WO1998047162A1 - Subassembly and method for making devices such as keyboards - Google Patents

Subassembly and method for making devices such as keyboards Download PDF

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Publication number
WO1998047162A1
WO1998047162A1 PCT/FR1998/000711 FR9800711W WO9847162A1 WO 1998047162 A1 WO1998047162 A1 WO 1998047162A1 FR 9800711 W FR9800711 W FR 9800711W WO 9847162 A1 WO9847162 A1 WO 9847162A1
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WO
WIPO (PCT)
Prior art keywords
spacer
sub
components
openings
assembly
Prior art date
Application number
PCT/FR1998/000711
Other languages
French (fr)
Inventor
Eugène Lecourtois
Original Assignee
Nicomatic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nicomatic filed Critical Nicomatic
Publication of WO1998047162A1 publication Critical patent/WO1998047162A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/7006Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard comprising a separate movable contact element for each switch site, all other elements being integrated in layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2205/00Movable contacts
    • H01H2205/016Separate bridge contact
    • H01H2205/024Means to facilitate positioning
    • H01H2205/026Adhesive sheet
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2205/00Movable contacts
    • H01H2205/016Separate bridge contact
    • H01H2205/024Means to facilitate positioning
    • H01H2205/03Apertured plate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2213/00Venting
    • H01H2213/002Venting with external pressure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2213/00Venting
    • H01H2213/01Venting with internal pressure of other switch sites

