WO1999050871A1 - Hybrid circuit arrangement with a thermal release - Google Patents

Hybrid circuit arrangement with a thermal release Download PDF

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Publication number
WO1999050871A1
WO1999050871A1 PCT/DE1999/000737 DE9900737W WO9950871A1 WO 1999050871 A1 WO1999050871 A1 WO 1999050871A1 DE 9900737 W DE9900737 W DE 9900737W WO 9950871 A1 WO9950871 A1 WO 9950871A1
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WO
WIPO (PCT)
Prior art keywords
resistance
circuit carrier
circuit arrangement
hybrid circuit
circuit
Prior art date
Application number
PCT/DE1999/000737
Other languages
German (de)
French (fr)
Inventor
Karl Rehnelt
Frank Templin
Original Assignee
Tyco Electronics Logistics Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics Ag filed Critical Tyco Electronics Logistics Ag
Priority to EP99922032A priority Critical patent/EP1068626A1/en
Publication of WO1999050871A1 publication Critical patent/WO1999050871A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/13—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/22—Elongated resistive element being bent or curved, e.g. sinusoidal, helical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/04—Bases; Housings; Mountings
    • H01H2037/046—Bases; Housings; Mountings being soldered on the printed circuit to be protected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H01H2037/762—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts
    • H01H2037/763—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts the spring being a blade spring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Definitions

  • the invention relates to a hybrid circuit arrangement with a resistance meander, which is applied to a plate-shaped circuit carrier, and with a thermal fuse thermally coupled to the circuit carrier and electrically connected to the resistance mander, which can be triggered by the resistance mander in the event of an overload due to the heating of the circuit carrier.
  • Thermal fuses used in public telephone exchange systems and usually manufactured in thick film or thin film technology. Thermal fuses of the type mentioned are described in detail, for example, in EP 0 352 771 A2 or in WO 94/03 913, each of which is a fuse, the pretensioned spring arm of which is soldered to a soldering point on the circuit substrate.
  • thermal ⁇ fuse While the thermal ⁇ fuse, is usually best positioned as described in the drawing of the above-mentioned DE 93 19 473 UI of space roughly in the middle of the circuit carrier, a prominent heat spot (hot spot) is usually not formed in the central region of the Wegungstragers, in which has a relatively large amount of substrate material for heat distribution, but in the area of the periphery. Due to the heat dissipation through the external connections of the hybrid circuit arrangement on the underside, there are usually one or more heat points on the upper periphery, the exact position of which cannot be predicted, but must be tested after the circuit has been developed.
  • the present invention is based on the object of achieving an optimized and predetermined effect of the thermal fuse without being fixed on the circuit arrangement during its positioning.
  • the resistance meander is designed in a limited area on the circuit carrier as a structure which is looped around it several times and which is based on the heat point to be generated with a defined position on the circuit carrier, and that the thermal fuse is thermally coupled to the circuit carrier at this heat point.
  • the drawing shows a top view of a resistance meander structured according to the invention and a thermal fuse.
  • a horrsmaander is shown, which loops do not form a uniform, parallel pattern, son ⁇ countries in the structure of which bends are provided, so that in each case one or more loops can not be arranged only side by side but also faced at an angle against each other or one another.
  • the individual loops which are in turn intertwined, thus create a structure that allows a particularly large output to be generated at a predetermined location and thus to generate a defined heat point 3 (hot spot).
  • the intertwined structure occupies only a limited area 4 of the circuit carrier 5, which is otherwise covered by a uniform resistance meander and / or flat resistors. These "normal" resistance structures are not shown in the drawing.
  • the adjustment of resistance meanders is preferably carried out by adjustment points which create a short circuit at the beginning of a loop and which can be cut through, for example by means of a laser, to produce a desired resistance value, so that the total resistance is increased by the resistance of this one loop.
  • This adjustment method can also be easily maintained within the scope of the present invention if no adjustment points are provided in the above-mentioned limited area 4 with the intertwined meandering structure, so that constant heating is generated in this area 4 regardless of the adjustment.
  • the invention as a whole ensures optimum triggering of the heating-based fuse by concentrating the heat turnover in the region 4, the total heating of the circuit arrangement remaining limited.
  • the drawing also shows a fuse 6 known per se, the spring arm of which is pretensioned is precisely soldered to a contact surface (not shown) of the circuit in the heat point 3 generated by the tortuous resistance meander.
  • the heating point 3 has in each 4 case over a certain extent, so that no precise positioning of the thermal fuse 6 is required.

