WO1997047037A1 - Semiconductor arrangement with plastic housing and heat spreader - Google Patents

Semiconductor arrangement with plastic housing and heat spreader Download PDF

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Publication number
WO1997047037A1
WO1997047037A1 PCT/DE1997/001032 DE9701032W WO9747037A1 WO 1997047037 A1 WO1997047037 A1 WO 1997047037A1 DE 9701032 W DE9701032 W DE 9701032W WO 9747037 A1 WO9747037 A1 WO 9747037A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
plastic housing
heat spreader
exposed
distributor
Prior art date
Application number
PCT/DE1997/001032
Other languages
German (de)
French (fr)
Inventor
Franz Petter
Bernhard SCHÄTZLER
Rochus Huska
Original Assignee
Siemens Aktiengesellschaft
HUSKA, Mathilde
SCHREIBER, Rochus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft, HUSKA, Mathilde, SCHREIBER, Rochus filed Critical Siemens Aktiengesellschaft
Publication of WO1997047037A1 publication Critical patent/WO1997047037A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10931—Exposed leads, i.e. encapsulation of component partly removed for exposing a part of lead, e.g. for soldering purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a semiconductor arrangement which contains a plastic housing with at least one semiconductor power chip contained therein, a heat distributor and external contact means.
  • the heat spreader is connected to an external heat sink.
  • a large part of electronic components are encapsulated in plastic housings.
  • the power components power components
  • a heat distributor is installed, which is integrated in the plastic housing.
  • This heat distributor heat spreader, heat slug
  • P-QFP is understood to mean a housing of an electronic power component which has a square, flat shape (power quad flat package). Because of special requirements, there is, for example, a requirement that the heat distributor be visible or accessible on the end face of a semiconductor component, ie on a narrow side.
  • the heat distributor can be connected by a solder connection to a heat sink positioned, for example, in a printed circuit board. To check the soldering, it is checked, for example, whether the solder material for this soldering is between the heat distributor and the heat sink on the The front of the heat spreader forms a solder menikus.
  • the heat distributor must be accessible in some way for a soldering device in order to introduce the process heat for the soldering process.
  • housing designs are known in the prior art, in which the heat distributor projects laterally on a narrow side of the plastic housing beyond the outline of this housing, so that it is accessible, for example, for a soldering iron.
  • a major disadvantage of this design is that the housing, as a result of the protruding part of the heat distributor, requires a substantially larger installation space on a circuit board.
  • the invention is based on the object of designing the external dimensions of a power semiconductor component with a plastic housing to be as small as possible or in accordance with a standard and at the same time to provide the conditions for carrying out and checking a reliable soldered connection.
  • the invention is based on the finding that a heat distributor integrated in a plastic housing of a power semiconductor element does not have to exceed or enlarge the lateral outline of the plastic housing in order to establish starting points or surfaces for producing a soldered connection between the heat distributor and a heat sink to be provided on the heat distributor for producing the soldered connection. According to the invention, the
  • Plastic housing of the heat spreader exposed laterally and additionally in an adjacent recess in the plastic house also exposed on its top.
  • Soldered connections can be soldered to the connection pins, for example, on a printed circuit board on corresponding connection pads (pads).
  • the recess in the plastic housing is made correspondingly large, a correspondingly large part of the surface of the heat distributor is exposed. This makes it possible, for example, to introduce a sufficient amount of heat to produce a soldered connection with soldering brackets adapted to it.
  • Such cutouts connected to an exposed upper surface of a heat distributor can be provided at various points on the narrow sides of the plastic housing.
  • the remaining area of the narrow side can be provided accordingly with electrical contact elements such as connecting pins.
  • Fig. 1 shows a housing design according to the prior art
  • FIG. 2 shows a power housing design with a heat distributor and partially exposed on the narrow side and upwards
  • FIG. 3 shows a housing corresponding to FIG. 2 with recesses on several narrow sides with correspondingly exposed heat distributors, the remaining areas of these narrow sides being additionally covered with connecting pins.
  • FIG. 1 shows a power semiconductor module from the prior art.
