WO1996009738A1 - Electric heating element - Google Patents

Electric heating element Download PDF

Info

Publication number
WO1996009738A1
WO1996009738A1 PCT/CH1995/000208 CH9500208W WO9609738A1 WO 1996009738 A1 WO1996009738 A1 WO 1996009738A1 CH 9500208 W CH9500208 W CH 9500208W WO 9609738 A1 WO9609738 A1 WO 9609738A1
Authority
WO
WIPO (PCT)
Prior art keywords
heating element
element according
carrier
electric heating
heat
Prior art date
Application number
PCT/CH1995/000208
Other languages
German (de)
French (fr)
Inventor
Dusko Maravic
Original Assignee
Negawatt Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27172084&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO1996009738(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Negawatt Gmbh filed Critical Negawatt Gmbh
Priority to DK95930361T priority Critical patent/DK0783830T3/en
Priority to AU33786/95A priority patent/AU3378695A/en
Priority to EP95930361A priority patent/EP0783830B1/en
Priority to DE59506182T priority patent/DE59506182D1/en
Publication of WO1996009738A1 publication Critical patent/WO1996009738A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds

Definitions

  • the invention relates to an electrical heating element with the features of the preamble of claim 1.
  • the heating element according to the invention is used in particular as a thermal shock-resistant plate heat exchanger, in particular as a plate.
  • WO 91/10336 describes an electrical heating element which includes an electrically insulating support and an electrically conductive layer u attached thereon, electrical contacts being attached to the electrically conductive layer.
  • Amorphous or polycrystalline silicon is used as the conductive layer.
  • the conductive layer when flowing through the heat, generates heat that is emitted directly to the support.
  • the carrier although electrically insulating, has heat-conducting properties. That is why beryllium oxide or aluminum nitrate is used in this publication as a carrier.
  • This carrier must therefore be dimensioned relatively small. It typically has a thickness of 1 mm and a cross-sectional area of 5 cm '.
  • a heat-conducting, preferably metallic body which absorbs the heat generated and thus acts as a so-called heat sensor. This body is generally formed by a massive plate.
  • the bracket must ensure that the support plates move relative to the heat sink be temperature changes and still be in good contact with it.
  • beryllium oxide or aluminum nitride as carrier plates has further disadvantages.
  • beryllium oxide is highly toxic and must therefore be covered with a protective layer.
  • the use of such heating elements in the household is unthinkable because of their toxic properties.
  • aluminum nitride is not hot water resistant. This heating element also had to be covered with a protective layer, at least in the household area. Both materials also have a low impact resistance, so they are easily damaged.
  • the heating element according to the invention has the advantage that it no longer has to be coupled to a further solid support serving as a heat sink, but rather that it can emit the heat generated directly to the object to be heated. Characterized the heating element is on the one hand simplifies BAULI c h and technically more feasible the instrumentss ⁇ other hand st degree increases.
  • the heating surface load for the heating element according to the invention is in relation to the plate-shaped and massive support and not like the heating elements known from 91/10336 with regard to the small support plates.
  • the electrically insulating support consists of silicon nitride (S13N4).
  • This materia has high thermal shock resistance, high impact resistance and good hot water resistance, is harmless to health, hardly undergoes chemical reactions and is scratch-resistant.
  • silicon nitride has an optimal behavior of the change in electrical resistance in relation to the change in temperature.
  • the electrically insulating carrier consists of high-resistance silicon carbide (SiC), which also has very good mechanical, thermomechanical and chemical properties.
  • the specific electrical resistance is approximately 10 13 ohm cm.
  • a method for producing such a silicon carbide carrier is known.
  • the silicon carbide is produced by means of a liquid phase smter process in which aluminum oxide and yttrium oxide are added as sintering additives.
  • the support can also consist of other electrically insulating ceramics or, for example, of aluminum oxide (AI2O3).
  • the layer or film serving as a heat source is preferably meandering and can consist of a wide variety of materials. Depending on the material, the layer is applied directly to the carrier using a sputtering process or it is vapor-deposited. In other embodiments, a film is first produced and then pressed onto the carrier by means of a pressing means.
  • FIG. 1 shows a coated heating element according to the invention m viewed from below;
  • Figure 2 shows the same heating element in the position of use as a hotplate in section
  • Figure 3 is an exploded view of a heating element with a film and a pressure plate.
  • the heating element shown schematically here has the shape of a circular plate, the shape being determined by a solid support 1.
  • This carrier consists of an electrically insulating but heat-conducting ceramic, preferably of silicon nitride (S13N4).
  • This plate typically has a cross-sectional area of 100-500 cm 'and a thickness of 1-5 mm. However, the dimensions vary depending on the area of application, which will be discussed later.
  • an electrically conductive layer 2 is brought up. It preferably runs in a meandering shape over the entire surface of the carrier 2 in order to optimize the electrical resistance.
  • This electrically conductive layer in this example consists of amorphous or polycrystalline doped silicon, as already known from publication WO 91/10336.
  • Other electrically conductive layers are also suitable, wi for example metallic layers, in particular of chromium-nickel, chromium-nickel alloys, titanium or titanium nitride. The choice of the material of the electrically conductive layer depends on the given boundary conditions, which vary depending on the application.
  • the electrically conductive layer 2 is preferably applied to the carrier 1 by means of a sputtering process or it is evaporated. In typical areas of application, their thickness is between a few tenths and a few micrometers.
  • the electrically conductive layer 2 forms the heat source. It is provided with electrical contacts 3, which make it possible to connect a voltage source.
  • the attachment of the electrical contacts 3 is particularly simplified when using silicon nitride as the carrier 1, since they can then be soldered directly onto the carrier, and because of the heat resistance of silicon nitride, even brazing processes can be used. If a voltage is applied, the current-carrying layer 2 generates heat, which is immediately released to the carrier 1. Since it is solid and has good heat shock resistance, it can be used as a heat sink.
  • the carrier now absorbs the heat generated and passes it on to the object to be heated.
  • the carrier in particular if it consists of silicon nitride, can typically be heated up to a temperature of 650 ° C. without long-term damage to the material occurring. However, peak temperatures up to 1650 ° C are possible.
  • the heating element according to the invention is particularly suitable for use as a heat exchanger which is exposed to direct environmental influences, in particular water.
  • a special area of application is the use as a hotplate.
  • Such a hotplate is shown in the position of use in FIG.
  • the layer 2 serving as a heat source is located on the underside of the carrier 1.
  • the carrier 1 itself forms the hotplate. Since the carrier is made of silicon nitride, the object to be heated, here a pan P, can be placed directly on the carrier.
  • the carrier 1 does not even need a protective layer because of its good material properties. Hardly anything can burn on the plate, and the carrier can also be cleaned with conventional cleaning agents, whereby abrasive rags can also be used.
  • the hotplate according to the invention thus has significant advantages, not only in daily use but also in terms of energy balance. Tests have shown that when using the heating element according to the invention for heating 1.5 lite water to the boiling point, the energy consumption is reduced by up to _0.
  • the object to be heated is placed directly on the carrier and the electrically conductive layer is on the underside of the carrier.
  • the carrier does not necessarily have to be made of silicon nitride, but the use of other ceramics such as aluminum oxide is also possible.
  • the heating elements can also be stacked in a sandwich. It is always essential that the carrier transfers the heat directly to the object to be heated, such as a pan, without another solid, heat-conducting carrier being arranged in between.
  • the electrically conductive layer is covered with a further layer of silicon oxide (Si0 2 ) or silicon nitride (Si 3 N ⁇ ) in order to prevent oxidation z.
  • the electrically conductive layer can also be coated with a thermally insulating layer.
  • the meandering heat source consists of a foil 2 'which is made of metal or a metal alloy is.
  • Preferred materials are constantan, aluminum chromium, nickel silver, copper-nickel alloys and steel. The choice of material depends on the desired temperature that should be achieved with this heating source.
  • the film 2 ' has a thickness of 1 to 100 micrometers. This film 2 'is self-supporting even in a meandering shape, so that it can be produced separately from the carrier 1. It is punched in a simple manufacturing process. This significantly reduces the manufacturing costs and simplifies the production of the heating element.
  • This film 2 ' is completely pressed onto the carrier 1 by means of a pressing means 4.
  • This pressing means 4 is plate-shaped like the carrier 1 and here has at least approximately the same diameter.
  • the mechanical and thermal properties of the pressing means must be such that a complete pressing of the film 2 'is guaranteed over the entire temperature range.
  • the pressing means 4 preferably consists of a heat insulating material, in particular quartz or glass with a heat conduction coefficient of approximately 1 W / mK. As a result, the pressure medium also serves as thermal insulation. It is not imperative that the pressing means 4 have electrically insulating properties.
  • the pressing means consists of electrically conductive material, there is an electrical insulating layer (not shown here) in the form of insulating paper or an insulating plate between the film 2 'and pressing means 4.
  • an electrical insulating layer (not shown here) in the form of insulating paper or an insulating plate between the film 2 'and pressing means 4.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Resistance Heating (AREA)
  • Cookers (AREA)

