are initially removed before etching because they cannot be exposed to the high temperature (i.e., > 150°C) processing conditions for etching the electrode layer 16.
- the high temperature i.e., > 150°C
- the exposed parts of the electrode layer 16 are etched in accordance with any of the methods (e.g., the temperature of the wafer 10 is greater than about 150°C) and any of the etchant gases of any of the embodiments of the present invention to produce elecfrode layers 16a, 16b, 16c and 16d and expose selective parts of the banier layer 14.
- the electrode layer 16 may be etched not only in a high density plasma but also in a low density plasma.
- the mask layers 18a, 18b, 18c and 18d are then removed in any suitable plasm processing apparatus employing a plasma of any suitable etchant gas.
- the protective layers 22a, 22b, 22c and 22d are then removed in accordance with any suitable procedure and process conditions. Subsequently, and as best shown in Fig. 26, the barrier layer 14 is then etched through and the etching process ceases in the substrate 12.
- the foregoing sequences may be performed on the semiconductor wafer 10 of Fig. 1 (i.e., a wafer without the protective layer 22). All reactors and process conditions for conducting the foregoing mask and etching sequence may be any suitable reactors and process conditions.
- the etching sequence is the same as for Fig. 26 except instead of etch-stopping in the barrier layer 14 before removal of the mask layer 18, etching continues into the substrate 12. After etching into the subsfrate 12, the mask layer 18 and the protective layer 22 are respectively removed, preferably without etching any further into the substrate 12.
- the barrier layer 14 and the protective layer 22 may be any one of the same compounds for the barrier layer 14 and the protective layer 22 for the embodiment of the invention illusfrated in Fig. 26.
- the mask layer 18 is preferably selected from the group consisting of Si 3 N , BSG, PSG, BPSG, a low dielectric constant (k) material with a dielectric constant less than about 3.0, and mixtures thereof.
- All reactors and process conditions for conducting the foregoing sequences may be any suitable reactors and process conditions, including the conditions where the temperature of the subsfrate 12 is greater than about 150°C and where the etchant gases may be any of the etchant gases of any of the embodiments of the present invention.
- the foregoing sequences may be performed on the semiconductor wafer 10 of Fig. 1 (i.e., a wafer without the protective layer 22).
- Fig. 28 for another embodiment of the present invention, there is seen the semiconductor wafer 10 of Fig. 25 having the etch-stop layer 17 (e.g., Si 3 N , TiO 2 , RuO 2 , IrO 2 ).
- the etching sequence comprises respectively etching through the protective layer 22, the elecfrode layer 16, and the banier layer 14.
- the etching sequence stops in the etch-stop layer 17.
- the mask layer 18 is selectively removed, preferably without etching the etch-stop layer 17, and then the protective layer 22 is removed.
- the etch-stop layer 17 may be left intact or etched down to the substrate 12.
- the barrier layer 14 and the protective layer 22 may be any one of the same compounds for the barrier layer 14 and the protective layer 22 for the embodiment of the invention in Fig. 26.
- the mask layer 18 is preferably selected from the group consisting of CVD SiO 2 , TEOS, BSG, PSG, BPSG, a low dielectric constant material with a dielecfric constant of less than about 3.0 and mixtures thereof.
- All reactors and process conditions for conducting the foregoing sequences may be any suitable reactors and process conditions, including the conditions where the temperature of the subsfrate 12 is greater than about 150°C and where the etchant gases may be any of the etchant gases of any of the embodiments of the present invention.
- the foregoing sequences may be performed on the semiconductor wafer 10 without the protective layer 22.
- the semiconductor wafer 10 having mask layer 18a and mask layer 18b.
- the ratio of the combined thicknesses of mask layer 18a and mask layer 18b (i.e., thickness of mask layer 18a plus thickness of mask layer 18b) to the thickness of the electrode layer 16 ranges from about 0.2 to about 5.0, preferably from about 0.5 to about 4.0, more preferably from about 1.0 to about 3.0.
- the ratio (thickness of mask layer 18a plus thickness of mask layer 18b)/thickness of elecfrode layer 16 ranges from about 0.2 to about 5.0, preferably from about 0.5 to about 4.0, more preferably from about 1.0 to about 3.0.
