WO1999062105A2 - Ameliorations apportees au fonctionnement d'un transformateur - Google Patents

Ameliorations apportees au fonctionnement d'un transformateur Download PDF

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Publication number
WO1999062105A2
WO1999062105A2 PCT/US1999/011824 US9911824W WO9962105A2 WO 1999062105 A2 WO1999062105 A2 WO 1999062105A2 US 9911824 W US9911824 W US 9911824W WO 9962105 A2 WO9962105 A2 WO 9962105A2
Authority
WO
WIPO (PCT)
Prior art keywords
electronic
circuit board
pcb
assembly according
board
Prior art date
Application number
PCT/US1999/011824
Other languages
English (en)
Other versions
WO1999062105A9 (fr
WO1999062105A8 (fr
WO1999062105A3 (fr
Inventor
Ionel Jitaru
Original Assignee
Rompower Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/086,365 external-priority patent/US5973923A/en
Priority claimed from US09/310,627 external-priority patent/US20020054480A1/en
Priority claimed from US09/313,939 external-priority patent/US6466454B1/en
Priority to AT99925964T priority Critical patent/ATE465622T1/de
Priority to AU42146/99A priority patent/AU4214699A/en
Priority to ROA200000080A priority patent/RO121308B1/ro
Priority to EP99925964A priority patent/EP1018146B1/fr
Priority to DE69942267T priority patent/DE69942267D1/de
Application filed by Rompower Inc. filed Critical Rompower Inc.
Publication of WO1999062105A2 publication Critical patent/WO1999062105A2/fr
Publication of WO1999062105A8 publication Critical patent/WO1999062105A8/fr
Publication of WO1999062105A3 publication Critical patent/WO1999062105A3/fr
Publication of WO1999062105A9 publication Critical patent/WO1999062105A9/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • This invention relates generally to the electrical design and mechanical packaging of electronic components, and more particularly to a method of power conversion utilizing a multiple transformers primaries in series and secondary in parallel.
  • Fig. 1 One approach to packaging electric components in power converters (Fig. 1) includes a housing which both encloses the components and means of heat extraction from the components.
  • the house includes a non-conductive casing 5 and an aluminum heat-smkmg base.
  • a printed circuit board (PCB) 3 is mounted next to the upper wall 5a of the casing.
  • Conductive pins 7 are attached directly to the PCB 3 and extend up through the wall 5a.
  • Electronic components 9a, 9c are mounted to one or both sides of the PCB 3. Larger side components such as the transformer 9c are monted to the lower side for space reason.
  • Power dissipat ⁇ devices sucn as 9b are mounted directly on the base-plate 6 for better heat transfer.
  • the power components 9b are electrically connected to the PBC by leads 12.
  • a thermally conductive insulator material 8 structure 1 may be filled with an encapsulant, which acts as a heat spreader and provides mechanical support.
  • an encapsulant which acts as a heat spreader and provides mechanical support.
  • a "buffer coating" material is used to protect some of the components.
  • This invention is related to the electrical design and mechanical packaging of electronic components. It involves a new method of power conversion utilizing a multiple transformers primaries in series ana secondary m parallel (or vice versa) .
  • a transformer group is created in which The transformers are connected in series ; in order to assist m providing a
  • the flux equalizer circuit provides a series of lux windings . Each flux
  • the invention provides a packaging technology for
  • the invention features a packaging concept most of the power magnetic elements are constructed into
  • the heat spreader connected to the th rm a l v a can s ⁇ rve as a s urface.
  • a heatsink 40 can be also attached to the heat spreader to increased the heat dissipation area.
  • Figure 1 is a cross-sectional side view of prior art components ? mg.
  • Figure 2 is a perspective exploded view of component packaging ie i ⁇ VPT
  • Figure 3A is a top view of the packaging with a detailed section of the magnetic' winding.