  • the version shown here is similar to the so-called P-QFP, the individual letters in turn standing for "performance-square / flat / housing".
  • This ready-to-sell component can, for example, be positioned and soldered on a printed circuit board at its installation location by the user.
  • This semiconductor arrangement (1) with plastic housing (4) and heat distributor (3) has connecting legs (2) on three sides. In order to dissipate the heat that is generated in the integrated chip, the heat distributor (3) is installed accordingly and guided to the outside.
  • the component shown in FIG. 1 has a heat distributor (3) which projects beyond the usual layout of the QFP.
  • the need for such a construction resides in the heat distributor (3), for example, to obtain support surfaces for soldering brackets, which bring in the process heat for soldering, through which the heat distributor (3) with a heat sink located under the component, for example integrated in a printed circuit board is connected.
  • the soldering can be checked by checking on the narrow edge of the heat distributor (3) after soldering whether a correspondingly necessary solder miniscus has been formed.
  • Power components of this type with a plastic housing require up to 10% more installation space on a printed circuit board.
  • this version represents a deviation from the P-QFP standard. 2 and 3 show power components according to the invention in plastic housings.
  • a heat spreader (3) exposed to the outside on at least one narrow side of the flat plastic housing can be seen in each case.
  • the heat distributor (3) is partially exposed on the upper side by recesses (5), so that the process energy required for soldering can be introduced via this partial area of the heat distributor (3). This can be done, for example, using soldering clips or using laser soldering processes.
  • the component can be both soldered and unsoldered. Simultaneously with the said soldering process, the electrical connecting legs (2) are soldered in or out.
  • the essential feature of the invention is that the heat spreader (3) does not conform to the outline of the QFP
  • connecting legs (2) can continue to be at the front on the same side that contains such a recess (5).
  • the P-QFP standard is not changed by a design in accordance with the invention.
  • the space requirement can be designed on a printed circuit board in accordance with this standard and there is no need for additional space for the plastic housing of a component to the outside protruding parts of heat distributors are taken into account.
  • the possibilities for a soldering control and for soldering and unsoldering as a whole are retained.
  • the component has a relatively low weight.
  • no changes in the soldering area on a printed circuit board compared to the P-QFP standard are necessary.
  • the lead frame technology used does not have to be changed.
  • the pitch of the connecting pins (2) is 0.8 mm
  • a number of connecting pins of 64 is possible in an embodiment according to FIGS. 2 and 3, whereas a version according to FIG. 1 has only 48 connecting pins.
  • the pitch of the connecting legs is 0.65 mm
  • the number of connecting legs is 80 for FIGS. 2 and 3 and 60 for FIG. 1.
  • the heat distributor (3) is integrated in the plastic housing (4) Expediently such that the heat spreader (3) is arranged under the semiconductor chip, so that the heat generated in the chip is conducted to the heat spreader (3), which is connected downward to a heat sink in a printed circuit board.
  • a power semiconductor component with a heat distributor installed above the chip can also correspond to the
  • the invention can be interpreted, which means higher construction effort with regard to the connection between heat distributor (3) and heat sink.

Abstract

The invention relates to power semiconductor components (P-QFP) in which visible points of the integrated heat spreader (3) are required to check, firstly the quality of a soldering, and secondly to introduce the process heat for soldering via the heat spreader (3). Corresponding recesses (5) are provided for this purpose in the plastic housing (4) with the result that the side and partially the top of the heat spreader (3) are exposed on the narrow side of a QFP housing (1).

Description

Beschreibungdescription
Halbleiteranordnung mit Kunststoffgehäuse und WärmeverteilerSemiconductor arrangement with plastic housing and heat spreader
Die Erfindung betrifft eine Halbleiteranordnung, die ein Kunststoffgehäuse mit mindestens einem enthaltenen Halblei¬ terleistungschip, einem Wärmeverteiler und Außenkontaktie- rungεmittel beinhaltet. Der Wärmeverteiler wird mit einer ex¬ ternen Wärmesenke verbunden.The invention relates to a semiconductor arrangement which contains a plastic housing with at least one semiconductor power chip contained therein, a heat distributor and external contact means. The heat spreader is connected to an external heat sink.