Definitions

  • the present invention relates to a method of manufacturing electrical devices comprising a number of stacked elements, and in particular of keyboards of various types, and sub-assemblies useful for simplifying this manufacture.
  • the invention is described below with reference to a keyboard of the type in which flat but slightly domed metal springs, sometimes called “domes", are intended to make electrical contacts with a printed circuit board.
  • the invention is not limited to these electrical devices alone, and it can be applied to the manufacture of other electrical devices in which components of one or more types are positioned relative to a circuit board. printed circuit board.
  • the domes keyboards have, as main elements, a printed circuit board on which is placed a spacer which delimits openings intended for the housing of the domes constituting the contacts of the keyboard. These domes are metallic while the spacer is insulating.
  • a closure panel covers one spacer, on the side opposite the card, and comprises either separate operating members, such as keys, movable in translation in the closure panel and intended to exert pressure on the domes, or a flexible element by means of which a finger can exert a force on a dome placed below.
  • a specific conductive part of the printed circuit board, the dome placed above in an opening of the spacer and an operating part guided by the closure panel are aligned in a direction perpendicular to the entire stack formed.
  • keyboards During the manufacture of these keyboards, one begins by positioning, on the printed circuit board, the spacer which thus ensures proper positioning of the openings relative to the conductive paths of the printed circuit board.
  • the components are then placed, manually or by special machines, in the form of domes in the necessary openings, then the panel is applied exterior closure to maintain the domes in the openings.
  • the outer closure panel is also positioned with respect to the stack so that the operating members which it positions (for example separate keys or which are part of a flexible element whose operating members carry alphanumeric characters) are aligned with the domes.
  • the above method has a drawback in that, when the domes have been placed in the openings of the spacer, they are not maintained and the slightest shock can cause them to exit, partially or completely, from the openings.
  • the domes have already been placed on an adhesive sheet so that all the domes of a keyboard, previously positioned on an adhesive film, are simultaneously housed in the openings 1 spacer already placed on the printed circuit board.
  • the adhesive film is then used practically over its entire surface, on the one hand locally for retaining the components and on the other hand, between the components, for fixing the film to the spacer. Consequently, the domes must be placed on the adhesive film when it is completely uncovered.
  • the handling of these adhesive films is then delicate. Indeed, the adhesive side can easily stick anywhere.
  • the positioning of the adhesive film carrying the domes just above the openings of the spacer is not convenient.
  • the object of the invention is to remedy the drawbacks of the abovementioned methods and to allow an increase in the production rates and a reduction in the cost of the electrical devices in question, for example keyboards, by improving the manufacturing process.
  • This improvement includes the production of a sub-assembly which does not only comprise a flexible adhesive film and domes, but which also comprises the spacer, in the openings of which the components are positioned, and possibly an electromagnetic screen and / or a flexible element carrying operating members.
  • the components are mechanically retained in the openings.
  • the problems of positioning the adhesive film carrying domes with respect to a spacer are solved because the domes are not placed on the adhesive film only after gluing the adhesive film to the spacer.
  • the precise positioning of the adhesive film with respect to the spacer is therefore entirely superfluous, and it is not possible for domes to be moved from the openings since they are placed directly one by one in the openings of the spacer and are then retained directly.
  • the invention relates to a method for manufacturing electrical devices of the type which comprises a circuit board carrying electrically conductive paths and a closure panel, between which are arranged components which cooperate with conductive paths of the card and which can be controlled by operating members guided by the closure panel, and a spacer having openings at the locations of the components;
  • the method comprises the following stages: the selection of the spacer so that it keeps the card and the panel at a distance, the manufacture of a sub-assembly comprising the spacer, a part at the least of the components and a device for retaining these components at least in cooperation with the spacer, then the fitting of the sub-assembly on the card, with relative positioning of the spacer and of the card.
  • the manufacture of the sub-assembly comprises the following stages: the manufacture of a spacer having openings for all the components, and the fixing of at least part of the components in an opening each.
  • the step of manufacturing the sub-assembly includes the selection of a spacer having a thickness which corresponds to the thickness of the components, the cutting of the openings in the spacer, the bonding of a film. adhesive to one side of the spacer, and the introduction of components into at least some openings which lead to the other side so that the components introduced are held by bonding to the adhesive film.
  • the fixing comprises the selection of a spacer having a thickness at least equal to the thickness of the thickest of the components to be introduced, the cutting of the openings in the spacer, the introduction of a part components at least in the spacer so that at least some components are retained by wedging in the openings, and the introduction of the components so that their face of cooperation with the card is at the surface of the spacer .
  • the invention also relates to a sub-assembly of an electrical device intended for the implementation of a method according to one of the preceding paragraphs, and which comprises a spacer having openings, and components housed in at least part of the openings and practically not protruding from either side of the spacer.
  • the thickness of the spacer is substantially equal to the height of the components, and the subassembly further comprises an adhesive film bonded to one face of the spacer and retaining a component by bonding to the film. in the openings.
  • the film has a perforation in the center of the part which is opposite an opening. It is also advantageous that the film has at least one linear cut in the part which is opposite an opening.
  • the subassembly further comprises an electromagnetic screen.
  • This screen can be formed by an additional metallized film adjacent to the adhesive film, or by metallization of the adhesive film itself.
  • the sub-assembly preferably comprises a flexible element incorporated in the sub-assembly on the side opposite to the side of the spacer, the flexible element having at least one operating member disposed opposite an opening containing an elastic keyboard dome.
  • the flexible element comprises all of the keyboard operating members to be produced.
  • the openings have a cylindrical shape of section corresponding to the configuration of the component.
  • the openings of the spacer have a shape of variable section along their length so that they wedge the components in only one part. It is also advantageous for the spacer to have channels connecting the openings.
  • the spacer comprises a positioning device intended to cooperate with an additional positioning device for a circuit board carrying electrically conductive paths.
  • FIG. 1 represents a section of an electrical device such as a keyboard domes
  • Figure 2 shows a section through a sub-assembly according to the invention
  • FIG. 3 represents a section of another sub-assembly according to the invention, comprising an additional element
  • FIG. 4 represents a section of another sub-assembly according to the invention, comprising one more element than the sub-assembly of FIG. 2
  • FIG. 5 represents a section of another sub-assembly according to the invention, comprising one more element than the sub-assembly of FIG. 3
  • FIG. 6 is a plan view of an example of a spacer useful for implementing the invention.
  • FIG. 1 represents a diagrammatic section of a keyboard comprising contact domes.
  • the reference 10 designates a printed circuit board having, on its upper face in FIG. 1, a drawing of conductive paths intended to be connected for example to a connector placed at the edge of the card 10.
  • This card 10 is formed of any conventional material, for example an epoxy resin substrate loaded with glass fibers, although any other printed circuit board, of single-sided or double-sided type for example, can be used.
  • a spacer 12 is disposed flat on the upper face of the card 10.
  • This spacer 12 has openings 14 corresponding to the components to be placed, that is to say domes in the example considered.
  • This spacer 12 must simply determine a thickness which corresponds to the thickness of the domes 16.
  • It is electrically insulating and preferably practically rigid, to ensure the spacing of the printed circuit and the operating members, but it can however have some flexibility.
  • it is a waterproof cardboard and treated so that it is rot-proof, but it can also be made of any suitable plastic material.
  • FIG. 6 represents an advantageous example of spacer 12, described below.
  • Domes 16 are placed in the openings 14. These are advantageously domes of the type described in international patent application No. WO-96/20799. These domes are particularly advantageous insofar as they cannot stick. They may be circular domes, with several branches, etc., having a hole or a projection in the central position, or any other embodiment.
  • a film 18 has been shown glued to the spacer 12 and at the top of the domes 16 in FIG. 1, although this film is not essential. This has been indicated because it is representative of the process in which the domes 16 are glued to the adhesive film 18 before the domes are introduced into the spacer 12, according to the above-mentioned process which poses the problem indicated in the introduction.
  • the assembly then comprises a closure panel 24, which guides the operating members 22 of a flexible element 20 which bear inscriptions, for example figures, corresponding to the function of the dome 16 placed below. Flexible parts placed above the domes thus form "operating devices".
  • the film 18 is advantageously a known adhesive film, for example with a polyester or polyethylene terephthalate support, and the flexible element 20 is for example formed of an elastomer.
  • the flexible element 20, the operating members 22 of which have a printing layer carrying the indications, such as alphanumeric characters, is retained on the inner face of a simple closure panel 24.
  • the panel 24 is preferably formed from a hard impact-resistant plastic. Such a panel and flexible element are already used in the art and one skilled in the art knows the materials used for their production.
  • the spacer 12 is placed on the card 10, and the domes 16 are introduced by hand or by a laying machine. Then, the flexible element 20 and the panel 24 are put in place.
  • the spacer 12 is positioned on the card 10, and a sub-assembly formed of the adhesive film 18 and of the domes 16, previously produced, is applied to the spacer 12, before positioning the flexible element 20 and panel 24.
  • the disadvantages of each of these methods have been indicated in the introduction.
  • the problems posed by these known methods are resolved by making a sub-assembly as shown in one of FIGS. 2 to 5.
  • the sub-assembly shown in FIG. 2 includes the spacer 12, the adhesive film 18 and the domes 16 housed in the openings 14 of the spacer 12.
  • the method of manufacturing this sub-assembly does not correspond to the steps used for the manufacture of the assembly shown in FIG. 1.
  • the spacer optionally cut beforehand so that it has the openings 14, is provided with the adhesive film 18.
  • the film 18 and 1 spacer 12 are already associated before the formation of the openings 14 which are simply cut by blade punches, according to a well known technique.
  • the method includes the positioning, manual or by laying machines, of the domes 16 in the openings 14, the sub-assembly obviously having at this moment a position opposite to that which is shown in FIG. 2. In this way, the domes are glued by their top with adhesive film 18 and are held in position.
  • the adhesive film prefferably has, at the center of each opening, a hole which allows the film to be bonded to the domes over the entire periphery of the hole, so that the total bonding surface of the domes is increased.
  • slits can be formed in the film, in the part exposed by the openings, so that the film allows more movement of the domes glued to the film.
  • FIG. 3 represents another sub-assembly according to the invention.
  • This sub-assembly comprises, in addition to that of FIG. 2, an additional film 26 forming an electromagnetic screen.
  • This film can advantageously be formed from aluminized polyethylene terephthalate.
  • such an electromagnetic screen is formed by aluminizing one face of the film constituting the adhesive film 18, preferably before it is made adhesive.
  • Figures 4 and 5 show other sub-assemblies according to the invention. They correspond respectively to the sub-assemblies of FIGS. 2 and 3, with an additional element which is the flexible element 20 provided with the operating members 22.
  • This flexible element 20 is preferably glued to the adjacent film 18 or 26.
  • FIG. 6 represents an advantageous characteristic of the spacer 12 used in the sub-assembly of FIG. 2. It is noted, on this spacer 12, that the openings 14 intended to contain the domes are connected to each other by channels 22. From this manner, when a dome is inserted, the air contained in the corresponding opening 14, instead of resisting the depression of the dome, escapes towards the spaces of the adjacent openings 14 so that the overpressure is extremely reduced. It can even be canceled when, according to another variant, a channel 24 connects the interior space of the openings 14 to the exterior of the spacer.
  • the means for fixing the domes 16 are not constituted by an adhesive film, such as the film 18, but on the contrary are formed by wedging the domes or components 16 in the openings 12 of cylindrical shape of any cross section. This jamming can be ensured at the normal edges of the components 16 or on the contrary on specially provided parts on these components.
  • the components have a height less than the thickness of the spacer 12, and they are also wedged in the openings 14, which are not cylindrical, because they have appendages (arms or claws) formed especially for retaining the components on the spacer 12.
  • the components are integral with the spacer 12 and have their working face practically at the face of the spacer 12 intended to come into contact of the printed circuit board 10, or slightly projecting.
  • the invention relates to a new method of manufacturing electrical devices, in particular of keyboards, and a sub-assembly intended for the implementation of this method.
  • This sub-assembly has the advantage of being easily packaged and of avoiding delicate positioning steps during the manufacture of the electrical devices.

