WO1998002848A1

WO1998002848A1 - Method and device for manufacturing a chip card as well as a chip card

Info

Publication number: WO1998002848A1
Application number: PCT/DE1997/001344
Authority: WO
Inventors: David Finn; Manfred Rietzler
Original assignee: David Finn; Manfred Rietzler
Priority date: 1996-07-11
Filing date: 1997-06-27
Publication date: 1998-01-22
Also published as: AU3433697A

Abstract

The invention concerns a method and device for manufacturing a chip carrier (80) with a multilayer design comprising a base substrate (22) and at least two cover layers (23, 24) applied to the top and underneath of the base substrate. The base substrate has at least one base substrate opening (36) which serves as a recess (84). The invention also concerns a chip carrier (80) produced in this way.

Description

Procedure and device; / Ur production of a chip card and chip carts

The present invention bet rifft a process for the preparation of _Chiptragern, in particular chip cards, according to the preamble of the on ^¬ claim 1., a Vorrichtu ng for performing the method for the manufacture ^¬ position of Chiptragern according to claim 20, and u nt one by the aforementioned method it Use of the aforementioned chip carrier which can be produced according to claim 22

It is expressly darau hi f ngewiesen that the term "chip carrier" as used herein includes nu nts all Chipanord in which a unit of chip or a chip module is disposed on a substrate without limita ^¬ the Matertalbeschaffenheit of the substrate or the use effect with respect to the Chiptragern Also includes the notion ff "smart ^{card" is} merely an indication au fd ie card form the substrate without Restrict ^ä n ^¬ effect in terms of Mat ertalbeschaffenheit As materials for the substrate are beispielswei se in question, plastics, textiles, papers

Have in the manufacture of Clupkarlen, the so-called "contact ^card" and a card body in cm dat recorded Chψ odule, d as a are treated with the Kartenobei substantially flat bundige Außenkon- _t ak tflachenanordnuny au fwei st for receiving the chip module to the Corresponding recesses in the chip body or the card substrate are introduced in the chip module dimensions. In the known chip cards, the recesses only extend over part of the height of the chip card, so that the recesses have a bottom on which the chip module can be placed in such a way that ultimately one Essentially, the outer contact surface arrangement of the chip module is flush with the card body. In order to be able to produce such recesses in the card substrate, which only extend over part of the card thickness, milling methods are usually used which, owing to the small thickness of the card substrate, are precise and must therefore be controlled with a correspondingly great effort. In addition, the known milling processes can only work at low feed speeds to ensure that the bottom of the milled recess is not broken during the milling process

The present invention is therefore based on the object of proposing a method which simplifies the production of a chip card

This object is achieved by a method with the features of claim 1

According to the invention, a method is proposed in which, starting from a base substrate material fed endlessly as roll material or as sheet material, a window opening is introduced into the base substrate material and subsequently the base substrate material is covered with a cover layer material and the base substrate material is loaded

By executing the method according to the invention, it is possible to replace the known, relatively complex milling process for producing a recess in the base substrate material provided with a bottom by a window opening in the base substrate material that is relatively easy to produce and overlaid with an occupancy of the base substrate material provided with the window opening with a Top layer material and subsequent! Equipping the base material with the in such a way created recess to be used chip card element

The introduction of a window opening, i.e. a continuous, bottomless recess in the base substrate material, is therefore simpler and quicker to implement, since no depth stop or the like has to be provided in order to stop a feed movement in time, as is the case when using a milling process, in order to do so Floor remains for the recess When the method according to the invention is used, the floor necessary for arrangement in the base substrate material is created by the covering of the base substrate material covering the window opening with the cover layer material

The method proves to be particularly advantageous if the introduction of the window opening, the covering of the base substrate material with the cover layer material and the placement of the base substrate material overlaps with a clocked feed movement of the base substrate material. Due to the clocked feed movement, it is possible to carry out any number of machining operations. and carry out mounting processes in parallel in successive workstations without synchronization problems

According to an advantageous variant of the method, the base substrate material is fixed in position by means of a raster positioning between two pushing cycles during a downtime of the base substrate material, in such a way that for position fixation in a work station a stationary latching device interacts with detent marks arranged on the base substrate material The locking device is fixed independently of the actual feed movement, so that deviations in successive feed sections are not integrated and thus a consistently accurate positioning is made possible regardless of the number of work stations

A particularly simple to carry out and, in addition, very precise fixing of the position is possible if the Marked recesses are made in the base substrate material and the position is fixed by inserting locking fingers into the locking recesses. This mechanical type of position fixation enables an immediate position fixation by the engagement of the latching fingers in the latching recesses, which, in the event of incorrect positioning due to forces acting on the base substrate material due to the latching fingers, enables simultaneous position correction without the use of additional correction elements