Abstract

An electrically conductive heating element consists of an electrically insulated, heat-conductive base (1) and an electrically conductive coating (2) applied thereto to act as a heat source. The plate (1) is plate-shaped and solid, thus being suitable as a heat sink, and can transfer the heat generated directly to the object to be heated. The base (1) preferably consists of silicon nitride or silicon carbide and the electrically conductive layer consists of polycrystalline or amorphous doped silicon or a metal coating.

Description

Elektrisches He element Electrical heating element
Die Erfindung betrifft ein elektrisches Heizelement mit den Merkmalen des Oberbegriffs des Patentanspruches 1. Das erfin- dungsgemasse Heizelement findet insbesondere Anwendung als thermoschockresistenter Plattenwarmetauscher, insbesondere als Kocnplatte.The invention relates to an electrical heating element with the features of the preamble of claim 1. The heating element according to the invention is used in particular as a thermal shock-resistant plate heat exchanger, in particular as a plate.
Bekannte konventionelle elektrische Heizelemente weisen stroir- durchflossene Widerstandsdrahte auf, bei denen die erzeugte Warme mittels Wärmestrahlung abgegeben wird. Der Wirkungsgrad ist klein, da ein beträchtlicher Teil der Energie frei ab¬ gestrahlt wird und nicht zu dem zu erwärmenden Objekt gelangt. Zudem ist eine derartige Wärmeübertragung trage.Known conventional electrical heating elements have resistive wires through which the heat generated is emitted by means of heat radiation. The efficiency is low, since a considerable part of the energy is radiated freely and does not reach the object to be heated. Such a heat transfer is also inert.
Es sind deshalb bereits elektrische Heizelemente entwickelt worden, die eine Wärmeübertragung mittels Warmeleitung ermög¬ lichen. So beschreibt WO 91/10336 ein elektrisches Heizelement, das einen elektrisch isolierenden Trager und eine darauf ange¬ brachte elektrisch leitende Schicht u fasst, wobei an der elektrisch leitenden Schicht elektrische Kontakte angebracht sind. Als leitende Schicht wird amorphes oder polykristallmes Silizium verwendet. Die leitende Schicht erzeugt, wenn stro - durchflossen, Warme, die direkt an den Trager abgegeben wird. Damit die Warme edoch zu dem effektiv zu erwärmenden Obje gelangt, uss der Träger, obwohl elektrisch isolierend, gu wärmeleitende Eigenschaften aufweisen. Deshalb wird in dies Publikation als Trager Berylliumoxid oder Aluminium-Nitr verwendet. Beide Materialien weisen zwar die geforderten Eige schaften auf, sie sind jedoch nicht sehr thermoschockresisten so dass Risse im Trager entstehen können. Diese Trager müss deshalb relativ klein bemessen werden. Typischerweise besitz sie eine Dicke von 1 mm und eine Querschnittsflache von 5 cm'. Zudem müssen sie, damit sie durch Temperaturschwankung nicht zerstört werden, auf einem gut wärmeleitende vorzugsweise metallischen Korper angeordnet werden, der d erzeugte Warme aufnimmt und somit als sogenannte Warmesen wirkt. Dieser Korper wird im allgemeinen durch eine massi Platte gebildet.For this reason, electrical heating elements have already been developed which enable heat to be transferred by means of hot conduction. For example, WO 91/10336 describes an electrical heating element which includes an electrically insulating support and an electrically conductive layer u attached thereon, electrical contacts being attached to the electrically conductive layer. Amorphous or polycrystalline silicon is used as the conductive layer. The conductive layer, when flowing through the heat, generates heat that is emitted directly to the support. In order for the heat to reach the object to be heated effectively, the carrier, although electrically insulating, has heat-conducting properties. That is why beryllium oxide or aluminum nitrate is used in this publication as a carrier. Although both materials have the required properties, they are not very resistant to thermal shock so that cracks can occur in the support. This carrier must therefore be dimensioned relatively small. It typically has a thickness of 1 mm and a cross-sectional area of 5 cm '. In addition, so that they are not destroyed by temperature fluctuations, they must be arranged on a heat-conducting, preferably metallic body, which absorbs the heat generated and thus acts as a so-called heat sensor. This body is generally formed by a massive plate.
Da der Trager und die metallische Warmesenke sehr unterschie liche Wärmeausdehnungskoeffizienten aufweisen, ist eine kompli zierte Halterung der Tragerplattchen auf der Warmesen erforderlich. Die Halterung muss nämlich gewahrleisten, da sich die Tragerplattchen gegenüber der Warmesenke be Temperaturveranderungen verschieben und trotzdem stets in gute Beruhrungskontakt mit ihr stehen können.Since the support and the metallic heat sink have very different coefficients of thermal expansion, a complicated mounting of the support plates on the heat sensor is required. The bracket must ensure that the support plates move relative to the heat sink be temperature changes and still be in good contact with it.
Die Verwendung von Berylliumoxid oder Aluminiumnitrid al Tragerplattchen weist noch weitere Nachteile auf. So is Berylliumoxid stark toxisch und muss deshalb mit einer Schutz schicht überzogen werden. Gerade die Verwendung derartige Heizelemente im Haushaltsbereich ist wegen ihrer toxische Eigenschaften undenkbar. Aluminiumnitrid hingegen ist nich heisswasserresistent. Auch dieses Heizelement musste zumindest im Haushaltsbereich mit einer Schutzschicht überzogen werden. Beide Materialien weisen zudem eine geringe Schlagfestigkeit auf, sind also leicht beschadigbar.The use of beryllium oxide or aluminum nitride as carrier plates has further disadvantages. For example, beryllium oxide is highly toxic and must therefore be covered with a protective layer. The use of such heating elements in the household is unthinkable because of their toxic properties. However, aluminum nitride is not hot water resistant. This heating element also had to be covered with a protective layer, at least in the household area. Both materials also have a low impact resistance, so they are easily damaged.
Diese Nachteile fuhren dazu, dass derartige Heizelemente klein ausgebildet sein müssen und stets mit einem massiven, gut wärmeleitenden und somit als Warmesenke dienenden Trager gekoppelt werden müssen.These disadvantages mean that such heating elements have to be made small and always have to be coupled to a solid, good heat-conducting and thus serving as a heat sink.
