WO1995027925A1 - Protected relief patterns - Google Patents

Protected relief patterns Download PDF

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Publication number
WO1995027925A1
WO1995027925A1 PCT/GB1995/000804 GB9500804W WO9527925A1 WO 1995027925 A1 WO1995027925 A1 WO 1995027925A1 GB 9500804 W GB9500804 W GB 9500804W WO 9527925 A1 WO9527925 A1 WO 9527925A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
relief structure
surface relief
protective layer
relief pattern
Prior art date
Application number
PCT/GB1995/000804
Other languages
French (fr)
Inventor
James Alexander Shearer
Original Assignee
Applied Holographics Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Holographics Plc filed Critical Applied Holographics Plc
Publication of WO1995027925A1 publication Critical patent/WO1995027925A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
    • G03H1/0252—Laminate comprising a hologram layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/14—Security printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/0027—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using protective coatings or layers by lamination or by fusion of the coatings or layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/328—Diffraction gratings; Holograms
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
    • G06K19/10—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
    • G06K19/16—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards the marking being a hologram or diffraction grating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
    • G03H1/024—Hologram nature or properties
    • G03H1/0244—Surface relief holograms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H2250/00—Laminate comprising a hologram layer
    • G03H2250/39—Protective layer

Definitions

  • This invention relates to structures having a surface relief pattern, particularly an optically variable relief pattern, for example diffraction gratings and surface relief holograms.
  • Optically variable devices OLED's
  • micro-fringe surface relief patterns for example embossed or moulded holograms
  • ODD's Optically variable devices
  • micro-fringe surface relief patterns for example embossed or moulded holograms
  • the surface which carries the micro-relief pattern is rendered electrically conductive and a metal coating of nickel, for example, is formed over the surface by electrodeposition from a solution of nickel sulpha ate.
  • the nickel deposition when of a sufficient thickness, is peeled from the surface of the master and carries a negative of the micro-relief pattern.
  • the nickel member commonly called a shim, is of robust structure and is then used either to mould or press the micro-relief pattern into blank substrates, to replicate the originally recorded OVD.
  • the shim is applied under heat and pressure to the surface of a thermoplastics substrate: this surface is metallised either before or after embossing, providing a degree of reflectivity to enable the e.g. hologram to be viewed under normal light conditions.
  • thermoplastics which will accept such embossing, including acrylic resins, polyurethane resins, and CAB.
  • resins mixed with a photoinitiator are used, and are cross-linked after the moulding by exposure to ultraviolet light: metallisation is applied to the micro- relief surface after the moulding, for example by sputtering, vacuum deposition or electron beam deposition.
  • micro-relief OVD'S When used as security devices, micro-relief OVD'S are themselves subject to attempts to replicate them as counterfeits.
  • One method which is used is to physically copy the surface relief pattern, by making a mould copy of the genuine OVD. Hitherto, the OVD has been adhered to a document or other article to be authenticated, by a layer of adhesive (for example a contact adhesive or a hot melt adhesive) applied over the micro-relief surface.
  • a layer of adhesive for example a contact adhesive or a hot melt adhesive
  • This invention provides surface relief structures for which the above-described problems are alleviated.
  • a surface relief structure which comprises a substrate having a surface formed with an optically variable relief pattern, and a protective layer covering said surface, in which the material comprising the substrate and the material comprising the protective layer are each independently soluble in the same solvent, and/or in which the material comprising the protective layer changes physical phase at a temperature not substantially less than that of the material comprising the substrate.
  • any chemicals that might be used to remove the protective layer will also attack the underlying substrate in which the relief pattern is formed, thus destroying the relief pattern.
  • any attempt to melt or evaporate the protective layer will also at least partially melt or evaporate the underlying substrate, again destroying the relief pattern.
  • the resin substrate, in which the surface relief pattern is formed is soluble in water or in solvents such as EK, toluene, ethylacetate, isopropylalcohol, etc.
  • the protective layer is preferably of substantially the same resin, or of a resin having similar solubility characteristics as the substrate resin.