If a stop mark is generated on the base substrate material in a placement station after the window opening has been introduced and before the base substrate material has been fitted, the generation or control of synchronization of the successive workstations, based on a chip carrier length, only requires the generation of a single stop mark, which corresponds to each of the interacts with the stationary workstations assigned to the individual workstations

In an embodiment of the assembly station, the base substrate material is equipped with a transponder unit having at least one coil and a chip module in such a way that at least the chip module is received by the window opening. As a result, the base substrate material is fitted in accordance with the production of a possible embodiment of a chip card which enables contactless tapping

Alternatively, in a different embodiment of a mounting station, the base substrate material can be equipped with a chip module in such a way that the chip module is accommodated by the window opening. The base substrate material is thereby fitted in accordance with the production of a chip card for the contact-based tap

If in a placement station immediately preceding or immediately following another placement station the base substrate material is loaded with a spool in such a way that the spool wire ends of the spool coincide with one another Connecting surfaces of the subsequently or previously applied chip module to establish a connection between the coil and the chip module and to form a transponder unit is another way of forming a so-called “contactless card”. The covering of the base substrate material with the coil can be done by laying a coil wire The coil is formed on the base substrate material or by equipping the base substrate material with a coil unit that has already been completely wound

In the event that the connection between the coil and the chip module is not superimposed with the production of the covering layer between the coil wire ends of the coil and the contact surfaces of the chip module in the mounting station, the connection between the coil and the chip module can be made in a connecting station following this mounting station take place after the covering layer between the coil wire ends of the coil and the connection surfaces of the chip module has been previously produced in the assembly station

If, after arranging or designing the transponder unit on the base substrate material, an upper cover layer material covering the transponder unit is used, it is possible to produce a chip card which only enables contactless tapping

If the mounting station following the window station is designed such that the base substrate material is equipped with a chip module receptacle in such a way that the chip module receptacle device is received by the window opening, the production of a chip card is made possible in which the chip module is protected from damage by the chip module receptacle device stiffening the chip card is arranged slotted in the chip card

Following the above assembly station, a further assembly translation can be used to cover the base substrate material with a

Coil are seen in such a way that the wire wires of the coil in a Cover position with connecting surfaces of the chip holder subsequently applied or previously applied to establish a connection between the coil and the chip holder

If the connection between the coil and the chip holder is not already made in the assembly station, this can be carried out in a subsequent connection station

If the base station material is subsequently covered by the top substrate material with an upper cover layer material, a laminatable card structure is created

If, in the case of a previous mounting of the base substrate material with a chip module receptacle, the upper cover layer material is provided with a window opening in a window station, the chip module receptacle not only offers internal protection of the chip module against bending stress, but also through the possibility of integration that is created flush with the surface of the cover layer The chip holder also provides external protection. In addition, the arrangement of the chip holder in the window opening of the cover layer makes it possible to subsequently insert a chip module from the outside into a finished card holder - i.e. only after the lamination processes have ended

In order to ensure that the window opening of the cover layer material is arranged in the desired overlap position with the window opening in the base substrate material, the cover layer material can be provided for synchronization with the clocked, advanced base substrate material with another congruent catch mark arranged with the catch mark of the base substrate material

It especially ADVANTAGES lhaft i st even if during the assignment of the base substrate material ^¬ a fixation of the aufeinanderl ying layers follows with the upper cover sheet material ei

The fixation can only be carried out as a pre-fi xing, the one Permanent fixation in a downstream laminating device follows

The pre-fixing makes it possible, in particular, that the permanent fixing that follows in the laminating device takes place only after the layer composite formed from the 5 base substrate material and at least one cover layer has been cut to pieces of card composite

Another object on which the invention is based is to propose a device for carrying out the above method according to one or more of claims 1 to 19, which enables particularly simple manufacture of chip carriers

This object is achieved with a device which has the features of claim 20

According to the invention, the device has a device frame with a guide rail device running along the advance axis

15 on which a driver device is arranged which can be moved longitudinally and which interacts with a position fixing device which is arranged in a stationary manner on the device frame, such that the driver device is moved forward together with the fixed base substrate material in a forward movement cycle, the position fixing device.

20 direction, the base substrate material at the end of the forward movement cycle is fixed in position and the driver device is returned in a jerky movement cycle in the released state

This type of exposure of the base substrate material during the processing of producing a Chiptragers based on the Basissubstratma- 5 terials allows an array of individual for producing a chip ^¬ wearer required workstations in a row lying one behind the other, wherein the appropriate relative position by the position fixing means for each work station of the base substrate material is defined. Here ^¬ through it is possible m, the effort for the synchronization of the individual, in) the workstations conducted Bearbcitungs- or Bestückungsvor- would be reduced to a minimum

Furthermore, it proves to be particularly advantageous if the device frame in a rack table has a cutout for carrying out a cover layer material arranged below the rack table against the base substrate material arranged above the rack table

Another task on which the invention is based is to propose a chip carrier that is as simple to manufacture as possible.

