WO1996042109A1 - Puce pour carte electronique revetue d'une couche de matiere isolante et carte electronique comportant une telle puce - Google Patents
Puce pour carte electronique revetue d'une couche de matiere isolante et carte electronique comportant une telle puce Download PDFInfo
- Publication number
- WO1996042109A1 WO1996042109A1 PCT/FR1996/000030 FR9600030W WO9642109A1 WO 1996042109 A1 WO1996042109 A1 WO 1996042109A1 FR 9600030 W FR9600030 W FR 9600030W WO 9642109 A1 WO9642109 A1 WO 9642109A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- layer
- insulating material
- contact pads
- smart card
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Definitions
- Chip for electronic card coated with a layer of insulating material and electronic card comprising such a chip
- the present invention relates to a chip for an electronic card, comprising a semiconductor chip having an active face provided with contact pads and on which asperities of different heights are formed.
- the chip does not remain parallel to the card body while the punch pushes it into the latter.
- the plastic material which it pushes back during its penetration tends to spread over the lowest parts of the active face of the chip and to prevent, at these parts, the subsequent establishment of a perfect bond between the contact pads and the conductive tracks usually deposited on the card body.
- the present invention proposes to provide a solution to this problem and, to do this, it relates to a chip for an electronic card, having the structure mentioned above and which is characterized in that the active face of the chip is coated at least partially with a layer of insulating material having a thickness greater than or equal to the height of the highest roughness, this layer being shaped to allow free access to the contact pads and having an external face parallel to the periphery of the active face of the chip.
- the chip according to the invention when implanted using a punch, remains parallel to the card body since the external face of the insulating material is parallel to the periphery of the active or upper face of the chip. .
- the risks for the repressed plastic material to inadvertently spread over certain parts of the active face of the chip are therefore eliminated, which allows the establishment of a perfect connection between the contact pads and the conductive tracks which are usually placed on the card body.
- the layer of insulating material may be in the form of a frame comprising orifices in its parts situated directly above the contact pads.
- the external peripheral surface of the frame is divided into two parts connected to each other by a bearing, the part adjacent to the chip having a periphery larger than that of the other party.
- the frame can be located inside the periphery of the active face of the chip.
- the plastic material which was pushed back during implantation extends in this case over the part of the active face of the chip which is outside the frame and again prevents the chip from accidentally separating from the card body when it is subjected to repeated bending.
- the insulating material is a polyimide, this resin having the property of forming a very smooth and very flat layer after polymerization.
- the present invention also relates to electronic cards whose chip has the characteristics set out above.
- FIG. 1 is a schematic perspective view of an electronic card comprising a chip conforming to l invention
- FIG. 2 is a perspective view on an enlarged scale of the card chip visible in Figure 1;
- FIG. 3 is a schematic sectional view on an enlarged scale along the line III-III of Figure 1;
- Figure 4 is a view similar to Figure 3, but showing another chip.
- FIG. 1 is a view similar to Figure 3, but showing yet another chip.
- the electronic card which can be seen in FIG. 1 comprises a flat body 1 made of plastic material, comprising two large rectangular opposite faces, a chip 2 implanted in one of the large faces of the body 1, and conductive pads 3 extending over the large face of the body 1 in which the chip 2 is implanted, the conductive plates 3 being intended to connect the chip 2 to a non-external reader represented in order to allow the establishment of an exchange of data between them.
- the chip 2 which is shown on an enlarged scale in FIG. 2, comprises a material known per se, a semiconductor chip 4 whose active face is provided with contact pads 5 distributed in two parallel rows and roughness 6 essentially formed by semiconductor circuits.
- the asperities 6 have different heights and if the chip were implanted using a punch, it would not remain parallel to the large face of the card body 1 intended to receive it.
- part of the active face of the chip 4 is coated with a layer of insulating material 7 whose thickness is at least equal to the height of the highest roughness 6.
- the active face of the chip 4 is square but there is nothing to prevent it from being rectangular or having any other shape.
- the layer 7 is in the form of a frame, the external peripheral surface 8 of which is an extension of the peripheral surface 9 of the chip 4.
