WO1999008850A3 - Mould and method for making a composite plastic body - Google Patents

Mould and method for making a composite plastic body Download PDF

Info

Publication number
WO1999008850A3
WO1999008850A3 PCT/DE1998/002446 DE9802446W WO9908850A3 WO 1999008850 A3 WO1999008850 A3 WO 1999008850A3 DE 9802446 W DE9802446 W DE 9802446W WO 9908850 A3 WO9908850 A3 WO 9908850A3
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
mould
moulded
zones
making
Prior art date
Application number
PCT/DE1998/002446
Other languages
German (de)
French (fr)
Other versions
WO1999008850A2 (en
Inventor
Alexandra Atzesdorfer
Juergen Fischer
Erich Syri
Klaus Neumann
Ulrich Vidal
Martin Huber
Michael Blumenauer
Jens Pohl
Guenter Tutsch
Original Assignee
Siemens Ag
Alexandra Atzesdorfer
Juergen Fischer
Erich Syri
Klaus Neumann
Ulrich Vidal
Martin Huber
Michael Blumenauer
Jens Pohl
Guenter Tutsch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19736210A external-priority patent/DE19736210A1/en
Application filed by Siemens Ag, Alexandra Atzesdorfer, Juergen Fischer, Erich Syri, Klaus Neumann, Ulrich Vidal, Martin Huber, Michael Blumenauer, Jens Pohl, Guenter Tutsch filed Critical Siemens Ag
Publication of WO1999008850A2 publication Critical patent/WO1999008850A2/en
Publication of WO1999008850A3 publication Critical patent/WO1999008850A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The invention concerns a mould (1; 101) having a cavity (14; 114) provided with mobile surface zones (9; 107, 109) which, in order to prevent entrapped air bubble while the material to be moulded (119) is being injected, are maintained in such a way as to provide the material to be moulded with a regular linear flow surface (120). In closed position, said surface zones (208, 209) can also divide the cavity (204) into two zones (210, 211) separated from each other. After injecting the material to be moulded (206), the surface zones (208, 209) which were at first opened are brought into closed position. A mould (301), designed for making an electrical component consisting of a box in thermosetting plastic enclosing a circuit, has a cavity (303) and an injection zone connected to the cavity (303) by a runner (305, 306). The invention is characterised in that the mould has at least two runners (305, 306) for one single cavity (303), thereby enabling to optimise the flow of the material to be moulded. Moreover, filling the cavity (303) is facilitated by shortening the circulation channels.
PCT/DE1998/002446 1997-08-20 1998-08-20 Mould and method for making a composite plastic body WO1999008850A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19736210A DE19736210A1 (en) 1996-11-12 1997-08-20 Microelectronic component esp. semiconductor memory component
DE19736210.9 1997-08-20

Publications (2)

Publication Number Publication Date
WO1999008850A2 WO1999008850A2 (en) 1999-02-25
WO1999008850A3 true WO1999008850A3 (en) 1999-11-18

Family

ID=7839609

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/002446 WO1999008850A2 (en) 1997-08-20 1998-08-20 Mould and method for making a composite plastic body

Country Status (1)

