WO1996034303A1

WO1996034303A1 - Material for forming color-filter protecting film and color-filter protecting film

Info

Publication number: WO1996034303A1
Application number: PCT/JP1996/001117
Authority: WO
Inventors: Kazuhiro Watanabe; Koichi Fujishiro
Original assignee: Nippon Steel Chemical Co., Ltd.; Nippon Steel Corporation
Priority date: 1995-04-27
Filing date: 1996-04-24
Publication date: 1996-10-31
Also published as: JP3909349B2; KR19990008104A; KR100417605B1

Abstract

A material for forming a color-filter protecting film, comprising an epoxy resin (A) of general formula (1) (wherein R1 and R2 are each hydrogen or C1-C5 alkyl; and n is 0 to 20) and, if necessary, an at least difunctional epoxy resin (B) other than the epoxy resin (A) and/or an acidic curing agent (C). This material can form a color-filter protecting film being excellent in heat resistance, transparency, hardness, adhesion, resistance to chemicals (such as acid, alkali and solvents), water resistance and particularly excellent in evenness, and enables the production of a color filter provided with such a protecting film.

Description

Specification

Material for color filter protective film formation and color filter-protective film technology field

The present invention relates to a color filter protective film forming material suitable for forming a color filter protective film of a liquid crystal display element, and a color filter formed using the same. -Filters Regarding protective films. Background technology

Conventionally, in order to improve the image quality of the color LCD display, the steps of the color filter are made flat, and after the color filter is made, In this process, a protective film is provided on the surface to protect the color filter against heat treatment and chemical treatment under high temperature. Yes.

In this regard, the performance required of such a color filter protective film is not only heat resistance and chemical resistance, but also the color filter type. Adhesion with glass substrates and the like, flatness, high hardness and the like are mentioned. Among these, regarding the heat resistance, when a transparent electrode such as ITO (indium tin oxide) is formed on the protective film by the sputtering method, the protective film is formed. Of 200 ° C or more, or 250 ° C when baking the liquid crystal alignment film on ITO, and 270 ° C when coping with ferroelectric liquid crystal. Is required, and it is required to be stable under these temperature conditions. As resins for forming such a protective film, at present, acrylate resins, melamine resins, and polyimide resins (Japanese Patent Application Laid-Open No. No. 63371), epoxy resin (Japanese Patent Application Laid-Open No. Hei 4-170421), and the like.

O

However, none of these conventional resins for protective films have completely satisfied all of the conditions required for protective films. Cryogenic resin has low heat resistance, low hardness and insufficient hardness, and unreacted light and thermal polymerization initiator are likely to evaporate as little as IT0 spatter with high vacuum. In other words, this evaporated substance contaminates the surface of the protective film, and also reduces the physical properties such as adhesion of ITO.o

In addition, the melamine resin has a three-dimensional network structure, has good heat resistance, and is unlikely to generate wrinkles and cracks during I τ 0 sputtering. Despite the advantages, poor wettability with glass substrates and color filters, poor coatability, and consequent loss of flatness of the formed protective film There is a problem.

Polyimide resin is also said to be excellent in heat resistance, but inferior in transparency and inevitable in image quality.

Epoxy resin, on the other hand, has good adhesion to glass substrates and provides a protective film with excellent transparency and chemical resistance, but tends to repel during coating, resulting in poor coatability. And consequently flatness And it is difficult to balance heat resistance. Therefore, it has been proposed to solve this fundamental problem of poor applicability by using a high molecular weight polymer as a base resin, but it is still cured to form a protective film. After formation, the flatness between pixels of the color filter is inferior, and the flatness as a protective film of the color filter cannot be sufficiently solved.