Elektronische Bauelemente werden zu einem großen Teil in Kunststoffgehäusen eingekapselt. Insbesondere die Leistungs¬ bauelemente (Power-Bauelemente) benötigen eine gezielte Wär¬ meabfuhr. In diesen Bauelementen wird im Betrieb eine derar- tige Wärmemenge erzeugt, die nicht über die metallischen An¬ schlußelemente und über das Kunststoffgehäuse ausreichend ab¬ führbar ist. Für diesen Fall wird ein Wärmeverteiler einge¬ baut, der im Kunststoffgehäuse integriert ist. Dieser Wärme¬ verteiler {Heat-Spreader, Heat-Slug) steht einerseits mög- liehst direkt in Kontakt mit dem Halbleiterchip und wird an¬ dererseits in der Regel mit einer externen Wärmesenke (Heat- Sink) verbunden. Diese Verbindung geschieht in der Regel durch eine flächige Lötverbindung.A large part of electronic components are encapsulated in plastic housings. In particular, the power components (power components) require targeted heat dissipation. During operation, such a quantity of heat is generated in these components that cannot be sufficiently dissipated via the metallic connection elements and the plastic housing. In this case, a heat distributor is installed, which is integrated in the plastic housing. This heat distributor (heat spreader, heat slug) is on the one hand in direct contact with the semiconductor chip and is generally connected to an external heat sink (heat sink). This connection is usually done by a flat solder connection.
Bei diesen Leistungsbauelementen mit Kunststoffgehäuse sind wiederum eine Vielzahl verschiedenartiger Typen bekannt. So wird beispielsweise unter P-QFP ein Gehäuse eines elektroni¬ schen Leistungsbauelementes verstanden, das eine quadratische flache Form aufweist (Power-Quad-Flat-Package) . Aufgrund be- sonderer Anforderungen besteht beispielsweise die Forderung, daß an der Stirnseite eines Halbleiterbauelementes, d. h. an einer Schmalseite, der Wärmeverteiler sichtbar bzw. zugäng¬ lich ist. Wird das Kunststoffgehäuse an seinem Einbauplatz eingelötet, so kann durch eine Lötverbindung der Wärmevertei- 1er mit einer beispielsweise in einer Leiterplatte positio¬ nierten Wärmesenke verbunden werden. Zur Kontrolle der Lötung wird beispielsweise geprüft, ob das Lotmaterial für diese Lö¬ tung zwischen dem Wärmeverteiler und der Wärmesenke an der Stirnseite des Wärmeverteilers einen Lotmenikus bildet. Dar- überhinaus muß der Wärmeverteiler in irgendeiner Art für eine Lötvorrichtung zugänglich sein, um die Prozeßwärme für den Lötvorgang einzubringen. Hierzu sind im Stand der Technik Ge- häusebauformen bekannt, bei denen der Wärmeverteiler seitlich an einer Schmalseite des Kunststoffgehäuses über den Umriß dieses Gehäuses hinausragt, so daß er beispielsweise für ei¬ nen Lötbügel zugänglich ist. Dadurch können sowohl die Her¬ stellung einer Lötverbindung zwischen Wärmeverteiler und Wär- mesenke als auch die Entlötung zuverlässig getätigt werden. Ein wesentlicher Nachteil dieser Bauform besteht jedoch dar¬ in, daß durch den überstehenden Teil des Wärmeverteilers das Gehäuse insgesamt einen wesentlich größeren Einbauplatz auf einer Leiterplatte benötigt.A large number of different types are known for these power components with a plastic housing. For example, P-QFP is understood to mean a housing of an electronic power component which has a square, flat shape (power quad flat package). Because of special requirements, there is, for example, a requirement that the heat distributor be visible or accessible on the end face of a semiconductor component, ie on a narrow side. If the plastic housing is soldered in at its installation location, the heat distributor can be connected by a solder connection to a heat sink positioned, for example, in a printed circuit board. To check the soldering, it is checked, for example, whether the solder material for this soldering is between the heat distributor and the heat sink on the The front of the heat spreader forms a solder menikus. In addition, the heat distributor must be accessible in some way for a soldering device in order to introduce the process heat for the soldering process. For this purpose, housing designs are known in the prior art, in which the heat distributor projects laterally on a narrow side of the plastic housing beyond the outline of this housing, so that it is accessible, for example, for a soldering iron. As a result, both the establishment of a soldered connection between the heat distributor and the heat sink and the desoldering can be carried out reliably. A major disadvantage of this design, however, is that the housing, as a result of the protruding part of the heat distributor, requires a substantially larger installation space on a circuit board.