Abstract

The invention concerns the manufacture of electrical devices, in particular a method for manufacturing devices comprising a circuit card (10) and a panel (24) between which are arranged components (16) and a spacer (12) which maintains the card (10) distant from the panel (24) and having openings (14) at the locations of the components. The method includes making a subassembly comprising the spacer (12), the components (16) and a device for maintaining the components, such as an adhesive film (18), consisting of steps for making a spacer (12) and fixing each component (16) into an opening (14), then in setting the subassembly on the card (10). The invention is applicable to the manufacture of keyboards.

Description

Sous-ensemble et procédé de fabrication de dispositifs tels que des claviersSub-assembly and method for manufacturing devices such as keyboards
La présente invention concerne un procédé de fabrication de dispositifs électriques comprenant un certain nombre d'élé- ments empilés, et notamment de claviers de divers types, et des sous-ensembles utiles pour simplifier cette fabrication.The present invention relates to a method of manufacturing electrical devices comprising a number of stacked elements, and in particular of keyboards of various types, and sub-assemblies useful for simplifying this manufacture.
On décrit dans la suite 1 ' invention en référence à un clavier du type dans lequel des ressorts métalliques plats mais légèrement bombés, parfois appelés "dômes", sont desti- nés à réaliser des contacts électriques avec une carte de circuit imprimé. Cependant, l'invention n'est pas limitée à ces seuls dispositifs électriques, et elle peut s'appliquer à la fabrication d'autres dispositifs électriques dans lesquels des composants d'un seul ou de plusieurs types sont positionnés par rapport à une carte de circuit imprimé.The invention is described below with reference to a keyboard of the type in which flat but slightly domed metal springs, sometimes called "domes", are intended to make electrical contacts with a printed circuit board. However, the invention is not limited to these electrical devices alone, and it can be applied to the manufacture of other electrical devices in which components of one or more types are positioned relative to a circuit board. printed circuit board.
Les claviers à dômes comportent, comme éléments principaux, une carte de circuit imprimé sur laquelle est disposée une entretoise qui délimite des ouvertures destinées au logement des dômes constituant les contacts du clavier. Ces dômes sont métalliques alors que 1 ' entretoise est isolante. Un panneau de fermeture recouvre 1 ' entretoise, du côté opposé à la carte, et comporte soit des organes séparés de manoeuvre, tels que des touches, mobiles en translation dans le panneau de fermeture et destinés à exercer une pression sur les dômes, soit un élément flexible par l'intermédiaire duquel un doigt peut exercer une force sur un dôme placé au- dessous. Une partie conductrice spécifique de la carte de circuit imprimé, le dôme placé au-dessus dans une ouverture de 1 ' entretoise et une partie de manoeuvre guidée par le panneau de fermeture sont alignés en direction perpendiculaire a l'ensemble de l'empilement formé.The domes keyboards have, as main elements, a printed circuit board on which is placed a spacer which delimits openings intended for the housing of the domes constituting the contacts of the keyboard. These domes are metallic while the spacer is insulating. A closure panel covers one spacer, on the side opposite the card, and comprises either separate operating members, such as keys, movable in translation in the closure panel and intended to exert pressure on the domes, or a flexible element by means of which a finger can exert a force on a dome placed below. A specific conductive part of the printed circuit board, the dome placed above in an opening of the spacer and an operating part guided by the closure panel are aligned in a direction perpendicular to the entire stack formed.
Lors de la fabrication de ces claviers, on commence par positionner, sur la carte de circuit imprimé, l' entretoise qui assure ainsi un positionnement convenable des ouvertures par rapport aux trajets conducteurs de la carte de circuit imprimé. On place ensuite, manuellement ou par des machines spéciales, les composants sous forme de dômes dans les ouvertures nécessaires, puis on applique le panneau extérieur de fermeture afin de maintenir les dômes dans les ouvertures. Le panneau extérieur de fermeture est lui aussi positionné par rapport à 1 ' empilement afin que les organes de manoeuvre qu'il positionne (par exemple des touches séparées ou qui font partie d'un élément flexible dont les organes de manoeuvre portent des caractères alphanumériques) soient alignés sur les dômes.During the manufacture of these keyboards, one begins by positioning, on the printed circuit board, the spacer which thus ensures proper positioning of the openings relative to the conductive paths of the printed circuit board. The components are then placed, manually or by special machines, in the form of domes in the necessary openings, then the panel is applied exterior closure to maintain the domes in the openings. The outer closure panel is also positioned with respect to the stack so that the operating members which it positions (for example separate keys or which are part of a flexible element whose operating members carry alphanumeric characters) are aligned with the domes.
Le procédé précité présente un inconvénient dans la mesure où, lorsque les dômes ont été placés dans les ouver- tures de 1 ' entretoise, ils ne sont pas maintenus et le moindre choc peut provoquer leur sortie, partielle ou totale, des ouvertures.The above method has a drawback in that, when the domes have been placed in the openings of the spacer, they are not maintained and the slightest shock can cause them to exit, partially or completely, from the openings.
Pour remédier à 1 ' inconvénient précité et réduire la main d'oeuvre nécessaire, on a déjà placé les dômes sur une feuille adhésive de manière que tous les dômes d'un clavier, préalablement positionnés sur un film adhésif, soient simultanément logés dans les ouvertures de 1 ' entretoise déjà placée sur la carte de circuit imprimé. Le film adhésif est alors utilisé pratiquement sur toute sa surface, d'une part localement pour la retenue des composants et d'autre part, entre les composants, pour la fixation du film à l'entre- toise. En conséquence, les dômes doivent être placés sur le film adhésif lorsque celui-ci est totalement découvert. La manutention de ces films adhésifs est alors délicate. En effet, la face adhésive peut facilement coller n'importe où. En outre, compte tenu de la souplesse du film, le positionnement du film adhésif portant les dômes juste au-dessus des ouvertures de l' entretoise n'est pas commode. Il arrive qu'un déplacement en direction parallèle au plan de 1 'entre- toise pour le positionnement du film adhésif portant les dômes provoque l'arrachement d'un dôme du film adhésif, si bien que l'ensemble devient inutilisable. Cette opération délicate nécessite donc deux positionnements précis, d'une part le positionnement des dômes sur le film adhésif aux emplacements prévus pour les ouvertures de 1 ' entretoise, et d'autre part, le positionnement global du film adhésif portant les dômes sur 1 ' entretoise . Dans le cas du premier procédé précité, l'industriel qui assemble les claviers, s'il veut éliminer la main d'oeuvre de positionnement des dômes, doit s'équiper de machines spéciales de positionnement des dômes dans les ouvertures des entretoises. La variante précitée de procédé dans laquelle les dômes sont collés à un film adhésif lui permet de s'affranchir de cette contrainte et donc de ne pas