Abstract

According to the invention, a thermal release (6) is electrically connected to a resistance meander (1) and can be triggered by said meander (1) in the case of an overload when the circuit substrate (5) heats up. The resistance meander (1) is embodied in a defined area (4) on the circuit support as a multiple interlaced structure surrounding the hot spot (3) which is to be produced in an optimised manner and in a defined position. The thermal release is thermally coupled to the circuit substrate (5) at said hot spot (3).

Description

1 Beschreibung 1 description
Hybridschaltungsanordnung mit ThermosicherungHybrid circuit arrangement with thermal fuse
Die Erfindung betrifft eine Hybridschaltungsanordnung mit einem Widerstandsmaander, der auf einem plattenförmigen Schaltungsträger aufgebracht ist, und mit einer thermisch mit dem Schaltungsträger gekoppelten und elektrisch mit dem Widerstandsmaander verbundenen Thermosicherung, die im Überlast- fall durch die Erwärmung des Schaltungstragers durch den Widerstandsmaander auslösbar ist.The invention relates to a hybrid circuit arrangement with a resistance meander, which is applied to a plate-shaped circuit carrier, and with a thermal fuse thermally coupled to the circuit carrier and electrically connected to the resistance mander, which can be triggered by the resistance mander in the event of an overload due to the heating of the circuit carrier.
Eine derartige Anordnung ist beispielsweise aus dem deutschen Gebrauchsmuster DE 93 19 473 UI bekannt. Derartige Hybrid- Schaltungen werden beispielsweise als VorwiderständeSuch an arrangement is known for example from German utility model DE 93 19 473 UI. Such hybrid circuits are used, for example, as series resistors
(Sicherungsnetzwerke) in öffentlichen Telefonvermittlungs- Anlagen eingesetzt und üblicherweise in Dickschicht- oder Dünnfilmtechnik hergestellt. Thermosicherungen der genannten Art sind im einzelnen beispielsweise in der EP 0 352 771 A2 oder in der WO 94/03 913 beschrieben, wobei es sich jeweils um Schmelzsicherungen handelt, deren vorgespannter Federarm mit einer Lötstelle des Schaltungssubstrats verlötet ist.(Security networks) used in public telephone exchange systems and usually manufactured in thick film or thin film technology. Thermal fuses of the type mentioned are described in detail, for example, in EP 0 352 771 A2 or in WO 94/03 913, each of which is a fuse, the pretensioned spring arm of which is soldered to a soldering point on the circuit substrate.
Diesen Anordnungen mit mechanisch auslösender Sicherung liegt die Erwärmung in Abhängigkeit vom Strom bzw. der umgesetzten Leistung zunächst des durchflossenen Widerstandsmäanders selbst und anschließend des dadurch erwärmten Schaltungsträgers zugrunde. Dieser Effekt wird zum Schmelzen eines Sicherungsdrahtes oder zum Öffnen einer Lötstelle einer Thermosi- cherung verwendet. Bei Hybridbaugruppen wird der Widerstandsmaander durch Aufdrucken des entsprechenden Pastenmaterials auf den Schaltungsträger erzeugt und bedeckt aus Platzgründen meist den gesamten Oberflächenbereich desselben. Da der Widerstandsmaander sich bei Stromfluß gleichmäßig erwärmt, stellt es ein Problem dar, die Wärme für das Auslösen der Thermosicherung optimal auf einen begrenzten Bereich (Hot Spot) zu konzentrieren und somit einen optimierten Wirkungs- 2 grad für die Thermosicherung zu erzielen. Während die Thermo¬ sicherung, wie in der Zeichnung des genannten DE 93 19 473 UI beschrieben, aus Platzgründen normalerweise am besten etwa in der Mitte des Schaltungsträgers positioniert wird, bildet sich ein hervorgehobener Wärmepunkt (Hot Spot) üblicherweise nicht im Zentralbereich des Schaltungstragers, in dem relativ viel Substratmaterial zur Wärmeverteilung vorhanden ist, sondern im Bereich der Peripherie. Aufgrund der Wärmeableitung durch die