Der Erfindung liegt die Aufgabe zugrunde, die Außenmaße eines Leistungshalbleiterbauelementes mit Kunststoffgehäuse so ge¬ ring wie möglich bzw. einem Standard entsprechend auszulegen und gleichzeitig die Voraussetzungen zur Durchführung und zur Kontrolle einer zuverlässigen Lötverbindung bereitzustellen.The invention is based on the object of designing the external dimensions of a power semiconductor component with a plastic housing to be as small as possible or in accordance with a standard and at the same time to provide the conditions for carrying out and checking a reliable soldered connection.
Die Lösung dieser Aufgabe geschieht durch die Merkmale des Anspruches 1.This object is achieved by the features of claim 1.
Vorteilhafte Ausgestaltungen können den Unteransprüchen ent¬ nommen werden.Advantageous refinements can be found in the subclaims.
Der Erfindung liegt die Erkenntnis zugrunde, daß ein in einem Kunststoffgehäuse eines Leistungshalbleiterelementes inte- grierter Wärmeverteiler den lateralen Umriß des Kunststoffge- häuses nicht überschreiten bzw. vergrößern muß, um zur Her¬ stellung einer Lötverbindung zwischen Wärmeverteiler und ei¬ ner Wärmesenke Ansatzpunkte oder -flächen auf dem Wärmever¬ teiler zur Herstellung der Lötverbindung bereitzustellen. Er- findungsgemäß wird an einer Schmal- bzw. Stirnseite desThe invention is based on the finding that a heat distributor integrated in a plastic housing of a power semiconductor element does not have to exceed or enlarge the lateral outline of the plastic housing in order to establish starting points or surfaces for producing a soldered connection between the heat distributor and a heat sink to be provided on the heat distributor for producing the soldered connection. According to the invention, the
Kunststoffgehäuses der Wärmeverteiler seitlich freigelegt und zusätzlich in einer angrenzenden Aussparung des Kunststoffge- häuses an seiner Oberseite ebenfalls freigelegt. Somit ist nicht nur eine Kontrolle der genannten Lötverbindung möglich, in dem ein bei der Herstellung der Lötverbindung entstehender Meniskus visuell kontrolliert werden kann, sondern darüber- hinaus kann beim Einlöten des elektronischen Bauelementes die Wärmezufuhr über die in der besagten Aussparung zugänglichen Oberfläche des Wärmeverteilers geschehen. Somit ist nicht nur eine wesentliche Platzersparnis für Einbau eines Bauelementes erzielbar, sondern die Herstellung der Lötverbindung kann si- chergestellt werden. Gleichzeitig mit der Herstellung derPlastic housing of the heat spreader exposed laterally and additionally in an adjacent recess in the plastic house also exposed on its top. Thus, not only is it possible to check the mentioned soldered connection by visually inspecting a meniscus that arises during the production of the soldered connection, but moreover, when the electronic component is soldered in, the heat can be supplied via the surface of the heat distributor accessible in said recess. This not only saves a significant amount of space for installing a component, it also ensures that the soldered connection is made. Simultaneously with the manufacture of the
Lötverbindung können die Anschlußbeinchen beispielsweise auf einer Leiterplatte auf entsprechenden Anschlußflecken (Pads) angelötet werden.Soldered connections can be soldered to the connection pins, for example, on a printed circuit board on corresponding connection pads (pads).