utiliser ces machines de pose. Cependant, il doit alors utiliser un matériel spécial pour la pose du film adhésif souple portant les dômes en position bien définie par rapport à 1 ' entretoise .To remedy the aforementioned drawback and reduce the labor required, the domes have already been placed on an adhesive sheet so that all the domes of a keyboard, previously positioned on an adhesive film, are simultaneously housed in the openings 1 spacer already placed on the printed circuit board. The adhesive film is then used practically over its entire surface, on the one hand locally for retaining the components and on the other hand, between the components, for fixing the film to the spacer. Consequently, the domes must be placed on the adhesive film when it is completely uncovered. The handling of these adhesive films is then delicate. Indeed, the adhesive side can easily stick anywhere. In addition, given the flexibility of the film, the positioning of the adhesive film carrying the domes just above the openings of the spacer is not convenient. It sometimes happens that a movement in a direction parallel to the plane of the spacer for positioning the adhesive film carrying the domes causes a dome to be torn off from the adhesive film, so that the assembly becomes unusable. This delicate operation therefore requires two precise positions, on the one hand the positioning of the domes on the adhesive film at the locations provided for the openings of the spacer, and on the other hand, the overall positioning of the adhesive film carrying the domes on 1 ' spacer. In the case of the first aforementioned process, the industrialist who assembles the keyboards, if he wants to eliminate the manpower for positioning the domes, must be equipped with special machines for positioning the domes in the openings of the spacers. The aforementioned variant of the process in which the domes are glued to an adhesive film allows it to overcome this constraint and therefore not to use these laying machines. However, he must then use a special material for the installation of the flexible adhesive film carrying the domes in a well-defined position relative to the spacer.
L'invention a pour objet de remédier aux inconvénients des procédés précités et de permettre une augmentation des cadences de fabrication et une réduction du coût des dispo- sitifs électriques considérés, par exemple des claviers, par perfectionnement du procédé de fabrication. Ce perfectionnement comprend la réalisation d'un sous-ensemble qui ne comporte pas uniquement un film adhésif souple et des dômes, mais qui comporte en outre 1 ' entretoise, dans les ouvertures de laquelle sont positionnés les composants, et éventuellement un écran électromagnétique et/ou un élément flexible portant des organes de manoeuvre. Dans une variante, à la place du film adhésif, les composants sont retenus mécaniquement dans les ouvertures. Dans le mode de réalisation dans lequel les composants sont retenus dans les ouvertures de l' entretoise par un film adhésif, les problèmes de positionnement du film adhésif portant des dômes par rapport à une entretoise sont résolus car les dômes ne sont placés sur le film adhésif qu'après collage du film adhésif sur 1 ' entretoise . Le positionnement précis du film adhésif par rapport à 1 ' entretoise est donc tout à fait superflu, et il n'est pas possible que des dômes soient déplacés des ouvertures puisqu'ils sont posés directement un à un dans les ouvertures de l' entretoise et sont alors retenus directement.The object of the invention is to remedy the drawbacks of the abovementioned methods and to allow an increase in the production rates and a reduction in the cost of the electrical devices in question, for example keyboards, by improving the manufacturing process. This improvement includes the production of a sub-assembly which does not only comprise a flexible adhesive film and domes, but which also comprises the spacer, in the openings of which the components are positioned, and possibly an electromagnetic screen and / or a flexible element carrying operating members. Alternatively, in place of the adhesive film, the components are mechanically retained in the openings. In the embodiment in which the components are retained in the openings of the spacer by an adhesive film, the problems of positioning the adhesive film carrying domes with respect to a spacer are solved because the domes are not placed on the adhesive film only after gluing the adhesive film to the spacer. The precise positioning of the adhesive film with respect to the spacer is therefore entirely superfluous, and it is not possible for domes to be moved from the openings since they are placed directly one by one in the openings of the spacer and are then retained directly.
Plus précisément, l'invention concerne un procédé de fabrication de dispositifs électriques du type qui comporte une carte de circuit portant des trajets conducteurs de l'électricité et un panneau de fermeture, entre lesquels sont disposés des composants qui coopèrent avec des trajets conducteurs de la carte et qui peuvent être commandés par des organes de manoeuvre guidés par le panneau de fermeture, et une entretoise ayant des ouvertures aux emplacements des composants ; selon l'invention, le procédé comprend les étapes suivantes : la sélection de 1 ' entretoise afin qu'elle assure le maintien à distance de la carte et du panneau, la fabrication d'un sous-ensemble comprenant 1 ' entretoise, une partie au moins des composants et un dispositif de retenue de ces composants au moins en coopération avec 1 ' entretoise, puis la pose du sous-ensemble sur la carte, avec positionnement relatif de 1 ' entretoise et de la carte. De préférence, la fabrication du sous-ensemble comprend les étapes suivantes : la fabrication d'une entretoise ayant des ouvertures pour tous les composants, et la fixation d'une partie au moins des composants dans une ouverture chacun . Dans un mode de réalisation avantageux, l'étape de fabrication du sous-ensemble comprend la sélection d'une entretoise ayant une épaisseur qui correspond à 1 ' épaisseur des composants, la découpe des ouvertures dans 1 ' entretoise, le collage d'un film adhésif à une face de 1 ' entretoise, et l'introduction de composants dans certaines ouvertures au moins qui débouchent à 1 ' autre face afin que les composants introduits soient maintenus par collage au film adhésif.More specifically, the invention relates to a method for manufacturing electrical devices of the type which comprises a circuit board carrying electrically conductive paths and a closure panel, between which are arranged components which cooperate with conductive paths of the card and which can be controlled by operating members guided by the closure panel, and a spacer having openings at the locations of the components; according to the invention, the method comprises the following stages: the selection of the spacer so that it keeps the card and the panel at a distance, the manufacture of a sub-assembly comprising the spacer, a part at the least of the components and a device for retaining these components at least in cooperation with the spacer, then the fitting of the sub-assembly on the card, with relative positioning of the spacer and of the card. Preferably, the manufacture of the sub-assembly comprises the following stages: the manufacture of a spacer having openings for all the components, and the fixing of at least part of the components in an opening each. In an advantageous embodiment, the step of manufacturing the sub-assembly includes the selection of a spacer having a thickness which corresponds to the thickness of the components, the cutting of the openings in the spacer, the bonding of a film. adhesive to one side of the spacer, and the introduction of components into at least some openings which lead to the other side so that the components introduced are held by bonding to the adhesive film.
