WO2000032682A1 - Electrostatic dissipative plastics adapted particularly for use at elevated temperatures - Google Patents
Electrostatic dissipative plastics adapted particularly for use at elevated temperatures Download PDFInfo
- Publication number
- WO2000032682A1 WO2000032682A1 PCT/US1999/028109 US9928109W WO0032682A1 WO 2000032682 A1 WO2000032682 A1 WO 2000032682A1 US 9928109 W US9928109 W US 9928109W WO 0032682 A1 WO0032682 A1 WO 0032682A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fibers
- compression molding
- range
- carbon fibers
- surface resistivity
- Prior art date
Links
- 239000004033 plastic Substances 0.000 title description 32
- 229920003023 plastic Polymers 0.000 title description 32
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000000835 fiber Substances 0.000 claims abstract description 24
- 238000000748 compression moulding Methods 0.000 claims abstract description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims description 4
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 2
- 229920002530 polyetherether ketone Polymers 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 19
- 239000004917 carbon fiber Substances 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 9
- 238000000465 moulding Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 238000007906 compression Methods 0.000 abstract description 5
- 230000015556 catabolic process Effects 0.000 abstract description 4
- 230000006835 compression Effects 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 25
- 230000003068 static effect Effects 0.000 description 10
- 239000002216 antistatic agent Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 6
- 239000006229 carbon black Substances 0.000 description 5
- 235000019241 carbon black Nutrition 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000003575 carbonaceous material Substances 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920003247 engineering thermoplastic Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- -1 fatty acid esters Chemical class 0.000 description 1
- 230000010006 flight Effects 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000003230 hygroscopic agent Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 230000003655 tactile properties Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
Abstract
Resins suitable for use in compression molding processes are prepared by mixing between about 10 and 30 weight % of chopped partially carbonized fibers, i.e. fibers having a carbon content of between about 70 to 95 % by weight and an average size of about 100 νm, with compression grade molding resins. Typically the compression grade molding resins are about 100 νm. When chopped carbon fibers of reduced conductivity are used the curve obtained by plotting the resistivity against the concentration of carbon fibers is less steep in the critical regions of interest (i.e., between about 10?10 and 1012¿ and between about 10?6 and 109¿) than the curve is obtained when high conductivity fibers are used. It has been observed that even if some dielectric breakdown occurs, the connected fibers are not as conductive and the effect has been found not to be as significant as is the case with the usual carbon fibers which have maximized conductivity.
Description
PATENT APPLICATION
For
ELECTROSTATIC DISSIPATTVE PLASTICS ADAPTED
PARΗCULARLY FOR USE AT ELEVATED TEMPERATURES
History of the Application
This application is based upon and claims priority from LInited States Provisional Patent
Application Serial Number 60/109.657 filed on November 24. 1998.
Technical Field
This invention relates to electrostatic dissipative plastics and, more particularly, to electrostatic dissipative plastics that retain useful physical, chemical and electrical properties at elevated temperatures to at least 160° C. The invention has particular utility in the manufacture and use of electronic components and electronic devices tliough it is to be understood that it is not intended that the invention be so limited.
Definitions For purposes of this specification and the appended claims, the following terms are defined as follows: a. .Antistatic Agent. A material that can increase the conductivity of a plastic. It may be incorporated into a plastic or it may be applied as a surface coating or treatment. b. Resistivity. Resistivity, the inverse of electrical conductivity, is a measure of the resistance to the flow of an electric current and is measured either as a surface or a volume phenomenon. Surface resistivity is expressed in ohms per square (Ω/π) and is measured at the surface of a material, usually at room temperature. Information detailing methods for quantifying surface resistivity is given in ASTM D257 and EOS/ESD S 11.11.
c. Conductor. A material that has a surface resistivity less than about 10"
Ω'!=. d. Insulator A material that has a surface resistivity greater than about 1013 Ω'c. e. Electrostatic Dissipative Material (ESP). A material that has a surface resistivity' between that of a conductor and an insulator, usually defined as between about 106 and 10 Ω'
Background .Art
Even' major plastic resin is. in its natural state, an electric insulator and many have a significant tendency to accumulate static electric charges. The ability- of plastics to generate static electric charges and accumulate them varioush" due to the relative movement of one piece to another, separation of surfaces and the turbulent flow of contaminates in the air is well recognized. As an example, it is the presence of static electrical charges on sheets of thermoplastic film, such as the familiar food wraps, that cause the sheets to stick to each other.