  • Figure 3B is an enlarged view of a section of Fig 3A
  • Figure 4A is a top view of the packaging with a detailed section of the cooling via.
  • Figure C is a section of the packaging through the cooling via and through a magnetic element.
  • Figure D is a oro en view of the cooling via herein the insulator material penetrates in the cooling via.
  • Figure 5A is the top view of the horizontal packaging with airflow cooling.
  • Figure 5B is a cross section of the errJoodimer.t of figure 5A.
  • Figure 6 is a top view of the packaging Figure 6A is a cross-section of the package with cooling by airflow and cavities for magnetic cores.
  • Figure 6B is a cross-section of the package with cooling by airflow and holes for magnetic cores.
  • Figure A it is a perspective view of the power packages for airflow cooling.
  • Figure " 'B is a perspective view of the power packages for airflow cooling and additional heating applied to the multilayers circuit board.
  • Figure ⁇ is a cross-section of the packaging connected to the motherboard.
  • Figure 9 it is another embodiment of the present invention.
  • Figure 10A is a high power magnetics package according to this invention.
  • Figure 10B is a cross-section of the magnetic package presented in figure 10.
  • Figure 11 is an electrical schematic of the preferred embodiment of the multiple transformer using flux equalizing loops.
  • Figure 12 is an electrical schematic of an alternative embodiment of the multiple transformer invention which no central taps have been utiliz e d.
  • Figure 13 is an electrical schematic of an embodiment of the multiple transformer invention m which the flux equalizing loops react to electrical flow througn multiple power trains.
  • Figure 1 is an electrical schematic of an alternative embodiment of the multiple transformer invention.
  • Figure 15 is a method of implementing the flux equalizing loops of this invention.
  • Figure 16 is an electrical schematic of an embodiment n which the flux equalizing loops are employed also in the output choke.
  • Figure l 1 snows a cross-sectional diagram of the completed PCB assembly using the improved thermal coupling apparatus for this invention.
  • Figure 19 is still another embodiment of the invention in which the thermal slugs/inserts are wedged into the via.
  • Figure 20 is still another embodiment of the thermal conductive aspect of this invention.
  • Figure 21 illustrates an alternative embodiment in which the metal slugs extend past the PCB and are used to secure the neatsmk to the PCB.
  • Figure 22 illustrates an emoodiment of the invention having enhanced cooling capabilities.
  • Figure 23 presents a multilayer PCB which contain the magnetic element and the high frequency switchinq electronic components of the electronic circuit.
  • Figure 24 presents the criteria used to define the high frequency switching electronic components.
  • Figure 25A presents the multilayer PCB structure that incorporates the magnetic element and the high frequency electronic components.
  • Figure 25B presents a method of attaching the power PCB to the mother PCB using copper coated via and solder penetrating through copper coated via.
  • Figure 25C presents a method of attaching the power PCB to the mother PCB using through hole pins.
  • Figure 25D presents a method of attaching the power PCB to the mother
  • Figure 25E presents a method of attacning the power PCB to the mother
  • Figure 25F presents a method of attaching the power PCB to the mother rCB using L,WO P GSSGU inserts s ⁇ a screw.
  • Figure 26 presents the same structure depicted m figure 11 wherein cnrf ⁇ TnAii oH C T _H Q ⁇ f h ITIO s PCB
  • Figure 27A presents the same structure depicted figure 11 wherein a rnei ⁇ lt--h hpp ⁇ - D ⁇ P
  • Figure 27C presents an embodiment wherein the magnetic element is
  • Figure 31 presents another embodiment of this invention wherein a _ ⁇ _ ⁇ -. ⁇ .C ⁇ c;Q L. L.IC wc .
  • Figure 32 presents another embodiment of this invention wherein a