Dans un autre mode de réalisation, la fixation comprend la sélection d'une entretoise ayant une épaisseur au moins égale à l'épaisseur du plus épais des composants à introduire, la découpe des ouvertures dans 1 ' entretoise, l'introduction d'une partie des composants au moins dans 1 ' entretoise de manière que certains composants au moins soient retenus par coincement dans les ouvertures, et l'introduction des composants de sorte que leur face de coopération avec la carte se trouve au niveau de la surface de 1 ' entretoise . L'invention concerne aussi un sous-ensemble de dispositif électrique destiné à la mise en oeuvre d'un procédé selon l'une des paragraphes précédents, et qui comprend une entretoise ayant des ouvertures, et des composants logés dans une partie au moins des ouvertures et ne dépassant pratiquement pas de l'une ou l'autre face de 1 ' entretoise.In another embodiment, the fixing comprises the selection of a spacer having a thickness at least equal to the thickness of the thickest of the components to be introduced, the cutting of the openings in the spacer, the introduction of a part components at least in the spacer so that at least some components are retained by wedging in the openings, and the introduction of the components so that their face of cooperation with the card is at the surface of the spacer . The invention also relates to a sub-assembly of an electrical device intended for the implementation of a method according to one of the preceding paragraphs, and which comprises a spacer having openings, and components housed in at least part of the openings and practically not protruding from either side of the spacer.
Dans un mode de réalisation avantageux, l'épaisseur de 1 ' entretoise est sensiblement égale à la hauteur des composants, et le sous-ensemble comporte en outre un film adhésif collé à une face de 1 ' entretoise et retenant un composant par collage au film dans les ouvertures.In an advantageous embodiment, the thickness of the spacer is substantially equal to the height of the components, and the subassembly further comprises an adhesive film bonded to one face of the spacer and retaining a component by bonding to the film. in the openings.
De préférence, le film a une perforation au centre de la partie qui est en face d'une ouverture. Il est aussi avantageux que le film ait au moins une découpe linéaire dans la partie qui se trouve en face d'une ouverture.Preferably, the film has a perforation in the center of the part which is opposite an opening. It is also advantageous that the film has at least one linear cut in the part which is opposite an opening.
Dans un mode de réalisation avantageux, le sous- ensemble comporte en outre un écran électromagnétique. Cet écran peut être formé d'un film métallisé supplémentaire adjacent au film adhésif, ou par métallisation du film adhésif lui-même.In an advantageous embodiment, the subassembly further comprises an electromagnetic screen. This screen can be formed by an additional metallized film adjacent to the adhesive film, or by metallization of the adhesive film itself.
Dans un mode de réalisation très avantageux, certains composants au moins sont des dômes élastiques de clavier. Dans ce mode de réalisation, le sous-ensemble comporte de préférence un élément flexible incorporé au sous-ensemble du côté opposé au côté de 1 ' entretoise, l'élément flexible ayant au moins un organe de manoeuvre disposé en face d'une ouverture contenant un dôme élastique de clavier. De préférence, l'élément flexible comporte tous les organes de manoeuvre du clavier à réaliser.In a very advantageous embodiment, at least some components are elastic keyboard domes. In this embodiment, the sub-assembly preferably comprises a flexible element incorporated in the sub-assembly on the side opposite to the side of the spacer, the flexible element having at least one operating member disposed opposite an opening containing an elastic keyboard dome. Preferably, the flexible element comprises all of the keyboard operating members to be produced.
Il est avantageux que les ouvertures aient une forme cylindrique de section correspondant à la configuration du composant. Dans une variante, les ouvertures de l' entretoise ont une forme de section variable sur leur longueur de manière qu'elles coincent les composants dans une partie seulement . Il est aussi avantageux que 1 ' entretoise comporte des canaux reliant les ouvertures.It is advantageous that the openings have a cylindrical shape of section corresponding to the configuration of the component. In a variant, the openings of the spacer have a shape of variable section along their length so that they wedge the components in only one part. It is also advantageous for the spacer to have channels connecting the openings.
De préférence, l' entretoise comporte un dispositif de positionnement destiné à coopérer avec un dispositif complé- mentaire de positionnement d'une carte de circuit portant des trajets conducteurs de l'électricité.Preferably, the spacer comprises a positioning device intended to cooperate with an additional positioning device for a circuit board carrying electrically conductive paths.
D'autres caractéristiques et avantages de l'invention ressortiront mieux de la description qui va suivre d'un exemple de réalisation, faite en référence aux dessins annexés sur lesquels : la figure 1 représente une coupe d'un dispositif électrique tel qu'un clavier à dômes ; la figure 2 représente une coupe d'un sous-ensemble selon l'invention ; la figure 3 représente une coupe d'un autre sous- ensemble selon l'invention, comportant un élément supplémentaire ; la figure 4 représente une coupe d'un autre sous- ensemble selon l'invention, comportant un élément de plus que le sous-ensemble de la figure 2 ; la figure 5 représente une coupe d'un autre sous- ensemble selon l'invention, comportant un élément de plus que le sous-ensemble de la figure 3 ; et la figure 6 est une vue en plan d'un exemple d 'entre- toise utile pour la mise en oeuvre de l'invention.Other characteristics and advantages of the invention will emerge more clearly from the description which follows of an exemplary embodiment, made with reference to the appended drawings in which: FIG. 1 represents a section of an electrical device such as a keyboard domes; Figure 2 shows a section through a sub-assembly according to the invention; FIG. 3 represents a section of another sub-assembly according to the invention, comprising an additional element; FIG. 4 represents a section of another sub-assembly according to the invention, comprising one more element than the sub-assembly of FIG. 2; FIG. 5 represents a section of another sub-assembly according to the invention, comprising one more element than the sub-assembly of FIG. 3; and FIG. 6 is a plan view of an example of a spacer useful for implementing the invention.
La figure 1 représente une coupe schématique d'un clavier comprenant des dômes de contact. Sur la figure 1, la référence 10 désigne une carte de circuit imprimé ayant, à sa face supérieure sur la figure 1, un dessin de trajets conducteurs destiné à être relié par exemple à un connecteur placé au bord de la carte 10. Cette carte 10 est formée de tout matériau classique, par exemple d'un substrat de résine époxyde chargée de fibres de verre, bien que toute autre carte de circuit imprimé, de type simple face ou double face par exemple, puisse être utilisée.FIG. 1 represents a diagrammatic section of a keyboard comprising contact domes. In FIG. 1, the reference 10 designates a printed circuit board having, on its upper face in FIG. 1, a drawing of conductive paths intended to be connected for example to a connector placed at the edge of the card 10. This card 10 is formed of any conventional material, for example an epoxy resin substrate loaded with glass fibers, although any other printed circuit board, of single-sided or double-sided type for example, can be used.
