WO1999042879A1 - Laser modulators - Google Patents
Laser modulators Download PDFInfo
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- WO1999042879A1 WO1999042879A1 PCT/GB1999/000537 GB9900537W WO9942879A1 WO 1999042879 A1 WO1999042879 A1 WO 1999042879A1 GB 9900537 W GB9900537 W GB 9900537W WO 9942879 A1 WO9942879 A1 WO 9942879A1
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- WIPO (PCT)
- Prior art keywords
- optical
- laser
- transmitter module
- laser assembly
- optical transmitter
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
- G02B6/4208—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback using non-reciprocal elements or birefringent plates, i.e. quasi-isolators
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4285—Optical modules characterised by a connectorised pigtail
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/21—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour by interference
- G02F1/225—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour by interference in an optical waveguide structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0064—Anti-reflection components, e.g. optical isolators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0085—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for modulating the output, i.e. the laser beam is modulated outside the laser cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
Definitions
- This invention relates to an optical transmitter module, suitable for use in telecommunications networks employing optical fibres.
- the pigtails interconnecting the laser module and the modulator must be of polarisation- maintaining optical fibre, for the overall assembly to operate effectively This increases the cost of the laser module since it requires special setting up procedures at the time of connecting thereto a polarisation-maintaining fibre Moreover, the pigtail from the laser must be connected to the pigtail to the modulator either with a polarisation-maintaining fusion splice or with pre-aligned optical connectors. Either of these solutions is difficult to implement and leads to significant further costs.
- the modulator may be manufactured using materials other than lithium niobate, such as gallium arsenide and indium phosphide, but the preferred modulator designs are still polarisation sensitive and must still therefore be used with polarisation-maintaining optical fibre, between the laser module and the - 2 - modulator.
- the modulator is fabricated into the same wafer as the laser, by multiple deposition and etching stages.
- electro-absorption modulators have been used, where the modulator section is fabricated with a band-gap such that the absorption edge of the material matches the laser emissions. In this way, a small applied electric field will shift the band-gap so that the material absorbs. Unfortunately, this has the effect of causing chirp within the structure, from a variety of sources.
- the fabrication of these devices has a relatively low yield due to the requirement to match a band-gap over two manufacturing growth stages. This device is thus not favoured for wavelength-division multiplexed networks.
- a hybrid solution allows the optimal performance of a narrow line width laser to be coupled to an external modulator, but still within the same package. Both direct laser-modulator coupling and the use of intermediate optics have been employed, as illustrated in Figures 1 and 2 of the accompanying drawings.
- a laser 10 is butt-coupled to a modulator 11 , so that the modulator directly receives emission from the laser.
- the output from the modulator is taken by an optical fibre pigtail 12 out of a package 13 within which both the laser 10 and the modulator 11 are hermetically sealed.
- polarisation-maintaining optical fibre, lenses and an optical isolator, associated with separate laser module and modulator, are all eliminated.
- the laser may suffer adverse effects due to the high reflectivity interface unless the modulator end-facet is angled or bevelled to direct reflections away from the active stripe of the laser.
- the laser and sometimes both the laser and the modulator are mounted on a Peltier cooler 14 (that is, a thermo-electric cooling element) so that the temperature of the laser can be maintained accurately at the required value to ensure emission at a precise wavelength, the wavelength being monitored externally of the device.
- a monitor photodiode 15 is incorporated within the laser so that the output power of the laser may be monitored and the drive current thereto controlled to stabilise the laser power.
- the emission wavelength is usually fine-tuned by controlling the temperature of the Peltier element 14, and a reduction in the quality of the control of the temperature will have an adverse affect on the network performance.
- Figure 2 shows the alternative approach of employing an intermediate optical train between the laser and the modulator, including lenses 16 and an optical isolator 17, to prevent reflected light passing back to the laser diode.
- the optical train is similar to that employed with a discrete laser package but the final lens is chosen to accommodate the mode size of the waveguide geometry, to allow light from the laser to enter the modulator waveguide.
- a particular disadvantage of the arrangement of Figure 2 is that the isolator is normally a single stage design, due to cost considerations, and hence rotates the polarisation by only 45°.