  • switching electronic components are attached to the power PCB.
  • Figure 34 presents another embodiment of th s invention wherein the "* ⁇ OD o f a e m 1V conductive insert further soldered to a copper foil edged on an isolated
  • FIG. 35 presents another embodiment of the invention wherein the
  • processing cells which can be multiplied to meet the power requirements.
  • figure 1 illustrates the prior art of this invention.
  • P.e ⁇ erri ⁇ to Fi 1 "* 2 m "h 0 ⁇ c ⁇ i cf ⁇ o ovideo, y th s ven ion, a power- ⁇ issipatmg electronic components 22 are located on the multilayer pm ? ⁇ r-n +- n-f -HH-a v, ⁇ a +- ⁇ mnp Hor- aH i Q T -i r* ⁇ P
  • the heat soreader oad is connected to the copper coated via.
  • a heat spreader 74, Fig 4B, is connected on tne rjacKsic or tne Lets tnrougu v ⁇ .
  • i * .. ue copper coated via can be filled with solder or can be empty in which case t- -. ⁇ noa-r- t ⁇ 11 o i ⁇ moT-al - ⁇ -at- ⁇ nn O CPd OH th .
  • S ll the via.
  • the metalization is formed by copper deposit during the plating r-n ⁇ o- c aco /-' ⁇ -t- H u ⁇ tVi +- " h ⁇ tnannf a fnrinrf ⁇ TCCSSS O t PCB.
  • the wall of the via is covered with copper.
  • the via can be also filled with a thermall conductive material 30a as is presented in figure 4D.
  • the isolated material 30 placed under the PCB 28 under p ress r will ⁇ enetrate throu g h the via filling the space.
  • the ma embodiment of this invention is the fact that the magnetics elements are implemented m the multilayers PCB 28.
  • the magnetics elements are implemented m the multilayers PCB 28.
  • the magnetic elements have the windings embedded —* i ⁇ si c ⁇ U FLU L1xsysTs iCu. X118 1 L6 ⁇ C0 U C X0 ⁇ UC .IC m ic elements and between the magnetic elements and the electronic components a o m a de and through the copper coated via 42 in the multiyear PCB 28.
  • This allows the u°e ⁇ IHTG cornelsx I ⁇ I ⁇ arrancrements and allows the use of more 0 magnetic elements on the same multilayers PCB construction.
  • the converter will contain a number of smaller magnetic elements
  • the low thermal impedance of the pad 56 will also offer a cooling path for
  • the pad, 56 have to have insulation properties.
  • the insulator 30 is pressed between the PCB 28 and metal
  • the isolator material 30 has adhesive properties > J s ⁇ _iiu . ⁇ _e j-'y a curing process 5L ⁇ iyn iupera re. ⁇ iter t.ie curing process the insulator created a bound between the PCB 28, and the metal
  • the flanges 40 can accommodate screws.
  • the copper coated via ca " the heat to the n oa+ " e ⁇ reade ⁇ .
  • the heat s further t ansfer ed via the thermally conductive insulator 30 to the metal plate 32.
  • a second C ⁇ O ⁇ S-SS ⁇ '*""' ⁇ f - ⁇ -K ⁇ ⁇ ⁇ i ⁇ d structure ⁇ is presented in figure 4C.
  • OCV- ⁇ T 7C •- ⁇ 1 t n ⁇ n r- Hi ffprpnf mpan rs- 1 V ff " TP SUTP r O "f"" structure 7 can also make the attachment of the PCB 28, to the isolator 30 x vj LUC Li ⁇ 5G ⁇ px ⁇ _6 -_>_... ⁇ H SGiT.e appxlCatlOnS LUC CULOULS iu LUC IUCLSXXXC plate 32 can penetrate through the plate.
  • the magnetic cores 26b will be visible from the bottom c-tHo n-f +- o ⁇ r,c ⁇ ' t ⁇ a lli' ⁇ ' ⁇ l t .
  • soft epoxy material can cover the remaining cavity in p-t-T- opn +- o martnpf i « cnn a ⁇ / +-h cny ac ⁇ f- ' h ⁇ Ha n 1 a p 32. T ⁇ " ⁇
  • signal connector 104 located on motherboard 96.
  • More than one structure 7 can ⁇ tc> connected to ''"h C ⁇ T ⁇ rn ⁇ -r-ne.r'K ⁇ ar-r-i 6 ⁇ n the motherboard 96 there are additional components 100 and 102. This structure it is suitable for
  • control section components supplementary locTi ' ⁇ c rcuits and ⁇ MI "FI I ⁇ OV-C- no l ⁇ Aa pH n +"] ⁇ ,o mo e bo r .
  • layer of the motherboard 96 may contain copper shields to protect the noise op c'T 'T-T P ccT - n pn-t- e T p nm ⁇ p & ⁇ c anp loca e H t" p motherboard and tne power ⁇ issipate components, some control components and
  • ii magnetics are ⁇ ocsteu on t ⁇ e structure > .
  • FIG. 5a and 5b is presented a packaging structure 11.