This object is achieved with a chip carrier which has the features of claim 22

According to the invention, the chip carrier has a multi-layer structure consisting of a base substrate and at least two cover layers arranged on an upper side and a lower side of the base substrate, the base substrate having at least one base substrate opening which serves to form a receiving space

In this way, the formation of a receptacle provided with a bottom and the use of a chip module or the like in the receptacle formed in this way is made possible in a simple manner if at least one of the cover layers has a cover layer opening which is arranged in a cover layer with the base substrate opening the surface of the chip module be arranged flush with the surface of the upper cover layer

If the cover layer opening is made smaller than the base substrate opening, in such a way that the receiving space formed in this way has an external retaining edge, a form-fit, secure reception of a chip module or the like in the receiving space is possible

If the cover layer opening is larger than the base substrate opening, in such a way that the receiving space formed in this way has an external extension, chip modules can also be inserted flush with the surface of the upper cover layer in the receptacle, which are provided with an outer contact surface substrate that is larger than the chip unit of the chip module

If, on the bottom and / or top of the base substrate, a plurality of cover layers with different or the same size of cover layer openings are arranged one above the other in a common cover layer with the base substrate opening, chip modules or the like with a complex contour can be used, which have several preliminary and Can have jumps

In a special embodiment of the chip carrier, the receiving chamber serves to receive a receiving device for a chip module, for example a stiffening device

In another special embodiment, the receiving space of the chip carrier serves to receive a chip module with a chip unit contacted on a contact surface substrate

15 Further advantageous embodiments of the chip carrier are the subject of claims 29 to 1

In a particularly advantageous embodiment of the chip carrier, the two outer cover layers of the arrangement of the base substrate and at least two cover layers arranged on the base substrate are designed as 0 closed cover layers, which together with the base substrate and any further cover layers arranged on the base substrate form a laminate composite Process itself as a quasi-sealed unit that is sealed off from the outside, regardless of the composition of the internal structure. For example, 5 electronic components, such as chip units, coils or other electronic components or assemblies suitable for populating a chip card, can be accommodated in the laminate composite closed surface through the outer, closed cover layers, the outer cover layers (1 itself as components, for example as a cover layer with integrated Keyboard or integrated display, for example in the form of a membrane keyboard or membrane display.

A particular advantage of the chip carrier constructed in this way, which represents a laminated composite, is the possibility of using the laminate composite as a card insert in the production of chip cards with any desired top layers. The designed top layers can then be laminated to the outer top layers of the chip carrier in a further coating process

In the first laminating process, that is to say the production of the laminate composite, essentially all unevenness that can arise from the integration of chip units, coils or other components in the base substrate is compensated for by the lamination of the outer, closed cover layers of the second lamination process, in which designed, for example printed, laminate layers are to be laminated on, an already essentially flat surface is available, so that distortions in the external appearance of the designed cover layers due to underlying unevenness can be largely excluded

The chip chip formed as a laminate with outer, closed cover layers thus virtually forms a "white card insert" which can be used as a chip card or can be further processed for further external design of the chip card

In the following, advantageous variants of the above-mentioned method, as well as the devices used and the chip cards manufactured with them, will be explained in more detail with reference to the accompanying drawings

• '£ • I a first process variant for producing a

Chip card,

² a second process variant for producing a chip card, Fig. 3 shows a third process variant for producing a

Chip card,

Fig. 4 shows a fourth process variant for producing a

Chip card,

5 is a plan view of the rack table of a device for producing a chip card,

6 is a side view of the rack table shown in FIG. 5,

7 is a plan view of the rack table shown in FIG. 5, showing the card substrate sheet required on the rack table,

8 shows a first exemplary embodiment of a chip card,

9 shows a second exemplary embodiment of a chip card,

10 shows a third exemplary embodiment of a chip card

1 shows a principle of a first method variant in the production of a chip carrier (not shown in the end) as a chip card from a card assembly 20, in which a transponder from a chip module (not shown here) from a chip module and one contacted with it by means of a transponder device 2 1 Coil implemented i st

The cut card assembly 20 produced at the end of the process sequence shown in FIG. 1 has a total of three material layers, namely a middle card substrate layer 22 and two cover layers 23 and 24 arranged on the top and bottom of the card substrate 22

The card substrate layer 22 is fed at the beginning of the process as an endless card substrate 26 rolled up by a card substrate roll 25. Likewise, the cover layers 23, 24 are supplied as an endless cover layer. mateπal 27 or 28 fed from a topsheet roll 29 or 30

To produce the card assembly 20 formed at the end of the method, the card substrate material 26 and the cover layer materials 27, 28 pass through different work stations. The card substrate material 26 and the cover layer materials 27, 28 are explained in more detail below with reference to FIGS. 5, 6 and 7 Driving device 93 clocked in production direction 89 (Fig. 1) moved