- This frame whose central recess 10 reveals certain roughness 6, is provided with orifices 11 at the level of the contact pads 5. It will be noted here that the production of the orifices 11 could be avoided if the frame was made so that its hollowed-out central part contains contact pads.
- the outer (or upper) face of the layer 7, which is perfectly flat, is parallel to the periphery 12 of the active face of the microchip 4. However, as the periphery 12 is parallel to the lower face 13 of the microchip, the outer face of the layer 7 is therefore also parallel to the lower face 13.
- the chip that can be seen in FIG. 4 differs from that which has just been described only by the fact that the external peripheral surface 8 of the frame delimited by the layer of insulating material is situated inside the periphery 12 of the active face of the chip 4.
- the plastic material that it pushes back to penetrate into the card body 1 comes to cover the part of the chip 4 which is located outside of the frame, as shown.
- the chip cannot therefore separate from the card body when the latter is subjected to repeated bending, which can significantly increase the duration of use of the electronic card.
- the chip visible in FIG. 5 differs from the chips described above in that the external peripheral surface 8 of the frame is divided into two parts 8a and 8b connected to each other by a bearing 14, the part 8a which is adjacent to the chip 4 extending in the extension of the peripheral surface 9 of the latter.
- the plastic which has been pushed back during the implantation of the chip 2 extends over the bearing 14, as shown. It therefore opposes a possible extraction of the chip from the card body when the latter is subjected to repeated bending.
- the external peripheral surface 8 of the frame could be located inside the periphery 12 of the active surface of the chip 4, as shown in FIG. 4, and have a bearing 14, as shown in FIG. 5.
- the insulating material used to form the layers 7 is a plastic material, in particular a polyimide. This plastic material was in fact chosen for its ability to give the layers 7, in the polymerized state, an extremely smooth and flat free face.
- the microchips 4 come from a silicon wafer such as that which is usually used for the manufacture of chips, and that the insulating material constituting the layers 7 is preferably deposited by photolithography on the silicon wafer, after the production of the integrated circuits but before the sawing operation which makes it possible to separate the different chips.
- the layer of insulating material 7 protects the chips against the thermal shocks that the punch could cause if it was heating, and that it electrically insulates them from the conductive tracks 3 deposited subsequently by screen printing.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MX9709940A MX9709940A (es) | 1995-06-12 | 1996-01-09 | Chip para tarjeta electronica revestida con una capa de material aislante, y una tarjeta electronica que comprende este chip. |
JP9502677A JP2000500251A (ja) | 1995-06-12 | 1996-01-09 | 絶縁材料層で被覆した電子カード用のチップ及びそのようなチップを含む電子カード |
BR9603590A BR9603590A (pt) | 1995-06-12 | 1996-01-09 | Chip para cartão eletrónico e cartão eletrónico |
AU44914/96A AU4491496A (en) | 1995-06-12 | 1996-01-09 | Smart card chip coated with a layer of insulating material, and smart card comprising same |
EP96901032A EP0832499A1 (fr) | 1995-06-12 | 1996-01-09 | Puce pour carte electronique revetue d'une couche de matiere isolante et carte electronique comportant une telle puce |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9506913A FR2735284B1 (fr) | 1995-06-12 | 1995-06-12 | Puce pour carte electronique revetue d'une couche de matiere isolante et carte electronique comportant une telle puce |