Außenanschlüsse der Hybridschaltungsanordnung an deren Unterseite ergeben sich meist ein oder mehrere Wärmepunkte an der oberen Peripherie, deren genaue Lage nicht vorhergesagt werden kann, sondern nach Entwicklung der Schaltung ausgetestet werden muß.These arrangements with a mechanically triggering fuse are based on the heating, depending on the current or the power converted, first of all of the resistance meander itself and then of the circuit carrier heated as a result. This effect is used to melt a safety wire or to open a soldering point of a thermal fuse. In the case of hybrid assemblies, the resistance mander is generated by printing the corresponding paste material on the circuit carrier and usually covers the entire surface area of the same for space reasons. Since the resistance meander heats up evenly when current flows, it is a problem to optimally concentrate the heat for triggering the thermal fuse in a limited area (hot spot) and thus to optimize the effectiveness To achieve 2 degrees for the thermal fuse. While the thermal ¬ fuse, is usually best positioned as described in the drawing of the above-mentioned DE 93 19 473 UI of space roughly in the middle of the circuit carrier, a prominent heat spot (hot spot) is usually not formed in the central region of the Schaltungstragers, in which has a relatively large amount of substrate material for heat distribution, but in the area of the periphery. Due to the heat dissipation through the external connections of the hybrid circuit arrangement on the underside, there are usually one or more heat points on the upper periphery, the exact position of which cannot be predicted, but must be tested after the circuit has been developed.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, eine optimierte und vorherbestimmte Wirkung der Thermosicherung zu erzielen, ohne bei deren Positionierung auf der Schaltungsanordnung festgelegt zu sein.The present invention is based on the object of achieving an optimized and predetermined effect of the thermal fuse without being fixed on the circuit arrangement during its positioning.
Diese Aufgabe wird bei einer Hybridschaltungsanordnung der eingangs angegebenen Art dadurch gelöst, daß der Widerstandsmaander in einem begrenzten Bereich auf dem Schaltungsträger als eine dort mehrfach in sich geschlungene Struktur ausgebildet ist, die sich um den dadurch mit definierter Position auf dem Schaltungsträger zu erzeugenden Wärmepunkt legt, und daß die Thermosicherung an diesem Wärmepunkt an den Schaltungsträger thermisch angekoppelt ist.This object is achieved in a hybrid circuit arrangement of the type specified at the outset in that the resistance meander is designed in a limited area on the circuit carrier as a structure which is looped around it several times and which is based on the heat point to be generated with a defined position on the circuit carrier, and that the thermal fuse is thermally coupled to the circuit carrier at this heat point.
Weitere Ausgestaltungen der Erfindung sind in den Unteran- Sprüchen gekennzeichnet.Further embodiments of the invention are characterized in the subclaims.
Die Erfindung wird nachfolgend anhand eines Ausführungsbei- spiels und der einzigen Figur der Zeichnung erläutert. Die Zeichnung zeigt in Draufsicht einen erfindungsgemäß struktu- rierten Widerstandsmaander und eine Thermosicherung. 