The increased complexity' and sensitivity of microelectronic deΛices makes the control of static discharge of particular concern in the electronic industry. There are many instances in the manufacture and use of electronic components and electronic
in which an excessive accumulation of static charges can range from being a general nuisance to being a disabling or destructive force. Even a
discharge may cause damage to sensitive deλices. The need to control static chaige buildup by the controlled dissipation may require the total assembh emiron ent to be constructed of electrostatic dissipative materials. It may also require that materials used in storing, handling and shipping electronic deΛices be made from electrostatic dissipative materials Tote boxes, strapping tape and shipping containers are examples.
The prevention of the buildup of static electrical charges which accumulate on plastics can be controlled through the use of several kinds of antistatic agents (antistats) which variously are incorporated into the plastic as fillers or applied to the plastic as a surface coating. Most commonh. the electrostatic dissipative technologies include those that make use of hygroscopic agents, those that make use of conductive particulates. those that make use of
conductive fibers, and those that make use of low molecular weight additives and conductive polymers. Vvliile the use of any of these techniques can be helpful in
electrostatic build-up. they are all subject to inherent limitations..
Surface antistat agents are not always reliable and can be inconsistent in operation. Some of the surface antistats do not adhere to a surface with sufficient tenacity- to avoid being wiped away over a period of use. Several surface antistats are essentially hygioscopic materials that cause a conductive film of water to form over a substiate. In this latter case, it is of course obvious that the resistivity of a given part will be dependent upon and change with the ambient humidity.
The other principal approach to the manufacture of ESD materials has been to fill a plastic with conductive materials like carbon black, metal fibers, carbon fibers, etc. This approach advantageously provides high conductivity, rapid static dissipation, reliability and permanence . Its disadvantages lie in the fact that the mechanical properties of the plastic materials may be adversely affected at the required loading levels. Some materials such as carbon black are of such black intensity' that it is difficult to color the composite material. Also it should be noted, the reduction in strength attributable to the filler may cause portions of the surface to slough off. This is anathema to clean rooms and otherwise presents a surface that is never clean. Carbon blacks and particulate graphitic fillers are especially prone to sloughing.
Conductive fillers are also sometimes difficult to disperse uniformly throughout a plastic matrix. Lack of uniformity can create "hot spots" within a plastic matrix where arcing or damaging static discharge can occur. Some effective fillers like carbon fibers are relatively- expensive while metal fibers cause excessive wear and abrasion to the flights of the screws in mixing extruders.
More recently, attention has been focused upon the use of synthetic organic materials as antistatic agents. These antistatic agents can range from low molecular weight compounds to comparatively high molecular weight compounds and polymeric materials.
.Antistatic agents in the form of comparatively low molecular weight organic materials can be blended with the plastic by melt mixing. Typical examples would include quaternary ammonium salts, fatty acid esters and ethoxylated amines. Not uncommonly, howeλ'er. low molecular weight electrostatic agents suffer from poor heat stability and. depending on the melting point of the base resin, they may not survive melt processing temperatures. Low molecular weight antistats. even when successfully incorporated into a molding powder can cause problems. Low molecular weight organic antistatic agents can migrate (bloom) to the surface of the molded article. Surface migration may impair the appearance and tactile properties of an article. Furthermore, most of these additives function by absorbing a layer of moisture on the surface of the article and so require a certain threshold of ambient humidity-, below which they are ineffective.
It is known that some organic antistatic agents are thermally unstable or chemically incompatible with a polymer at processing temperatures and cause unacceptable degradation to or enter into unwanted side reactions with the host polymer. This is especially so with more complex host resins such as polyesters and poly amides.
Higher molecular weight organic and polymeric antistatic agents are available but here the miscibility of the antistatic agent with the base resins often becomes a problem. In addition to physical incompatibility (poor miscibility). thermal instability and chemical incompatibility may also cause problems.