- the emission plane of the laser and that required by the modulator are the same when the elements are placed on a common flat plane.
- the present invention aims at overcoming the disadvantages of the direct and indirect hybrid laser-modulator packages described above, particularly with reference to Figures 1 and 2.
- an optical transmitter module an optical transmitter module comprising packaging means enclosing a laser assembly, an integrated optical circuit having an input waveguide and an output waveguide, an optical fibre stub having one end supported to receive light from the laser assembly and the other end of the optical fibre stub being optically coupled to the input waveguide of the optical circuit, and an output optical fibre in optical communication with the output waveguide of the optical circuit and leading out of the packaging means, whereby light emanating from the laser assembly is subjected to data-encoding by the optical circuit before leaving the packaging means.
- the laser assembly is in the form of an hermetically- sealed sub-module mounted within said packaging means, the optical fibre stub entering in a sealing manner the laser sub-module to receive light from the laser assembly.
- a non-hermeticaliy-sealed sub-module could instead be employed.
- the fibre stub is connected internally of the sub-module to the laser, so that optical alignment with the stub is maintained at all times.
- the disadvantages of having external pigtails are wholly avoided.
- the optical fibre stub may be only a few mm long, at the most, and its free end is preferably directly connected to the modulator end face, in communication with the waveguide.
- Such a fibre need not be polarisation maintaining, in view of its very short length, and thus such a structure is relatively simple and cheap to implement.
- a mounting element is provided within the packaging means and carries the laser assembly, and support means is provided on the mounting element for supporting the said one end of the optical fibre adjacent the laser assembly.
- a laser assembly is packaged together with an integrated optical circuit, with light being supplied to the optical circuit from the laser assembly through the optical fibre stub.
- a mounting element configured expressly to support the end of the fibre stub is carried on the same mounting element as the laser itself together with any other required optical components to couple the output of the laser into the stub.
- the mounting element comprises a Peltier cooler, with which significant dimensional changes may be expected dependent upon the drive current thereto. Even despite significant variations in the driving current to the cooler, accurate alignment may still be expected, optimising the coupling of light from the laser, to the optical circuit.
- the packaging means has a base wall and one of the laser assembly and the integrated optical circuit is carried on a mounting surface which lies at an acute angle to the base wall whereby the polarisation plane of light leaving the laser assembly matches the launch polarisation plane of the integrated optical circuits.
- an optical isolator included in the laser assembly rotates the plane of polarisation of light emitted by the laser through + ⁇ °; in this case, said mounting surface should lie at - ⁇ °, for a modulator requiring TE polarisation (that is, parallel to the package base wall). In a case where the modulator requires TM polarisation, said mounting surface should lie at (90 - ⁇ )° to the base wall. In either case, by employing a mounting surface in accordance with - 6 -
- the plane of polarisation of the light leaving the laser assembly will be properly matched to the launch polarisation plane for the modulator.
- the isolator will rotate the plane of polarisation by 45° and then the mounting surface should lie at 45° to the plane of the base wall.
- the mounting surface preferably is defined by a sub-mount provided with the package and secured either directly to the package base wall or indirectly to that base wall by means of a Peltier cooler element.
- the laser assembly includes the laser-diode which is carried on the mounting surface.
- the optical isolator preferably also is carried on the mounting surface.
- the integrated optical circuit is carried on the mounting surface, the laser assembly then being carried in a conventional manner, on a sub-mount itself supported by a Peltier cooler.
- the laser assembly may be directly coupled to the optical circuit, a lens being provided to direct the output of the laser assembly into the input waveguide of the modulator.
- an optical fibre stub may be provided optically to interconnect the laser assembly and the input waveguide of the integrated optical circuit.
- the laser assembly may include a tunable source such that a laser element in the assembly emits light at a single discrete wavelength dependent upon the tuning of the source. This may be achieved by monitoring the output from the laser, which typically will be a laser diode, and then providing a suitable feedback signal to the laser in order to control the wavelength of the emission. The feedback may be achieved optically, or electronically.
- the packaging means may comprise a package similar to that conventionally employed for a modulator, except that it may need to be slightly larger in order to accommodate the laser assembly.
