WO1998031075B1 - High density connector arrangement for a circuit board module - Google Patents
High density connector arrangement for a circuit board moduleInfo
- Publication number
- WO1998031075B1 WO1998031075B1 PCT/US1998/000032 US9800032W WO9831075B1 WO 1998031075 B1 WO1998031075 B1 WO 1998031075B1 US 9800032 W US9800032 W US 9800032W WO 9831075 B1 WO9831075 B1 WO 9831075B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- contact tails
- arrangement
- heatsink
- inserts
- Prior art date
Links
- 210000000538 Tail Anatomy 0.000 claims abstract 23
- 230000023298 conjugation with cellular fusion Effects 0.000 claims 4
- 230000013011 mating Effects 0.000 claims 4
- 230000021037 unidirectional conjugation Effects 0.000 claims 4
Abstract
A circuit board module includes a plurality of high density edge connectors (11, 12) in which the contacts are arranged in rows, with contact tails (13) extending from the connectors (11, 12) for electrical connection to a circuit board (8, 9) carrying electrical components. Instead of terminating the contacts directly to pads or terminals on the principal surface of the circuit board on which the electrical components are situated, the contact tails are terminated to pads or terminals on pairs of intermediate circuit boards (14, 15) each providing two termination surfaces rather than one, thereby effectively doubling the space available for termination. The intermediate circuit boards (14, 15) are connected to the main circuit board (8, 9) by a rigid-flex interconnection,(16, 17) thus facilitating assembly of the connectors to a heat sink (10) or frame of the circuit board following termination of the contact tails to the intermediate circuit boards.
Claims
1. An arrangement for electrically connecting a plurality of contact tails to components on a circuit board, wherein the circuit board comprises a rigid main circuit board on one surface of which is mounted electronic components, comprising: a rigid intermediate circuit board having two oppositely facing principal surfaces, a first group of said contact tails being terminated to a first of said two surfaces and a second group of said contact tails being terminated to a second of said two surfaces; and a flexible section extending between said main circuit board and said intermediate circuit board for electrically interconnecting said contact tails in each of said two groups with said components on said one surface of the main circuit board.
2. An arrangement as claimed in claim 1 , wherein said contact tails are terminated to said intermediate circuit board by surface mounting.
3. An arrangement as claimed in claim 1 , further comprising a second main circuit board having one surface to which electronic components are mounted, a second intermediate circuit board having two principal surfaces to which contact tails are terminated, a second flexible section between said second main circuit board and said second intermediate circuit board, and a heatsink sandwiched between said first and second main circuit boards.
4. An arrangement as claimed in claim 3, wherein said contact tails extend from contacts positioned within passages in dielectric inserts of electrical connectors.
29
5. An arrangement as claimed in claim 4, wherein said contact tails extend eccentrically from said contacts such that pairs of upper and lower contact tails are nearly planar.
6. An arrangement as claimed in claim 4, wherein said dielectric inserts include extensions having slots for guiding said intermediate circuit boards between rows of upper and lower contact tails.
7. An arrangement as claimed in claim 6, wherein an upper surface of an extension on a lower one of said inserts faces a lower surface on an extension of an upper one of said inserts to sandwich said heatsink when said upper insert is moved vertical relative to said lower insert.
8. An arrangement as claimed in claim 7, further comprising an electrostatic discharge shield surrounding top, side, and front surfaces of said inserts.
9. An arrangement as claimed in claim 8, further comprising upper and lower shell blocks positioned such that flanges on said shell blocks capture said extensions of the dielectric inserts and flanges on said shields and lock the inserts and shields to the heatsink when the shell blocks are fastened to the heatsink.
10. An arrangement as claimed in claim 9, further comprising a cover secured to said shell blocks for enclosing said circuit boards and forming an electronic circuit board module for mounting in a rack, said connectors being arranged to mate with mating connectors on a backplane of said
30
rack.
1 1 . An arrangement as claimed in claim 10, wherein shell blocks ground said cover and said shields to said heatsink, and wherein forces on said contacts during mating are transmitted through said inserts and shell blocks to said heatsink.
12. An arrangement as claimed in claim 10, further comprising pockets in one of said shell blocks for containing keying members, and openings for including guide pins for securing said connectors of said module to said mating connectors, said guide pins also being grounded to said heatsink via said shell blocks.
