WO2000006806A3 - Vorrichtung zum galvanischen abscheiden und abtragen von metall - Google Patents
Vorrichtung zum galvanischen abscheiden und abtragen von metall Download PDFInfo
- Publication number
- WO2000006806A3 WO2000006806A3 PCT/DE1999/001923 DE9901923W WO0006806A3 WO 2000006806 A3 WO2000006806 A3 WO 2000006806A3 DE 9901923 W DE9901923 W DE 9901923W WO 0006806 A3 WO0006806 A3 WO 0006806A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plating material
- metal
- electroplated
- electrodeposition
- electrolyte
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19833715 | 1998-07-27 | ||
DE19833715.9 | 1998-07-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000006806A2 WO2000006806A2 (de) | 2000-02-10 |
WO2000006806A3 true WO2000006806A3 (de) | 2000-11-09 |
Family
ID=7875427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1999/001923 WO2000006806A2 (de) | 1998-07-27 | 1999-07-01 | Vorrichtung zum galvanischen abscheiden und abtragen von metall |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2000006806A2 (de) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3723283A (en) * | 1970-12-23 | 1973-03-27 | Select Au Matic | Selective plating system |
US4029555A (en) * | 1975-05-23 | 1977-06-14 | Electroplating Engineers Of Japan, Limited | High-speed continuous plating method and apparatus therefor |
US4376017A (en) * | 1982-01-04 | 1983-03-08 | Western Electric Co., Inc. | Methods of electrolytically treating portions of digitated strips and treating cell |
EP0241079A1 (de) * | 1986-04-02 | 1987-10-14 | Meco Equipment Engineers B.V. | Verfahren und Vorrichtung zur Plattierung mit einer metallischen Schicht auf miteinander verbundenen metallischen Komponenten und/oder metallisierten Produkten |
EP0328278A1 (de) * | 1988-02-11 | 1989-08-16 | TWICKENHAM PLATING & ENAMELLING COMPANY LIMITED | Vorrichtung und Verfahren zur Verwendung einer Plattiermaske |
US5705043A (en) * | 1993-11-04 | 1998-01-06 | Suntec Trading Ag | Electroplating apparatus |
-
1999
- 1999-07-01 WO PCT/DE1999/001923 patent/WO2000006806A2/de active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3723283A (en) * | 1970-12-23 | 1973-03-27 | Select Au Matic | Selective plating system |
US4029555A (en) * | 1975-05-23 | 1977-06-14 | Electroplating Engineers Of Japan, Limited | High-speed continuous plating method and apparatus therefor |
US4376017A (en) * | 1982-01-04 | 1983-03-08 | Western Electric Co., Inc. | Methods of electrolytically treating portions of digitated strips and treating cell |
EP0241079A1 (de) * | 1986-04-02 | 1987-10-14 | Meco Equipment Engineers B.V. | Verfahren und Vorrichtung zur Plattierung mit einer metallischen Schicht auf miteinander verbundenen metallischen Komponenten und/oder metallisierten Produkten |
EP0328278A1 (de) * | 1988-02-11 | 1989-08-16 | TWICKENHAM PLATING & ENAMELLING COMPANY LIMITED | Vorrichtung und Verfahren zur Verwendung einer Plattiermaske |
US5705043A (en) * | 1993-11-04 | 1998-01-06 | Suntec Trading Ag | Electroplating apparatus |
Also Published As
Publication number | Publication date |
---|---|
WO2000006806A2 (de) | 2000-02-10 |
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