  • the substrate is embossed or moulded, its surface is metallised or coated with a high refractive index layer, before the protective layer is applied.
  • the metallised or high refractive index layer is porous, so that any solvent which is effective on the protective layer permeates through the substrate and attacks its surface relief pattern. This effect is enhanced if the metallised or high refractive index layer is partially removed, for example in dots, to leave perhaps a 27% cover and a 63% exposure of the substrate.
  • the substrate which is formed with the surface relief pattern, comprises a layer applied to a carrier.
  • a method of producing a surface relief structure which comprises providing a substrate with an optically variable relief pattern, and applying a protective covering layer to said relief pattern, the material comprising the substrate and the material comprising the protective layer being each independently soluble in the same solvent and/or the material comprising the protective layer changes physical phase at a temperature not substantially less than that of the material comprising the relief pattern.
  • the protective layer is applied in fluid form and is then converted rapidly to a continuous solid layer by the application of heat, such that the relief pattern remains substantially unchanged.
  • FIGURE 1 is an enlarged cross-section through a base material prior to embossing
  • FIGURE 2 is a similar cross-section through the material after embossing
  • FIGURE 3 is a similar cross-section through the material after the application of a protective layer over the embossed surface
  • FIGURE 4 is a similar cross-section through a hot stamp foil in accordance with this invention.
  • a material prior to embossing comprising a carrier film 10 for example of PET, OPP, PVC etc., having a layer of thermoplastic resin 12 on one surface, which in turn has a thin coating 14 of a material of high refractive index relative to the resin 12: coating 14 may instead be applied after embossing.
  • Figure 2 shows the material after formation of the micro-relief pattern 16 in its outer surface.
  • Figure 3 shows the material after application of a protective coating 18, of essentially the same resin as the embossed resin layer 12, and an adhesive coating 20 to enable the device to be adhered to a document or other article to be authenticated.
  • Figure 4 shows an embodiment of foil for hot stamping uses.
  • a release layer 11 is provided between the carrier film 10 and the resin layer 12, so that the carrier film 10 can be removed as the structure is secured, by means of its adhesive coating 20, to the document or other article to be authenticated.
  • the resin substrate 12 is transparent: in Figures 1 to 3 the carrier film is also transparent.
  • the coating 14 typically comprises aluminium but may comprise other metals, and is typically applied by sputtering, vacuum deposition or electron beam deposition to a thickness of several molecules only.
  • the coating 14 may comprise a rare earth oxide (e.g. titanium oxide) instead of metal.
  • the coating 14 provides a degree of reflectivity so that the hologram or other image is visible through the carrier film 10 and substrate 12.
  • the coating 14 is partially removed by firstly covering discrete areas with a resin and then etching away the exposed areas of the coating 14 e.g. with caustic soda, before then the protective layer 18 is applied.
  • the protective layer 18 and the substrate 12 are chosen of the same base materials, or of materials soluble in the same solvents. Accordingly, any solvent used to dissolve the protective layer 18 will also attack the substrate 12 and so destroy its relief pattern.
  • the substrate 12 may comprise a water-based or solvent- based lacquer or coating formulation: after this has been applied to the carrier 10 and cured, the surface relief pattern 16 is formed by embossing (before or after application of the high refractive index coating 14) .
  • the protective layer 18 is then applied: this also preferably comprises a water-based or solvent-based lacquer or coating formulation which is then subjected to high temperatures to dry it or drive off the solvents, before these have time to attack the substrate 12.
  • the surface relief pattern 16 may be any form of optically variable relief pattern, i.e. providing a different image or appearance when viewed (through the substrate) from different angles.
  • the relief pattern may comprise a micro-fringe relief pattern or an interference relief pattern (particularly a diffraction grating pattern such as a hologram) .

Abstract

A surface relief structure comprises a substrate (12) having a surface formed with an optically variable relief pattern, and covered with a protective layer (18). The materials of the protective layer (18) and substrate (12) are soluble in the same solvents, so that the protective layer (18) cannot be dissolved without attacking the surface relief pattern of the substrate (12): the surface relief pattern is therefore protected against copying by taking a mould copy from it.