In a first merging phase 33, the card substrate material 26 and the cover layer material 27 supplied from below the card substrate material 26 are introduced into the entraining device 93 (FIGS. 5, 6 and 7) and in a first standstill phase of the clocked feed movement in a window station 35, a window opening is introduced 36 in the card substrate material 26 In the exemplary embodiment shown in FIG. I, the window station 35 has a window punch 37 which, by means of a window stamp 38, introduces the window opening 36 into the card substrate material 26 held between two clamping jaws 39, 40 of the window punch 37. In the same standstill phase, this takes place Furthermore, the introduction of a position mark, which is designed here as a detent mark 41, into the merged, now two-day layer composite 42 formed from the card substrate material 26 and the cover layer material 27. The position mark 1 is shown in FIG. 1 Exemplary embodiment introduced by a ratchet punching device 43 in the layer composite 42 and consists of a simple through hole

Following the merging phase 33, the layer assembly 42 that has now been formed is transferred to an assembly phase 44. In the assembly phase 44, the layer assembly 42 is moved forward by a feed stroke in the direction of production 89, the relative change in position of the layer assembly 42 being defined by a latching finger 45, which is shown in FIG of the merging phase 33 generated by the ratchet punch 43, designed as a through hole ratchet 41 intervenes In the exemplary embodiment shown here, the distance a between the latching finger 45 and the latching punch device 43 corresponds to twice the distance c between the latching punch device 43 and the window punch 37 Halfway between the latching punch device 43 and the latching finger 45, ie at a distance b the transponder assembly device 21 is located to the latching finger 45. In the assembly phase 44, the transponder assembly device 21 is thus positioned exactly above the window opening 36 made in the card substrate material 26 in the assembly phase 33. In the assembly phase 44, the window opening 36 also forms as a result of the layer assembly 42 the cover layer material 27 covering the window opening 36 from below now has a recess 47 (FIG. 8) provided with a base 46 formed by the cover layer material 27. The chip module 48 of the transponder 49 is inserted into this recess 47 such that the Coil 50 of transponder 49 rests on card substrate material 26

After insertion of the card substrate material 26 42 or the layered composite with the transponder 49 is the locking fingers 45 from the Relativpo ^¬ sition of the layered composite 42 compared to the Transponderbestuckungsein- direction 21 securing stop mark 41 again hinausbewegi and La ^¬ genverbund 42 in a further feed stroke in the direction of manufacture 89 advances the process, the layered composite is 42 together with the current supplied from above the card substrate material 26 upper Deckla ^¬ genetic material 28 in a further Zusammenfuhrungsphase 51

In the merging phase 51, the layer composite 42 and the cover layer material 28 are detected and moved forward by the driver device 93. The end point of the advance movement is defined again by the next engagement of the locking finger 45 in a locking mark following in the direction of production 89 during the advance movement in the merging phase the top side of the card substrate material 26 is covered with the cover layer material 28. During the advance movement cycle, a continuous lending over the now from the card Substrate material 26 and the cover layer materials 27 and 28 formed layer composite 53 led away thermode device 54 at least along a line running in the direction of production 89 for pre-fixing the layers of the layer composite 53 against each other, so that at the end of the merging phase 51 with a separating device 55 the layer composite 53 to form the already card composite 20 having essentially card dimensions can be cut off after each feed tap, such a card composite can be cut off and arranged, for example, in a card composite stack 56. The card composite 20 can then be fed to a laminating process in order to connect the layers of the card composite 20 over the entire surface to form a chip card to accomplish

In the method variant shown in principle in FIG. 1, just as with the method variants explained below, different materials can be used as card substrate material and cover layer material. Plastic materials as well as textile or paper materials can be used. Depending on the type of material selected, the one described in the above can be used Process variant as a thermode device 54 designed for pre-fixing the card assembly can also be formed from an ultrasound or adhesive device. Likewise, the device designed as a window punch 37 with reference to the process variant shown in FIG. 1 for introducing the window openings into the card substrate material - likewise depending on the type of used material - can also be replaced, for example, by a mechanical cutting device or a high-frequency cutting device

In figures 2 and 3, further variants of the process are shown for producing a chip Karle, having coincident with the Darge in Fig. 1 ^¬ presented process variant at the beginning of a Zusammenfuhrungsphase 33 and the end of a Zusammenfuhrungsphase 51, however with regard ihrei Bestuckungsphasen 57 b / w 58 from the Darge in Fig. I ^¬ presented methods differ vai laπte The method variants shown in FIGS. 2 and 3 serve to produce a chip card comparable to the chip card 59 shown in FIG. 8, in which, however, the coil 50 and the chip module 48 are not used as a coherent unit, ie as a transponder 49, but rather as individual elements subsequent connection can be implemented