  • the components are located on both sides of the multila y ers PCB This structure applies to low
  • the structure 15 include the magnetic elements
  • the motherboard 64 is connected to two packaging s ⁇ c ⁇ s 1 * ⁇
  • These r , f m f ° ⁇ r ⁇ .ctures contain the same components as structure 15 with an additional heat sink 58 attached to the multilayers PCB 28 throu g h the insulator 30.
  • the insulator w ⁇ ⁇ _ ⁇ o thermal impedance 30 is placed between the multilayers PCB 28 and the base plate 58.
  • the magnetic core 26b is cooled
  • air fms 60 has cutout—outs 64 to accommodate for the magnetic core 26b.
  • dissipation devices is done through copper coated via 42.
  • a ⁇ ac ag ⁇ ng struc ure W ⁇ erein ⁇ ui ⁇ ⁇ plate 32 does not contain cavities. It has elevated sections 104, which makes contact w ⁇ * ⁇ h the ⁇ ⁇ h°rm ll ⁇ * ⁇ ⁇ nd ⁇ ' , ct ⁇ e insulator 30, which is laced under the multilayers PCB 28.
  • the elevated sections of the metal plate 104 are
  • the thermali conductive soft pad 34 on the base plate 32 supports the magnetic core 26a and 26b.
  • the height of the elevated section of the ⁇ s Qr ⁇ late 104 are function of the height of the magnetic core 26b and the compression ratio of the pad 34.
  • the advantage * Oi- uiie ⁇ ac ag ⁇ ng concept is ne -.act tnat more components can be mounted on the multilayers PCB on the backside 20b. This package is suitable for o er ⁇ r n °rt Q ⁇ C!
  • teeth 112 are formed along the lower edge of the case.
  • a matching grove 108 s undercut into the base ⁇ l t 32.
  • the cutout 116 in the multilayers PBC 28 are made to accommodate the m a rm i ' cn.na 26. cn ⁇ ' -c -o ano m HT l t laVe S PBC
  • the connectors 24a and 24b are connected to the windings 50.
  • the cores 26a and 26b are attache ⁇ ⁇ o ⁇ th r via the clips 82.
  • the multilayers 10 PCB 28 wherein the windings 50 are embedded into also offers supports for
  • thermally conductive soft pad is placed under the magnetic core 26b on top of base ⁇ l t 32
  • Figure 11 is an electrical schematic of the preferred embodiment of x w> L xc ⁇ u_) xuIiiL uoxuy c _ ⁇ xx-.xuy x ⁇ uub .
  • the transformer is optionally a discrete type of tran ° ormer which ⁇ c sol ⁇ e e ⁇ * ⁇ ⁇ "* ⁇ ⁇ e p ⁇ ⁇ ⁇ c t is constructed of windings embedded in a multilayer PCB with an E-cores.
  • the secondaries are placed parallel prior to the output
  • the present invention provides for a balancing the output power needs
  • auxiliary secondary winding (112A, 112B) is added to each transformer m
  • Figure 12 is an electrical schematic of an alternative embodiment of the multiple transformer invention in which no central taps have been
  • figure 12 performs in an identical manner as that of figure 11, except that in the figure 12 embodiment, the transformers do not have a central tap.
  • Figure 13 is an electrical schematic of an embodiment of the multiple transformer invention m which the flux equalizing loops react to electrical flow through multiple power tra s. These multiple power trains can be phase shifted to reduce the input and output current ripple.
  • Figure 14 is an electrical schematic of an alternative embodiment of the multiple transformer invention.
  • the auxiliary windings Lauxl and L.aux2 are connected in parallel with reverse polarity to insure a bi- ⁇ irectional flux swing m the transformers.
  • Figure 15 is a method of implementing a flux equalizing loop.
  • Layer 151A and 151B are two different layers of a multi-layered printed circuit board.
  • Magnet core 152 extends through the multi-layered printed circuit board.
  • Other magnet cores 155 and 154 are also positioned through the PCB.
  • Copper layer 153A is used to create the flux windings; flux windings created by copper layer 153B is offset to create the required phase shift.
  • Figure 16 is an electrical schematic of an embodiment which flux equalizing loops are employed also in the output choke.
  • the flux equalizing loops L- ... L dN will ensure an equal flux swing the transformer T effet, ... T Recipe .