Furthermore, it has excellent transparency, heat resistance, and mechanical strength as a sealing resin for elements and electronic components that require transparency, such as light-electricity return devices such as light-emitting devices and light-receiving devices. The epoxy resin composition (Japanese Patent Publication No. 7-911365) and the cured coating film have a high heat distortion temperature, and have heat resistance, moisture resistance, hardness, plating resistance, and chemical resistance. Also, a solder resist ink composition having excellent electrical insulation properties and the like (JP-A-4-345673) has been proposed. However, even with these resin compositions, the former has a problem that the planarizing ability is poor as a coating agent, and the latter has a problem.問題 There is a problem that it is easy to discolor during heat treatment, and none of them has been able to satisfy all the conditions required for the use of color filters

In addition, an acrylic resin composition having excellent heat resistance has been proposed (Japanese Patent Application Laid-Open No. 4-36631), but this resin is a heat polymerization initiator or a photopolymerization initiator. Due to the addition of the initiator, there is a problem that the unreacted polymerization initiator becomes a transpiration in the IT0 spattering process with a high vacuum.

In addition, Japanese Patent Application Laid-Open No. 6-192394 discloses a low-shrinkage epoxy resin composition. It is intended for use as an adhesive.

The present invention has been made in view of such a viewpoint, and an object of the present invention is to provide a material for forming a color filter protective film having excellent flatness. Another object of the present invention is to provide a resin composition.

Another object of the present invention is to use an epoxy resin composition, which is a material for forming a color filter protective film having such flatness, to provide heat resistance. It is also excellent in terms of transparency, hardness, adhesion, chemical resistance (acid resistance, alkali resistance, solvent resistance), water resistance, etc., and provides a high quality liquid crystal display device. To provide a color filter protective film that can be removed

That is, the present invention provides: (A) the following general formula (1)

(Wherein, R and R ₂ represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and n represents a number of 0 to 20). And a material for forming a color filter protective film.

Further, the present invention provides a material for forming a color filter and a protective film, comprising (A) the epoxy resin of the general formula (1) and (C) an acidic curing agent. .

Further, the present invention provides (A) an epoxy resin represented by the general formula (1) and (B) an epoxy resin other than the epoxy resin (A), wherein the epoxy resin is bifunctional or more. A material for forming a color filter protective film, comprising the epoxy resin described above and (C) an acidic curing agent.

Further, the present invention provides a color filter-protective film formed by applying and curing such a material for forming a color filter protective film, or a color filter-protective film. A color filter provided with such a color filter protective film.

In the present invention, the divalent alcohol component (diol component) present in the above-mentioned general formula (1), which is the component A, generally has the following general formula (2)

(Wherein, and R ₂ are the same as those in the general formula (1)) The geological components such as those derived from geoles represented by the formula (1) are dependent on the geoles used as raw materials. Specific examples of the geoles include, for example, 9, 9-vis (4-hydroxyfenyl) phenolic, 9, 9 —Bis (3—Methyl 1—4—Hydroxy) 2 9 9 9 (2) It is possible to include phenol

The method for producing the epoxy resin represented by the general formula (1) of the component A is the same as the method for synthesizing a general epoxy resin. The polyols are heated and dissolved together with an appropriate amount of epichlorohydrin to polymerize.

In the general formula (1) for the A component, the average number of repetitions n is in the range of 0 to 20, preferably 0 to 2, and when the n force exceeds 20, the resin becomes The melt viscosity and the viscosity as a solution become so high that it becomes difficult to handle.

Specific examples of the epoxy resin represented by the general formula (1) of the component A used in the present invention include, for example, a resin having an epoxy equivalent of 256 when R,, R ₂ = H. Doepoxy resin (trade name: ESF-300, manufactured by Nippon Steel Chemical Co., Ltd.) can be mentioned.

The material for forming a color filter protective film of the present invention is an epoxy resin composition containing the epoxy resin (A component) represented by the general formula (1). The other essential component in the composition is an epoxy resin curing agent, and any known curing agent can be used, and the amount of the curing agent can be reduced. Within the known range Good. In addition to this epoxy resin, a better color filter can be obtained by including other epoxy resins and a specific acidic curing agent. It can be used as a material for forming a protective film. That is, the epoxy resin (A component) of the general formula (1) may be added to the epoxy resin other than the epoxy resin of the A component (component B) or acid hardened. An agent (component C) is blended. Examples of the components B and C include the following.