Une entretoise 12 est disposée à plat sur la face supérieure de la carte 10. Cette entretoise 12 a des ouvertures 14 correspondant aux composants à placer, c'est- à-dire des dômes dans l'exemple considéré. Cette entretoise 12 doit simplement déterminer une épaisseur qui correspond à l'épaisseur des dômes 16. Elle est isolante de l'élec- tricité et de préférence pratiquement rigide, pour assurer l'espacement du circuit imprimé et des organes de manoeuvre, mais elle peut cependant avoir une certaine souplesse . De préférence, il s'agit d'un carton imperméabilisé et traité de manière qu'il soit imputrescible, mais elle peut aussi être constituée de toute matière plastique convenable.A spacer 12 is disposed flat on the upper face of the card 10. This spacer 12 has openings 14 corresponding to the components to be placed, that is to say domes in the example considered. This spacer 12 must simply determine a thickness which corresponds to the thickness of the domes 16. It is electrically insulating and preferably practically rigid, to ensure the spacing of the printed circuit and the operating members, but it can however have some flexibility. Preferably, it is a waterproof cardboard and treated so that it is rot-proof, but it can also be made of any suitable plastic material.
La figure 6 représente un exemple avantageux d'entre- toise 12, décrite dans la suite.FIG. 6 represents an advantageous example of spacer 12, described below.
Des dômes 16 sont placés dans les ouvertures 14. Il s ' agit avantageusement des dômes du type décrit dans la demande de brevet international n° WO-96/20799. Ces dômes sont particulièrement avantageux dans la mesure où ils ne peuvent pas se coller. Il peut s'agir de dômes circulaires, à plusieurs branches, etc., ayant un trou ou une saillie en position centrale, ou de toute autre réalisation. On a représenté un film 18 collé à 1 ' entretoise 12 et au sommet des dômes 16 sur la figure 1, bien que ce film ne soit pas indispensable. On l'a indiqué car il est représentatif du procédé dans lequel les dômes 16 sont collés au film adhésif 18 avant introduction des dômes dans 1 'entre- toise 12, selon le procédé précité qui pose le problème indiqué dans l'introduction.Domes 16 are placed in the openings 14. These are advantageously domes of the type described in international patent application No. WO-96/20799. These domes are particularly advantageous insofar as they cannot stick. They may be circular domes, with several branches, etc., having a hole or a projection in the central position, or any other embodiment. A film 18 has been shown glued to the spacer 12 and at the top of the domes 16 in FIG. 1, although this film is not essential. This has been indicated because it is representative of the process in which the domes 16 are glued to the adhesive film 18 before the domes are introduced into the spacer 12, according to the above-mentioned process which poses the problem indicated in the introduction.
L'ensemble comporte ensuite un panneau de fermeture 24, qui guide des organes de manoeuvre 22 d'un élément flexible 20 qui portent des inscriptions, par exemple des chiffres, correspondant à la fonction du dôme 16 placé au-dessous. Des parties souples placées au-dessus des dômes forment ainsi des "organes de manoeuvre" .The assembly then comprises a closure panel 24, which guides the operating members 22 of a flexible element 20 which bear inscriptions, for example figures, corresponding to the function of the dome 16 placed below. Flexible parts placed above the domes thus form "operating devices".
Le film 18 est avantageusement un film adhésif connu, par exemple à support de polyester ou de téréphtalate de polyéthylène, et l'élément flexible 20 est par exemple formé d'un élastomère. L'élément flexible 20, dont les organes de manoeuvre 22 ont une couche d'impression portant les indications, telles que des caractères alphanumériques, est retenu à la face intérieure d'un simple panneau de fermeture 24. Le panneau 24 est de préférence formé d'une matière plastique dure résistant aux chocs. De tels panneau et élément flexible sont déjà utilisés dans la technique et 1 ' homme du métier connaît les matériaux mis en oeuvre pour leur réalisation.The film 18 is advantageously a known adhesive film, for example with a polyester or polyethylene terephthalate support, and the flexible element 20 is for example formed of an elastomer. The flexible element 20, the operating members 22 of which have a printing layer carrying the indications, such as alphanumeric characters, is retained on the inner face of a simple closure panel 24. The panel 24 is preferably formed from a hard impact-resistant plastic. Such a panel and flexible element are already used in the art and one skilled in the art knows the materials used for their production.
Les caractéristiques qu'on vient de décrire sont connues pour l'essentiel, et il en existe de nombreuses variantes. Dans le procédé classique de fabrication, 1 ' entretoise 12 est placée sur la carte 10, et les dômes 16 sont introduits à la main ou par une machine de pose. Ensuite, l'élément flexible 20 et le panneau 24 sont mis en place . Dans une variante de procédé, 1 ' entretoise 12 est positionnée sur la carte 10, et un sous-ensemble formé du film adhésif 18 et des dômes 16, préalablement réalisé, est appliqué sur 1 ' entretoise 12, avant positionnement de l'élément flexible 20 et du panneau 24. On a indiqué dans l'introduction les inconvénients de chacun de ces procédés.The features just described are known for the most part, and there are many variations. In the conventional manufacturing process, the spacer 12 is placed on the card 10, and the domes 16 are introduced by hand or by a laying machine. Then, the flexible element 20 and the panel 24 are put in place. In a variant of the process, the spacer 12 is positioned on the card 10, and a sub-assembly formed of the adhesive film 18 and of the domes 16, previously produced, is applied to the spacer 12, before positioning the flexible element 20 and panel 24. The disadvantages of each of these methods have been indicated in the introduction.
Selon l'invention, les problèmes posés par ces procédés connus sont résolus par réalisation d'un sous-ensemble tel que représenté sur l'une des figures 2 à 5. On note que le sous-ensemble représenté sur la figure 2 comporte l' entretoise 12, le film adhésif 18 et les dômes 16 logés dans les ouvertures 14 de l' entretoise 12. Le procédé de fabrication de ce sous-ensemble ne correspond pas aux étapes utilisées pour la fabrication de l'ensemble représenté sur la figure 1. En effet, lors de la fabrication du sous-ensemble de la figure 2, 1 ' entretoise, éventuellement préalablement découpée afin qu'elle possède les ouvertures 14, est munie du film adhésif 18. Dans un mode de réalisation avantageux, le film 18 et 1 ' entretoise 12 sont déjà associés avant la formation des ouvertures 14 qui sont simplement découpées par des poinçons à lames, selon une technique bien connue. Ensuite, le procédé comprend le positionnement, manuel ou par des machines de pose, des dômes 16 dans les ouvertures 14, le sous-ensemble ayant évidemment à ce moment une position inverse de celle qui est représentée sur la figure 2. De cette manière, les dômes sont collés par leur sommet au film adhésif 18 et sont maintenus en position.According to the invention, the problems posed by these known methods are resolved by making a sub-assembly as shown in one of FIGS. 2 to 5. It is noted that the sub-assembly shown in FIG. 2 includes the spacer 12, the adhesive film 18 and the domes 16 housed in the openings 14 of the spacer 12. The method of manufacturing this sub-assembly does not correspond to the steps used for the manufacture of the assembly shown in FIG. 1. In fact, during the manufacture of the sub-assembly of FIG. 2, the spacer, optionally cut beforehand so that it has the openings 14, is provided with the adhesive film 18. In an advantageous embodiment, the film 18 and 1 spacer 12 are already associated before the formation of the openings 14 which are simply cut by blade punches, according to a well known technique. Then, the method includes the positioning, manual or by laying machines, of the domes 16 in the openings 14, the sub-assembly obviously having at this moment a position opposite to that which is shown in FIG. 2. In this way, the domes are glued by their top with adhesive film 18 and are held in position.