Wird die Aussparung im Kunststoffgehäuse entsprechend groß ausgeführt, so liegt ein entsprechend großer Teil der Ober¬ fläche des Wärmeverteilers frei. Dies ermöglicht beispiels¬ weise mit daran angepassten Lötbügeln eine ausreichende Wär¬ memenge zur Herstellung einer Lötverbindung einzubringen. Derartige Aussparungen verbunden mit einer offenliegenden oberen Oberfläche eines Wärmeverteilers können an verschiede¬ nen Stellen an Schmalseiten des Kunststoffgehäuseε angebracht sein.If the recess in the plastic housing is made correspondingly large, a correspondingly large part of the surface of the heat distributor is exposed. This makes it possible, for example, to introduce a sufficient amount of heat to produce a soldered connection with soldering brackets adapted to it. Such cutouts connected to an exposed upper surface of a heat distributor can be provided at various points on the narrow sides of the plastic housing.
Sind beispielsweise an einer Schmalseite eines Kunststoffge¬ häuses nur kleine Aussparungen mit im Verhältnis zur gesamten Länge der Schmalseite kleinen Bereichen mit offenliegendem Wärmeverteiler vorgesehen, so kann der restliche Bereich der Schmalseite entsprechend mit elektrischen Kontaktelementen wie Anschlußbeinchen versehen sein.If, for example, only small recesses are provided on a narrow side of a plastic housing with small areas with exposed heat distributors in relation to the entire length of the narrow side, the remaining area of the narrow side can be provided accordingly with electrical contact elements such as connecting pins.
Im folgenden werden anhand von schematischen Figuren der Stand der Technik und Ausführungsbeispiele der Erfindung dar¬ gestellt.The state of the art and exemplary embodiments of the invention are illustrated below with the aid of schematic figures.
Fig. 1 zeigt eine Gehäusebauform nach dem Stand derFig. 1 shows a housing design according to the prior art
Technik mit einem nach außen ragendem Wärmever- teuer,Technology with an outwardly protruding heat expensive,
Fig. 2 zeigt eine Leistungsgehäuse-Bauform mit einem an einer Schmalseite seitlich und nach oben hin teilweise offenliegenden Wärmeverteiler und2 shows a power housing design with a heat distributor and partially exposed on the narrow side and upwards
Fig. 3 zeigt ein Gehäuse entsprechend Fig. 2 mit an mehreren Schmalseiten befindlichen Aussparungen mit entsprechend offenliegenden Wärmeverteilern, wobei restliche Bereiche dieser Schmalseiten zu¬ sätzlich mit Anschlußbeinchen belegt sind.FIG. 3 shows a housing corresponding to FIG. 2 with recesses on several narrow sides with correspondingly exposed heat distributors, the remaining areas of these narrow sides being additionally covered with connecting pins.
In der Fig. 1 wird ein Leistungshalbleiterbaustein aus dem Stand der Technik dargestellt. Die hier gezeigte Version äh¬ nelt dem sog. P-QFP, wobei die einzelnen Buchstaben der Reihe nach für "Leistung-quadratisch/flach/Gehäuse" stehen. Dieses verkaufsfertige Bauelement kann beispielsweise vom Anwender auf einer Leiterplatte an seinem Einbauplatz positioniert und eingelötet werden. Diese Halbleiteranordnung (1) mit Kunst¬ stoffgehäuse (4) und Wärmeverteiler (3) weist an drei Seiten Anschlußbeinchen (2) auf. Zur Ableitung der Wärme, die im in- tegrierten Chip entsteht, ist der Wärmeverteiler (3) entspre¬ chend eingebaut und nach außen geführt. Das in Fig. 1 gezeig¬ te Bauelement weist einen über den üblichen Grundriß des QFPs hinausragenden Wärmeverteiler (3) auf. Die Notwendigkeit ei¬ ner derartigen Konstruktion liegt darin am Wärmeverteiler (3) beispielsweise Auflageflächen für Lotbügel zu erhalten, die die Prozeßwärme für eine Lötung einbringen, durch die der Wärmeverteiler (3) mit einer unter dem Bauelement liegenden, beispielsweise in einer Leiterplatte integrierten, Wärmesenke verbunden wird. Außerdem kann die Lötung kontrolliert werden, indem am schmalseitigen Rand des Wärmeverteilers (3) nach dem Löten kontrolliert wird, ob ein entsprechend notwendiger Lot- miniskus ausgebildet ist. Derartig ausgeführte Leistungsbau¬ elemente mit Kunststoffgehäuse benötigen jedoch bis zu 