- the packaging means may comprise a base wall on which the laser assembly and the integrated optical circuit are separately mounted, side walls upstanding from the base wall, and a cover sheet sealed to the side walls so as wholly to enclose the laser assembly and the integrated optical circuit.
- the laser assembly may be of an essentially conventional design and thus including a Peltier cooler, to control the wavelength of the laser, the wavelength being tracked externally of the device or by using a filter arrangement as described above .
- the integrated optical circuit may be a modulator of a known suitable design for the intended use of the transmitter module.
- it may comprise a phase modulator or a Mach-Zehnder interferometer, typically fabricated on a lithium niobate wafer, though other modulator designs may be used.
- FIGS 3 and 4 respectively show isolated and non-isolated laser sub- modules packaged together with an optical modulator to form two embodiments of optical transmitter modules of this invention
- Figure 5A diagrammatical ly shows a plan view of an isolated laser assembly packaged together with an optical modulator, to form a second embodiment of this invention
- Figure 5B is an enlarged view on a part of the laser assembly of Figure
- Figure 5C is a sectional view on line A-A marked on Figure 5B;
- Figure 6A is a diagrammatic plan view on a third embodiment of this invention;
- Figure 6B is a section taken on line A-A marked on Figure 6A; and
- Figures 7A and 7B are similar to Figures 6A and 6B, but of a fourth embodiment.
- First and Second Embodiments Figures 3 and 4
- FIG. 3 there is shown a compact laser sub-module 20 comprising an hermetically sealed package 21 within which is enclosed a laser diode 22, a monitor photodiode 23 and an optical train 24 including lenses and an optical isolator, shielding the laser diode from reflected light.
- a compact laser sub-module 20 comprising an hermetically sealed package 21 within which is enclosed a laser diode 22, a monitor photodiode 23 and an optical train 24 including lenses and an optical isolator, shielding the laser diode from reflected light.
- a Peltier cooler 25 which also supports a fibre mount 26 carrying an end portion of a fibre stub 27 leading out of the package 21 in an hermetically- sealed manner.
- the end of the fibre stub 27 is appropriately prepared to receive light from the optical train 24 and is mounted in accurate alignment with the optical train in order to receive the maximum emission from the laser.
- the lens nearer the fibre may be micro-manipulated in order to optimise the coupling of the laser emission to the fibre stub, before all the components are secured in position.
- the laser sub-module 20 is mounted to the base wall 30 of an overall package 31 of a known general design, which package also includes four side walls upstanding from the base wall and a cover sheet (not shown).
- the base wall 30 supports an optical modulator 32, fibre stub 27 being directly connected at 33 to the input waveguide of the optical modulator.
- a fibre pigtail 34 is connected to the output waveguide of the modulator and leads out of the package 31 , for connection to another fibre or another network component. Suitable electrical connections are made from pins 35 of the package 31 to connecting pins of the laser sub-module 20 and also to the electrodes of the modulator 32.
- Suitable means may be provided to permit tuning of the emission wavelength of the laser diode 22.
- an optical feedback arrangement may be provided to control the frequency at which the diode 22 lases, or an electronic control may instead be utilised.
- Figure 4 illustrates a similar arrangement to that of Figure 3 except that the laser sub-module does not include an optical isolator.
- the laser sub-module does not include an optical isolator.
- Like components with those of Figure 3 are given like reference characters and will not be described again here.
- an un-isolated laser sub-module 20 allows the cost to be reduced very significantly, as an optical isolator represents a very high proportion of the raw material cost of a laser module. It is possible to eliminate an optical isolator by employing radiused or angled fibre end-faces within the laser module, and also angled fibre/optical circuit interfaces, so as significantly to reduce near-end reflections. Such an approach is better suited to short-haul - 9 -
- the above described embodiments of this invention have the following advantages: a) The laser sub-module may be manufactured and tested before incorporation within the overall package and this leads to high manufacturing yields, since bare-chip lasers are eliminated; b) The manufacturing process for connecting a fibre to the modulator may employ materials (such as an epoxy resin) which are incompatible with a laser diode, as the laser is hermetically sealed; c) The laser-modulator interface is optically compliant and maintains optimum optical coupling, eliminating the temperature effects of the Peltier element; d) The physical size of the Peltier element may be reduced to a minimum, so reducing the element power consumption and increasing the effectiveness of the closed-loop control; e) A short fibre stub of singlemode fibre will effectively maintain polarisation between the laser and the modulator, so eliminating the need for polarisation-main
- a laser assembly 120 comprising a laser- diode 121 , a monitor photo-diode 122 and an optical train 123 including lenses and an optical isolator, shielding the laser diode 121 from reflected light.