For this purpose, the mounting phase 57 of the method variant shown in FIG. 2 is divided into three feed cycles, with the chip module 48 being inserted into the previously introduced window opening 36 in the card substrate material 26 during the downtime after the first feed cycle 62 in the following feed cycle The standstill phase is by means of a laying device 60 movable relative to the fixedly positioned card substrate material 26, a coil wire, not shown here, is laid in coil form on the card substrate material 26 in such a way that the coil wire ends, not shown here, are brought into a covering position with contact surfaces of the chip module 48 accommodated in the window opening 36 Finally, in a further standstill phase, which follows the next feed cycle, a connecting device 61 is positioned above the window opening 36 in such a way that contacting of the ones in an Ub coverage position with the contact surfaces of the chip module 48 located Spuiendahendenden

The method variant shown in FIG. 3 differs in terms of its mounting phase 58 from that in the method variant shown in FIG. 2 insofar as the sequence of the mounting equipment 62 and the laying device 60 are interchanged

In principle, in the case of the layer composite 42 composed in the method variants according to FIGS. 2 and 3, all the mounting, laying and connection processes take place from above, since the window openings 36 made in the card substrate material 26 due to the cover layer material guided against the card substrate material 26 from below - πals 27 are only accessible from above. In the event of a different structure of the layer composite 42, at least the assembly processes were also from possible below

Figure 4 ⁱ ze gt e ⁱ ne further process variant, the respect of the first Zusammenfuhrungsphase 33 and the subsequent Bestuckungsphase 57 m ⁱ of the ^above process variant bere ⁱ nst ⁱ mmt regard explained with reference to Figure 2, a Zusammenfuhrungsphase t 63, however, arise against ^ü over the Zusammenfuhrungsphase shown in Figure 2 can be seen 51 abwe deviations ⁱ W ⁱ e in Figure 4, takes place namely the feeds into one _¬ tion of the guided from above on the card substrate material 26 finish coating genmateπals 28 after previously a window opening 64 in the upper Decklagenmateπal 28 has been introduced by means of a window punch 65 or a vergle ⁱ chbaren means the Fen-art _¬ ^ö opening 64 is introduced into a stationary phase, which is superimposed on the said last bar of Bestuckungsphase 27 subsequent standstill phase

At a distance b - in relation to the length of the planarly disposed Decklag ζetn- mateπals 28 - is parallel to the insertion of the window _OPENING 64 by d ⁱ e window punch 65 with a further Rastmarkenstanzeinπchtung 66 deckungsgle ⁱ ch with a previously ⁱ n by the Rastmarkenstanzeinπchtung 43 the layered composite 42 introduced stop mark 41, a stop mark placed 67 in the topsheet material 28, which together form a positionsidenti- SCHC stop mark 68 of the now from the Decklagenmateπalien 27 and 28, ⁱ e sow the card substrate material 26 layered composite 53 formed form H ⁱ erdurch ensures that further according to a pulsed feeding movement firstly the window opening 64 of the Decklagenmateπals 28 ⁱ of the desired Uber overlapping position n with the window _ö opening 36 is arranged in the card substrate material 26, and on the other a further stat ⁱ on ^e rs Bestυckungseinπchtung 69 is positioned such that a chip module 70 (Fig. 10) in a previously through the equipping inπchtung ^ö 62 in the window opening 36 of the card substrate material 26 introduced Chipmo- dulaufnahme 71 (FIG. 10) is used

E ⁱ ne prepared according to the in Fig. 4 shown with process variant ⁱ Ch pkarte 72 is shown in Fig. 10 The smart card 72 has a Card substrate layer 22, each with a top layer and a bottom surface of the card substrate layer 22 applied to the top layer 24 or 23 in the card substrate layer 22 formed from the card substrate material 26, the chip module receptacle 5 71 is inserted into the window opening 36, which in turn is in contact with one on the underside of the Card substrate material 26 applied by laying coil 73. Coil 73 is covered by the lower cover layer 23 formed from cover layer material 27.To enable such an arrangement of coil 73 between card substrate material 26 and cover layer material I () 27, it can differ from that in FIG Fig.4 shown

Method variant, the assignment of the card substrate material 26 with the coil 73 by means of a laying device 60 from below already before the card substrate material 26 is brought together with the cover layer material 27

15 window opening 36 of the card substrate material 26 is inserted, so that to complete the card assembly, the upper cover layer material 28 with a window opening 64 formed therein can be applied to the card substrate material 26, if, as shown in FIG. 10, the chip module receptacle 71 is provided with a offset flange 74 If the window opening 64 is appropriately dimensioned, an arrangement of a retaining rim 34 on the cover layer material 28 is achieved, which means that the chip module receptacle 71 is positively secured in one of the window openings 64 and 36 of the cover layer material 28 or the card substrate material 26 and the 5 lower cover layer material 27 recess formed is ensured 76 the chip module receiving 71 may be such that it is directly contacted with the coil 73 and an electrical connection of the Chipmo ^¬ duls 70 with the coil 73 via the chip module receiving 71 carried Alternatively, i However, it is also possible for the chip module 70, as shown in FIG. 10 0, to be in direct contact with the coil 73 with its connection surfaces 77, 78