Il est avantageux que le film adhésif comporte, au centre de chaque ouverture, un trou qui permet un collage du film sur les dômes sur toute la périphérie du trou, si bien que la surface totale de collage des dômes est accrue. En outre, des fentes peuvent être formées dans le film, dans la partie exposée par les ouvertures, afin que le film permette des mouvements plus amples des dômes collés au film.It is advantageous for the adhesive film to have, at the center of each opening, a hole which allows the film to be bonded to the domes over the entire periphery of the hole, so that the total bonding surface of the domes is increased. In addition, slits can be formed in the film, in the part exposed by the openings, so that the film allows more movement of the domes glued to the film.
La figure 3 représente un autre sous-ensemble selon l'invention. Ce sous-ensemble comporte, en plus de celui de la figure 2, un film supplémentaire 26 formant un écran électromagnétique. Ce film peut avantageusement être formé de téréphtalate de polyéthylène aluminisé . Dans une variante non représentée, un tel écran électromagnétique est formé par aluminisation d'une face du film constituant le film adhésif 18, de préférence avant qu'il ne soit rendu adhésif.FIG. 3 represents another sub-assembly according to the invention. This sub-assembly comprises, in addition to that of FIG. 2, an additional film 26 forming an electromagnetic screen. This film can advantageously be formed from aluminized polyethylene terephthalate. In a variant not shown, such an electromagnetic screen is formed by aluminizing one face of the film constituting the adhesive film 18, preferably before it is made adhesive.
Les figures 4 et 5 représentent d'autres sous-ensembles selon l'invention. Ils correspondent respectivement aux sous-ensembles des figures 2 et 3 , avec un élément supplé- mentaire qui est l'élément flexible 20 muni des organes de manoeuvre 22. Cet élément flexible 20 est de préférence collé sur le film adjacent 18 ou 26.Figures 4 and 5 show other sub-assemblies according to the invention. They correspond respectively to the sub-assemblies of FIGS. 2 and 3, with an additional element which is the flexible element 20 provided with the operating members 22. This flexible element 20 is preferably glued to the adjacent film 18 or 26.
La figure 6 représente une caractéristique avantageuse de l' entretoise 12 utilisée dans le sous-ensemble de la figure 2. On note, sur cette entretoise 12, que les ouvertures 14 destinées à contenir les dômes sont reliées mutuellement par des canaux 22. De cette manière, lorsqu'un dôme est enfoncé, l'air contenu dans l'ouverture correspondante 14, au lieu de résister à l'enfoncement du dôme, s'échappe vers les espaces des ouvertures adjacentes 14 si bien que la surpression est extrêmement réduite. Elle peut même être annulée lorsque, selon une autre variante, un canal 24 relie l'espace intérieur des ouvertures 14 à l'extérieur de 1 ' entretoise .FIG. 6 represents an advantageous characteristic of the spacer 12 used in the sub-assembly of FIG. 2. It is noted, on this spacer 12, that the openings 14 intended to contain the domes are connected to each other by channels 22. From this manner, when a dome is inserted, the air contained in the corresponding opening 14, instead of resisting the depression of the dome, escapes towards the spaces of the adjacent openings 14 so that the overpressure is extremely reduced. It can even be canceled when, according to another variant, a channel 24 connects the interior space of the openings 14 to the exterior of the spacer.
On a décrit, en référence aux figures 2 à 5, des sous- ensembles dans lesquels les dômes 16 ont une hauteur corres- pondant à l'épaisseur de l' entretoise 12 et sont maintenus par un film adhésif 18. Dans un autre mode de réalisation, les moyens de fixation des dômes 16 ne sont pas constitués par un film adhésif, tel que le film 18, mais sont au contraire constitués par coincement des dômes ou composants 16 dans les ouvertures 12 de forme cylindrique de section quelconque. Ce coincement peut être assuré aux bords normaux des composants 16 ou au contraire sur des parties spécialement prévues sur ces composants.With reference to FIGS. 2 to 5, sub-assemblies have been described in which the domes 16 have a height corresponding to the thickness of the spacer 12 and are held by an adhesive film 18. In another embodiment of embodiment, the means for fixing the domes 16 are not constituted by an adhesive film, such as the film 18, but on the contrary are formed by wedging the domes or components 16 in the openings 12 of cylindrical shape of any cross section. This jamming can be ensured at the normal edges of the components 16 or on the contrary on specially provided parts on these components.
Dans une autre variante, les composants ont une hauteur inférieure à l'épaisseur de l' entretoise 12, et ils sont aussi coincés dans les ouvertures 14, qui ne sont pas cylindriques, parce qu'ils possèdent des appendices (bras ou griffes) formés spécialement pour la retenue des composants sur l' entretoise 12. La seule condition est que les compo- sants soient solidarisés de 1 ' entretoise 12 et aient leur face de travail pratiquement au niveau de la face de 1 ' entretoise 12 destinée à venir au contact de la carte 10 de circuit imprimé, ou légèrement en saillie.In another variant, the components have a height less than the thickness of the spacer 12, and they are also wedged in the openings 14, which are not cylindrical, because they have appendages (arms or claws) formed especially for retaining the components on the spacer 12. The only condition is that the components are integral with the spacer 12 and have their working face practically at the face of the spacer 12 intended to come into contact of the printed circuit board 10, or slightly projecting.
Ainsi, l'invention concerne un nouveau procédé de fabrication de dispositifs électriques, notamment de claviers, et un sous-ensemble destiné à la mise en oeuvre de ce procédé. Ce sous-ensemble présente l'avantage de pouvoir être facilement conditionné et d'éviter des étapes de positionnement délicates lors de la fabrication des dispo- sitifs électriques.Thus, the invention relates to a new method of manufacturing electrical devices, in particular of keyboards, and a sub-assembly intended for the implementation of this method. This sub-assembly has the advantage of being easily packaged and of avoiding delicate positioning steps during the manufacture of the electrical devices.
Il est bien entendu que l'invention n'a été décrite et représentée qu'à titre d'exemple préférentiel et qu'on pourra apporter toute équivalence technique dans ses éléments constitutifs sans pour autant sortir de son cadre. It is understood that the invention has only been described and shown as a preferential example and that any technical equivalence may be made in its constituent elements without going beyond its ambit.