- These components are supported on a sub-mount 124 which is itself mounted on a Peltier cooler 125, secured to a base wall 126 of the overall package 127.
- the laser diode 121 could be mounted on an individual sub-mount, with the other components then being mounted directly on the Peltier cooler 125.
- an optical modulator 128 mounted on the base wall 126 is an optical modulator 128 arranged as a Mach-Zehnder interferometer of a known design, fabricated in a lithium niobate wafer in a manner known in the art
- the input waveguide 129 of the modulator 128 is coupled to the laser assembly by means of an optical fibre stub 130, one end of which is disposed within the laser assembly and the other end of which is directly attached to an end face of the modulator, in direct communication with the input waveguide 129
- a support block 132 (see also Figures 5B and 5C) is attached, for example by laser-welding, to the Peltier cooler 125, for supporting the end of the fibre stub 130 within the laser assembly, on the optical axis thereof
- a pair of saddles 133 are provided to secure the fibre to the support block 132
- the end face of the fibre within the laser assembly may be treated so as to form a lens
- the fibre stub 130 is manipulated with reference to the laser on its sub-mount 124
- the saddles 133 are laser-welded to the fibres and then the saddles are laser-welded to the support block 132
- Final optimisation of the coupling may be achieved by micro-manipulation of the lens nearer the fibre stub and then securing, by laser-welding, a carrier for the lens to the sub-mount 124
- the package 127 includes four side walls upstanding from the base wall and also a cover sheet (not shown) Suitable electrical connections are made from the pins 134 of the package 127, to the laser diode 121, monitor photo-diode 122 and the optical modulator 128 as well as to the Peltier cooler 125, to permit proper driving of these various components
- the optical power fed into the optical modulator by the fibre is constant since the optical alignment is at all times maintained and the laser assembly/modulator interface (provided by the fibre stub) is not subjected to any stress from dimensional changes of the Peltier element - 1 1 -
- a device package 210 comprising a base wall 211 , side walls 212 and a cover sheet (not shown) Mounted on the base wall is a Peltier cooling element 213, which in turn carries a laser assembly (towards the left-hand side of Figure 6A) and a modulator 214
- the laser assembly comprises a laser-diode 216, first lens 217, an optical isolator 218 and a second lens 219, all of which are supported on a sub-mount 220 in turn carried by the Peltier cooling element 213
- the sub-mount 220 has a V-shaped groove 221 in its upper surface, one wall 222 of which groove serves as a mounting surface for the laser-diode 216
- the shape of the groove 221 is modified in the region between the laser-diode 216 and the modulator 214, in order to accommodate the lenses 217 and 219 and the optical isolator 218, on the optical axis of the laser assembly as a whole
- the laser may be mounted on a first sub-mount, and the other optical components on a separate sub-mount
- a monitor photo-diode 223 which receives emission from the laser-diode 216, the output from the photo- diode 223 being used to control the drive current for the laser-diode 216, thereby to control the power thereof
- the Peltier cooling element 213 is driven to control the temperature of the laser diode, and so the wavelength of its emission, the wavelength being monitored by a suitable tracking mechanism (not shown) mounted either externally or internally of the package 210 In this way, the wavelength of the emission from the laser-diode 216 may closely be controlled, by adjusting the temperature of that diode
- the modulator 214 is, as shown, of a Mach-Zehnder interferometer configuration, fabricated on a lithium niobate water
- the modulator has an input waveguide 224 into which emissions from the laser-diode 216 are directed by lens 219, with that lens performing the required mode size adjustment for optimum coupling of the modulator to the laser-diode