Es ist deshalb Aufgabe der Erfindung, ein elektrisches Heiz¬ element zu schaffen, das obengenannte Nachteile behebt und das insbesondere als Wärmetauscher eingesetzt werden kann, der direkten Umwelteinflüssen ausgesetzbar ist.It is therefore an object of the invention to provide an electrical heating element which overcomes the disadvantages mentioned above and which can be used in particular as a heat exchanger which can be exposed to direct environmental influences.
Diese Aufgabe lost ein elektrisches Heizelement mit den Merk¬ malen des Patentanspruches 1.This object is achieved by an electrical heating element with the features of patent claim 1.
Weitere Ausfuhrungsformen gehen aus den abhangigen Patent¬ ansprüchen hervor.Further embodiments emerge from the dependent patent claims.
Das erfmdungsgemasse Heizelement weist den Vorteil auf, dass es nicht mehr mit einem weiteren als Warmesenke dienenden massiven Trager gekoppelt werden muss, sondern dass es die erzeugte Warme direkt an das zu erwärmende Objekt abgeben kann. Dadurch ist das Heizelement einerseits baulich vereinfacht und technisch besser realisierbar, andererseits st der Wirkungs¬ grad erhöht. Zudem ist die Heizflachenbelastung für das erfm- dungsgemasse Heizelement in Bezug auf den plattenformigen und massiven Trager zu betrachten und nicht wie bei den aus 91/10336 bekannten Heizelementen in Bezug auf die klein Tragerplattchen.The heating element according to the invention has the advantage that it no longer has to be coupled to a further solid support serving as a heat sink, but rather that it can emit the heat generated directly to the object to be heated. Characterized the heating element is on the one hand simplifies BAULI c h and technically more feasible the Wirkungs¬ other hand st degree increases. In addition, the heating surface load for the heating element according to the invention is in relation to the plate-shaped and massive support and not like the heating elements known from 91/10336 with regard to the small support plates.
In einer bevorzugten Ausfuhrungsform besteht der elektris isolierende Trager aus Siliziumnitirid (S13N4) . Dieses Materia weist eine hohe Warmeschockresistenz, eine hohe Schlagfestig keit und eine gute Heisswasserresistenz auf, ist gesundheitlic unbedenklich, geht kaum chemische Reaktionen ein und is kratzfest. Zudem weist Siliziumnitrid ein optimales Verhalte der Veränderung des elektrischen Widerstandes im Verhältnis de Te peraturveranderung auf.In a preferred embodiment, the electrically insulating support consists of silicon nitride (S13N4). This materia has high thermal shock resistance, high impact resistance and good hot water resistance, is harmless to health, hardly undergoes chemical reactions and is scratch-resistant. In addition, silicon nitride has an optimal behavior of the change in electrical resistance in relation to the change in temperature.
In einer anderen bevorzugten Ausfuhrungsform besteht de elektrisch isolierende Trager aus hochohmigen Siliziumkarbi (SiC) , das ebenfalls sehr gute mechanische, thermomechanisch wie auch chemische Eigenschaften aufweist. Der spezifisch elektrische Widerstand betragt annähernd 1013 Ohm cm. Ei Verfahren zur Herstellung eines derartigen Siliziumkarbid Tragers ist bekannt. Das Siliziumkarbid wird mittels eine Flussigphasensmter-Verfahren hergestellt, bei dem Aluminium oxyd und Yttriumoxyd als Sinteradditive zugegeben werden. Wird das Heizelement jedoch lediglich für tiefe Temperaturen i Bereich von 250°C eingesetzt, so kann der Trager auch au anderen elektrisch isolierenden Keramiken oder beispielsweis aus Aluminiumoxid (AI2O3) bestehen. Diese Keramiken können be höheren Temperaturen auch eingesetzt werden, wenn die Erhitzun und Abkühlung des Heizelementes kontrolliert und langsa erfolgt, so dass kaum ein Thermoschock entstehen kann. Die als Wärmequelle dienende Schicht oder Folie ist bevorzugterweise maanderformig und kann aus verschiedensten Materialien bestehen. Je nach Material wird die Schicht direkt auf den Trager mittels Sputterverfahren aufgebracht oder s e wird aufgedampft. In anderen Ausfuhrungsformen wird zuerst eine Folie hergestellt und diese anschliessend mittels einem Anpressmittel an den Trager gepresst.In another preferred embodiment, the electrically insulating carrier consists of high-resistance silicon carbide (SiC), which also has very good mechanical, thermomechanical and chemical properties. The specific electrical resistance is approximately 10 13 ohm cm. A method for producing such a silicon carbide carrier is known. The silicon carbide is produced by means of a liquid phase smter process in which aluminum oxide and yttrium oxide are added as sintering additives. However, if the heating element is only used for low temperatures in the range of 250 ° C, the support can also consist of other electrically insulating ceramics or, for example, of aluminum oxide (AI2O3). These ceramics can also be used at higher temperatures if the heating and cooling of the heating element is controlled and slow, so that there is hardly any thermal shock. The layer or film serving as a heat source is preferably meandering and can consist of a wide variety of materials. Depending on the material, the layer is applied directly to the carrier using a sputtering process or it is vapor-deposited. In other embodiments, a film is first produced and then pressed onto the carrier by means of a pressing means.
In den Figuren sind Ausfuhrungsbeispiele des erfmdungsgemassen Heizelementes dargestellt, die m der nachfolgenden Beschrei¬ bung erläutert werden. Es zeigenExemplary embodiments of the heating element according to the invention are shown in the figures and are explained in the following description. Show it
Figur 1 ein beschichtetes Heizelement gemäss der Erfindung m der Ansicht von unten dargestellt;1 shows a coated heating element according to the invention m viewed from below;
Figur 2 dasselbe Heizelement m Gebrauchslage als Kochplatte im Schnitt dargestellt undFigure 2 shows the same heating element in the position of use as a hotplate in section and
Figur 3 eine Explosionsdarstellung eines Heizelementes mit einer Folie und einer Gegendruckplatte.Figure 3 is an exploded view of a heating element with a film and a pressure plate.