Claims

REVENDICATIONS
1. Procédé de fabrication de dispositifs électriques du type qui comporte une carte (10) de circuit portant des trajets conducteurs de l'électricité et un panneau (24) de fermeture, entre lesquels sont disposés des composants (16) qui coopèrent avec des trajets conducteurs de la carte et qui peuvent être commandés par des organes de manoeuvre guidés par le panneau de fermeture, et une entretoise (12) ayant des ouvertures (14) aux emplacements des composants, le procédé étant caractérisé en ce qu'il comprend les étapes suivantes :1. A method of manufacturing electrical devices of the type which comprises a circuit board (10) carrying electrically conductive paths and a closure panel (24), between which are arranged components (16) which cooperate with paths card conductors which can be controlled by actuators guided by the closure panel, and a spacer (12) having openings (14) at the locations of the components, the method being characterized in that it comprises the steps following:
- la sélection de l' entretoise (12) afin qu'elle assure le maintien à distance de la carte (10) et du panneau (24) ,- selecting the spacer (12) so that it keeps the card (10) and the panel (24) at a distance,
- la fabrication d'un sous-ensemble comprenant 1 'entre- toise (12) , une partie au moins des composants (16) et un dispositif de retenue de ces composants au moins en coopération avec 1 ' entretoise, puisthe manufacture of a sub-assembly comprising the spacer (12), at least part of the components (16) and a device for retaining these components at least in cooperation with the spacer, then
- la pose du sous-ensemble sur la carte (10) , avec positionnement relatif de l' entretoise et de la carte. - the installation of the sub-assembly on the card (10), with relative positioning of the spacer and the card.
2. Procédé selon la revendication 1, caractérisé en ce que l'étape de fabrication du sous-ensemble comprend la sélection d'une entretoise (12) ayant une épaisseur qui correspond à l'épaisseur des composants (16), la découpe des ouvertures (14) dans l' entretoise (12) et le collage d'un film adhésif (18) à une face de l'entretoise (12), puis l'introduction de composants (16) dans certaines ouvertures (14) au moins qui débouchent à l'autre face afin que les composants introduits (16) soient maintenus par collage au film adhésif (18) . 2. Method according to claim 1, characterized in that the manufacturing step of the sub-assembly comprises the selection of a spacer (12) having a thickness which corresponds to the thickness of the components (16), the cutting of the openings (14) in the spacer (12) and gluing an adhesive film (18) to one face of the spacer (12), then the introduction of components (16) in at least some openings (14) which open on the other side so that the components introduced (16) are held by bonding to the adhesive film (18).
3. Sous-ensemble de dispositif électrique destiné à la mise en oeuvre d'un procédé selon l'une des revendications 1 et 2 , caractérisé en ce qu'il comprend :3. Sub-assembly of an electrical device intended for the implementation of a method according to one of claims 1 and 2, characterized in that it comprises:
- une entretoise (12) ayant des ouvertures (14) , et- a spacer (12) having openings (14), and
- des composants (16) logés dans une partie au moins des ouvertures (14) et ne dépassant pratiquement pas de l'une ou l'autre face de l'entretoise (12). - components (16) housed in at least part of the openings (14) and practically not projecting from either side of the spacer (12).
4. Sous-ensemble selon la revendication 3, caractérisé en ce que l'épaisseur de l'entretoise (12) est sensiblement égale à la hauteur des composants (16) , et le sous-ensemble comporte en outre un film adhésif (18) collé à une face de l'entretoise (12) et retenant un composant (16) par collage au film (18) dans les ouvertures (12) .4. Sub-assembly according to claim 3, characterized in that the thickness of the spacer (12) is substantially equal to the height of the components (16), and the sub-assembly further comprises an adhesive film (18) glued to one face of the spacer (12) and retaining a component (16) by gluing to the film (18) in the openings (12).
5. Sous-ensemble selon l'une des revendications 3 et 4, caractérisé en ce qu'il comporte en outre un écran électromagnétique . 5. Sub-assembly according to one of claims 3 and 4, characterized in that it further comprises an electromagnetic screen.
6. Sous-ensemble selon la revendication 5, caractérisé en ce que l'écran électromagnétique est formé d'un film métallisé supplémentaire adjacent au film adhésif.6. Sub-assembly according to claim 5, characterized in that the electromagnetic screen is formed of an additional metallized film adjacent to the adhesive film.
7. Sous-ensemble selon la revendication 5, caractérisé en ce que l'écran électromagnétique est formé d'une métallisation du film adhésif.7. Sub-assembly according to claim 5, characterized in that the electromagnetic screen is formed from a metallization of the adhesive film.
8. Sous-ensemble selon l'une quelconque des revendications 3 à 7, caractérisé en ce que certains composants (16) au moins sont des dômes élastiques de clavier.8. Subassembly according to any one of claims 3 to 7, characterized in that certain components (16) at least are elastic keyboard domes.
9. Sous-ensemble selon la revendication 8, caractérisé en ce qu'il comporte en outre un élément flexible incorporé au sous-ensemble du côté opposé au côté de l'entretoise, l'élément flexible ayant au moins un organe de manoeuvre disposé en face d'une ouverture contenant un dôme élastique de clavier. 9. Sub-assembly according to claim 8, characterized in that it further comprises a flexible element incorporated in the sub-assembly on the side opposite to the side of the spacer, the flexible element having at least one operating member disposed in face of an opening containing an elastic keyboard dome.
10. Sous-ensemble selon l'une quelconque des revendications 4 à 7, caractérisé en ce que l'entretoise (12) comporte un dispositif de positionnement destiné à coopérer avec un dispositif complémentaire de positionnement d'une carte (10) de circuit portant des trajets conducteurs de l'électricité. 10. Sub-assembly according to any one of claims 4 to 7, characterized in that the spacer (12) comprises a positioning device intended to cooperate with an additional device for positioning a card (10) of the carrying circuit conductive paths of electricity.
PCT/FR1998/000711 1997-04-11 1998-04-08 Subassembly and method for making devices such as keyboards WO1998047162A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR97/04503 1997-04-11
FR9704503A FR2762134B1 (en) 1997-04-11 1997-04-11 SUB-ASSEMBLY AND METHOD FOR MANUFACTURING DEVICES SUCH AS KEYBOARDS

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2793345A1 (en) * 1999-05-05 2000-11-10 Nicomatic METHOD OF MANUFACTURING SUB-ASSEMBLIES OF ELECTRICAL DEVICES, AND RUNNING-IN AND TESTING MACHINE FOR SUCH SUB-ASSEMBLIES

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4417588B2 (en) * 2001-06-07 2010-02-17 株式会社フジクラ Metal dome sheet

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153987A (en) * 1974-12-09 1979-05-15 Texas Instruments Incorporated Method for assembling keyboard
US4439647A (en) * 1982-07-14 1984-03-27 Nick Calandrello Touchpad keyboard
WO1996020799A1 (en) * 1995-01-04 1996-07-11 Nicomatic Method for making flat components, and resulting flat components

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153987A (en) * 1974-12-09 1979-05-15 Texas Instruments Incorporated Method for assembling keyboard
US4439647A (en) * 1982-07-14 1984-03-27 Nick Calandrello Touchpad keyboard
WO1996020799A1 (en) * 1995-01-04 1996-07-11 Nicomatic Method for making flat components, and resulting flat components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2793345A1 (en) * 1999-05-05 2000-11-10 Nicomatic METHOD OF MANUFACTURING SUB-ASSEMBLIES OF ELECTRICAL DEVICES, AND RUNNING-IN AND TESTING MACHINE FOR SUCH SUB-ASSEMBLIES
WO2000068964A1 (en) * 1999-05-05 2000-11-16 Nicomatic Method for making subassemblies of electrical devices and burn-in and testing machine for same

Also Published As

Publication number Publication date
FR2762134B1 (en) 1999-06-18
FR2762134A1 (en) 1998-10-16

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