FR95/06913 | 1995-06-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996042109A1 true WO1996042109A1 (fr) | 1996-12-27 |
Family
ID=9479858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR1996/000030 WO1996042109A1 (fr) | 1995-06-12 | 1996-01-09 | Puce pour carte electronique revetue d'une couche de matiere isolante et carte electronique comportant une telle puce |
Country Status (12)
Country | Link |
---|---|
US (1) | US5753901A (fr) |
EP (1) | EP0832499A1 (fr) |
JP (1) | JP2000500251A (fr) |
KR (1) | KR19990022245A (fr) |
CN (1) | CN1114947C (fr) |
AU (1) | AU4491496A (fr) |
BR (1) | BR9603590A (fr) |
CA (1) | CA2220636A1 (fr) |
FR (1) | FR2735284B1 (fr) |
MX (1) | MX9709940A (fr) |
RU (1) | RU2172017C2 (fr) |
WO (1) | WO1996042109A1 (fr) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2798225A1 (fr) * | 1999-09-03 | 2001-03-09 | Gemplus Card Int | Micromodule electronique et procede de fabrication et d'integration de tels micromodules pour la realisation de dispositifs portatifs |
WO2002050905A1 (fr) * | 2000-12-21 | 2002-06-27 | Gemplus | Connexion par isolant decoupe et cordon imprime en plan |
US6848617B1 (en) | 1998-01-27 | 2005-02-01 | Infineon Technologies Ag | Smart card module for biometric sensors |
US7653602B2 (en) | 2003-11-06 | 2010-01-26 | Visa U.S.A. Inc. | Centralized electronic commerce card transactions |
US7725369B2 (en) | 2003-05-02 | 2010-05-25 | Visa U.S.A. Inc. | Method and server for management of electronic receipts |
US7857216B2 (en) | 2003-09-12 | 2010-12-28 | Visa U.S.A. Inc. | Method and system for providing interactive cardholder rewards image replacement |
US8005763B2 (en) | 2003-09-30 | 2011-08-23 | Visa U.S.A. Inc. | Method and system for providing a distributed adaptive rules based dynamic pricing system |
US8010405B1 (en) | 2002-07-26 | 2011-08-30 | Visa Usa Inc. | Multi-application smart card device software solution for smart cardholder reward selection and redemption |
US8015060B2 (en) | 2002-09-13 | 2011-09-06 | Visa Usa, Inc. | Method and system for managing limited use coupon and coupon prioritization |
US8407083B2 (en) | 2003-09-30 | 2013-03-26 | Visa U.S.A., Inc. | Method and system for managing reward reversal after posting |
US8429048B2 (en) | 2009-12-28 | 2013-04-23 | Visa International Service Association | System and method for processing payment transaction receipts |
US8554610B1 (en) | 2003-08-29 | 2013-10-08 | Visa U.S.A. Inc. | Method and system for providing reward status |
US8626577B2 (en) | 2002-09-13 | 2014-01-07 | Visa U.S.A | Network centric loyalty system |
US9852437B2 (en) | 2002-09-13 | 2017-12-26 | Visa U.S.A. Inc. | Opt-in/opt-out in loyalty system |
US11132691B2 (en) | 2009-12-16 | 2021-09-28 | Visa International Service Association | Merchant alerts incorporating receipt data |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2756975B1 (fr) * | 1996-12-05 | 1999-05-07 | Solaic Sa | Circuit integre ayant une face active recouverte d'une couche isolante et carte a circuit integre le comportant |
FR2769130B1 (fr) * | 1997-09-30 | 2001-06-08 | Thomson Csf | Procede d'enrobage d'une puce electronique et carte electronique comportant au moins une puce enrobee selon ce procede |
FR2796759B1 (fr) * | 1999-07-23 | 2001-11-02 | Gemplus Card Int | Minicarte a circuit integre et procede pour son obtention |
FR2817656B1 (fr) * | 2000-12-05 | 2003-09-26 | Gemplus Card Int | Isolation electrique de microcircuits regroupes avant collage unitaire |