Das hier schematisch dargestellte Heizelement weist die Form einer kreisrunden Platte auf, wobei die Form durch einen massiven Trager 1 bestimmt wird. Dieser Trager besteht aus einer elektrisch isolierenden, jedoch wärmeleitenden Keramik, bevorzugterweise aus Siliziumnitrid (S13N4) . Diese Platte weist typischerweise eine Querschnittsflache von 100 - 500 cm' und eine Dicke von 1 - 5 mm auf. Die Abmessungen variieren jedoch je nach Anwendungsbereich, auf den später noch eingegange wird.The heating element shown schematically here has the shape of a circular plate, the shape being determined by a solid support 1. This carrier consists of an electrically insulating but heat-conducting ceramic, preferably of silicon nitride (S13N4). This plate typically has a cross-sectional area of 100-500 cm 'and a thickness of 1-5 mm. However, the dimensions vary depending on the area of application, which will be discussed later.
Auf dem Träger 1 ist eine elektrisch leitende Schicht 2 aufge bracht. Sie verlauft bevorzugterweise zur Optimierung de elektrischen Widerstandes maanderformig über die gesamte Fläch des Tragers 2. Diese elektrisch leitende Schicht besteht diesem Beispiel aus amorphem oder polykristallinen dotierte Silizium, wie bereits aus der Publikation WO 91/10336 bekannt Auch andere elektrisch leitende Schichten sind geeignet, wi beispielsweise metallische Schichten, insbesondere aus Chrom Nickel, Chrom-Nickellegierungen, Titan oder Titannitrid. Di Wahl des Materials der elektrisch leitenden Schicht hangt vo den vorgegebenen, je nach Anwendungsbereich verschiedenen Rand bedingungen ab.On the carrier 1, an electrically conductive layer 2 is brought up. It preferably runs in a meandering shape over the entire surface of the carrier 2 in order to optimize the electrical resistance. This electrically conductive layer in this example consists of amorphous or polycrystalline doped silicon, as already known from publication WO 91/10336. Other electrically conductive layers are also suitable, wi for example metallic layers, in particular of chromium-nickel, chromium-nickel alloys, titanium or titanium nitride. The choice of the material of the electrically conductive layer depends on the given boundary conditions, which vary depending on the application.
Die elektrisch leitende Schicht 2 wird bevorzugterweise auf de Trager 1 mittels Sputterverfahren aufgebracht oder sie wir aufgedampft. In typischen Anwendungsbereichen betragt ihr Dicke zwischen einigen Zehntel und einigen Mikrometern. Di elektrisch leitende Schicht 2 bildet die Wärmequelle. Sie is mit elektrischen Kontakten 3 versehen, die eine Verbindung z einer Spannungsquelle ermöglichen. Das Anbringen de elektrischen Kontakte 3 ist vorallem bei Verwendung vo Siliziumnitrid als Trager 1 vereinfacht, da sie dann direkt au den Träger lotbar sind, wobei wegen der Hitzebeständigkeit vo Siliziumnitrid sogar Hartlotverfahren eingesetzt werden können. Wird eine Spannung angelegt, so erzeugt die stromdurchflossene Schicht 2 Warme, die sogleich an den Trager 1 abgegeben wird. Da dieser massiv ausgebildet ist und eine gute Warmeschock- resistenz aufweist, kann er als Warmesenke eingesetzt werden. Dieser Trager nimmt nun die erzeugte Warme auf und gibt sie an das zu erwärmende Objekt weiter. Der Trager 1, insbesondere wenn er aus Siliziumnitrid besteht, kann typischerweise bis zu einer Temperatur von 650 °C erwärmt werden, ohne dass Langzeit¬ schaden am Material auftreten. Es sind jedoch Spitzen¬ temperaturen bis zu 1650°C möglich.The electrically conductive layer 2 is preferably applied to the carrier 1 by means of a sputtering process or it is evaporated. In typical areas of application, their thickness is between a few tenths and a few micrometers. The electrically conductive layer 2 forms the heat source. It is provided with electrical contacts 3, which make it possible to connect a voltage source. The attachment of the electrical contacts 3 is particularly simplified when using silicon nitride as the carrier 1, since they can then be soldered directly onto the carrier, and because of the heat resistance of silicon nitride, even brazing processes can be used. If a voltage is applied, the current-carrying layer 2 generates heat, which is immediately released to the carrier 1. Since it is solid and has good heat shock resistance, it can be used as a heat sink. This carrier now absorbs the heat generated and passes it on to the object to be heated. The carrier 1, in particular if it consists of silicon nitride, can typically be heated up to a temperature of 650 ° C. without long-term damage to the material occurring. However, peak temperatures up to 1650 ° C are possible.
Das erfmdungsgemasse Heizelement eignet sich vorallem zur Verwendung als Wärmetauscher, der direkten Umwelteinflüssen, insbesondere »asser, ausgesetzt ist. Ein spezieller Anwendungs¬ bereich ist die Verwendung als Kochplatte. In Figur 2 ist eine derartige Kochplatte in Gebrauchslage dargestellt. Die als Wärmequelle dienende Schicht 2 befindet sich auf der Unterseite des Tragers 1. Der Trager 1 selber bildet die Kochplatte. Da der Trager aus Siliziumnitrid gefertigt ist, kann das zu erwärmende Objekt, hier eine Pfanne P, direkt auf den Trager gestellt werden. Der Trager 1 benotigt wegen seiner guten Materialeigenschaften nicht einmal eine Schutzschicht. Auf der Platte kann kaum etwas anbrennen, zudem kann der Trager mit herkömmlichen Putzmitteln gereinigt werden, wobei auch scheuernde Lappen eingesetzt werden können. Im Vergleich zu den heute bekannten Glaskeramikherden weist die erfmdungsgemasse Kochplatte somit wesentliche Vorteile auf, nicht nur im täglichen Gebrauch sondern auch in der Energiebilanz. Testversuche haben gezeigt, dass bei Verwendung des erfmdungsgemassen Heizelementes zum Erhitzen von 1.5 Lite Wasser bis zum Siedepunkt der Energieverbrauch bis zu _0 reduziert wird.The heating element according to the invention is particularly suitable for use as a heat exchanger which is exposed to direct environmental influences, in particular water. A special area of application is the use as a hotplate. Such a hotplate is shown in the position of use in FIG. The layer 2 serving as a heat source is located on the underside of the carrier 1. The carrier 1 itself forms the hotplate. Since the carrier is made of silicon nitride, the object to be heated, here a pan P, can be placed directly on the carrier. The carrier 1 does not even need a protective layer because of its good material properties. Hardly anything can burn on the plate, and the carrier can also be cleaned with conventional cleaning agents, whereby abrasive rags can also be used. Compared to the glass ceramic cookers known today, the hotplate according to the invention thus has significant advantages, not only in daily use but also in terms of energy balance. Tests have shown that when using the heating element according to the invention for heating 1.5 lite water to the boiling point, the energy consumption is reduced by up to _0.