  • the flux equalizing loops L favour._ ... L ofL will ensure equal flux swing in the output inductance elements L ... L for stead state and dynamic operating conditions.
  • the coupling between L 1 ...L OH and L ofl and L £N can be loose, without deviating from the scope of this invention.
  • Figure I "7 show's a cross-sectional diagram of the completed PCB assembly using the improved thermal coupling apparatus for this invention.
  • the basic components for this embodiment are: power device I “7 ! other devices 172, magnetic cores l " ⁇ , solder 174, via with plated copper walls 1 T ⁇ 1 p ⁇ c -f* ⁇ ⁇ a n o l i"? nni f-oH
  • PCB having multilayers 178, copper foil 179, insulation material 1710, material 1713, and metal insert 1714.
  • 5 Electrical components (171, 172 and 173) are assembled on a multilayer PCB (178) .
  • Under the power device (171) are one or more rn ⁇ 1 +-1-— .I c* ( ⁇ H a ⁇ - 1 a rrro enough to accept a large metal insert (1714) which is soldered to the PCB.
  • thermal insert/ plug 1714 used within the via
  • an insulated multilayer 20 substrate which aids in the transfer of heat form the PCB to the aluminum naopnl a p Vi i c cnKc af Q i o Vivpp rli ffprpn m f-pv' ⁇ al c T* Vi top layer is a thin copper foil (179) . A portion of this copper foil * 7 G f Vip D T- ⁇ i n hp l - ⁇ a+-- ⁇ uVipvp +- p metal inserts (1714) protrude through the PCB. Electrical isolation from
  • the PCB alone w ⁇ ''"h ⁇ he substrate ma' then be m.ounted to an aluminum, baseplate (1712) .
  • Any conductive devices such as fer ⁇ te cores (1713) may be thermoconductive material.
  • ⁇ . are ass mbl d on a multilayer PCB ( 178 ) .
  • an insulated multilayer 10 substrate which aids in the transfer of heat from the PCB to the aluminum h° a tsmk.
  • This substrate is of three different materials.
  • the top layer is a thin copper foil (179) .
  • a portion of this copper foil '179 ⁇ is soldered to the under side of the PCB ⁇ 1 ⁇ 8) m the location where the metal insert protrude through the PCB (178) .
  • the middle l a er of the substrate (1 ⁇ 10) is a thermally 20 conducting material which electrically insulates the copper foil layer from
  • the PCB along w th the substrate is then be mounted to an aluminum heatsmk (182A) .
  • the method of operation for this system is to solder the power device __. -v to the top of the PCB above the soldered metal inserts.
  • nG ueat generatcu. during electrical operation of the circuit is transmitted through the metal m ⁇ er"* ⁇ s to the co r, ⁇ ⁇ il ⁇ ⁇ ⁇ ⁇ ⁇ ' , n ⁇ Q n at .
  • This island s iarcre compared to tne metal inserts to allow for greater thermal conductivity.
  • the size of the o ⁇ ⁇ er foil la ⁇ r 1 ⁇ 9 underneath the metal insert is tailored to control the capacitance between tne power device 171 and heat s kl712.
  • FIG 19 is still another embodiment of the invention in which the
  • the metal mserts/slugsl94A are also unique that th y have a sm l1 throu g h hole 1 ⁇ 15 wh ch e tends rom its top to bottom. This allows for a good solder flow due to a capillary action when the insert s o i_H ⁇ n H r ⁇ m a ⁇ " ⁇ r ⁇ i ' “ ⁇ 7 " 1 ⁇ f the underly ncr multilayer 40 substrate to the power device on top side of the PCB.
  • the metal inserts/sl ⁇ s 194A have diameter ⁇ c tc than the diameter of the via with ts walls coated with copper. This re q russias the metal insert 'sl ⁇ 194 ⁇ to be *wcdgcd" into the via. The solder flows through the internal channel to connect the top of PCB 178 t° the ⁇ o ⁇ t ⁇ .
  • the PCB along with the substrate is mounted to an aluminum baseplate
  • the method of operation for this system is to solder the power device
  • A° w +- O e bo i t o f cr w 0 in 1 "l de ⁇ the electrical components (171, 172 and 173) are assembled on a multilayer PCB (l ⁇ S) .
  • the metal inserts (194A) have a small 20 through hole 174A which extends from its top to bottom. This allows for a
  • the substrate is located directly underneath the PCB and its function
  • This substrate is comprised of three different materials.