The epoxy resin as the component B of the present invention may be any epoxy resin other than the epoxy resin as the component A, and may be a bifunctional or more functional epoxy resin. Although not particularly limited, aromatic epoxy resins are preferably used from the viewpoint of maintaining the heat resistance, which is a characteristic of the A-component epoxy resin. Is an alicyclic epoxy resin, such as bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, and vinyl resin. Volatile epoxy resin, Creso-no-reno Volak-type epoxy resin, 3, 4-Epoxy cyclohexyl methyl -3, 4-Epoxy Glycidyl ester resin, polycarbonate, etc. Polypropylene resin, aliphatic epoxy resin, etc. can also be mixed. These may be mixed with oligomeric units during the formation of the grissile ether, but there is no problem in the performance of the material.

In addition, the epoxy resin of the B component has a viewpoint of improving flatness and, at least, preferably on a color filter. Melts below the curing temperature after application Or a liquid at room temperature. Specific examples of such a B component epoxy resin include liquid bisphenol A epoxy resins and bisphenol F epoxy resins. Pox resin, 3,4—Epoxy cyclohexyl methacrylate 1,3,41 Epoxy mouth hexyl carboxylate and the like.

When compounding a bifunctional or higher epoxy resin, which is the component B, the amount of the component is not more than 400 parts by weight based on 100 parts by weight of the component A epoxy resin. It is. If the amount exceeds 400 parts by weight, the inherent properties of the epoxy resin of the component A will deteriorate, and as a result, heat resistance, water resistance and flatness will be impaired.

Next, as the acidic curing agent for the epoxy resin which is the component c, specifically, polyvalent carboxylic acids composed of polyvalent carboxylic acid and its acid anhydride, Examples include polyvalent phenols having a phenolic hydroxyl group.

In the present invention, polyvalent carboxylic acids that can be used as the component C include, for example, polycarboxylic acids such as itaconic acid, Succinic acid, phthalanoic acid, tetrahydrofuranoic acid, hexahydrophthalic acid, methylendmethylentetrahydrophthalanoic acid, Chlorendic acid, trimellitic acid, etc. can be mentioned, and as polyvalent carboxylic anhydride, succinic anhydride, itaconic anhydride , Phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, meth ylene oleic anhydride methyl methane hydrophthalate Oleic acid, water-free chlorendic acid, methyl phenol tetrahydro anhydride, etc. , Trimethylitic anhydride, pyromellitic anhydride, benzophenonecentra carboxylic acid dianhydride, biphenyl tetracarboxylic acid Aromatic polycarboxylic anhydrides such as dianhydride and biphenyl ether tetracarboxylic dianhydride can be mentioned.

Examples of polyvalent phenols that can be used as the C component include, for example, phenol phenolic resin and cresol phenolic resin. And other various aromatic bisphenol compounds.

With regard to the polyvalent carboxylic acids and polyvalent phenols used as the above-mentioned acidic curing agent, only one type can be used alone, or two or more types can be used in combination. > O

The curing agent for the epoxy resin may be, for example, disocyanide, an imidazole compound, a triazine derivative, a perylene compound, or an aromatic amine compound. However, in the present invention, there is a problem of discoloration upon heating (heating) and a problem of deterioration of moisture resistance. It is advantageous to use

The mixing ratio of the acidic curing agent as the component C is preferably (A) + (B): (C) = 100 parts by weight: 1 to 100 parts by weight. More preferably, (A) + (B): (C) = 100 parts by weight: in the range of 5 to 80 parts by weight.

If the amount of the acidic curing agent, which is the component C, is less than 1 part by weight, the curing will be insufficient, and the chemical resistance and hardness will be inferior.原因 The cause of the decrease in Become.