10 % mehr Einbaufläche auf einer Leiterplatte. Darüberhinaus stellt diese Version eine Abweichung von dem P-QFP-Standard dar. Die Fig. 2 und 3 zeigen erfindungsgemäße Leistungsbauelemente in Kunststoffgehäusen. Es ist jeweils ein an mindestens einer Schmalseite des flachen Kunststoffgehäuses nach außen frei¬ liegender Wärmeverteiler (3) erkennbar. Der Wärmeverteiler (3) wird jeweils durch Aussparungen (5) oberseitig teilweise freigelegt, so daß über diesen Teilbereich des Wärmevertei¬ lers (3) die für eine Lötung notwendige Prozeßenergie einge¬ bracht werden kann. Dies kann beispielsweise über Lötbügel oder über Laserlötverfahren geschehen. Das Bauelement kann dabei sowohl ein- als auch ausgelötet werden. Gleichzeitig mit dem besagten Lötvorgang werden die elektrischen Anschlu߬ beinchen (2) ein- oder ausgelotet.1 shows a power semiconductor module from the prior art. The version shown here is similar to the so-called P-QFP, the individual letters in turn standing for "performance-square / flat / housing". This ready-to-sell component can, for example, be positioned and soldered on a printed circuit board at its installation location by the user. This semiconductor arrangement (1) with plastic housing (4) and heat distributor (3) has connecting legs (2) on three sides. In order to dissipate the heat that is generated in the integrated chip, the heat distributor (3) is installed accordingly and guided to the outside. The component shown in FIG. 1 has a heat distributor (3) which projects beyond the usual layout of the QFP. The need for such a construction resides in the heat distributor (3), for example, to obtain support surfaces for soldering brackets, which bring in the process heat for soldering, through which the heat distributor (3) with a heat sink located under the component, for example integrated in a printed circuit board is connected. In addition, the soldering can be checked by checking on the narrow edge of the heat distributor (3) after soldering whether a correspondingly necessary solder miniscus has been formed. Power components of this type with a plastic housing, however, require up to 10% more installation space on a printed circuit board. In addition, this version represents a deviation from the P-QFP standard. 2 and 3 show power components according to the invention in plastic housings. A heat spreader (3) exposed to the outside on at least one narrow side of the flat plastic housing can be seen in each case. The heat distributor (3) is partially exposed on the upper side by recesses (5), so that the process energy required for soldering can be introduced via this partial area of the heat distributor (3). This can be done, for example, using soldering clips or using laser soldering processes. The component can be both soldered and unsoldered. Simultaneously with the said soldering process, the electrical connecting legs (2) are soldered in or out.
In den Fig. 2 und 3 ist das wesentliche Merkmal der Erfin- düng, daß der Wärmeverteiler (3) nicht den Umriß des QFP-2 and 3, the essential feature of the invention is that the heat spreader (3) does not conform to the outline of the QFP
Gehäuses nach außen hin überschreitet, deutlich dargestellt. Somit ist eine Erhitzung des Wärmeverteilers (3) in einer Aussparung (5) zur Herstellung einer Lötung möglich. Diese freigelegten Teile der oberen Oberfläche des Wärmeverteilers (3) in Verbindung mit den entsprechenden Aussparungen (5) im Kunststoffgehäuse (4) können an einer oder mehreren Seiten des Kunststoffgehäuses (4) vorhanden sein. Entsprechend Fig. 3 können auf der gleichen Seite, die eine derartige Ausspa¬ rung (5) enthält auch weiterhin Anschlußbeinchen (2) vornan- den sein.Housing clearly outwards. It is thus possible to heat the heat distributor (3) in a recess (5) in order to produce soldering. These exposed parts of the upper surface of the heat distributor (3) in connection with the corresponding recesses (5) in the plastic housing (4) can be present on one or more sides of the plastic housing (4). According to FIG. 3, connecting legs (2) can continue to be at the front on the same side that contains such a recess (5).