Country Link
WO (1) WO1999008850A2 (en)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4644384A (en) * 1984-02-02 1987-02-17 National Semiconductor Corporation Apparatus and method for packaging eprom integrated circuits
JPH0290633A (en) * 1988-09-28 1990-03-30 Nec Corp Resin sealing die for semiconductor device
EP0361194A2 (en) * 1988-09-30 1990-04-04 Siemens Aktiengesellschaft Method of enveloping electrical or electronic components or component assemblies, and envelope for electrical or electronic components or component assemblies
US4954307A (en) * 1987-12-31 1990-09-04 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
JPH03225930A (en) * 1990-01-31 1991-10-04 Nec Corp Apparatus for resin-sealing semiconductor device
JPH05192963A (en) * 1992-01-17 1993-08-03 Mitsubishi Materials Corp Mold device for molding resin sealing section of electronic part
JPH05206185A (en) * 1991-04-16 1993-08-13 Fujitsu Miyagi Electron:Kk Manufacturing device of semiconductor device
JPH05243303A (en) * 1992-02-26 1993-09-21 Nec Corp Production of semiconductor device nad resin sealing die for semiconductor device
JPH05326594A (en) * 1992-05-22 1993-12-10 Nec Corp Mold and method for sealing semiconductor device with resin
JPH0639870A (en) * 1992-07-24 1994-02-15 Oki Electric Ind Co Ltd Resin sealing method and mold used therein
EP0589569A1 (en) * 1992-08-27 1994-03-30 Texas Instruments Incorporated Lead frame with slots and a method for molding integrated circuit packages
JPH06260518A (en) * 1993-03-04 1994-09-16 Sony Corp Sealing method for semiconductor chip with resin and transfer molding die
JPH07290513A (en) * 1994-04-27 1995-11-07 Akita Nippon Denki Kk Mold for sealing semiconductor device with resin
JPH08288322A (en) * 1995-04-20 1996-11-01 Nec Kyushu Ltd Resin sealing die for semiconductor chip
GB2305004A (en) * 1995-09-05 1997-03-26 Motorola Inc Semiconductor device having contoured package body profile and method for its fabrication

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4644384A (en) * 1984-02-02 1987-02-17 National Semiconductor Corporation Apparatus and method for packaging eprom integrated circuits
US4954307A (en) * 1987-12-31 1990-09-04 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
JPH0290633A (en) * 1988-09-28 1990-03-30 Nec Corp Resin sealing die for semiconductor device
EP0361194A2 (en) * 1988-09-30 1990-04-04 Siemens Aktiengesellschaft Method of enveloping electrical or electronic components or component assemblies, and envelope for electrical or electronic components or component assemblies
JPH03225930A (en) * 1990-01-31 1991-10-04 Nec Corp Apparatus for resin-sealing semiconductor device
JPH05206185A (en) * 1991-04-16 1993-08-13 Fujitsu Miyagi Electron:Kk Manufacturing device of semiconductor device
JPH05192963A (en) * 1992-01-17 1993-08-03 Mitsubishi Materials Corp Mold device for molding resin sealing section of electronic part
JPH05243303A (en) * 1992-02-26 1993-09-21 Nec Corp Production of semiconductor device nad resin sealing die for semiconductor device
JPH05326594A (en) * 1992-05-22 1993-12-10 Nec Corp Mold and method for sealing semiconductor device with resin
JPH0639870A (en) * 1992-07-24 1994-02-15 Oki Electric Ind Co Ltd Resin sealing method and mold used therein
EP0589569A1 (en) * 1992-08-27 1994-03-30 Texas Instruments Incorporated Lead frame with slots and a method for molding integrated circuit packages
JPH06260518A (en) * 1993-03-04 1994-09-16 Sony Corp Sealing method for semiconductor chip with resin and transfer molding die
JPH07290513A (en) * 1994-04-27 1995-11-07 Akita Nippon Denki Kk Mold for sealing semiconductor device with resin
JPH08288322A (en) * 1995-04-20 1996-11-01 Nec Kyushu Ltd Resin sealing die for semiconductor chip
GB2305004A (en) * 1995-09-05 1997-03-26 Motorola Inc Semiconductor device having contoured package body profile and method for its fabrication

Non-Patent Citations (10)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 282 (E - 0942) 19 June 1990 (1990-06-19) *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 514 (E - 1150) 27 December 1991 (1991-12-27) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 623 (M - 1511) 17 November 1993 (1993-11-17) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 636 (E - 1464) 25 November 1993 (1993-11-25) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 702 (E - 1482) 21 December 1993 (1993-12-21) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 141 (E - 1520) 9 March 1994 (1994-03-09) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 258 (M - 1606) 17 May 1994 (1994-05-17) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 658 (E - 1643) 13 December 1994 (1994-12-13) *
PATENT ABSTRACTS OF JAPAN vol. 096, no. 003 29 March 1996 (1996-03-29) *
PATENT ABSTRACTS OF JAPAN vol. 097, no. 003 31 March 1997 (1997-03-31) *

Also Published As

Publication number Publication date
WO1999008850A2 (en) 1999-02-25

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