WO1997019491A1 - An electrically conductive wire - Google Patents

An electrically conductive wire Download PDF

Info

Publication number
WO1997019491A1
WO1997019491A1 PCT/IB1996/001203 IB9601203W WO9719491A1 WO 1997019491 A1 WO1997019491 A1 WO 1997019491A1 IB 9601203 W IB9601203 W IB 9601203W WO 9719491 A1 WO9719491 A1 WO 9719491A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electrically conductive
wire
solder balls
conductive wire
Prior art date
Application number
PCT/IB1996/001203
Other languages
French (fr)
Inventor
Eddy Willy Vanhoutte
Gilbert De Clercq
Original Assignee
Philips Electronics N.V.
Philips Norden Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics N.V., Philips Norden Ab filed Critical Philips Electronics N.V.
Priority to JP9519537A priority Critical patent/JPH10513308A/en
Priority to EP96935237A priority patent/EP0804817A1/en
Publication of WO1997019491A1 publication Critical patent/WO1997019491A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Definitions

  • the invention relates to an electrically conductive wire having a solder ball thereon for making a circuit connection between electrically conductive members on opposite surfaces of a substrate by means of a soldering process.
  • a through-hole substrate is known from EP-A-0 126 164.
  • an electrically conductive wire having a solder ball thereon is used.
  • the wire is inserted in the through-hole of the substrate.
  • the substrate has electrically conductive members on both surfaces and the conductive members are arranged on the perimeters of the through-hole.
  • the solder ball on the wire is positioned on one of the conductive members.
  • soldering process like dipping or flow soldering, one or both ends of the wire are soldered to a conductive member at one surface of the substrate, whereas at the same time heat generated during the soldering process is transferred through the wire to the solder ball at the opposite surface of the substrate in order to melt the solder ball for making a soldering connection between the wire and the conductive member at the opposite surface of the substrate.
  • the circuit connection between the conductive members on both surfaces of the substrate is made.
  • to make a circuit connection with the use of a single solder ball on it as described hereinbefore often leads to a bad connection between the conductive members.
  • the object of the invention is to provide an electrically conductive wire means for making a reliable circuit connection between electrically conductive members on opposite surfaces of a substrate.
  • the present invention provides an electrically conductive wire having a solder ball thereon for making a circuit connection between electrically conductive members on opposite surfaces of a substrate, characterized in that the wire comprises two spaced apart solder balls on it and flux in the space between the solder balls.
  • the wires are very suitable for use in an automatic soldering process, like reflow or wave soldering.
  • the wire can be inserted in the through- hole of a substrate during the process of placing other components with the same machine. In one of the subsequent operation steps the components are soldered at their required position. At the same time the wires can be soldered in the same soldering process. So, the most important advantage is that the wires can be soldered during existing automatic soldering processes of other components.
  • Figure 1 shows the conductive wire
  • Figure 2 shows the wires packed in a tape
  • Figure 3 shows schematically a wave soldering process for a substrate with inserted conductive wires.
  • the electrically conductive wire 1 usually a copper wire, is provided with two solder balls or dots 2 fixedly secured thereon.
  • the solder balls are spaced apart.
  • the small space 3 between the balls are filled with a flux 4.
  • the wires can be packed in a tape 5 in well known manner (see Fig. 2) for use in a feeder of, for example, a component placement machine.
  • a component placement machine the wires are inserted in through- holes 7 of a substrate 6 or printed circuit board in such a manner that the ends 8 of a wire make contact with or are close to a conductive track 9 provided on one of the surfaces 10 of the substrate and the solder balls 2 with flux 4 between them make contact with or are close to a conductive track 11 provided on the opposite surface 12 of the substrate.
  • the substrate is transported through, for example, a wave soldering machine 13, as shown in Fig. 3.
  • the surface 10 of the substrate faces the hot solder 14.
  • the hot solder touches the ends 8 of the wire 1 , which are then soldered to their respective conductive tracks 9.
  • the heat of the hot solder 14 is also transferred through the wire 2 to the solder balls 2 situated at the opposite surface 12 of the substrate.
  • the solder balls melt and the conductive track surfaces to be wetted by solder are cleaned by means of the flux, so that a reliable connection is obtained.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

The invention relates to an electrically conductive wire (1) comprising two spaced solder balls (2) thereon and flux (4) in the space (3) between the solder balls for making a circuit connection between electrically conductive members on opposite surfaces of a substrate. The wire (1) is inserted in a through-hole of the substrate and soldered by a customary soldering process, like wave soldering.