3 In der Figur ist ein Widerstandsmaander dargestellt, dessen Schleifen kein gleichförmiges, paralleles Muster bilden, son¬ dern in dessen Struktur Abbiegungen vorgesehen sind, damit jeweils eine oder mehrere Schleifen nicht nur nebeneinander, sondern auch im Winkel gegeneinander oder einander gegenübergestellt angeordnet werden können. Durch die selbst wiederum verschlungen angeordneten einzelnen Schleifen entsteht somit eine Struktur, die es erlaubt, einen besonders großen Leistungsumsatz an einem vorherbestimmten Ort zu erzeugen und somit einen definierten Wärmepunkt 3 (Hot Spot) zu erzeugen. Die verschlungene Struktur nimmt dabei nur einen begrenzten Bereich 4 des ansonsten von einem gleichförmigen Widerstands- mäander und/oder flächigen Widerständen bedeckten Schaltungstr gers 5 ein. Diese "normalen" Widerstandsstrukturen sind in der Zeichnung nicht dargestellt.The invention is explained below using an exemplary embodiment and the single figure of the drawing. The drawing shows a top view of a resistance meander structured according to the invention and a thermal fuse. 3 In the figure, a Widerstandsmaander is shown, which loops do not form a uniform, parallel pattern, son ¬ countries in the structure of which bends are provided, so that in each case one or more loops can not be arranged only side by side but also faced at an angle against each other or one another. The individual loops, which are in turn intertwined, thus create a structure that allows a particularly large output to be generated at a predetermined location and thus to generate a defined heat point 3 (hot spot). The intertwined structure occupies only a limited area 4 of the circuit carrier 5, which is otherwise covered by a uniform resistance meander and / or flat resistors. These "normal" resistance structures are not shown in the drawing.
Der Abgleich von Widerstandsmäandern erfolgt bevorzugt durch Abgleichpunkte, die eingangs einer Schleife einen Kurzschluß herstellen und die zur Herstellung eines gewünschten Wider- standswertes beispielsweise mittels eines Laser durchgetrennt werden können, so daß der Gesamtwiderstand um den Widerstand dieser einen Schleife erhöht wird. Dieses Abgleichverfahren kann auch im Rahmen der vorliegenden Erfindung ohne weiteres beibehalten werden, wenn in dem genannten begrenzten Bereich 4 mit der verschlungenen Mäanderstruktur keine Abgleichpunkte vorgesehen werden, so daß unabhängig vom Abgleich eine gleichbleibende Erwärmung in diesem Bereich 4 erzeugt wird.The adjustment of resistance meanders is preferably carried out by adjustment points which create a short circuit at the beginning of a loop and which can be cut through, for example by means of a laser, to produce a desired resistance value, so that the total resistance is increased by the resistance of this one loop. This adjustment method can also be easily maintained within the scope of the present invention if no adjustment points are provided in the above-mentioned limited area 4 with the intertwined meandering structure, so that constant heating is generated in this area 4 regardless of the adjustment.
Die Erfindung insgesamt gewährleistet durch die Konzentration des Wärmeumsatzes auf den Bereich 4 ein optimales Auslösen der auf Erwärmung basierenden Sicherung, wobei die Gesamterwärmung der Schaltungsanordnung begrenzt bleibt. In der Zeichnung ist außerdem eine an sich bekannte Schmelzsicherung 6 dargestellt, deren unter Vorspannung stehender Federarm ge- nau im durch den verschlungenen Widerstandsmaander erzeugten Wärmepunkt 3 mit einer Kontaktfläche (nicht dargestellt) der Schaltung verlötet ist. Der Wärmepunkt 3 verfügt in jedem 4 Fall über eine gewisse Ausdehnung, so daß keine millimetergenaue Positionierung der Thermosicherung 6 erforderlich ist. The invention as a whole ensures optimum triggering of the heating-based fuse by concentrating the heat turnover in the region 4, the total heating of the circuit arrangement remaining limited. The drawing also shows a fuse 6 known per se, the spring arm of which is pretensioned is precisely soldered to a contact surface (not shown) of the circuit in the heat point 3 generated by the tortuous resistance meander. The heating point 3 has in each 4 case over a certain extent, so that no precise positioning of the thermal fuse 6 is required.