Somit steht fest, daß durch eine Bauform entsprechend der Er¬ findung der P-QFP-Standard nicht verändert wird.Der Platzbe¬ darf kann auf einer Leiterplatte entsprechend diesem Standard ausgelegt werden und es muß nicht zusätzlicher Platz für die das Kunststoffgehäuse eines Bauelementes nach außen hin über¬ ragenden Teile von Wärmeverteilern berücksichtigt werden. Die Möglichkeiten für eine Einlötkontrolle und zum Ein- und Aus¬ löten insgesamt werden beibehalten.It is therefore certain that the P-QFP standard is not changed by a design in accordance with the invention. The space requirement can be designed on a printed circuit board in accordance with this standard and there is no need for additional space for the plastic housing of a component to the outside protruding parts of heat distributors are taken into account. The possibilities for a soldering control and for soldering and unsoldering as a whole are retained.
Die Erfindung ist weiterhin verbunden mit folgenden Vortei¬ len: Das Bauelement weist relativ geringes Gewicht im Gegensatz zum Stand der Technik auf. Bei einem erfindungsgemäßen Bauelement sind keine Veränderungen der Einlötfläche auf einer Leiterplatte gegenüber dem P-QFP-Standard notwendig.The invention is also associated with the following advantages: In contrast to the prior art, the component has a relatively low weight. In the case of a component according to the invention, no changes in the soldering area on a printed circuit board compared to the P-QFP standard are necessary.
Die angewandte Leiterrahmentechnologie (Lead Frame) muß nicht verändert werden.The lead frame technology used does not have to be changed.
Eine übliche Fertigungslinie für den P-QFP-Standard muß bis auf ein Spritzgießwerkzeug nicht verändert werden.A usual production line for the P-QFP standard does not have to be changed except for an injection mold.
Beträgt beispielsweise die Teilung der Anschlußbeinchen (2) 0,8 mm, so ist bei einer Ausführung entsprechend der Fig. 2 und 3 eine Anschlußbeinchenzahl von 64 möglich, wohingegen eine Version entsprechend Fig. 1 lediglich 48 Anschlußbein¬ chen aufweist. Beträgt die Teilung der Anschlußbeinchen 0,65 mm, so ergibt sich eine Anzahl von Anschlußbeinchen für die Fig. 2 und 3 von 80 und für die Fig. 1 von 60. Die Integrati¬ on des Wärmeverteilers (3) im Kunststoffgehäuse (4) geschieht zweckmäßigerweise derart, daß der Wärmeverteiler (3) unter dem Halbleiterchip angeordnet ist, so daß die im Chip entste¬ hende Wärme zum Wärmeverteiler (3) geführt wird, der nach un¬ ten hin mit einer Wärmesenke in einer Leiterplatte verbunden ist. Ein Leistungshalbleiterbauelement mit einem über dem Chip eingebauten Wärmeverteiler kann auch entsprechend derIf, for example, the pitch of the connecting pins (2) is 0.8 mm, a number of connecting pins of 64 is possible in an embodiment according to FIGS. 2 and 3, whereas a version according to FIG. 1 has only 48 connecting pins. If the pitch of the connecting legs is 0.65 mm, the number of connecting legs is 80 for FIGS. 2 and 3 and 60 for FIG. 1. The heat distributor (3) is integrated in the plastic housing (4) Expediently such that the heat spreader (3) is arranged under the semiconductor chip, so that the heat generated in the chip is conducted to the heat spreader (3), which is connected downward to a heat sink in a printed circuit board. A power semiconductor component with a heat distributor installed above the chip can also correspond to the
Erfindung ausgelegt werden, was jedoch höheren Konstruktions¬ aufwand hinsichtlich der Verbindung zwischen Wärmevertei¬ ler(3) und Wärmesenke bedeutet. The invention can be interpreted, which means higher construction effort with regard to the connection between heat distributor (3) and heat sink.