There are even more difficult requirements imposed upon antistats in meeting special needs for a high temperature electrostatic dissipative material for use in applications such as wafer back-end testing in which chips are pressed against a fixture (nests, contactors and sockets) under elevated pressures and relatively high operating temperatures for plastics, such as 160° C . Electrostatic charges resulting from the movement of the equipment, the wafer itself oi minute particles in the air surrounding the wafer can discharge suddenly and have significant and nesatn e effects on the wafer.
As discussed generally above the requirements for an electrostatic dissipative plastics material fall in a specific range of resistivity. When the surface resistivity is less than about 106 Ω z. a composition has very little insulating ability and is generally considered a conductor. Such compositions are generally poor electrostatic dissipating polymeric materials because the speed of bleed off is too rapid and sparking or arcing can occur. A substrate with high conductivity does not offer protection from a destructive discharge as can result when the device is in the proximity of or contacts an electrically conductive element. In some applications the leads of a semiconductor device are in direct contact with the ESD test fixture during the test cycle. It follows that the surface resistivity must be high enough to avoid unwanted current flow- between leads, but low enough to bleed off electrostatic charges in a controlled manner.
Summarizing, the surface resistivity- of an electrostatic dissipative plastic should lie in a range of from about 106 and 1012 and, when used, a conductive additive should have pennanence. it should be not be affected by changes in the humidity and it should not slougli off conductive particles. .Also in the case of contact with devices having closely spaced leads, the electrostatic dissipative plastics should not be shorted out by a current being carried between two nearby leads (cross talk).
Early attempts to develop a product fitting these requirements (high compressive strength to at least 160° C and the surface conductivity' to bleed off the static) focused on the conventional approach of adding carbon black and organic antistats. It was found that carbon black sloughs and most commercial organic antistats are hygroscopic in their mode of action. Thus the latter are ineffective in low- humidity environments. Few. if any. commercial organic antistats exhibit the thermal stability required for incorporation into and subsequent use of the high temperature plastics (dimensional stability at about 160° C and above). Excellent thermal stability is especially necessary for processes such as stock shape extrusion or compression molding in which the blend may be held in the molten state for one hour or more.
Other attempts were made to form electrostatic dissipative plastics by adding carbon fibers at various concentrations. It was learned that the
e in which the resistivity is plotted
vs. the concentration of the carbon fibers (sometimes referred to in the art as the percolation curve) is very steep in the region of desired surface resistivity. This means that a small change in the overall or local concentrations of carbon fibers can cause the surface resistivity to vary from too resistive to too conductive. Poor dispersion and variations in fiber orientation further contribute to the inability of obtaining consistent and reproducible values of resistivity-. It has also been observed that even if a consistent surface resistivity is achieved by very careful blending of the carbon fibers in certain substrate, such as polyetheretherketone. the resistance drops quickly and irreversibly if the testing is carried out at voltages exceeding about 100 volts. It is thought that this happens because there is a dielectric breakdown of the thin sheath of polymer separating adjacent carbon fibers and also because carbonaceous material may be formed that provides conductive pathways.
It is also noted that many applications require that the resistivity of the ESD material is limited to a predefined one or two decade range within the overall 10δ -1012 ESD range. This was not found to be possible using additives such as standard or liigh performance carbon fibers, again due primarily to the steepness of the response curve. Therefore, prior to this invention, a material for making components with controlled resistivity (i.e. in a one or two decade range) for higher temperature (to 160°C) applications has remained an unfulfilled need of the semiconductor industry.
The patent art has recognized that conductive carbonaceous materials in fibrous form can be used advantageously- to adjust the surface resistivity of plastics. Reference is made, for example. to US patent number 5.068,061 which, inter aha, makes use of elongated non-linear non-flammable conductive carbonaceous fibers having reversible deflection ratios greater than 1.2:1 and aspect ratios greater than 10:1 to control the surface resistivity- of plastics.