DE10340129B4 (de) * | 2003-08-28 | 2006-07-13 | Infineon Technologies Ag | Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben |
FR2939221B1 (fr) * | 2008-11-28 | 2010-11-26 | Sagem Securite | Carte a puce comportant un module electronique porte par un corps de carte pourvue de moyens d'authentification de l'appairage du module avec le corps |
AT12741U1 (de) * | 2011-03-10 | 2012-10-15 | Forster Verkehrs Und Werbetechnik Gmbh | Anordnung mit elektrischen/elektronischen bauteilen |
MY195079A (en) * | 2016-03-01 | 2023-01-09 | Cardlab Aps | A Circuit Layer For An Integrated Circuit Card |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0246744A2 (fr) * | 1986-05-20 | 1987-11-25 | Kabushiki Kaisha Toshiba | Carte à circuit intégré et son procédé de fabrication |
DE3917707A1 (de) * | 1989-05-31 | 1990-12-06 | Siemens Ag | Elektronisches modul und verfahren zu seiner herstellung |
FR2671417A1 (fr) * | 1991-01-04 | 1992-07-10 | Solaic Sa | Procede pour la fabrication d'une carte a memoire et carte a memoire ainsi obtenue . |
EP0627707A1 (fr) * | 1991-12-02 | 1994-12-07 | SOLAIC (société anonyme) | Procédé de fabrication d'une carte à mémoire et carte à mémoire ainsi obtenue |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4344297A1 (de) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten |
-
1995
- 1995-06-12 FR FR9506913A patent/FR2735284B1/fr not_active Expired - Fee Related
-
1996
- 1996-01-09 KR KR1019970708724A patent/KR19990022245A/ko not_active Application Discontinuation
- 1996-01-09 AU AU44914/96A patent/AU4491496A/en not_active Abandoned
- 1996-01-09 MX MX9709940A patent/MX9709940A/es not_active IP Right Cessation
- 1996-01-09 BR BR9603590A patent/BR9603590A/pt not_active Application Discontinuation
- 1996-01-09 RU RU98100354/09A patent/RU2172017C2/ru not_active IP Right Cessation
- 1996-01-09 JP JP9502677A patent/JP2000500251A/ja active Pending
- 1996-01-09 EP EP96901032A patent/EP0832499A1/fr not_active Withdrawn
- 1996-01-09 WO PCT/FR1996/000030 patent/WO1996042109A1/fr not_active Application Discontinuation
- 1996-01-09 CN CN96194764A patent/CN1114947C/zh not_active Expired - Fee Related
- 1996-01-09 CA CA002220636A patent/CA2220636A1/fr not_active Abandoned
- 1996-05-24 US US08/653,314 patent/US5753901A/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0246744A2 (fr) * | 1986-05-20 | 1987-11-25 | Kabushiki Kaisha Toshiba | Carte à circuit intégré et son procédé de fabrication |
DE3917707A1 (de) * | 1989-05-31 | 1990-12-06 | Siemens Ag | Elektronisches modul und verfahren zu seiner herstellung |
FR2671417A1 (fr) * | 1991-01-04 | 1992-07-10 | Solaic Sa | Procede pour la fabrication d'une carte a memoire et carte a memoire ainsi obtenue . |
EP0627707A1 (fr) * | 1991-12-02 | 1994-12-07 | SOLAIC (société anonyme) | Procédé de fabrication d'une carte à mémoire et carte à mémoire ainsi obtenue |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6848617B1 (en) | 1998-01-27 | 2005-02-01 | Infineon Technologies Ag | Smart card module for biometric sensors |
WO2001018862A1 (fr) * | 1999-09-03 | 2001-03-15 | Gemplus | Micromodule electronique et procede de fabrication et d'integration de tels micromodules pour la realisation de dispositifs portatifs |
FR2798225A1 (fr) * | 1999-09-03 | 2001-03-09 | Gemplus Card Int | Micromodule electronique et procede de fabrication et d'integration de tels micromodules pour la realisation de dispositifs portatifs |
WO2002050905A1 (fr) * | 2000-12-21 | 2002-06-27 | Gemplus | Connexion par isolant decoupe et cordon imprime en plan |
FR2818802A1 (fr) * | 2000-12-21 | 2002-06-28 | Gemplus Card Int | Connexion par isolant decoupe et cordon imprime en plan |