Bezugszeichenliεte:Reference symbol list:
(1) Halbleiteranordnung(1) semiconductor device
(2) Anschlußbeinchen(2) leg
(3) Wärmeverteiler (Heat Slug, Heat Spreader)(3) Heat slug, heat spreader
(4) Kunststoffgehäuse(4) plastic housing
(5) Aussparung (5) recess

Claims

Patentansprüche claims
1. Halbleiteranordnung (1) bestehend aus mindestens einem Halbleiterleistungselement mit Kunststoffgehäuse (4), einem Wärmeverteiler (3) und Kontaktierungsmitteln (2), worin der Wärmeverteiler (3) zumindest an einer Schmalseite des Kunst¬ stoffgehäuses (4) freiliegt, die ebene Ausdehnung des Wärme¬ verteilers (3) maximal bis zum Rand des Umrisses des Kunst¬ stoffgehäuses (4) reicht und das Kunststoffgehäuse (4) an der besagten Schmalseite eine Aussparung (5) aufweist, wodurch der Wärmeverteiler (3) zusätzlich an seiner oberen Oberfläche offenliegt .1. Semiconductor arrangement (1) consisting of at least one semiconductor power element with a plastic housing (4), a heat distributor (3) and contacting means (2), wherein the heat distributor (3) is exposed at least on a narrow side of the plastic housing (4), the flat extent of the heat spreader (3) extends up to the edge of the outline of the plastic housing (4) and the plastic housing (4) has a recess (5) on the said narrow side, as a result of which the heat spreader (3) is also exposed on its upper surface .
2. Halbleiteranordnung nach Anspruch 1, worin der Wärmever- teiler (3) an mindestens zwei Schmalseiten des Kunststoffge¬ häuses (4) seitlich und angrenzend in der Aussparung (5) oberseitig frei liegt.2. The semiconductor arrangement according to claim 1, wherein the heat distributor (3) is exposed on at least two narrow sides of the plastic housing (4) laterally and adjacent in the recess (5) on the upper side.
3. Halbleiteranordnung nach Anspruch 1 oder 2, worin sich ei- ne Aussparung (5) annähernd über die gesamte Länge einer3. A semiconductor arrangement according to claim 1 or 2, wherein a recess (5) extends approximately over the entire length of one
Schmalseite eines Kunststoffgehäuses (4) erstreckt.Narrow side of a plastic housing (4) extends.
4. Halbleiteranordnung nach Anspruch 1 oder 2, worin sich ei¬ ne Aussparung (5) mit freigelegtem Wärmeverteiler (3) über einen Teil der Länge einer Schmalseite des Kunststoffgehäuses (4) erstreckt und die restliche Länge der Schmalseite mit An¬ schlußbeinchen (2) belegt ist. 4. The semiconductor arrangement as claimed in claim 1 or 2, in which a recess (5) with an exposed heat distributor (3) extends over part of the length of a narrow side of the plastic housing (4) and the remaining length of the narrow side with connecting legs (2) is occupied.
PCT/DE1997/001032 1996-05-30 1997-05-22 Semiconductor arrangement with plastic housing and heat spreader WO1997047037A1 (en)

Applications Claiming Priority (2)

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DE19621766.0 1996-05-30
DE19621766A DE19621766A1 (en) 1996-05-30 1996-05-30 Semiconductor arrangement with plastic housing and heat spreader

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DE102011076094A1 (en) 2011-05-19 2012-11-22 Robert Bosch Gmbh Method for electrically controlling soldering of quad flat package building block in integrated circuit, involves applying zone with potential of pad to test soldering of another zone, where voltage drop is evaluated to assess soldering

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JPS62224049A (en) * 1986-03-26 1987-10-02 Hitachi Ltd Electronic device
EP0548496A1 (en) * 1991-12-20 1993-06-30 STMicroelectronics S.r.l. A mold and a method for manufacturing semiconductor devices of plastics incorporating an exposed heat sink of metal for inspecting the soldered joint

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