LϊS patent 5.820.788 is of interest since it teaches the utility of using chopped linear fibers of about 6 mils in length which have been partially carbonized to a carbon content of between about 70-85°o by weight. The disclosed invention is adapted for the use in injection molding processes un which the filled resins are feed to the feed hopper in the form of chips
approximately 14 inch. The patent is also of interest for its discussion of other related prior art processes in which carbonaceous conductive materials are used to alter the conductivity of resins.
Disclosure of the Invention
Accordingly it is an object of this invention to provide plastic materials that have surface resistivities in a range of from about 10° to about 101* Ω'C
.Another object of this invention is to provide plastic materials that have surface resistivities in the range of from about 1010 to about 1012 Ω'C.
Another object of this invention is to provide plastic materials that have surface resistivities in the range of from about 106 to about 109 Ω'π.
A further object of this invention to provide molding resins for use in compression molding processes plastic materials that can produce shaped articles which have surface resistivities that fall in a range of from about one to about two decades in the overall range of from about 10° to about 10 Ω'C
A further object of the invention is to provide ESD materials made by compression molding processes that retain useful physical, chemical and electrical propeities at temperatures of about 160°C an d upward.
.Another object of this invention is to provide effective methods means for predictably and consistently providing electrostatic dissipative plastics made by compression molding processes that have surface resistivities between that of a conductor and that of a insulator.
A related object of this invention is to provide electrostatic dissipative plastics with high temperature capabilities that have stable surfaces and do not slough off particles.
.And yet a further object of this invention is to provide electrostatic dissipative plastics whose surface resistivity does not appreciably change with changes in temperature or humidity.
A still further object of this invention is to provide electrostatic dissipative plastics that substantially retain their initial surface resitivity after exposure to applied voltages in excess of about 100 volts.
Best means of Practicing the Invention
These and other objects of the invention are achieved by lriixing between about 10 and 30 weight °o of chopped partially carbonized fibers . i.e. fibers having a carbon content of between about 70 to 95°o by weight and an average size of about lOOμm. with compression grade molding resins. Typically the compression grade molding resins are about 100 μm in size. When chopped carbon fibers of reduced conductivity are used the curve obtained by plotting the resistivity against the concentration of carbon fibers is less steep in the critical regions of interest (i.e.. between about 1010 and 1012 and between about 106 and 109 ) than is the cun'e obtained when high conductivity fibers are used. It has been observed that even if some dielectric breakdown occurs, the connected fibers are not as conductive and the effect has been found not to be as significant as is the case with the usual carbon fibers which have maximized conductivity.
Since the invention is directed toward products made by compression processes, the chopped fibers of about 6 mil in length as taught by the prior art in preparing injection molding resins are of little or no utility- since it is physically difficult to mix the fibers with the comparatively small compression molding resins of this invention. It has been found that when it is attempted to mix fibers in the range of about 6 mils with approximately lOOμm compression molding resins, the carbonaceous fibers tend to "ball up" and are difficult to impossible to disperse uniformly throughout the fibers with the compression molding resins.
Various blends were therefore made with PAI (polyamidimides). glass fibers (GF) and carbon fibers. Glass fibers were used to help reduce the coefficient of thermal expansion to provide better dimensional stability and mechanical properties of the components.
Additional tests were made by including reduced conductivity carbon fibers in other plastics including polyetherimides and polyethersulfones. By changing from the use of standard carbon fibers to reduced conductivity chopped fibers, it was possible to reproducibly establish materials with surface resistivities in the desired range. It is believed that these results are novel and have not been achieved by any other means for compression molding high temperature engineering thermoplastics.
Carbon fibers wliich were tested had carbonization of less than 100 % and particularly- carbon fibers in which the carbonization has proceeded from 85 to 95% proved to be particularly- desirable.
Claims
1. A compression molding resin comprised of a base resin and chopped partially carbonized fibers.
2. A compression molding resin according to Claim 1 wherein the partially carbonized fibers are comprised of from about 70 to 95 wt% carbon.
3. A compression molding resin according to Claim 1 wherein the partially carbomzed fibers are present in an amount of from about 10 to 30 weight %.
4. An article made by the compression molding a resin according to Claim 1 wherein the surface resistivity is in a range of from about 10° to about 1012 Ω □.
5. An article made by the compression molding a resin according to Claim 1 wherein the surface resistivity is in the range of from about 1010 to about 1012 Q'o.