  • the top layer is a thin co ⁇ ⁇ r foil 'l ' ⁇ 9' 1 .
  • thermoconductive material thermoconductive material
  • the metal inserts directly to the aluminum baseplate underneath.
  • Figure 22 illustrates an embodiment of the invention having enhanced
  • metal mserts/slu ⁇ s (214C) are elongated to pass
  • the embodiment of figure 22 uses metal inserts/slugs 214C
  • Metal insert/slug 214C have a contoured exterior
  • the winding 2318 of the magnetic element 2316 are constructed in the mult ⁇ la"er PCB 232.
  • FIG 25A is presented the magnetic element 2310, with the high w xc4U nv- ow LL-uxug ⁇ lupju uL ⁇ ⁇ _. w u ⁇ uu Luc xu ww-xxuc x wu ⁇ QS
  • the power PCB 10 232 contains copper coated via 2524, which allow the penetration of the solder 2522B.
  • the sol ⁇ e ⁇ 2522B creates a medium for current flow and also constitutes a mechanical bind between power PCB 232, and the mother PCB
  • figure 25C is presented another embodiment of the invention wherein the 232 and 234 is accomplished with the 20 p 2526C pressed in power PCB 232, and further soldered to 234.
  • the pressed insert has to be made from a conductive t°r ⁇ "* ⁇ /-.-> ⁇ -- ⁇ + _ - ⁇ ⁇ ⁇ ⁇ nl ⁇ r a bond but also a path for current and heat.
  • an additional metal plate 2 26 is attached to the mother PCB 234, via a dielectric material 2724.
  • FIG. 27B is presented another embodiment of the invention wherein a isolated metal substrate element composed by a metal plate 2734, a dielectric 2 "7 32 and copper foil 2 7 30, is attached to the mother PCB. Additional electric components 2728 can be attached to the copper pads, edged on the copper foil 2" 7 30.
  • This packaging method allows the heat transfer from the power PCB 232, and mother PCB 234, to be transferred to the metal plate 2 "7 34.
  • the location of additional components as 2 7 28, leads to an increased in power density.
  • Figure 2 C presents an embodiment of the invention which the magnetic element 2316 is attached to an isolated metal substrate composed O T ci ul S ici. i-i. i- Lu Lci i ⁇ j. -> -. , Lu ⁇ x l x -. / 3 -. , ⁇ iid luc: i- ax pi ⁇ tc -. / -> -* . s cutout 2700 in the isolated metal substrate is performed to accommodate the magnetic core 2310.
  • the interconnection between the isolated metal substrate and the magnetic element 2316 is made via the copper foil 2752 and via 2 7 24. In the soldering process, the melted solder penetrates through via 2724, creating an electrical and mechanical bind.
  • the advantage of this embodiment is the fact that high power dissipating devices are located directly on the isolated metal substrate with very low thermal impedance to the metal plate 2 34.
  • the magnetic core 2310 penetrates through, power PCB 232, and mother PCB, 234.
  • the windings 2318 created in the layers of the power PCB 232, and the windings 2819 created in the mother PCB 234, can be magnetically coupled . In this way it is increased the level of utilization of the mother PCB 234.
  • the secondary winding can be implemented in the power PCB 232 and 232B and the additional high frequency switching electronic components such as rectifiers means can be surface mounted on 232 and 232B.
  • an additional metal plate 316 is attached to at he power PCB 232, via a dielectric material 314.
  • the heat produced by the magnetic element 2316, with winding 2318 and magnetic core 2310, and by the high frequency switching electronic components 238 can be transferred to 316 and further transferred to air or additional heatsmk.
  • figure 32 is presented similar concept as in figure 31, wherein some of the high frequency switching electronic components is located under the metal plate 316B.
  • the metal plate 316B has cavities to accommodate
  • the high power dissipation electronic components 330 are located on an alumina substrate 332.
  • the interconnection between the alumina substrate 332 and the power PCB 232 is provided by the pins 338.
  • the module created by the power PCB with the high frequency switching electronic components 238, 330 the metal plate 336 is attached to the mother PCB 232.