Ein weiterer Anwendungsbereich ist die Verwendung als Warme platte. Auch hier wird das zu erwärmende Objekt direkt auf de Trager gestellt und die elektrisch leitende Schicht befinde sich auf der Unterseite des Tragers. Da jedoch hier meistens einem tieferen Temperaturbereich gearbeitet wird, muss de Trager nicht zwingend aus Siliziumnitrid gefertigt sein sondern auch die Verwendung von anderen Keramiken wi Aluminiumoxid ist möglich.Another area of application is the use as a hot plate. Here, too, the object to be heated is placed directly on the carrier and the electrically conductive layer is on the underside of the carrier. However, since a lower temperature range is usually used here, the carrier does not necessarily have to be made of silicon nitride, but the use of other ceramics such as aluminum oxide is also possible.
Je nach Anwendungsbereich können die Heizelemente auch sand wichartig gestapelt werden. Wesentlich ist stets, dass der Tra ger die Warme direkt an das zu erwärmende Objekt, wi beispielsweise eine Pfanne, weitergibt, ohne dass ein weitere massiver, wärmeleitender Trager dazwischen angeordnet ist. In einer Ausfuhrungsform ist die elektrisch leitende Schicht mit einer weiteren Schicht aus Siliziumoxid (Sι02) ooe Siliziumnitrid (Sι3N<) bedeckt sein, um Oxidationen z verhindern.Depending on the application, the heating elements can also be stacked in a sandwich. It is always essential that the carrier transfers the heat directly to the object to be heated, such as a pan, without another solid, heat-conducting carrier being arranged in between. In one embodiment, the electrically conductive layer is covered with a further layer of silicon oxide (Si0 2 ) or silicon nitride (Si 3 N < ) in order to prevent oxidation z.
Um Warmeverluste auf der nicht dem Trager zugewandten Seite z verhindern, kann die elektrisch leitende Schicht zudem mi einer thermisch isolierenden Schicht überzogen sein.In order to prevent heat losses on the side z not facing the wearer, the electrically conductive layer can also be coated with a thermally insulating layer.
In einer weiteren in Figur 3 dargestellten Ausfuhrungsform de Erfindung besteht die maanderformige Heizquelle aus eine Folie 2', die aus Metall oder einer Metallegierung gefertig ist. Bevorzugte Materialien sind Konstantan, Aluchrom, Neusilber, Kupfer-Nickel-Legierungen und Stahl. Die Wahl des Materiales hangt von der gewünschten Temperatur ab, die mit dieser Heizquelle erzielt werden soll. Die Folie 2' weist je nach Material und gewünschtes Temperaturverhalten eine Dicke von 1 bis 100 Mikrometer auf. Diese Folie 2' ist selbst m Mäanderform selbsttragend, so dass sie getrennt vom Trager 1 hergestellt werden kann. In einem einfachen Herstellungs¬ verfahren wird sie gestanzt. Dadurch werden die Herstellungs¬ kosten wesentlich gesenkt und die Produktion des Heizelementes vereinfacht.In a further embodiment of the invention shown in FIG. 3, the meandering heat source consists of a foil 2 'which is made of metal or a metal alloy is. Preferred materials are constantan, aluminum chromium, nickel silver, copper-nickel alloys and steel. The choice of material depends on the desired temperature that should be achieved with this heating source. Depending on the material and the desired temperature behavior, the film 2 'has a thickness of 1 to 100 micrometers. This film 2 'is self-supporting even in a meandering shape, so that it can be produced separately from the carrier 1. It is punched in a simple manufacturing process. This significantly reduces the manufacturing costs and simplifies the production of the heating element.
Diese Folie 2' ist mittels einem Anpressmittel 4 vollständig am Trager 1 angepresst. Dieses Anpressmittel 4 ist wie der Trager 1 plattenformig und weist hier mindestens annähernd denselben Durchmesser auf. Die mechanischen und thermischen Eigenschaften des Anpresεmittels müssen derart sein, dass eine vollständige Anpressung der Folie 2' über den gesamten Temperaturbereich gewährleistet ist. Das Anpressmittel 4 besteht bevorzugterweise aus einem warmeisolierenden Material, insbesondere Quarz ooer Glas mit einem Warmeleitkoefflzienten von annähernd 1 W/mK. Dadurch dient das Anpressmittel zugleich als Thermoisolation. Es ist nicht zwingend, dass das Anpressmittel 4 elektrisch isolierende Eigenschaften aufweist. Falls das Anpressmittel aus elektrisch leitendem Material besteht, befindet sich zwischen Folie 2' und Anpressmittel 4 eine hier nicht dargestellte elektrische Isolationsschicht in Form von Isolationspapier oder einer Isolationsplatte. Ein weiterer Vorteil dieser Ausfuhrungsform ist neben sein kostengünstigen und einfachen Herstellung, dass b Beschädigung der Heizquelle, also der Folie 2', diese einfa entfernt werden kann und das teurere Bauteil, der Trager wiederverwendet werden kann. This film 2 'is completely pressed onto the carrier 1 by means of a pressing means 4. This pressing means 4 is plate-shaped like the carrier 1 and here has at least approximately the same diameter. The mechanical and thermal properties of the pressing means must be such that a complete pressing of the film 2 'is guaranteed over the entire temperature range. The pressing means 4 preferably consists of a heat insulating material, in particular quartz or glass with a heat conduction coefficient of approximately 1 W / mK. As a result, the pressure medium also serves as thermal insulation. It is not imperative that the pressing means 4 have electrically insulating properties. If the pressing means consists of electrically conductive material, there is an electrical insulating layer (not shown here) in the form of insulating paper or an insulating plate between the film 2 'and pressing means 4. Another advantage of this embodiment, in addition to its inexpensive and simple manufacture, is that damage to the heat source, that is to say the film 2 ', can be easily removed and the more expensive component, the carrier, can be reused.