6. An article made by the compression molding a resin according to Claim 1 having a surface resistivity in the range of from about 106 to about 109 'o,
1. An article made by the compression molding a resin according to Claim 1 having a surface resistivity in a range of from about one to about two decades in an overall range of from about 10° to about 1012 Ω'π.
8. . n article made by compression molding a resin according to Claim 1 that retains useful physical, chemical and electrical properties at temperatures of about 160°C an d upward.
9. A compression molding resin comprised of a base resin and chopped partially carbonized fibers in which the base resin is selected from the group consisting of polyphenylenesulphide, polyamidimide. polyetheretherketone. polyletrafluoroethylene. polyetheiimides orpolyethersulfones
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000585319A JP2003513109A (en) | 1998-11-24 | 1999-11-24 | Static dissipative plastic specially adapted for use at elevated temperatures |
| CA002352130A CA2352130A1 (en) | 1998-11-24 | 1999-11-24 | Electrostatic dissipative plastics adapted particularly for use at elevated temperatures |
| EP99965054A EP1133773A4 (en) | 1998-11-24 | 1999-11-24 | Electrostatic dissipative plastics adapted particularly for use at elevated temperatures |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10965798P | 1998-11-24 | 1998-11-24 | |
| US60/109,657 | 1998-11-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2000032682A1 true WO2000032682A1 (en) | 2000-06-08 |
Family
ID=22328857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1999/028109 WO2000032682A1 (en) | 1998-11-24 | 1999-11-24 | Electrostatic dissipative plastics adapted particularly for use at elevated temperatures |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1133773A4 (en) |
| JP (1) | JP2003513109A (en) |
| CA (1) | CA2352130A1 (en) |
| WO (1) | WO2000032682A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013090054A1 (en) * | 2011-12-16 | 2013-06-20 | Sabic Innovative Plastics Ip B.V. | Electrostatic dissipative composites |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5599615A (en) * | 1995-11-09 | 1997-02-04 | Xerox Corporation | High performance electric contacts |
| US5635252A (en) * | 1994-09-09 | 1997-06-03 | Precision Fabrics Group, Inc. | Conductive fabric conductive resin bodies and processes for making same |
| US5820788A (en) * | 1997-01-29 | 1998-10-13 | Sgl Technic Ltd. | Electroconductive antistatic polymers containing carbonaceous fibers |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4837076A (en) * | 1985-04-18 | 1989-06-06 | The Dow Chemical Company | Carbonaceous fibers with spring-like reversible deflection and method of manufacture |
| GB8614784D0 (en) * | 1986-06-18 | 1986-07-23 | Griffiths J A | Surface coating |
| US5593776A (en) * | 1994-02-08 | 1997-01-14 | Osaka Gas Company, Limited | Fluororesin composites |
| JP3525525B2 (en) * | 1994-11-28 | 2004-05-10 | 出光石油化学株式会社 | Polyarylene sulfide resin composition |
| TW318857B (en) * | 1995-01-20 | 1997-11-01 | Sumitomo Chemical Co | |
| JP3642873B2 (en) * | 1996-03-26 | 2005-04-27 | 日本ジーイープラスチックス株式会社 | Antistatic resin composition |
| JPH107898A (en) * | 1996-06-28 | 1998-01-13 | Sumitomo Chem Co Ltd | Polyether-ketone resin composition and carrier for processing and treating semiconductor wafer |
| US5695197A (en) * | 1996-12-06 | 1997-12-09 | Farley; Michael L. | Seal ring method of sealing and molding composition comprising blend of PTFE copolymer, polyamide and carbon fiber therefor |
-
1999
- 1999-11-24 JP JP2000585319A patent/JP2003513109A/en active Pending
- 1999-11-24 EP EP99965054A patent/EP1133773A4/en not_active Withdrawn
- 1999-11-24 WO PCT/US1999/028109 patent/WO2000032682A1/en not_active Application Discontinuation
- 1999-11-24 CA CA002352130A patent/CA2352130A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5635252A (en) * | 1994-09-09 | 1997-06-03 | Precision Fabrics Group, Inc. | Conductive fabric conductive resin bodies and processes for making same |
| US5599615A (en) * | 1995-11-09 | 1997-02-04 | Xerox Corporation | High performance electric contacts |