Description

An electrically conductive wire
The invention relates to an electrically conductive wire having a solder ball thereon for making a circuit connection between electrically conductive members on opposite surfaces of a substrate by means of a soldering process.
For circuit connection across both surfaces of a substrate, a through-hole substrate is known from EP-A-0 126 164. For making the circuit connection an electrically conductive wire having a solder ball thereon is used. The wire is inserted in the through-hole of the substrate. The substrate has electrically conductive members on both surfaces and the conductive members are arranged on the perimeters of the through-hole. The solder ball on the wire is positioned on one of the conductive members. By means of a soldering process, like dipping or flow soldering, one or both ends of the wire are soldered to a conductive member at one surface of the substrate, whereas at the same time heat generated during the soldering process is transferred through the wire to the solder ball at the opposite surface of the substrate in order to melt the solder ball for making a soldering connection between the wire and the conductive member at the opposite surface of the substrate. In this way the circuit connection between the conductive members on both surfaces of the substrate is made. In practice it has turned out that to make a circuit connection with the use of a single solder ball on it as described hereinbefore, often leads to a bad connection between the conductive members.
Therefore many manufacturers use a separate soldering robot for making such circuit connections. However, this method is rather expensive and results in a limitation in design, logistics, maintenance and process control.
The object of the invention is to provide an electrically conductive wire means for making a reliable circuit connection between electrically conductive members on opposite surfaces of a substrate.
The present invention provides an electrically conductive wire having a solder ball thereon for making a circuit connection between electrically conductive members on opposite surfaces of a substrate, characterized in that the wire comprises two spaced apart solder balls on it and flux in the space between the solder balls. Using this kind of wires for making circuit connections across both surfaces of a substrate results in a good and reliable connection. The wires are very suitable for use in an automatic soldering process, like reflow or wave soldering. The wire can be inserted in the through- hole of a substrate during the process of placing other components with the same machine. In one of the subsequent operation steps the components are soldered at their required position. At the same time the wires can be soldered in the same soldering process. So, the most important advantage is that the wires can be soldered during existing automatic soldering processes of other components.
The present invention will now be described, by way of example, with reference to the accompanying drawings, wherein:
Figure 1 shows the conductive wire,
Figure 2 shows the wires packed in a tape, and
Figure 3 shows schematically a wave soldering process for a substrate with inserted conductive wires.
The electrically conductive wire 1 , usually a copper wire, is provided with two solder balls or dots 2 fixedly secured thereon. The solder balls are spaced apart. The small space 3 between the balls are filled with a flux 4. The wires can be packed in a tape 5 in well known manner (see Fig. 2) for use in a feeder of, for example, a component placement machine. In a component placement machine the wires are inserted in through- holes 7 of a substrate 6 or printed circuit board in such a manner that the ends 8 of a wire make contact with or are close to a conductive track 9 provided on one of the surfaces 10 of the substrate and the solder balls 2 with flux 4 between them make contact with or are close to a conductive track 11 provided on the opposite surface 12 of the substrate. Usually other components are also placed on the substrate as well. For electrically connecting the wires and components, the substrate is transported through, for example, a wave soldering machine 13, as shown in Fig. 3. The surface 10 of the substrate faces the hot solder 14. The hot solder touches the ends 8 of the wire 1 , which are then soldered to their respective conductive tracks 9. The heat of the hot solder 14 is also transferred through the wire 2 to the solder balls 2 situated at the opposite surface 12 of the substrate. The solder balls melt and the conductive track surfaces to be wetted by solder are cleaned by means of the flux, so that a reliable connection is obtained.

Claims

Claim:
An electrically conductive wire (1) having a solder ball (2) thereon for making a circuit connection between electrically conductive members on opposite surfaces of a substrate, characterized in that the wire comprises two spaced apart solder balls (2) on it and flux (4) in the space (3) between the solder balls.
PCT/IB1996/001203 1995-11-20 1996-11-13 An electrically conductive wire WO1997019491A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9519537A JPH10513308A (en) 1995-11-20 1996-11-13 Electric conductive wire
EP96935237A EP0804817A1 (en) 1995-11-20 1996-11-13 An electrically conductive wire

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP95203166 1995-11-20
EP95203166.4 1995-11-20

Publications (1)

Publication Number Publication Date
WO1997019491A1 true WO1997019491A1 (en) 1997-05-29

Family

ID=8220841

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB1996/001203 WO1997019491A1 (en) 1995-11-20 1996-11-13 An electrically conductive wire

Country Status (5)

Country Link
US (4) US6410854B1 (en)
EP (1) EP0804817A1 (en)
JP (1) JPH10513308A (en)
KR (1) KR100404275B1 (en)
WO (1) WO1997019491A1 (en)

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US8199716B2 (en) 1999-08-11 2012-06-12 Qualcomm Incorporated Method and system for performing handoff in wireless communication systems

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US7708205B2 (en) 2003-11-13 2010-05-04 Metrologic Instruments, Inc. Digital image capture and processing system employing multi-layer software-based system architecture permitting modification and/or extension of system features and functions by way of third party code plug-ins
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Also Published As

Publication number Publication date
JPH10513308A (en) 1998-12-15
US6752310B2 (en) 2004-06-22
KR100404275B1 (en) 2004-03-12
US20020040804A1 (en) 2002-04-11
US6410854B1 (en) 2002-06-25
KR19980701441A (en) 1998-05-15
US20040188498A1 (en) 2004-09-30
US20050224932A1 (en) 2005-10-13
EP0804817A1 (en) 1997-11-05
US6902097B2 (en) 2005-06-07

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