- the plane of polarisation of light from the laser diode 216 is at 45° to the base wall 211 of the package 210, on account of the laser-diode 216 - 12 -
- the optical isolator 218 rotates that piane of polarisation through 45°, so that the plane of polarisation is parallel to the base wall 211 of the package, corresponding to the launch polarisation state for the modulator 214 which, in this example is TE polarisation
- the output from the modulator 214 appears on waveguide 225, which is directly coupled to an output optical fibre pigtail 226, leading out of the package 210 for connection to another optical fibre or some other optical component, in a manner well known in the art Connections to the various components within the package 210 are completed to external pins 227 of the package in a manner which is well understood and will not be described in further detail here
- Figures 7A and 7B show a second embodiment of this invention and like parts with those of Figures 6A and 6B are given like reference characters, those parts will not be described again here
- the arrangement of Figures 7A and 7B differs from that of Figures 6A and 6B in that the laser-diode 216, lenses 217 and 219 and the optical isolator 218 are mounted on a conventional sub-mount having a planar upper surface parallel to the surface of the base wall 211 of the package 210
- the base wall of the package carries a mount 230 over the region where the modulator 214 is supported, which mount 230 provides a mount surface 231 at 45° to the main area of the base wall, as shown in Figure 7B
- the modulator 214 is carried by this surface, so that the plane of the wafer in which the modulator is fabricated lies at 45° to the plane of the base wall and thus is matched to the plane of polarisation of the light leaving lens 219
- the base wall could be modified directly to provide mount surface 231
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99905109A EP1057058A1 (en) | 1998-02-21 | 1999-02-22 | Laser modulators |
CA002320727A CA2320727A1 (en) | 1998-02-21 | 1999-02-22 | Laser modulators |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9803736.9 | 1998-02-21 | ||
GB9803732.8 | 1998-02-21 | ||
GB9803731.0 | 1998-02-21 | ||
GBGB9803731.0A GB9803731D0 (en) | 1998-02-21 | 1998-02-21 | Laser modulators |
GBGB9803732.8A GB9803732D0 (en) | 1998-02-21 | 1998-02-21 | Laser modulators |
GBGB9803736.9A GB9803736D0 (en) | 1998-02-21 | 1998-02-21 | Laser modulators |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999042879A1 true WO1999042879A1 (en) | 1999-08-26 |
Family
ID=27269222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1999/000537 WO1999042879A1 (en) | 1998-02-21 | 1999-02-22 | Laser modulators |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1057058A1 (en) |
CA (1) | CA2320727A1 (en) |
WO (1) | WO1999042879A1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1281998A1 (en) * | 2001-07-30 | 2003-02-05 | Agilent Technologies, Inc. (a Delaware corporation) | Temperature controlled light modulator assembly |
EP1369721A2 (en) * | 2002-05-25 | 2003-12-10 | Agilent Technologies, Inc. - a Delaware corporation - | Optoelectronic module with integrated variable optical attenuator |
EP1492208A3 (en) * | 2003-06-27 | 2005-01-26 | NEC Corporation | Semiconductor laser module and method of assembling the same |
WO2005012970A1 (en) * | 2003-07-28 | 2005-02-10 | Qinetiq Limited | Monolithic optical transmitter and receiver apparatus incorporating hollow waveguides |
CN104698551A (en) * | 2015-03-10 | 2015-06-10 | 武汉电信器件有限公司 | Optical fiber coupled multimode semiconductor photoelectric device |
WO2015116274A3 (en) * | 2013-11-05 | 2015-09-24 | Cisco Technology, Inc. | Method and system for an optical communication device |
CN107315229A (en) * | 2017-07-17 | 2017-11-03 | 中国电子科技集团公司第四十四研究所 | Integrated encapsulation structure and the technique for making integrated encapsulation structure |