US8010405B1 (en) | 2002-07-26 | 2011-08-30 | Visa Usa Inc. | Multi-application smart card device software solution for smart cardholder reward selection and redemption |
US10460338B2 (en) | 2002-09-13 | 2019-10-29 | Visa U.S.A. Inc. | Network centric loyalty system |
US9852437B2 (en) | 2002-09-13 | 2017-12-26 | Visa U.S.A. Inc. | Opt-in/opt-out in loyalty system |
US8626577B2 (en) | 2002-09-13 | 2014-01-07 | Visa U.S.A | Network centric loyalty system |
US8239261B2 (en) | 2002-09-13 | 2012-08-07 | Liane Redford | Method and system for managing limited use coupon and coupon prioritization |
US8015060B2 (en) | 2002-09-13 | 2011-09-06 | Visa Usa, Inc. | Method and system for managing limited use coupon and coupon prioritization |
US7827077B2 (en) | 2003-05-02 | 2010-11-02 | Visa U.S.A. Inc. | Method and apparatus for management of electronic receipts on portable devices |
US7987120B2 (en) | 2003-05-02 | 2011-07-26 | Visa U.S.A. Inc. | Method and portable device for management of electronic receipts |
US7725369B2 (en) | 2003-05-02 | 2010-05-25 | Visa U.S.A. Inc. | Method and server for management of electronic receipts |
US9087426B2 (en) | 2003-05-02 | 2015-07-21 | Visa U.S.A. Inc. | Method and administration system for management of electronic receipts |
US8386343B2 (en) | 2003-05-02 | 2013-02-26 | Visa U.S.A. Inc. | Method and user device for management of electronic receipts |
US8554610B1 (en) | 2003-08-29 | 2013-10-08 | Visa U.S.A. Inc. | Method and system for providing reward status |
US8793156B2 (en) | 2003-08-29 | 2014-07-29 | Visa U.S.A. Inc. | Method and system for providing reward status |
US7857216B2 (en) | 2003-09-12 | 2010-12-28 | Visa U.S.A. Inc. | Method and system for providing interactive cardholder rewards image replacement |
US7857215B2 (en) | 2003-09-12 | 2010-12-28 | Visa U.S.A. Inc. | Method and system including phone with rewards image |
US8005763B2 (en) | 2003-09-30 | 2011-08-23 | Visa U.S.A. Inc. | Method and system for providing a distributed adaptive rules based dynamic pricing system |
US8407083B2 (en) | 2003-09-30 | 2013-03-26 | Visa U.S.A., Inc. | Method and system for managing reward reversal after posting |
US8244648B2 (en) | 2003-09-30 | 2012-08-14 | Visa U.S.A. Inc. | Method and system for providing a distributed adaptive rules based dynamic pricing system |
US9141967B2 (en) | 2003-09-30 | 2015-09-22 | Visa U.S.A. Inc. | Method and system for managing reward reversal after posting |
US9710811B2 (en) | 2003-11-06 | 2017-07-18 | Visa U.S.A. Inc. | Centralized electronic commerce card transactions |
US7653602B2 (en) | 2003-11-06 | 2010-01-26 | Visa U.S.A. Inc. | Centralized electronic commerce card transactions |
US11132691B2 (en) | 2009-12-16 | 2021-09-28 | Visa International Service Association | Merchant alerts incorporating receipt data |
US8429048B2 (en) | 2009-12-28 | 2013-04-23 | Visa International Service Association | System and method for processing payment transaction receipts |
US8650124B2 (en) | 2009-12-28 | 2014-02-11 | Visa International Service Association | System and method for processing payment transaction receipts |
Also Published As
Publication number | Publication date |
---|---|
MX9709940A (es) | 1998-03-31 |
US5753901A (en) | 1998-05-19 |
CN1114947C (zh) | 2003-07-16 |
RU2172017C2 (ru) | 2001-08-10 |
CA2220636A1 (fr) | 1996-12-27 |
BR9603590A (pt) | 1999-06-01 |
FR2735284A1 (fr) | 1996-12-13 |
CN1187905A (zh) | 1998-07-15 |
FR2735284B1 (fr) | 1997-08-29 |
AU4491496A (en) | 1997-01-09 |
EP0832499A1 (fr) | 1998-04-01 |
KR19990022245A (ko) | 1999-03-25 |
JP2000500251A (ja) | 2000-01-11 |
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