Claims

Patentansprüche claims
1. Elektrisches Heizelement, das einen elektrisch isolieren¬ den, wärmeleitenden Trager (1) aus Keramik und eine darauf angebrachte elektrisch leitende, mit elektrischen Kontakten versehene Schicht (2) oder Folie (2') aufweist, dadurch gekennzeichnet, dass der Trager (1) plattenformig und so massiv ausgebildet ist, dass er als Warmesenke wirkt.1. An electrical heating element which has an electrically isolating, heat-conducting support (1) made of ceramic and an electrically conductive layer (2) or film (2 ') provided thereon with electrical contacts, characterized in that the support (1 ) is plate-shaped and so massive that it acts as a heat sink.
2. Elektrisches Heizelement nach Anspruch 1, dadurch gekenn¬ zeichnet, dass der Trager (1) aus Siliziumnitrid (S13N4) besteht.2. Electric heating element according to claim 1, characterized gekenn¬ characterized in that the carrier (1) consists of silicon nitride (S13N4).
3. Elektrisches Heizelement nach Anspruch 1, dadurch gekenn¬ zeichnet, dass die leitende Schicht (2) oder Folie (2') maanderformig auf dem Trager (1) verlauft.3. Electric heating element according to claim 1, characterized gekenn¬ characterized in that the conductive layer (2) or film (2 ') runs in a meandering shape on the carrier (1).
4. Elektrisches Heizelement nach Anspruch 1, dadurch gekenn¬ zeichnet, dass die Dicke der leitenden Schicht (2) 0.1 bis 10 Mikrometer betragt.4. Electrical heating element according to claim 1, characterized gekenn¬ characterized in that the thickness of the conductive layer (2) is 0.1 to 10 microns.
5. Elektrisches Heizelement nach Anspruch 1, dadurch gekenn¬ zeichnet, dass die leitende Schicht (2) aus poly- kristallinem oder amorphem dotiertem Silizium oder aus einem Metall, bevorzugterweise aus der Gruppe Chrom, Nickel, Titan, Titannitrid oder einer Chrom-Nickel- Legierung, besteht. 5. Electric heating element according to claim 1, characterized gekenn¬ characterized in that the conductive layer (2) made of polycrystalline or amorphous doped silicon or a metal, preferably from the group chromium, nickel, titanium, titanium nitride or a chromium-nickel Alloy.
6. Elektrisches Heizelement nach Anspruch 1, dadurch gekenn zeichnet, dass der Trager (1) eine Querschnittsflache vo 100 bis 500 c z und eine Dicke von 1 bis 5 mm aufweist.6. Electrical heating element according to claim 1, characterized in that the carrier (1) has a cross-sectional area from 100 to 500 c z and a thickness of 1 to 5 mm.
7. Elektrisches Heizelement nach Anspruch 1, dadurch gekenn zeichnet, dass die leitende Schicht (2) auf den Trager (1 gesputtert oder aufgedampft ist.7. Electrical heating element according to claim 1, characterized in that the conductive layer (2) on the carrier (1 is sputtered or vapor-deposited.
8. Elektrisches Heizelement nach Anspruch 1, dadurch gekenn zeichnet, dass die leitende Folie (2') aus einem Metal oder einer Metallegierung, insbesondere Konstanten Aluchrom, Neusilber oder Stahl, besteht.8. Electrical heating element according to claim 1, characterized in that the conductive film (2 ') consists of a metal or a metal alloy, in particular constants aluminum chromium, nickel silver or steel.
9. Elektrisches Heizelement nach Anspruch 8, dadurch gekenn zeichnet, dass die Dicke der Folie (2') 1 bis 10 Mikrometer betragt.9. Electric heating element according to claim 8, characterized in that the thickness of the film (2 ') is 1 to 10 micrometers.
10. Elektrisches Heizelement nach Anspruch 8, dadurch gekenn zeichnet, dass die Folie (2') mittels einem Anpressmitte (4) an den Trager (1) angepresst ist.10. Electric heating element according to claim 8, characterized in that the film (2 ') is pressed by means of a pressing center (4) on the carrier (1).
11. Elektrisches Heizelement nach Anspruch 10, dadurch gekenn zeichnet, dass das Anpressmittel (4) aus warmeisolierende Material, insbesondere aus Quarz oder Glas, besteht un plattenformig ausgebildet ist.11. An electrical heating element according to claim 10, characterized in that the pressing means (4) consists of heat-insulating material, in particular quartz or glass, is un-plate-shaped.
12. Elektrisches Heizelement nach Anspruch 1, dadurc gekennzeichnet, dass der Trager (1) aus hochohmige Siliziumkarbid (SiC) besteht. 12. Electrical heating element according to claim 1, characterized in that the carrier (1) consists of high-resistance silicon carbide (SiC).
13. Verwendung des elektrischen Heizelementes nach Anspruch 1 als direkten Umwelteinflüssen, insbesondere Wasser, ausgesetzter Wärmetauscher.13. Use of the electric heating element according to claim 1 as direct environmental influences, in particular water, exposed heat exchanger.
14. Verwendung des elektrischen Heizelementes nach Anspruch 1 als Kochplatte.14. Use of the electric heating element according to claim 1 as a hot plate.
15. Verwendung des elektrischen Heizelementes nach Anspruch 1 als Wärmeplatte.15. Use of the electric heating element according to claim 1 as a hot plate.
.3 - .3 -
PCT/CH1995/000208 1994-09-20 1995-09-19 Electric heating element WO1996009738A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DK95930361T DK0783830T3 (en) 1994-09-20 1995-09-19 Electric heating element
AU33786/95A AU3378695A (en) 1994-09-20 1995-09-19 Electric heating element
EP95930361A EP0783830B1 (en) 1994-09-20 1995-09-19 Electric heating element
DE59506182T DE59506182D1 (en) 1994-09-20 1995-09-19 ELECTRIC HEATING ELEMENT