As can also be seen from FIG. 10, the arrangement of the chip module 70 in the chip module receptacle 71 enables simple implementation. lo ren of Ch ⁱ pmoduls 70 in the smart card 72 from above this case, the Implement ⁱ augmentation after completion of the IC card 72, ie after the e ⁱ ngangs erw ^ä agreements referred to lamination of the layered composite _53, or already be done even before advantageous as particularly the in Fig. 10 ones shown, arrangement presented the chip module 70 in the chip module receiving 71 erwe ⁱ st s ⁱ ch ^that in a simple manner, corresponding by selecting _¬ the Mateπalstarken for the card substrate material 26 and the finish coating genmateπal 28 as well as a correspondingly highly educated chip module _¬ pickup 71 both bundige arrangement of the gutter 74 of the Ch pmodulaufnahme ⁱ 71 with the surface of the Decklagenmateπals 28 and e ⁱ ne bund ⁱ ge arrangement of an external contact area 31 of the Chipmo _¬ duls 70 m ⁱ t the surface of the Decklagenmateπals 28 possible is

W ⁱ e shows Fig.9 is a bundige arrangement of a chip module executed here with a different outer contour 79 without the use e ⁱ ner Ch ⁱ pmodulaufnahme 71 possible this purpose, the smart card 80 includes a layered composite 53 from the card substrate material 26, the lower Decklagenmateπal 27 and the upper cover layer material 28 _, in which the upper cover layer material 28 is provided with a relatively large window opening 64 and the card substrate material 26 with a relatively small window opening 36, both of which are arranged concentrically. As a result, the chip module 79 shown in FIG -pull configuration in the transition from e ⁱ nem relatively large-area contact substrate 81 having a large Außenkon- 82 on a chip unit 107 Querschnitssprung be included flush aufwe ⁱ ^st, and formschlussig

W ⁱ e it can be seen from Figure 9, the opening _ö from the window ₆₄ of the

^OPENING window 36 and a base 83 forming the lower Decklagenma ^l he ⁱ al 27 formed recess 84 corresponding to the contour of the chip module 79 is formed

Fig.5 ⁱ ze gt in a plan view a part of a rack board 85 of a Vorr ⁱ rect 86, which serves to carry out the Veifahrensvaπanten shown in FIGS. 1 to 4 The view shown in FIG. 5 shows the rack table 85 in the region of the assembly of the card substrate material 26 shown in FIG. 5 as an endless film with a cover layer material 27 also indicated in FIG. 5 with a dashed line, which is shown from below through a feed opening 87 in the rack table 85 in the direction of the card substrate material 26. A punch cutout 88 shown in FIG. 5 to the left of the feed cutout 87 enables the arrangement of a stationary window punch 37 above the punch cutout 88 in accordance with the representation of the method variants in FIGS can be used to remove the punching waste

As indicated by arrow 89 in FIG. 5, the production direction runs from left to right. In order to enable the clocked advance of the material webs explained with reference to the method variants of FIGS. 1 to 4, there is one along the table 85 Rail guide device 92 running in the production direction and having two guide rails 90, 91 has a driver device 93. The driver device 93 has a plurality of driver tongs 95 which are connected to one another with a rigid coupling member 94 and are guided such that they can be moved along the guide rail 90 or 91 96 connected, which when driving the one coupling member 94 via a spindle drive 97 ensures that the second coupling member 94 moves accordingly. The spindle drive 97 has two end stops 98, 99 which define the feed path

For the clocked feed movement of the contact substrate material 26 or of the layer composite 42 formed from the contact substrate material 26 and the cover layer material 27 (FIG. 1), the driving tongs 95 of the driving device 93 take the contact substrate material 26 or the layer composite 42 in a left end stop position of the spindle drive 97 and move this up to Reaching the right end stop 99 before reaching the right end stop 99, the card substrate material 26 or the layer composite 42 is in the position defined by moving the locking finger 45 into the locking mark 41 (FIG. 1), then fixed, the driver tongs 95 loosen and move back until the left end stop 98 is reached against the manufacturing direction 98. Here, the driver tongs 95 again grip the card substrate material 26 or the layer composite 42 and move the card substrate material 26 or the layer composite 42 after loosening the engagement between the locking finger 45 and the locking mark 41 by the same distance until the right end stop 99 is repeatedly reached

7 shows a top view of the frame 85 in the area of the tianponder equipment 21 already mentioned in connection with the method variant explained in FIG. 1. As can be seen from FIG. 7, the transponder equipment 21 is on a portal 100 spanning the rail guide device 92 A guide rail 101 is arranged, which enables the transponder assembly 21 to be moved along the guide rail 101 and transversely to the production assembly 89. In the embodiment of the transponder assembly 21 shown in FIG. 7, the transponder assembly 21 is pivotable about a pivot axis 102 arranged parallel to the production direction 89 formed with a winding head 103 arranged transversely to the pivot axis 102