13. An arrangement as claimed in claim 10, wherein said module is an SEM-E standard circuit board module.
14. An arrangement as claimed in claim 7, further comprising upper and lower shell blocks positioned such that flanges on said shell blocks capture said extensions of the dielectric inserts and lock the inserts to the heatsink when the shell blocks are fastened to the heatsink.
15. An arrangement as claimed in claim 4, further comprising an electrostatic discharge shield surrounding top, side, and front surfaces of said inserts.
16. An arrangement as claimed in claim 15, further comprising upper and lower shell blocks positioned such that flanges on said shell blocks
31
capture said extensions of the dielectric inserts and flanges on said shields and lock the inserts and shields to the heatsink when the shell blocks are fastened to the heatsink.
17. A method of electrically connecting contact tails to a main circuit board having one surface on which electronic components are mounted, comprising the step of: terminating a first group of the contact tails to a first principal surface of an intermediate circuit board and terminating a second group of the contact tails to a second principal surface of the intermediate circuit board, said intermediate circuit board being connected to the main circuit board by a flexible interconnecting section, whereby said contact tails of said first and second groups are thereby electrically interconnected with said electronic components on said one surface of the main circuit board.
18. A method as claimed in claim 17, wherein the step of electrically connecting the contact tails comprises the step of surface mounting the contact tails on said opposite side of the circuit board.
19. A method as claimed in claim 18, further comprising the steps of positioning contacts to which the contact tails are attached in openings in a dielectric insert of a connector, and positioning the intermediate circuit board in a slot in said insert during electrical connection of the contact tails to the opposite sides of the intermediate circuit board.
20. A method as claimed in claim 19, further comprising the step of
32
terminating additional rows of contact tails attached to contacts positioned in openings in a second dielectric insert to opposite sides of a second intermediate circuit board connected to a second main circuit board by a second flexible interconnection section, said first and second main circuit board sandwiching a planar heatsink.
21. A method as claimed in claim 20, further comprising the step of vertical moving said first and second dielectric inserts towards each other following termination of the contact tails to said intermediate circuit boards.
22. A method as claimed in claim 21 , further comprising the step of fitting an electrostatic discharge shield over said dielectric members after said dielectric members have been brought together.
23. A method as claimed in claim 22, further comprising the steps of positioning the shell blocks such that extensions of said dielectric members capture and flanges on said shield against said heat sink, and subsequently fastening said shell blocks to said heatsink.
24. A method as claimed in claim 23, further comprising the step of attaching cover members to said shell blocks to form a circuit board module arranged to be mounted within a rack, with said connector being arranged to mate with a mating connector on a backplane of said rack.
33
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA002248712A CA2248712C (en) | 1997-01-13 | 1998-01-13 | High density connector arrangement for a circuit board module |
| DE69834606T DE69834606T2 (en) | 1997-01-13 | 1998-01-13 | CONNECTOR ASSEMBLY HIGH PACKING DENSITY FOR A PCB MODULE |
| EP98902384A EP0902990B1 (en) | 1997-01-13 | 1998-01-13 | High density connector arrangement for a circuit board module |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/782,792 | 1997-01-13 | ||
| US08/782,792 US5947753A (en) | 1997-01-13 | 1997-01-13 | High density connector arrangement for a circuit board module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO1998031075A1 WO1998031075A1 (en) | 1998-07-16 |
| WO1998031075B1 true WO1998031075B1 (en) | 1998-10-01 |
Family
ID=25127195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1998/000032 WO1998031075A1 (en) | 1997-01-13 | 1998-01-13 | High density connector arrangement for a circuit board module |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5947753A (en) |