The combination of the above-mentioned components A, B and C is effective in any combination as long as the compatibility is not hindered during the preparation of the composition, and is appropriately selected according to the application.

When the epoxy resin composition as the material of the present invention is used as a coating agent, it should be diluted with a solvent for the purpose of viscosity adjustment and the like. I can do it. Solvents used for this purpose are not particularly limited as long as they dissolve these A, B, and C components and do not react with these components. Instead, various solvents can be used. For example, ketones such as methylethylenoketone, methylenzoisobutylenoketone, etc., methylonecellonelone, methylonecellonelone, etc. Cellophanes such as butanol, cellulose, cellulose acetate, etc., ethylene glycol, etc., polyethylene, ethylene, etc. Ethers such as glycol jets, polyethylenes, etc., ethers such as polyesters, abbactylactones, etc. Lactones and the like.

The epoxy resin composition may further include a curing accelerator, a filler for improving reliability and moisture resistance, and a repellent for enhancing flatness during coating, if necessary. It is possible to mix additives such as anti-foaming agents, anti-foaming agents to eliminate air bubbles that are expected to occur during application and vibration, and silane coupling agents to improve adhesion. Wear.

Examples of the curing accelerator include amide compounds, imidazole compounds, and 1,8-diazabicyclo (5,4,0) diamine. Decene 17 and its salts, boron trifluoride amine complex, organic sulfonium salts that generate oleic acid by heat, carboxylic acids,ヱ Knols, quaternary ammonium salts or compounds containing a methylol group, etc., which are used in combination with a small amount to heat the coating film Thereby, various properties such as heat resistance, solvent resistance, acid resistance, adhesion, electrical properties, and hardness of the obtained cured product can be improved.

Examples of the filler include glass filler, silica, mica, and alumina. In addition, an antifoaming agent and a leveling agent are used. Examples thereof include a silicon-based compound, a fluorine-based compound, and an acrylic-based compound, and these can be added as appropriate according to the purpose. .

Furthermore, the mixing of a silane coupling agent is very effective in improving the adhesion, and a functional silane coupling agent is particularly preferred. . The functional silane coupling agents include vinyl, methacryloyl, hydroxyl, amino, isocyanate, and epoxy groups. Those having a reactive substituent such as a xyl group are desirable.

The material for forming a color filter protective film of the present invention comprises the above-mentioned component A, component B, and component C for the purpose, use, and production process of the color filter. Taking into account the conditions (coating method, temperature, etc.), mix them within the above mixing ratio, and further dilute with a solvent as necessary, and then use a curing accelerator, filler, leveling agent It is prepared as a material for forming a protective film by adding an antifoaming agent, a silane coupling agent and the like.

The color filter of the present invention prepared in this manner. The material for forming the protective film is applied to the surface of the color filter, and is cured by heating to form the protective film for the color filter. And can be done.

The method of applying the material of the present invention to the surface of a color filter may be a solution dipping method, a spray method, a roller-coating machine or a runner. Any method, such as using one DOCOMO or one spinner, can be used.

The color filter to be applied may be glass or transparent film (for example, polycarbonate, polyethylene terephthalate, poly terephthalate). (A color filter) in which a colored and cured film is laminated on a substrate made of glass, etc., and a substrate made of glass / transparent film. A transparent electrode made of ITO, metal, or the like is deposited on the electrode, and a patterned color fin- olator or the like can be used. In addition, a color filter formed by any known method such as an electrodeposition method, a dyeing method, a pigment dispersion method, and a printing method as a method for forming a colored film. Can also be used.

Next, using the color filter protective film forming material of the present invention, a color filter provided with the color filter protective film of the present invention is manufactured. A typical method will be described.