- Mask layer 18a is preferably composed of a compound selected from the group consisting of Si 3 N 4 , BSG, PSG, BPSG, an organic polymer, a low dielectric constant material with a dielectric constant of less than about 3.0 and mixtures thereof.
- a suitable organic polymer has been determined to be an organic polymer sold by Dow Chemical Co. of Midland, MI, under the registered frademark SiLK®.
- Mask layer 18b is preferably composed of a compound selected from the group consisting of CVD SiO 2 , TEOS, Si 3 N 4 , BSG, PSG, BPSG, and SiC.
- the barrier layer 14 and the protective layer 22 may be any one of the same compounds for the banier layer 14 and the protective layer 22 for the embodiment of the invention in Fig. 26.
- Mask layer 18b is initially removed, or optionally left in place, and the etch sequence includes: respectively etching through the protective layer 22, the electrode layer 16, and the banier layer 14. The etch sequence terminates in the subsfrate 12. Subsequently, mask layer 18b, or both mask layers 18a and 18b, are selectively removed, preferably without etching the subsfrate 12. Protective layer 22 is selectively removed from the etched elecfrode layer 22, preferably without etching subsfrate 12. The foregoing sequences may be performed on the semiconductor wafer 10 without the protective layer 22.
- All reactors and process conditions for conducting the foregoing sequences for this embodiment of the invention may be any suitable reactor and process conditions, including the conditions where the temperature of the subsfrate 12 is greater than about 150°C and where the etchant gases may be any of the etchant gases of any of the embodiments of the present invention.
- the etchant gases may be any of the etchant gases of any of the embodiments of the present invention.
- electrode layer 16 would include the combination of one or more layer(s) with each layer respectively comprising a noble metal and/or an oxide(s) of one or more noble metal and/or an alloy(s) of one or more noble metal(s).
- electrode layer 16 could comprise the combination of a layer of platinum, a layer of ruthenium disposed on the layer of platinum, and a layer of iridium oxide disposed on the layer of ruthenium.
- the “thickness of electrode layer 16” would include the summation of the respective thicknesses of all layer(s) that form the “elecfrode layer 16.”
- the thickness of the electrode layer 16 would be 1,000A (i.e., 30 ⁇ A + 50 ⁇ A + 200 A).
- the invention will be illusfrated by the following set forth example which s being given to set forth the presently known best mode and by way of illusfration only and not by way of any limitation. All parameters such as concentrations, mixing proportions, temperatures, pressure, rates, compounds, etc., submitted in this example are not to be construed to unduly limit the scope of the invention.
- Example I A test semiconductor wafer was formulated with the following film stack:
- the feature size of the patterned PR test semiconductor wafer was 0.3 ⁇ m block and 0.25 ⁇ m spacing.
- the oxide mask i.e., the mask layer
- the etchant gas for opening the oxide mask comprised about 68% by volume Ar and about 32% by volume CHF 3 .
- the reactor and process conditions were as follows: Reactor Conditions
- the photoresist was stripped from the oxide mask in an ASP chamber of the Metal Etch MxP CenturaTM brand plasma processing apparatus under the following recipe using microwave downstream O 2 /N 2 plasma: 120 seconds, 250° C, 1400 W, 3000 seem O 2 , 300 seem N 2 , and 2 Ton.
- the Ti protective layer was etched with Ar, Cl 2 and BC1 3 as the etchant gases and in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions:
- the platinum layer of the test semiconductor wafer was then etched with Ar and Cl 2 as the etchant gas and in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions:
- the oxide mask was then removed in a 6: 1 FJF solution to produce the veil-less test semiconductor wafer shown in Fig. 20.
- the remaining Ti protective layer could be removed by any suitable means and/or in any suitable manner, such as by etching with Ar, BC1 3 and Cl 2 as the etchant gases and in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions:
- a test semiconductor wafer was formulated with the following film stack: 0.8 ⁇ m patterned PR (photoresist)/500 ⁇ A Oxide/60 ⁇ A TiN/200 ⁇ A Pt/300A TiN
- the feature size of the patterned PR test semiconductor wafer was 0.25 ⁇ m block and 0.2 ⁇ m spacing.