The winding head 103 is used on the one hand to produce a wire coil in a winding process, and on the other hand to connect the coil wire ends of the wire coil (not shown here in more detail) to a chip module accommodated in the winding head Fig. 7 alignment shown with a parallel to the guide rail 101 of the portal 100 winding axis 104 on After completion of the transponder unit in the winding head 103, this is moved along the portal 100 and pivoted about its pivot axis 102 so that the winding axis 104 is now perpendicular to the plane or top surface of in direction 89 Aligned on the card substrate material 26 required by the frame 85 Starting from this position, the winding head 103 is lowered in the direction of the surface of the card substrate material 26 by means of a lifting device, not shown here, which is integrally formed on the transponder embossing device 21 by the action of pressure and / or Temperature, the coil 50 of the transponder unit 49 is then embedded in the surface of the card substrate material 26 such that the chip module 48 of the transponder unit 49 is received by the window opening 36 in the card substrate material 26

In the exemplary embodiment shown in FIG. 7, the card substrate material 26 is designed in the form of ready-made card substrate sheets 105 with a benefit division implemented here as a benefit of 21. Each card substrate sheet 105 enables the production of a total of 21 chip cards 59 (FIG. 8) snapshot of a chip card production shown, the winding head 103 is in a

Position for producing the third of two transponder units 49 already arranged in a transverse row 106 on the card substrate sheet 105

Both in the manufacture of chip carriers based on pre-assembled sheets and in the manufacture of chip carriers based on a base substrate provided as a roll material, it is possible to arrange the chip carriers in several rows parallel to the production direction, that is to say multi-lane as in FIG. 7, or only in of a deer, i.e. single-track, in particular for a single-track manufacturing process, a corresponding device can be designed to be particularly compact as a table device. In this embodiment, the device is particularly suitable for producing chip carriers designed as ID cards, e.g. personal ID cards, in which the base substrate and the cover layers Can consist of paper Here, as with other designs of the chip carrier, it is also possible to form the base substrate and the cover layers from different materials

Even if not shown in FIGS. 1 to 4, it is also contemplated during the manufacture of a chip card to add additives as required, such as a filler to fill in otherwise possibly remaining gaps between the element inserted into a window opening and the edges of the window opening. Such a filler can consist of a foaming plastic with an adhesive effect

Claims

claims

I Process for the production of chip carriers, in particular chip cards, in which the base substrate material is supplied continuously as a roll material (25) or as a sheet material (105)

(26) a window opening (36) is introduced into the base substrate material and subsequently the base substrate material is covered with a cover layer material (27, 28) and the base substrate material is equipped

2 Method according to claim 1, characterized in that the introduction of the window opening (36), the covering of the base substrate material with the cover layer material (27, 28) and the placement of the base substrate material (26) is superimposed with a clocked feed movement of the base substrate material

3 3 Method according to claim 2, characterized in that between two feed cycles during a standstill line of the base substrate material (26) the base substrate material (26) is fixed in position by means of a raster positioning. in such a way that a stationary locking device (45) interacts with locking marks (41) arranged on the base substrate material (26) for fixing the position in a work station

Method according to claim 3, characterized in that recesses are made in the base substrate material (26) to form the latching marks (41) and the position is fixed by inserting latching fingers (45) into the latching recesses

Method according to Claim 3 or 4, characterized in that the detent marks (41) are generated in a standstill time after the window opening (36) has been introduced into the base substrate material and before the base substrate material is loaded in a mounting station on the base substrate material (26)

Method according to one or more of the preceding claims, characterized in that the base substrate material in the mounting station is equipped with a transponder unit (49) having at least one coil (50) and a chip module (48) such that at least that

Chip module (48) is received by the window opening (36)

Method according to one or more of Claims 1 to 5, characterized in that the base substrate material (26) is equipped with a chip module (79) in the mounting station in such a way that the chip module

(79) is received by the window opening (36).

A method according to claim 7, characterized in that in one of the assembly stations (62) for equipping the base substrate material (26) with the chip module (79) immediately before or after another assembly station (60) the base substrate material (26) is filled with a coil (73) such that the coil wire ends of the Coil in a covering position with connection surfaces of the subsequently or previously applied chip module for establishing a connection between the coil (73) and the chip module (48) and forming a transponder unit

9. The method according to one or more of the preceding claims, characterized in that the connection between the coil (73) and the chip module (48) takes place in a connecting device (54) following the mounting device

10 The method according to one or more of the preceding claims, characterized in that, after arrangement or design of the transponder unit (49) on the base substrate material (26), an upper covering material layer (28) covering the transponder unit (49) takes place

11. The method according to one or more of the preceding claims, characterized in that the mounting device (62) following a window station (37) for introducing the window opening (36) for mounting the base substrate material (26) with a chip module receptacle

(71) is used in such a way that the chip module receptacle is received by the window opening (36)

12 Vei drive according to one or more of the preceding claims, characterized in that the assembly station (62) for equipping the base substrate material (26) with a chip module receptacle (71) is followed by another assembly station (60) for covering the base substrate material (26) with a coil (73), such that coil wire ends of the coil (73 ) are brought into a covering position with connection surfaces of the subsequently or previously applied chip holder (71) for establishing a connection between the coil (73) and the chip holder (71).