  • the advantage of this concept is the fact that it offers a good thermal path from the high heat dissipation components to a metal plate heatsmk 336.
  • the high heat dissipation components as 340 are located on top of a heat conductive insert 344.
  • the insert is further penetrating into a co ⁇ er interface 342.
  • Farth r ⁇ h copper interface 342 is soldered to the copper foil 341 located on the dielectric 346, attached to a metal plate 348.
  • the mechanical structure formed by 344, 342, 341 can efficiently extract the heat from the device 340 to the metal plate 348. This mechanical structure can also efficiently be a path for the current flow.
  • the power processing module formed by power PCB 234, high frequency switching electronic components such as 238 and 340, the thermal interface 344, 342, 5 341, dielectric layer 34C and the metal plate 348, can be farther connected to the mother PCB 232
  • Each power PCB contains at least one magnetic o 1 pr ⁇ n +- a H f-Vi o /- ⁇ n ci n f p i cr -r n n /- /-> m on r o ⁇ r p npc +- 0 of the electronic components, such as the signal control portion are located on the mother PCB 234.
  • Cooling plates 316A... 316Z can be further attached to the power PCB for cooling.
  • the high frequency switching electronic components and high heat dissipation components are located on the power PCB, separated from the rest of 5 electronic components located on mother PCB, 234.
  • the high power dissipation components which most of the power converters are also high frequency switching electronic components, are separated by the noise and heat sensitive components located on the mother PCB.
  • the size of high cost, large number of layers power PCB is reduced, 0 leading to a low cost design.
  • the high frequency switching high power dissipation electronic components are separated by the rest of the components leading to improve electrical-thermal characteristics.
  • the number of power PCB which includes magnetic elements and high frequency switching electronic components, can increase to increase the output power.
  • These power-processing cells can be standardized to constitute the building blocks for any power systems.
  • the present invention creates a highly improved transformer package which provides for the enhanced provision of power with the burden properly split between the transformers.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Dc-Dc Converters (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention porte sur un groupe de transformateurs dans lequel plusieurs transformateurs (110A et 110B) sont utilisés pour alimenter en énergie une charge unique. Les transformateurs (110A et 110B) sont raccordés en série ; afin de faciliter l'effet 'd'égalisation de flux', l'invention comprend un circuit (112A et 112B) égaliseur de flux qui comporte une série d'enroulements. Chaque enroulement est associé à un transformateur unique. Les enroulements sont disposés en parallèle. On peut ainsi obtenir une sortie équilibrée des transformateurs ; la puissance de sortie de chacun d'eux est 'détectée' par son enroulement de flux associé qui est 'partagé' par les autres transformateurs par l'intermédiaire de leur propre enroulement associé. Le courant passe ensuite par les enroulements secondaires, les redresseurs et des filtres de sortie pour parvenir à une charge commune.
PCT/US1999/011824 1998-05-28 1999-05-27 Ameliorations apportees au fonctionnement d'un transformateur WO1999062105A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AT99925964T ATE465622T1 (de) 1998-05-28 1999-05-27 Anordnung für elektrische bauteile
AU42146/99A AU4214699A (en) 1998-05-28 1999-05-27 Improved transformer operations
ROA200000080A RO121308B1 (ro) 1998-05-28 1999-05-27 Structură de încapsulare pentru circuite electronice de putere
EP99925964A EP1018146B1 (fr) 1998-05-28 1999-05-27 Agencement pour composants électriques
DE69942267T DE69942267D1 (de) 1998-05-28 1999-05-27 Anordnung für elektrische Bauteile