- the oxide mask i.e., the mask layer
- the etchant gas for opening the oxide mask comprised about 68% by volume Ar and about 32% by volume CHF 3 .
- the reactor and process conditions were as follows: Reactor Conditions
- the photoresist was stripped from the oxide mask in an ASP chamber of the Metal Etch MxP CenturaTM brand plasma processing apparatus under the following recipe using microwave downstream O 2 2 plasma: 120 seconds, 250° C, 1400 W, 3000 seem O 2 , 300 seem N 2 , and 2 Ton.
- the TiN protective layer was etched with Ar, Cl 2 and BC1 3 as the etchant gases and in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions:
- the platinum layer of the test semiconductor wafer was then etched with Ar and Cl 2 and BC1 3 as the etchant gas and in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions:
- the oxide mask could have been removed in a 6: 1 HF solution to produce a veil-less test semiconductor wafer similar to the one shown in Fig. 20.
- the remaining TiN protective layer could have been removed by any suitable means and/or in any suitable manner, such as by etching with Ar, BC1 3 and Cl 2 as the etchant gases and in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions: Reactor Conditions
- Example III A test semiconductor wafer was formulated with the following film stack:
- the feature size of the patterned PR test semiconductor wafer was 0.35 ⁇ m line and 0.35 ⁇ m spacing.
- the TEOS mask i.e., the mask layer
- the etchant gas for opening the TEOS mask comprised about 68% by volume Ar and about 32% by volume CHF 3 .
- the reactor and process conditions were as follows: Reactor Conditions
- the photoresist was stripped from the TEOS mask in an ASP chamber of the Metal Etch MxP CenturaTM brand plasma processing apparatus under the following recipe using microwave downstream O 2 /N 2 plasma: 120 seconds, 250° C, 1400 W, 3000 seem O 2 , 300 seem N 2 , and 2 Ton.
- the TiN protective layer was etched with Ar, Cl 2 and BC1 3 as the etchant gases and in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions: Reactor Conditions
- the platinum layer of the test semiconductor wafer was then etched with Ar, Cl 2 , BC1 3 and N 2 as the etchant gas and in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions:
- the TiN layer underneath the platinum layer was then etched with Ar, BC1 2 and N 2 as the etchant gas and in a DPTTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions:
- the TEOS mark was then removed in a 6:1 HF solution to produce a veil- free test semiconductor wafer shown in the picture of Fig. 30.
- the remaining TiN protective layer on the etched platinum layer could be removed by any suitable means and/or in any suitable manner, such as by etching with Ar, BC1 3 and Cl 2 as the etchant gases and in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions:
- Example IN A test semiconductor wafer was formulated with the following film stack: 1.2 ⁇ m patterned PR (photoresist)/200 ⁇ A TEOS/8000A SiLK ® /200 ⁇ A Pt/30 ⁇ A Ti ⁇ /SiO 2 substrate.
- the feature size of the patterned PR test semiconductor wafer was 0.35 ⁇ m line and 0.35 ⁇ m spacing.
- SiLK ® is a registered frademark of Dow Chemical Co. of Midland, Michigan 48674. It is a high temperature organic polymer. It is disposed on the Pt layer by the spin coating method.
- the TEOS mask i.e., the first mask layer was etched with Ar, CF 4 and
- the SiLK brand layer (i.e., the second mask layer) of the test semiconductor wafer was then etched (which also completely etched away the patterned PR) with NH 3 as the etchant gas in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions:
- the TiN layer (i.e., a barrier layer) underneath the Pt layer is also etched with the same etchant gases and in the same DPS chamber and same reactor and process conditions after Pt etching. The result is shown in Figure 32.
- Fig. 33 shows the final result of etching Pt layer after the SiLK ® brand mask was removed.
- Fig. 34 is a top plan view picture of the etched platinum layer of Fig. 33.
- Example V A test semiconductor wafer was formulated with the following film stack: 0.8 ⁇ m PR (photoresist)/700 ⁇ A Oxide/20 ⁇ A Ti/300 ⁇ A Pt/30 ⁇ A TiN/Si 3 N 4
- the feature size of the formulated test semiconductor wafer was 0.27 ⁇ m block and 0.13 ⁇ m spacing.