| US5820788A (en) * | 1997-01-29 | 1998-10-13 | Sgl Technic Ltd. | Electroconductive antistatic polymers containing carbonaceous fibers |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP1133773A4 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013090054A1 (en) * | 2011-12-16 | 2013-06-20 | Sabic Innovative Plastics Ip B.V. | Electrostatic dissipative composites |
| CN103987772A (en) * | 2011-12-16 | 2014-08-13 | 沙特基础创新塑料Ip私人有限责任公司 | Electrostatic dissipative composites |
| US9125310B2 (en) | 2011-12-16 | 2015-09-01 | Sabic Global Technologies B.V. | Electrostatic dissipative composites |
| CN103987772B (en) * | 2011-12-16 | 2016-01-06 | 沙特基础创新塑料Ip私人有限责任公司 | Electrostatic dissipation mixture |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1133773A4 (en) | 2002-06-05 |
| JP2003513109A (en) | 2003-04-08 |
| EP1133773A1 (en) | 2001-09-19 |
| CA2352130A1 (en) | 2000-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Narkis et al. | New injection moldable electrostatic dissipative (ESD) composites based on very low carbon black loadings | |
| US5705555A (en) | Conductive polymer compositions | |
| Aal et al. | New antistatic charge and electromagnetic shielding effectiveness from conductive epoxy resin/plasticized carbon black composites | |
| US7476339B2 (en) | Highly filled thermoplastic composites | |
| US5294374A (en) | Electrical overstress materials and method of manufacture | |
| EP1012853B1 (en) | Electrically conductive compositions and methods for producing same | |
| US4545926A (en) | Conductive polymer compositions and devices | |
| Sau et al. | Electrical and mechanical properties of conducting carbon black filled composites based on rubber and rubber blends | |
| US5276080A (en) | Static dissipative resin composition | |
| US4228194A (en) | Electrically conductive article and method of making the same | |
| Bigg | The effect of chemical exposure on the EMI shielding of conductive plastics | |
| JP2002531660A (en) | Synthetic resin composition | |
| US5820788A (en) | Electroconductive antistatic polymers containing carbonaceous fibers | |
| KR20050027124A (en) | Static dissipative thermoplastic polymer composition | |
| Klason et al. | Electrical properties of filled polymers and some examples of their applications | |
| US6720379B1 (en) | Electrostatic dissipative plastics adapted particularly for use at elevated temperatures | |
| Zhang et al. | Electrical conductivity and rheological behavior of multiphase polymer composites containing conducting carbon black | |
| AU740765B2 (en) | Conductive polymer composite materials and methods of making same | |
| WO2000032682A1 (en) | Electrostatic dissipative plastics adapted particularly for use at elevated temperatures | |
| EP0822236A1 (en) | Tuned conductive coatings and blends from intrinsically conductive polymers and processes for making same | |
| JPS63302501A (en) | Ptc conductive polymer composition | |
| Bigg | The effect of thermal stresses on the EMI (electromagnetic interference) shielding of conductive plastics | |
| US5744573A (en) | Electrostatic dissipative nylons | |
| Narkis et al. | Innovative ESD thermoplastic composites structured through melt flow processing | |
| Sommers | Carbon black for electrically conductive plastics |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A1 Designated state(s): CA JP KR RU |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
| WWE | Wipo information: entry into national phase |
Ref document number: 1999965054 Country of ref document: EP |
|
| ENP | Entry into the national phase |
Ref country code: JP Ref document number: 2000 585319 Kind code of ref document: A Format of ref document f/p: F |
|
| ENP | Entry into the national phase |
Ref document number: 2352130 Country of ref document: CA Ref country code: CA Ref document number: 2352130 Kind code of ref document: A Format of ref document f/p: F |
|
| WWP | Wipo information: published in national office |
Ref document number: 1999965054 Country of ref document: EP |
|
| WWW | Wipo information: withdrawn in national office |
Ref document number: 1999965054 Country of ref document: EP |