| EP (1) | EP0902990B1 (en) |
| CA (1) | CA2248712C (en) |
| DE (1) | DE69834606T2 (en) |
| WO (1) | WO1998031075A1 (en) |
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| JP2000068007A (en) | 1998-08-20 | 2000-03-03 | Fujitsu Takamisawa Component Ltd | Connector for balanced transmission with cable |
| DE19859228C1 (en) * | 1998-12-21 | 2000-06-21 | Siemens Nixdorf Banking Syst | Pluggable circuit board with movable plug contact arrangement |
| US6450822B1 (en) * | 1999-06-01 | 2002-09-17 | Rockwell Collins, Inc. | System and method for electrically and mechanically coupling an avionics line replaceable unit with electronic equipment |
| TW452235U (en) * | 2000-09-29 | 2001-08-21 | Hon Hai Prec Ind Co Ltd | Connection device of electronic card |
| FR2816066B1 (en) * | 2000-10-26 | 2003-01-03 | Framatome Connectors Int | ELECTRO-OPTICAL CONNECTION MODULE |
| JP3437837B2 (en) * | 2001-02-02 | 2003-08-18 | 株式会社東芝 | Flexible printed circuit board connector, head actuator provided with the same, and magnetic disk drive |
| US6419502B1 (en) * | 2001-03-14 | 2002-07-16 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector assembly with improved contact arrangement |
| US7073955B1 (en) | 2001-09-17 | 2006-07-11 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
| US7073954B1 (en) | 2001-09-17 | 2006-07-11 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
| US7056032B2 (en) * | 2001-09-17 | 2006-06-06 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
| US6842325B2 (en) * | 2001-09-19 | 2005-01-11 | Square D Company | Flexible circuit adhered to metal frame of device |
| US6674644B2 (en) * | 2001-11-01 | 2004-01-06 | Sun Microsystems, Inc. | Module and connector having multiple contact rows |
| US6549424B1 (en) | 2002-02-28 | 2003-04-15 | Garmin Ltd. | Electronic equipment module mounting apparatus and method |
| US7008233B1 (en) | 2002-02-28 | 2006-03-07 | Garmin, Ltd. | Retractable panel interface cable device and method |
| US7473931B1 (en) | 2002-02-28 | 2009-01-06 | Garmin International, Inc. | System and method for mounting units for an avionic display |
| US6589061B1 (en) * | 2002-03-07 | 2003-07-08 | Hon Hai Precision Ind. Co., Ltd. | Printed circuit board for straddle mount electrical connector and method for pasting the same |
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| CN1318823C (en) * | 2002-09-20 | 2007-05-30 | 矢崎总业株式会社 | Dial module, manufacturing method thereof, LED display element, display module, movement module, connector module, and meter using them |
| DE10261410B4 (en) * | 2002-12-30 | 2008-09-04 | Qimonda Ag | Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement |
| US7248455B2 (en) * | 2003-10-31 | 2007-07-24 | International Business Machines Corporation | Method and apparatus for providing compressive connection with electrostatic discharge dissipative properties |
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| CN101232131B (en) * | 2007-01-22 | 2010-06-23 | 富士康(昆山)电脑接插件有限公司 | Electric connector assembly |
| JP5297326B2 (en) * | 2009-10-08 | 2013-09-25 | 富士通コンポーネント株式会社 | Male connector, connector and backplane |
| US8517759B1 (en) * | 2011-02-15 | 2013-08-27 | Blue Sun Energy, Inc. | Ribbon flex light connector system |
| US9078569B2 (en) * | 2012-08-20 | 2015-07-14 | Zhengrong Ying | Configurable data measurement and acquisition systems for multi-slice X-ray computed tomography systems |
| US8926360B2 (en) | 2013-01-17 | 2015-01-06 | Cooper Technologies Company | Active cooling of electrical connectors |
| US9093764B2 (en) | 2013-01-17 | 2015-07-28 | Cooper Technologies Company | Electrical connectors with force increase features |
| EP2821988A1 (en) * | 2013-07-02 | 2015-01-07 | Samsung Electronics Co., Ltd | Connector for reducing near-end crosstalk |
| US11757221B2 (en) * | 2021-11-02 | 2023-09-12 | Te Connectivity Solutions Gmbh | Electrical connector having contact modules |
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-
1997
- 1997-01-13 US US08/782,792 patent/US5947753A/en not_active Expired - Lifetime
-
1998
- 1998-01-13 CA CA002248712A patent/CA2248712C/en not_active Expired - Fee Related
- 1998-01-13 WO PCT/US1998/000032 patent/WO1998031075A1/en active IP Right Grant
- 1998-01-13 EP EP98902384A patent/EP0902990B1/en not_active Expired - Lifetime
- 1998-01-13 DE DE69834606T patent/DE69834606T2/en not_active Expired - Lifetime
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