- the oxide hard mask i.e., the insulation layer
- the etchant gas for opening up the oxide hard mask comprised about 68% by volume Ar and about 32% by volume CHF 3 .
- the reactor and process conditions were as follows:
- the photoresist was stripped from the oxide hard mask in an ASP chamber of the Metal Etch MxP CenturaTM brand plasma processing apparatus under the following recipe using microwave downstream O 2 /N 2 plasma: 120 seconds, 250° C, 1400 W, 3000 seem O 2 , 300 seem N 2 , and 2 Ton.
- the Ti protective layer was etched with Ar, Cl 2 and BC1 3 as the etchant gases and in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions:
- CenturaTM brand plasma processing apparatus under the following reactor and process conditions: Reactor Conditions
- Fig. 37 The resulting etched platinum layer of the test semiconductor wafer is shown in the photograph picture of Fig. 37 wherein a platinum profile of about 88 degrees is shown.
- Fig. 38 is a drawing representing the photograph of Fig. 37 with the respective parts identified by a reference numeral.
- the oxide hard mask could have been removed in a 6:1 HF solution to produce the veil-less test semiconductor wafer similar to the one shown in Fig. 20.
- the remaining Ti protective layer could be removed by any suitable means and/or in any suitable manner, such as by etching with Ar, BC1 3 and Cl 2 as the etchant gases and in a DPSTM brand chamber of the Metal Etch DPS CenturaTM brand plasma processing apparatus under the following reactor and process conditions: Reactor Conditions
- a test semiconductor wafer was formulated with the following film stack: 0.8 ⁇ m PR (photoresist)/500 ⁇ A Oxide/IOOA TiN/150 ⁇ A Pt 30 ⁇ A TiN/Si 3 N 4
- the feature size of the formulated test semiconductor wafer was 0.3 ⁇ m block and 0.2 ⁇ m spacing.
- the oxide hard mask i.e., the insulation layer
- the etchant gas for opening up the oxide hard mask comprised about 68% by volume Ar and about 32% by volume CHF 3 .
- the reactor and process conditions were as follows:
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JP2000600301A JP2003529914A (en) | 1999-02-17 | 2000-02-17 | Improved masking method and etching arrangement for patterning electrodes of high density RAM capacitors |
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US25158899A | 1999-02-17 | 1999-02-17 | |
US09/251,826 US6323132B1 (en) | 1998-01-13 | 1999-02-17 | Etching methods for anisotropic platinum profile |
US09/251,588 | 1999-02-17 | ||
US09/251,826 | 1999-02-17 | ||
US09/251,633 US6265318B1 (en) | 1998-01-13 | 1999-02-17 | Iridium etchant methods for anisotropic profile |
US09/251,633 | 1999-02-17 | ||
US42146799A | 1999-10-19 | 1999-10-19 | |
US09/421,467 | 1999-10-19 |
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US20050020072A1 (en) * | 2001-09-11 | 2005-01-27 | Robert Kachel | Means and method for patterning a substrate with a mask |
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CN111982761B (en) * | 2020-08-26 | 2021-12-07 | 攀钢集团重庆钒钛科技有限公司 | Method for detecting dispersibility of titanium dioxide in water-based color paste |
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KR100269298B1 (en) * | 1997-06-09 | 2000-10-16 | 윤종용 | Method for etching pt layer in semiconductor fabrication |
TW365691B (en) * | 1997-02-05 | 1999-08-01 | Samsung Electronics Co Ltd | Method for etching Pt film of semiconductor device |
EP0865079A3 (en) * | 1997-03-13 | 1999-10-20 | Applied Materials, Inc. | A method for removing redeposited veils from etched platinum surfaces |
TW421858B (en) * | 1997-06-30 | 2001-02-11 | Texas Instruments Inc | Integrated circuit capacitor and memory |
DE19728473A1 (en) * | 1997-07-03 | 1999-01-07 | Siemens Ag | Layer structuring by dry etching process |
US6143476A (en) * | 1997-12-12 | 2000-11-07 | Applied Materials Inc | Method for high temperature etching of patterned layers using an organic mask stack |
WO1999036956A1 (en) * | 1998-01-13 | 1999-07-22 | Applied Materials, Inc. | Etching methods for anisotropic platinum profile |
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