SE9701666D0 - Capacitive device on a circuit board - Google Patents

Capacitive device on a circuit board

Info

Publication number
SE9701666D0
SE9701666D0 SE9701666A SE9701666A SE9701666D0 SE 9701666 D0 SE9701666 D0 SE 9701666D0 SE 9701666 A SE9701666 A SE 9701666A SE 9701666 A SE9701666 A SE 9701666A SE 9701666 D0 SE9701666 D0 SE 9701666D0
Authority
SE
Sweden
Prior art keywords
circuit board
supporting structure
capacitive device
electrically conducting
electrically
Prior art date
Application number
SE9701666A
Other languages
Swedish (sv)
Other versions
SE9701666L (en
Inventor
Leif Bergstedt
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9701666A priority Critical patent/SE9701666L/en
Publication of SE9701666D0 publication Critical patent/SE9701666D0/en
Priority to AU74594/98A priority patent/AU7459498A/en
Priority to PCT/SE1998/000767 priority patent/WO1998049876A2/en
Publication of SE9701666L publication Critical patent/SE9701666L/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09318—Core having one signal plane and one power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Capacitive device (100) in a circuit board with at least one supporting structure (120), at least one electrically conducting supporting structure (130) for the circuit board, at least one dielectric layer (140) between the supporting structure (120) and the electrically supporting structure (130), with a capacitance (150), the first element of which consists of the electrically conducting supporting structure (130), and the second element of which is arranged below, in, or on the supporting structure (120).
SE9701666A 1997-04-30 1997-04-30 Capacitive device on a circuit board SE9701666L (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9701666A SE9701666L (en) 1997-04-30 1997-04-30 Capacitive device on a circuit board
AU74594/98A AU7459498A (en) 1997-04-30 1998-04-28 Capacitive device on a circuit board
PCT/SE1998/000767 WO1998049876A2 (en) 1997-04-30 1998-04-28 Capacitive device on a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9701666A SE9701666L (en) 1997-04-30 1997-04-30 Capacitive device on a circuit board

Publications (2)

Publication Number Publication Date
SE9701666D0 true SE9701666D0 (en) 1997-04-30
SE9701666L SE9701666L (en) 1998-10-31

Family

ID=20406820

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9701666A SE9701666L (en) 1997-04-30 1997-04-30 Capacitive device on a circuit board

Country Status (3)

Country Link
AU (1) AU7459498A (en)
SE (1) SE9701666L (en)
WO (1) WO1998049876A2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3837206C2 (en) * 1988-11-02 1998-07-23 Bosch Gmbh Robert Electrical switching device

Also Published As

Publication number Publication date
SE9701666L (en) 1998-10-31
AU7459498A (en) 1998-11-24
WO1998049876A3 (en) 1999-03-11
WO1998049876A2 (en) 1998-11-05

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Legal Events

Date Code Title Description
NAV Patent application has lapsed