WO1998049876A3 - Capacitive device on a circuit board - Google Patents

Capacitive device on a circuit board Download PDF

Info

Publication number
WO1998049876A3
WO1998049876A3 PCT/SE1998/000767 SE9800767W WO9849876A3 WO 1998049876 A3 WO1998049876 A3 WO 1998049876A3 SE 9800767 W SE9800767 W SE 9800767W WO 9849876 A3 WO9849876 A3 WO 9849876A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
supporting structure
capacitive device
electrically conducting
electrically
Prior art date
Application number
PCT/SE1998/000767
Other languages
French (fr)
Other versions
WO1998049876A2 (en
Inventor
Leif Bergstedt
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to AU74594/98A priority Critical patent/AU7459498A/en
Publication of WO1998049876A2 publication Critical patent/WO1998049876A2/en
Publication of WO1998049876A3 publication Critical patent/WO1998049876A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09318—Core having one signal plane and one power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Capacitive device (100) in a circuit board with at least one supporting structure (120), at least one electrically conducting supporting structure (130) for the circuit board, at least one dielectric layer (140) between the supporting structure (120) and the electrically supporting structure (130), with a capacitance (150), the first element of which consists of the electrically conducting supporting structure (130), and the second element of which is arranged below, in, or on the supporting structure (120).
PCT/SE1998/000767 1997-04-30 1998-04-28 Capacitive device on a circuit board WO1998049876A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU74594/98A AU7459498A (en) 1997-04-30 1998-04-28 Capacitive device on a circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9701666-1 1997-04-30
SE9701666A SE9701666L (en) 1997-04-30 1997-04-30 Capacitive device on a circuit board

Publications (2)

Publication Number Publication Date
WO1998049876A2 WO1998049876A2 (en) 1998-11-05
WO1998049876A3 true WO1998049876A3 (en) 1999-03-11

Family

ID=20406820

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE1998/000767 WO1998049876A2 (en) 1997-04-30 1998-04-28 Capacitive device on a circuit board

Country Status (3)

Country Link
AU (1) AU7459498A (en)
SE (1) SE9701666L (en)
WO (1) WO1998049876A2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4967316A (en) * 1988-11-02 1990-10-30 Robert Bosch Gmbh Electric circuit unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4967316A (en) * 1988-11-02 1990-10-30 Robert Bosch Gmbh Electric circuit unit

Also Published As

Publication number Publication date
SE9701666D0 (en) 1997-04-30
SE9701666L (en) 1998-10-31
AU7459498A (en) 1998-11-24
WO1998049876A2 (en) 1998-11-05

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