First, a lattice black matrix is formed by using a resin black or a chromium vapor deposition film as a medium for forming a color filter. Red, blue and green, and one ink on the entire surface of the glass substrate using a spinner, lone recorder, etc., and apply the paint And evaporate the solvent. Next, through a photomask that has formed the desired pattern, Perform contact exposure using an ultra-high pressure mercury lamp, develop the unexposed area with an alkaline developer such as 1% sodium carbonate aqueous solution, and then wash with water. Then, the coating is post-cured at an appropriate temperature, for example, 200 ° C., and the coating is completely dried to form the first color filter pixels. Then, using ink having one of the remaining two colors and one of the pigments, follow the same procedure as above to form the first color filter. A pixel of a second color reflector is formed adjacent to the pixel. Further, the ink having the remaining one-color pigment is used, and similarly, the pixels of the third color filter are formed, and the three primary color filters, the color filter, and the like are formed. To obtain pixels.

The color filter protective film forming material of the present invention may be applied to the surface of the color filter thus formed by any method, for example, spin coating, dicing. Coat with a coating method such as coating or bar coating.

After coating the color filter protective film forming material, a pre-bake treatment is performed if a solvent evaporation and drying step is required. The heat treatment conditions at that time are usually 80 to 150 and 1 to 30 minutes. Post bake treatment for curing the epoxy resin is usually performed by heat treatment at 100 to 250 ° C for 10 to 120 minutes. After the coating is completely dried and cured, the surface of the color filter has the desired heat resistance, transparency, adhesion, surface hardness, flatness, water resistance, chemical resistance A color filter protective film having excellent properties and the like is formed, and a power filter provided with the color filter protective film of the present invention is obtained. Further, a transparent electrode such as ITO is deposited on this surface, and if necessary, the electrode is etched to form a pattern, and further an alignment film is formed. It is used as a color filter in liquid crystal display panels.

The material for forming a color filter protective film of the present invention can be suitably used as a coating material, and is particularly suitable for a liquid crystal display device or a photographing device. As a material for a color filter protective film used in the device, and as a color filter protective film formed using the same, furthermore, Useful for the preparation of color filters with a color filter protective film such as

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is an explanatory sectional view of a power filter provided with a color filter protective film of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described specifically based on examples and comparative examples.

Examples 1 to 6 and Comparative Examples 1 to 2

A component, B component and C component, and if necessary, an additive and an organic solvent are mixed to form a color filter protective film having the composition (mass part) shown in Table 1 respectively. An epoxy resin composition was prepared.

Next, spin-coating is performed on a glass substrate that has been degreased and washed using the epoxy resin composition for forming a color filter protective film. — Coat with a coater, dry in an oven at 80 ° C for 5 minutes, and heat dry at 200 ° C for 60 minutes using a hot air drier to cure. I got it. The final film thickness after curing was about 2 m.

The obtained cured films of Examples and Comparative Examples were evaluated for adhesion to a substrate, heat-resistant transparency, hardness, and flatness.

Table 1 shows the results.

These physical properties were measured by the following methods and conditions.

(1) Adhesion with substrate

① After heat curing

② After heat resistance test (250 hours for 3 hours)

③ After moisture resistance test (120, R R 90%, 36 hours)

密着 Adhesion after chemical immersion

Acid resistance (a) 5% H C 1, 24 hours

Alkali resistance: (b) 5% Na0Η, 24 hours soaking

(c) 4% K 0 H, 50 ° C-10 min (d) 1% Na 0 H, 80 ° C-5 min Solvent resistance (e) NMP, 40 ° C-10 min

(f) N P, 80 ° C — 5 min

(NMP: N—methylpyrrolidone)

Insert a crosscut so as to make 100 grids, then perform a peeling test using a cello tape, and visually observe the separation of the grids. I evaluated it. The ranking of the evaluation is as follows ο

〇: For which no separation is observed X: Some separation is recognized

(2) Heat-resistant transparency (measurement of light transmittance)

The film cured by heating at 200 ° C. for 60 minutes was placed in an oven at 250 ° C. for 3 hours, and the state of the obtained coating film was evaluated. The same glass plate coated with the coating film was used as a reference, and the absorption spectrum at a wavelength of 400 to 800 nm after the heat resistance test was measured. Was.