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CH285494 1994-09-20
CH2854/94-1 1994-09-20
CH414/95-3 1995-02-13
CH41495 1995-02-13
CH206995 1995-07-13
CH2069/95-0 1995-07-13

Publications (1)

Publication Number Publication Date
WO1996009738A1 true WO1996009738A1 (en) 1996-03-28

Family

ID=27172084

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH1995/000208 WO1996009738A1 (en) 1994-09-20 1995-09-19 Electric heating element

Country Status (7)

Country Link
EP (1) EP0783830B1 (en)
AT (1) ATE181199T1 (en)
AU (1) AU3378695A (en)
DE (1) DE59506182D1 (en)
DK (1) DK0783830T3 (en)
ES (1) ES2135084T3 (en)
WO (1) WO1996009738A1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29702813U1 (en) 1997-01-10 1997-05-22 E.G.O. Elektro-Gerätebau Gmbh, 75038 Oberderdingen Contact heat transferring cooking system with an electric hotplate
DE19617319A1 (en) * 1996-04-19 1997-10-23 Inter Control Koehler Hermann Procedure for controlling heat from electric kitchen stove having cooking and/or grilling plate
EP0853444A2 (en) * 1997-01-10 1998-07-15 E.G.O. ELEKTRO-GERÄTEBAU GmbH Cooking system with an electric cooking-plate, transferring heat by conduction
FR2763201A1 (en) * 1997-05-07 1998-11-13 Aeg Hausgeraete Gmbh Hybrid electric hotplate
DE19746845C1 (en) * 1997-10-23 1998-12-03 Schott Glas Ceramic heating element for electric cooking hob
DE19746844C1 (en) * 1997-10-23 1998-12-03 Schott Glas Ceramic heating element for electric cooking hob
WO1999009791A1 (en) * 1996-07-25 1999-02-25 Aktiebolaget Electrolux (Publ) Ceramic hob
WO1999025154A1 (en) * 1997-11-06 1999-05-20 Watlow Electric Manufacturing Company Quartz substrate heater
DE19813996A1 (en) * 1998-03-28 1999-10-07 Aeg Hausgeraete Gmbh Cooker with structure for heating both by induction and resistance
DE19820108A1 (en) * 1998-05-06 1999-12-02 Schott Glas Heat conducting ceramic support fitted with a heating element
US20110132896A1 (en) * 2009-12-08 2011-06-09 Therm-X Of California Heater plate with embedded hyper-conductive thermal diffusion layer for increased temperature rating and uniformity
CN105509488A (en) * 2015-12-23 2016-04-20 西安超码科技有限公司 Internal heating device with immersive ceramic resistor
WO2018019530A1 (en) * 2016-07-27 2018-02-01 Heraeus Noblelight Gmbh Infrared surface emitter and method for producing said infrared surface emitter

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10008646A1 (en) 2000-02-24 2001-09-13 Kempten Elektroschmelz Gmbh Molded body used as a cooking plate comprises an adhesion- and scratch-resistant surface coating made of glass and/or glass-ceramic formed on hot-pressed, gas pressure-sintered , reaction-bound or hot isostatically pressed silicon nitride

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0069298A1 (en) * 1981-07-08 1983-01-12 E.G.O. Elektro-Geräte Blanc u. Fischer Cooking plate
JPS60166469A (en) * 1985-01-21 1985-08-29 Tdk Corp Thermal head
JPS60224217A (en) * 1984-04-20 1985-11-08 Fujitsu Ltd Two step diffusion furnace
US4652727A (en) * 1984-10-26 1987-03-24 Nippondenso Co., Ltd. Ceramic heater and a process for producing the same
JPS63278201A (en) * 1987-05-09 1988-11-15 Oki Electric Ind Co Ltd Heating resistor
JPS63278203A (en) * 1987-05-09 1988-11-15 Oki Electric Ind Co Ltd Heating resistor
US4804823A (en) * 1986-07-31 1989-02-14 Kyocera Corporation Ceramic heater
JPH0325880A (en) * 1989-06-23 1991-02-04 Tokyo Erekutoron Kyushu Kk Infrared heater

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0069298A1 (en) * 1981-07-08 1983-01-12 E.G.O. Elektro-Geräte Blanc u. Fischer Cooking plate
JPS60224217A (en) * 1984-04-20 1985-11-08 Fujitsu Ltd Two step diffusion furnace
US4652727A (en) * 1984-10-26 1987-03-24 Nippondenso Co., Ltd. Ceramic heater and a process for producing the same
JPS60166469A (en) * 1985-01-21 1985-08-29 Tdk Corp Thermal head
US4804823A (en) * 1986-07-31 1989-02-14 Kyocera Corporation Ceramic heater
JPS63278201A (en) * 1987-05-09 1988-11-15 Oki Electric Ind Co Ltd Heating resistor
JPS63278203A (en) * 1987-05-09 1988-11-15 Oki Electric Ind Co Ltd Heating resistor
JPH0325880A (en) * 1989-06-23 1991-02-04 Tokyo Erekutoron Kyushu Kk Infrared heater