CN114200580A (en) * | 2022-01-26 | 2022-03-18 | 中国科学院半导体研究所 | Light emitting module |
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JPH01307725A (en) * | 1988-06-06 | 1989-12-12 | Nec Corp | Optical transmission module |
JPH0499081A (en) * | 1990-03-20 | 1992-03-31 | Fujitsu Ltd | Connecting structure between semiconductor laser package and package for modulator |
JPH04274204A (en) * | 1991-02-28 | 1992-09-30 | Fujitsu Ltd | Optical modulator module |
JPH0969819A (en) * | 1995-08-30 | 1997-03-11 | Nec Corp | Optical transmitter |
JPH09252164A (en) * | 1996-03-15 | 1997-09-22 | Mitsubishi Electric Corp | Laser diode module |
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- 1999-02-22 WO PCT/GB1999/000537 patent/WO1999042879A1/en not_active Application Discontinuation
- 1999-02-22 EP EP99905109A patent/EP1057058A1/en not_active Withdrawn
- 1999-02-22 CA CA002320727A patent/CA2320727A1/en not_active Abandoned
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JPH0499081A (en) * | 1990-03-20 | 1992-03-31 | Fujitsu Ltd | Connecting structure between semiconductor laser package and package for modulator |
JPH04274204A (en) * | 1991-02-28 | 1992-09-30 | Fujitsu Ltd | Optical modulator module |
US5712940A (en) * | 1995-02-10 | 1998-01-27 | U.S. Philips Corporation | Optoelectronic device with a coupling between a semiconductor laser modulator or amplifier and two optical glass fibres |
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Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6714333B2 (en) | 2001-07-30 | 2004-03-30 | Agilent Technologies Inc. | Modulator assembly |
EP1281998A1 (en) * | 2001-07-30 | 2003-02-05 | Agilent Technologies, Inc. (a Delaware corporation) | Temperature controlled light modulator assembly |
EP1369721A2 (en) * | 2002-05-25 | 2003-12-10 | Agilent Technologies, Inc. - a Delaware corporation - | Optoelectronic module with integrated variable optical attenuator |
EP1369721A3 (en) * | 2002-05-25 | 2004-07-21 | Agilent Technologies, Inc. - a Delaware corporation - | Optoelectronic module with integrated variable optical attenuator |
US7308012B2 (en) | 2003-06-27 | 2007-12-11 | Nec Corporation | Semiconductor laser module and method of assembling the same |
EP1492208A3 (en) * | 2003-06-27 | 2005-01-26 | NEC Corporation | Semiconductor laser module and method of assembling the same |
US8027552B2 (en) | 2003-07-28 | 2011-09-27 | Qinetiq Limited | Monolithic optical transmitter and receiver apparatus incorporating hollow waveguides |
JP2007500370A (en) * | 2003-07-28 | 2007-01-11 | キネティック リミテッド | Monolithic optical transmitter and receiver incorporating a hollow waveguide |
WO2005012970A1 (en) * | 2003-07-28 | 2005-02-10 | Qinetiq Limited | Monolithic optical transmitter and receiver apparatus incorporating hollow waveguides |
WO2015116274A3 (en) * | 2013-11-05 | 2015-09-24 | Cisco Technology, Inc. | Method and system for an optical communication device |
CN105705975A (en) * | 2013-11-05 | 2016-06-22 | 思科技术公司 | Method and system for an optical communication device |
US9628184B2 (en) | 2013-11-05 | 2017-04-18 | Cisco Technology, Inc. | Efficient optical communication device |
US9755752B2 (en) | 2013-11-05 | 2017-09-05 | Cisco Technology, Inc. | Method for manufacturing an optical communication device |
CN105705975B (en) * | 2013-11-05 | 2018-01-16 | 思科技术公司 | Method and system for optical communication device |
US10735101B2 (en) | 2013-11-05 | 2020-08-04 | Cisco Technology, Inc. | Method for manufacturing an optical communication device |
CN104698551A (en) * | 2015-03-10 | 2015-06-10 | 武汉电信器件有限公司 | Optical fiber coupled multimode semiconductor photoelectric device |
CN107315229A (en) * | 2017-07-17 | 2017-11-03 | 中国电子科技集团公司第四十四研究所 | Integrated encapsulation structure and the technique for making integrated encapsulation structure |
CN114200580A (en) * | 2022-01-26 | 2022-03-18 | 中国科学院半导体研究所 | Light emitting module |
Also Published As
Publication number | Publication date |
---|---|
CA2320727A1 (en) | 1999-08-26 |
EP1057058A1 (en) | 2000-12-06 |
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