Claims

Patentansprüche claims
1. Hybridschaltungsanordnung mit einem Widerstandsmaander (1), der auf einem plattenförmigen Schaltungstr ger (5) auf- gebracht ist und mit einer thermisch mit dem Schaltungstr ger (5) gekoppelten und elektrisch mit dem Widerstandsmaander (1) verbundenen Thermosicherung (6), die im Überlastfall durch die Erwärmung des Schaltungsträgers (5) durch den Widerstandsm ander (1) auslösbar ist, dadurch gekennzeichnet, daß der Widerstandsmaander (1) in einem begrenzten Bereich (4) auf dem Schaltungstr ger (5) als eine dort mehrfach in sich geschlungene Struktur ausgebildet ist, die sich um den dadurch mit definierter Position auf dem Schaltungstrager (5) zu erzeugenden Wärmepunkt (3) legt, und daß die Thermosicherung (6) an diesem Wärmepunkt (3) an den Schaltungsträger (5) thermisch angekoppelt ist.1. Hybrid circuit arrangement with a resistance meander (1) which is applied to a plate-shaped circuit carrier (5) and with a thermal fuse (6) thermally coupled to the circuit carrier (5) and electrically connected to the resistance manger (1) in the event of an overload, the heating of the circuit carrier (5) can be triggered by the resistance manger (1), characterized in that the resistance mander (1) in a limited area (4) on the circuit carrier (5) as one looped therein several times Structure is formed, which surrounds the heat point (3) to be generated with a defined position on the circuit carrier (5), and that the thermal fuse (6) is thermally coupled to the circuit carrier (5) at this heat point (3).
2. Hybridschaltungsanordnung nach Anspruch 1, dadurch gekennzeichnet, daß der Widerstandsmaander (1) mit Abgleichpunkten versehen ist, wobei die Abgleichpunkte jedoch nicht in dem begrenzten Bereich (4) vorgesehen sind.2. Hybrid circuit arrangement according to claim 1, characterized in that the resistance meander (1) is provided with adjustment points, but the adjustment points are not provided in the limited area (4).
3. Hybridschaltungsanordnung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Thermosicherung (6) durch eine Schmelzsicherung (6) mit wenigstens einem unter Vorspannung mit einer Kontaktfläche der Hybridschaltung verlöteten Federarm gebildet ist, und daß diese Kontaktfläche in den Wärmepunkt (3) gelegt ist. 3. Hybrid circuit arrangement according to claim 1 or 2, characterized in that the thermal fuse (6) is formed by a fuse (6) with at least one spring arm pretensioned with a contact surface of the hybrid circuit, and that this contact surface is placed in the heat point (3) is.
PCT/DE1999/000737 1998-03-31 1999-03-16 Hybrid circuit arrangement with a thermal release WO1999050871A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP99922032A EP1068626A1 (en) 1998-03-31 1999-03-16 Hybrid circuit arrangement with a thermal release

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1998114445 DE19814445C1 (en) 1998-03-31 1998-03-31 Hybrid circuit arrangement
DE19814445.8 1998-03-31

Publications (1)

Publication Number Publication Date
WO1999050871A1 true WO1999050871A1 (en) 1999-10-07

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PCT/DE1999/000737 WO1999050871A1 (en) 1998-03-31 1999-03-16 Hybrid circuit arrangement with a thermal release

Country Status (4)

Country Link
EP (1) EP1068626A1 (en)
CN (1) CN1294749A (en)
DE (1) DE19814445C1 (en)
WO (1) WO1999050871A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1811819B1 (en) * 2006-01-19 2011-03-23 Siemens Aktiengesellschaft Circuit board
JP2008021520A (en) * 2006-07-12 2008-01-31 Nec Lighting Ltd Discharge lamp

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0352771A2 (en) * 1988-07-28 1990-01-31 Siemens Aktiengesellschaft Fuse with a spring arm
US5192937A (en) * 1990-12-24 1993-03-09 Dong A Electric Parts Co., Ltd. Resistance unit for motor speed control
WO1994003913A1 (en) * 1992-08-07 1994-02-17 Siemens Aktiengesellschaft Thermal cut-out and process for activating it
DE9319473U1 (en) * 1993-12-17 1994-06-23 Siemens Ag Hybrid circuit arrangement
DE19639427A1 (en) * 1995-09-26 1997-03-27 Nippon Denso Co Resistor with thermal fuse

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0352771A2 (en) * 1988-07-28 1990-01-31 Siemens Aktiengesellschaft Fuse with a spring arm
US5192937A (en) * 1990-12-24 1993-03-09 Dong A Electric Parts Co., Ltd. Resistance unit for motor speed control
WO1994003913A1 (en) * 1992-08-07 1994-02-17 Siemens Aktiengesellschaft Thermal cut-out and process for activating it
DE9319473U1 (en) * 1993-12-17 1994-06-23 Siemens Ag Hybrid circuit arrangement
DE19639427A1 (en) * 1995-09-26 1997-03-27 Nippon Denso Co Resistor with thermal fuse

Also Published As

Publication number Publication date
DE19814445C1 (en) 1999-06-24
CN1294749A (en) 2001-05-09
EP1068626A1 (en) 2001-01-17

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