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 10, no. 2 (M - 444) 8 January 1986 (1986-01-08) *
PATENT ABSTRACTS OF JAPAN vol. 10, no. 79 (E - 391) 28 February 1986 (1986-02-28) *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 106 (E - 726) 14 March 1989 (1989-03-14) *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 224 (C - 559) 24 May 1989 (1989-05-24) *
PATENT ABSTRACTS OF JAPAN vol. 15, no. 152 (E - 1057) 17 April 1991 (1991-04-17) *

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19617319A1 (en) * 1996-04-19 1997-10-23 Inter Control Koehler Hermann Procedure for controlling heat from electric kitchen stove having cooking and/or grilling plate
WO1999009791A1 (en) * 1996-07-25 1999-02-25 Aktiebolaget Electrolux (Publ) Ceramic hob
EP0853444A3 (en) * 1997-01-10 1998-12-09 E.G.O. ELEKTRO-GERÄTEBAU GmbH Cooking system with an electric cooking-plate, transferring heat by conduction
EP0853444A2 (en) * 1997-01-10 1998-07-15 E.G.O. ELEKTRO-GERÄTEBAU GmbH Cooking system with an electric cooking-plate, transferring heat by conduction
US6150636A (en) * 1997-01-10 2000-11-21 E.G.O. Elektro-Geraetebau Gmbh Contact heat-transferring cooking system with an electric hotplate
DE29702813U1 (en) 1997-01-10 1997-05-22 E.G.O. Elektro-Gerätebau Gmbh, 75038 Oberderdingen Contact heat transferring cooking system with an electric hotplate
FR2763201A1 (en) * 1997-05-07 1998-11-13 Aeg Hausgeraete Gmbh Hybrid electric hotplate
DE19814949C2 (en) * 1997-05-07 2002-04-18 Aeg Hausgeraete Gmbh Cooking equipment with induction heating and resistance heating
DE19746844C1 (en) * 1997-10-23 1998-12-03 Schott Glas Ceramic heating element for electric cooking hob
EP0911586A2 (en) 1997-10-23 1999-04-28 Schott Glas Mounting of a ceramic cooking heater in an opening of a cooking hob
DE19746845C1 (en) * 1997-10-23 1998-12-03 Schott Glas Ceramic heating element for electric cooking hob
US6050176A (en) * 1997-10-23 2000-04-18 Schott Glas Arrangement of a hot plate in a cook top
US6111229A (en) * 1997-10-23 2000-08-29 Schott Glas Cooking appliance such as a stove with an arrangement of a ceramic heating element as a cooking zone in a cutout of a cooking surface
WO1999025154A1 (en) * 1997-11-06 1999-05-20 Watlow Electric Manufacturing Company Quartz substrate heater
DE19813996A1 (en) * 1998-03-28 1999-10-07 Aeg Hausgeraete Gmbh Cooker with structure for heating both by induction and resistance
DE19820108C2 (en) * 1998-05-06 2001-03-15 Schott Glas Arrangement of a heat-conducting ceramic carrier with a heating element as a cooking zone in a recess in a cooking surface
DE19820108A1 (en) * 1998-05-06 1999-12-02 Schott Glas Heat conducting ceramic support fitted with a heating element
US20110132896A1 (en) * 2009-12-08 2011-06-09 Therm-X Of California Heater plate with embedded hyper-conductive thermal diffusion layer for increased temperature rating and uniformity
US8481896B2 (en) * 2009-12-08 2013-07-09 Phillip G. Quinton, Jr. Heater plate with embedded hyper-conductive thermal diffusion layer for increased temperature rating and uniformity
CN105509488A (en) * 2015-12-23 2016-04-20 西安超码科技有限公司 Internal heating device with immersive ceramic resistor
WO2018019530A1 (en) * 2016-07-27 2018-02-01 Heraeus Noblelight Gmbh Infrared surface emitter and method for producing said infrared surface emitter
CN109479345A (en) * 2016-07-27 2019-03-15 贺利氏特种光源有限公司 The method of infrared panel radiator and the infrared panel radiator of manufacture

Also Published As

Publication number Publication date
ES2135084T3 (en) 1999-10-16
DE59506182D1 (en) 1999-07-15
AU3378695A (en) 1996-04-09
ATE181199T1 (en) 1999-06-15
EP0783830B1 (en) 1999-06-09
DK0783830T3 (en) 1999-12-27
EP0783830A1 (en) 1997-07-16

Similar Documents

Publication Publication Date Title
WO1996009738A1 (en) Electric heating element
DE69815142T2 (en) QUARTZ SUBSTRATE HEATING ELEMENT
DE10029437B4 (en) Infrared radiator and method for operating such an infrared radiator
DE4204288C2 (en) Electric heater
DE3545442A1 (en) HEATING ELEMENT FOR THERMAL HOME APPLIANCES, ESPECIALLY FOR COOKING POINTS
DE2021177A1 (en) Heating unit with plate-shaped surface and low thermal mass
EP1814362A1 (en) Heating element for a hot air device
DE19510989A1 (en) Component combination for electrical heating plates, ignition devices, temperature sensors or the like
DE19711541A1 (en) Electric hotplate
DE1806457C3 (en) Electric plate heater
DE2355345B2 (en) Heating device, in particular stove or hot plate
DE19841674B4 (en) Electrically operated, flat infrared radiator
EP1006320A2 (en) Electral instantaneous heater and method for making same
DE3816819A1 (en) Heating device with PTC thermistor elements
DE3730195C2 (en)
DE29619759U1 (en) Electric radiant heater
EP1249671A2 (en) Electric convection heater
DE9400205U1 (en) Electric instantaneous water heater
EP1554957B1 (en) Heating device for a domestic appliance
WO1995002952A1 (en) Electric heating unit
DE19613209C2 (en) Load transfer structure with low thermal conductivity
DE102006003073A1 (en) Electric radiant heating unit for electrical heater, has longitudinally stretched band with two edges, in which one edge includes fins that are distanced from each other, such that they form electrically conducting band of varying height
DE19640650A1 (en) Heat generating assembly for substrate mounted electronics
DE2407619A1 (en) Infra-red emitter consisting of flat plate - has two components with heater coil between them
DE10310255A1 (en) Electric heating with a contact hot plate

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AM AT AU BB BG BR BY CA CH CN CZ DE DK EE ES FI GB GE HU IS JP KE KG KP KR KZ LK LR LT LU LV MD MG MN MW MX NO NZ PL PT RO RU SD SE SG SI SK TJ TM TT UA UG US UZ VN

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): KE MW SD SZ UG AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1995930361

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1995930361

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWG Wipo information: grant in national office

Ref document number: 1995930361

Country of ref document: EP