The ranking of the evaluation is as follows.

〇: 90% or more in all areas without any abnormal appearance of the coating film.

: Separation, coloring, etc. on the appearance of the coating film, 900

(3) Hardness of coating film

The hardness of the coating film heated at 200 ° C for 60 minutes was measured according to the test method of JIS-K540. In the measurement, when a load of 1 kg was applied using a pencil hardness tester, the highest hardness value at which the coating film was not scratched was indicated. The pencil used

"Mitsubishi Hyuni".

(4) Flatness test

As shown in Fig. 1, a glass substrate 1 washed with a neutral detergent, water, isopropyl alcohol, and a nozzle was used as the transparent substrate. A black deposition film (0.1 m or less in thickness) 2a is formed by applying a chromium vapor deposition film on the A red pixel (R), a green pixel (G), and a blue pixel (B) are formed using the three types of inks of green, blue, and blue to form a color pixel. , 'Turn. At this time, The baking was performed at 80 ° C for 5 minutes, and the development was performed using a 0.4% by weight aqueous solution of sodium carbonate. In addition, the application order was such that pixels 2b were formed at predetermined positions in the order of red (R) -green (G) -blue (B). At this time, the film thickness of each pixel 2b is about 1.5 / zm, and the film thickness (1.5m) of each pixel 2b is almost the same as the step D before application. Was measured.

Next, the color filter-protective film forming material of each of the examples and the comparative examples is applied on the color filter patterns thus formed. And heat-cured to form a 2 m-thick rough-finoleter protective film 2c, and remove the step d remaining on the surface of the color filter protective film 2c. It was measured.

Furthermore, an ITO transparent electrode layer 2d is formed on the formed color filter protective film 2c by a sputtering method, and the ITO transparent electrode layer 2d is formed on the ITO transparent electrode layer 2d. An alignment film 2 e was formed to form a color finalizer 2.

In this color filter 2, the coating surface (black matrix 2a) before applying the color filter protective film forming material forming the protective film 2c is applied. And the step (before application D) on the upper surface of the pixel 2b) and the step remaining on the surface of the protective film 2c (step d after application) according to the step D before application, and The flatness was evaluated based on the value of the step d after application with respect to the step D before application. The results are shown in Table 1 below. [Table 1] Example

Composition (parts by weight) 1 2 3 4

A component ESF-300 * ¹ '90 34 25 25

B component: celloxide 2021 P * 5 61 75 75

Webb 1009 * 5 5-one

C component Anhydrous M 7 Tonic acid 40 40 40 100 Siraace 510S * ⁵¹ 1 1 1 1

707-G 'FC-430 * ⁶¹ 0.2 0.2 0.2 0.2 0.2 Digrim * 300 300 300 430

① After heat curing 〇〇〇〇

②After heat resistance test 〇〇〇〇

③ After moisture resistance test 〇〇〇密 Dense

④ Chemical immersion (a) 〇〇〇〇 After soaking

Object (b) 〇〇〇〇

(c) 〇〇〇〇

(d) 〇〇〇性 ((e) 〇〇〇〇

(f) 〇〇〇耐熱 Heat resistant transparency 〇〇〇〇 Hardness 5H 4H 4H 5H Step before application D (μηι) 1.5.1.5.1.5 I.5 Step after application d (μη) 0.05 0. 03 0, 07 0. 08

Example Comparative Example Composition (parts by weight) 5 6 1 2

A component: ESF-300 * ^{1 1} 90 34 B component Ebicoat 828 * ² ) 34 50

': Celoxite' 2021 P * 3i

5 61 61-

Four )

Webb 1009 *--5 50

C component 7R methylendmethylene

Tetra-t-drofuric acid 40

": Evening Manor 752 * ⁸ > 30

Syllaace 510S * ⁵¹ 1 1 1 1 Flat D'FC-430 * ^6> 0.2 0.2 0.2 0.2 0.2

7)