A method according to claim 8 or 12, characterized in that the base substrate material (26) is covered with the coil by laying a coil wire on the base substrate material in the coil configuration

Method according to one or more of the preceding claims, characterized in that the connection between the coil (73) and the chip holder (71) takes place in a subsequent connection station (54)

Method according to one or more of the preceding claims, characterized in that the embedding device (21, 62, 60) is followed by the covering of the base substrate material (26) with an upper cover layer material (28)

A method according to claim 15, characterized in that the upper cover layer material (28) is provided with a window opening (64) in a window station (65)

A method according to claim 1 or 16, characterized in that the cover layer material (28) is provided with further, similarly arranged with the catch marks (41) of the base substrate material (26) arranged catch marks (67).

Method according to one or more of the preceding claims, characterized in that, during the covering of the base substrate material (26) with the upper cover layer material (28), the layers lying one on top of the other are fixed

Method according to claim 18, characterized in that the fixation created during the covering of the base substrate material (26) with the upper cover layer material (28) is carried out as a pre-fixation and subsequently the layers lying one on top of the other are permanently fixed in a laminating device

Device for carrying out the method according to one or more of claims I to 19 with a device frame (85) with a guide rail device (92) running along the forward movement axis (89), on which a driver device (93), which is arranged with a stationary on

Device frame (85) arranged position fixing device (45) interacts in such a way that the driver device (93) is moved forward together with the held base substrate material (26) in a forward movement cycle, the position fixing device (45) the base substrate material (26) on

Holds the position of the end of the forward movement cycle fixed and the driver device is returned in a loosened state in a return movement cycle Apparatus according to claim 20, characterized in that a cutout (87) is arranged in a rack table (85) of the device rack for the passage of a cover layer material (27) arranged below the rack table (85) against the base substrate material (26) arranged above the rack table

Chip carrier with a multilayer structure made up of a base substrate (22) and at least two cover layers (23, 24) arranged on an upper side and a lower side of the base substrate, the base substrate having at least one base substrate opening (36) which forms a receiving space (76 , 84) is used

Chip carrier according to claim 22, characterized in that at least one of the cover layers (23, 24) has a cover layer opening (64) which is arranged in a cover layer with the base substrate opening (36)

Chip carrier according to claim 23, characterized in that the cover layer opening (64) is made smaller than the base substrate opening (36), in such a way that the receiving space formed in this way

(76) has an external retention edge formed by the upper cover layer (24)

Chip carrier according to claim 23, characterized in that the cover layer opening (64) is larger than the base substrate opening (36), such that the receiving space (84) thus formed has an external extension Chip carrier according to one or more of claims 23 to 25, characterized in that on the bottom and / or top of the base substrate (22) a plurality of cover layers (23, 24) with different or equally sized cover layer openings (64) lying one above the other in a common overlap with the base substrate opening (36) are arranged

Chip carrier according to one or more of claims 22 to 26, characterized in that the receiving space (76) serves to receive a receiving device (78) for a chip module (70)

Chip carrier according to one or more of claims 22 to 26, characterized in that the receiving space (84) serves to receive a chip module (79) with a chip unit (107) contacted on a contact surface substrate (81)

Chip carrier according to one or more of claims 22 to 28, characterized in that the base substrate (22) and / or the cover layers (23, 24) consist of paper or plastic

Chip carrier according to claim 29, provided by training as a sticker, in particular for baggage identification

Chip carrier according to one or more of claims 22 to 29, characterized by a card-shaped design, in particular as a plastic card 32 chip carrier according to one or more of claims 22 to 27 and 29 to 31, characterized in that the two outer cover layers of an arrangement of the base substrate (22) and at least two cover layers (23, 24) arranged on the base substrate as closed cover layers are formed and together with the base substrate (22) and any other cover layers arranged on the base substrate form a laminate composite.

33 chip carrier according to claim 32, characterized in that the laminate composite serves to accommodate electronic components or electronic assemblies

34. Chip carrier according to claim 32 or 33, g e k e n n ze i ch n e t by use as a card inlet in the production of chip cards with designed outer cover layers

35 A method for producing a chip card using a chip carrier according to claim 34, characterized in that the designed cover layers are laminated onto the chip carrier