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US09/086,365 1998-05-28
US09/086,365 US5973923A (en) 1998-05-28 1998-05-28 Packaging power converters
US09/310,626 US6046918A (en) 1998-05-28 1999-05-12 Flux equalized transformer circuit
US09/310,626 1999-05-12
US09/310,627 1999-05-12
US09/310,627 US20020054480A1 (en) 1999-05-12 1999-05-12 Enhanced thermal coupling for electronic boards
US09/313,939 1999-05-18
US09/313,939 US6466454B1 (en) 1999-05-18 1999-05-18 Component transformer

Publications (4)

Publication Number Publication Date
WO1999062105A2 true WO1999062105A2 (fr) 1999-12-02
WO1999062105A8 WO1999062105A8 (fr) 2000-03-09
WO1999062105A3 WO1999062105A3 (fr) 2000-06-29
WO1999062105A9 WO1999062105A9 (fr) 2000-07-27

Family

ID=27492032

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/011824 WO1999062105A2 (fr) 1998-05-28 1999-05-27 Ameliorations apportees au fonctionnement d'un transformateur

Country Status (3)

Country Link
EP (1) EP1018146B1 (fr)
RO (1) RO121308B1 (fr)
WO (1) WO1999062105A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012166028A1 (fr) * 2011-06-01 2012-12-06 Telefonaktiebolaget L M Ericsson (Publ) Agencement conducteur thermique/électrique pour cartes de circuit imprimé multicouches
US9633772B2 (en) 2013-03-14 2017-04-25 Gentex Corporation Solderable planar magnetic components

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Publication number Priority date Publication date Assignee Title
CN110461084A (zh) * 2019-07-19 2019-11-15 恩达电路(深圳)有限公司 厚铜金属基板压铜块方法

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US5576934A (en) * 1992-07-09 1996-11-19 Robert Bosch Gmbh Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
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US5576934A (en) * 1992-07-09 1996-11-19 Robert Bosch Gmbh Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board
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WO2012166028A1 (fr) * 2011-06-01 2012-12-06 Telefonaktiebolaget L M Ericsson (Publ) Agencement conducteur thermique/électrique pour cartes de circuit imprimé multicouches
US9107296B2 (en) 2011-06-01 2015-08-11 Telefonaktiebolaget L M Ericsson (Publ) Thermo/electrical conductor arrangement for multilayer printed circuit boards
US9633772B2 (en) 2013-03-14 2017-04-25 Gentex Corporation Solderable planar magnetic components

Also Published As

Publication number Publication date
RO121308B1 (ro) 2007-02-28
WO1999062105A9 (fr) 2000-07-27
EP1018146A4 (fr) 2007-10-17
WO1999062105A8 (fr) 2000-03-09
EP1018146A1 (fr) 2000-07-12
WO1999062105A3 (fr) 2000-06-29
EP1018146B1 (fr) 2010-04-21

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