Ziglyme * 300 300 300 300

① After heat curing 〇〇〇〇

②After heat resistance test 〇〇 X X

③ After moisture resistance test 〇〇 X 〇 dense

④ Chemical immersion (a) 〇〇〇後 After immersion

Object (b) 〇〇 X 〇

(c) 〇〇〇〇

(d) 〇〇 X 〇 (e) 〇〇〇〇

(f) 〇〇〇 X Thermal transparency 〇〇 XX Hardness 4H 4H 4H 4H Step before application D (μτη) 1.5.1.5 1.5 1.5 Step after application d (μη) 0.07 0.09 0.20 0.30

(Note) ") Epoxy resin of general formula (1) (R, R ₂ = H, manufactured by Nippon Steel Chemical Co., Ltd.)

Bisphenol A type epoxy resin (epoxy equivalent: 190, Yuka Shell Epoxy Co., Ltd.)

Alicyclic epoxy resin, resin equivalent, 134, manufactured by Daicel Chemical Industries, Ltd.)

* 4) Bisphenol A type epoxy resin (Epoxy 1: 2660, Eichshell Epoxy ㈱) * 5): Silane power, Bring ij, * 6): Leveling ij, * 7): Diethylene glycol dimethyl ether

* 8): Nornovala resin (hydroxyl equivalent: 104, manufactured by Arakawa Chemical Co., Ltd.) As is clear from the results shown in Table 1, the epoxy resin compositions according to Examples 1 to 6 of the present invention. It was confirmed that the color filter protective film formed using the material had excellent adhesion, heat resistance, and flatness.

In addition, the epoxy resin composition of Comparative Example 1 uses the epoxy resin of the general formula (1), which is the component A, as a bisphenol A type epoxy resin. The composition was the same as that of Example 2 except that the composition was changed, and the epoxy resin composition of Comparative Example 2 was further obtained by adding the B component to an alicyclic ester type epoxy resin. Although they were replaced, all of them were inferior in adhesion, heat resistance and flatness as compared with the examples.

Industrial applicability

The material for forming a color filter protective film of the present invention has excellent coatability, and the color filter protective film formed by using the material has heat resistance, Excellent in adhesion, surface hardness, water resistance, flatness, etc.

Therefore, the color filter protective film forming material and the color filter protective film of the present invention provide a high-quality and highly reliable power color filter. Liquid crystal display, liquid crystal display, color fax, power line image sensor, etc. It is extremely useful for the production of

Claims

The scope of the claims

(1) (A) The following general formula (1)

(Wherein, R, and R ₂ represent a hydrogen atom or a carbon atom of 1 to

Wherein n represents an alkyl group, and n represents a number from 0 to 20.) A material for forming a color filter protective film, characterized by containing an epoxy resin represented by the following formula:

(2) (A) The following general formula (1)

(Wherein, R and R ₂ represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and n represents a number of 0 to 20). A material for forming a color filter protective film, characterized by containing a silicone resin and (C) an acidic curing agent.

(3) The acidic curing agent is at least one compound selected from polyvalent carboxylic acids, polyvalent carboxylic anhydrides and polyphenols. The material for forming a color filter protective film according to claim 2.

(4) (A) The following general formula (1)

(Wherein, R and R 2 represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and n represents a number of 0 to 20). A resin comprising: (B) an epoxy resin other than the above-mentioned epoxy resin (A), a bifunctional or more functional epoxy resin; and (C) an acidic curing agent. A material for forming a protective film, which is characterized by:

(5) The acidic curing agent is at least one compound selected from polyvalent carboxylic acids, polyvalent oleic anhydrides and polyphenols. Item 4. The material for forming a color fusible film protective film according to Item 4.

(6) The color filter protective film formed by applying and curing the material for forming the color filter protective film according to claim 1, 2 or 4.

(7) The color finalizer described in claim 1, 2 or 4 A material for forming a protective film is applied on a color filter, and the color filter is formed by curing the material for forming a protective film. A force-finalizer characterized by having a protective film.