Description

PROTECTED RELIEF PATTERNS
This invention relates to structures having a surface relief pattern, particularly an optically variable relief pattern, for example diffraction gratings and surface relief holograms. Optically variable devices (OVD's) , having micro-fringe surface relief patterns (for example embossed or moulded holograms) , are increasingly being used as security devices to authenticate documents and other items of value, and to inhibit counterfeiting. There are numerous methods by which masters for optical variable devices can be originated, and many of these methods have been documented and published: in all instances the surface of the master is formed with a micro- relief pattern of fringes. In order to mass replicate optically variable devices from this original master, the surface which carries the micro-relief pattern is rendered electrically conductive and a metal coating of nickel, for example, is formed over the surface by electrodeposition from a solution of nickel sulpha ate. The nickel deposition, when of a sufficient thickness, is peeled from the surface of the master and carries a negative of the micro-relief pattern. The nickel member, commonly called a shim, is of robust structure and is then used either to mould or press the micro-relief pattern into blank substrates, to replicate the originally recorded OVD. In the embossing process, the shim is applied under heat and pressure to the surface of a thermoplastics substrate: this surface is metallised either before or after embossing, providing a degree of reflectivity to enable the e.g. hologram to be viewed under normal light conditions. There are many thermoplastics which will accept such embossing, including acrylic resins, polyurethane resins, and CAB. In the moulding process, resins mixed with a photoinitiator are used, and are cross-linked after the moulding by exposure to ultraviolet light: metallisation is applied to the micro- relief surface after the moulding, for example by sputtering, vacuum deposition or electron beam deposition.
When used as security devices, micro-relief OVD'S are themselves subject to attempts to replicate them as counterfeits. One method which is used is to physically copy the surface relief pattern, by making a mould copy of the genuine OVD. Hitherto, the OVD has been adhered to a document or other article to be authenticated, by a layer of adhesive (for example a contact adhesive or a hot melt adhesive) applied over the micro-relief surface. However, it is possible by use of certain solvents to remove the adhesive layer without interfering with the underlying relief structure: once the adhesive layer has been removed and the micro-relief surface is exposed, the relief pattern can be copied.
This invention provides surface relief structures for which the above-described problems are alleviated.
In accordance with this invention, there is provided a surface relief structure which comprises a substrate having a surface formed with an optically variable relief pattern, and a protective layer covering said surface, in which the material comprising the substrate and the material comprising the protective layer are each independently soluble in the same solvent, and/or in which the material comprising the protective layer changes physical phase at a temperature not substantially less than that of the material comprising the substrate.
Thus, any chemicals that might be used to remove the protective layer will also attack the underlying substrate in which the relief pattern is formed, thus destroying the relief pattern. In addition or alternatively, any attempt to melt or evaporate the protective layer will also at least partially melt or evaporate the underlying substrate, again destroying the relief pattern. Generally the resin substrate, in which the surface relief pattern is formed, is soluble in water or in solvents such as EK, toluene, ethylacetate, isopropylalcohol, etc. The protective layer is preferably of substantially the same resin, or of a resin having similar solubility characteristics as the substrate resin.
Once the substrate is embossed or moulded, its surface is metallised or coated with a high refractive index layer, before the protective layer is applied. The metallised or high refractive index layer is porous, so that any solvent which is effective on the protective layer permeates through the substrate and attacks its surface relief pattern. This effect is enhanced if the metallised or high refractive index layer is partially removed, for example in dots, to leave perhaps a 27% cover and a 63% exposure of the substrate.
Typically the substrate, which is formed with the surface relief pattern, comprises a layer applied to a carrier.
Also, in accordance with the invention there is provided a method of producing a surface relief structure, which comprises providing a substrate with an optically variable relief pattern, and applying a protective covering layer to said relief pattern, the material comprising the substrate and the material comprising the protective layer being each independently soluble in the same solvent and/or the material comprising the protective layer changes physical phase at a temperature not substantially less than that of the material comprising the relief pattern.
Typically the protective layer is applied in fluid form and is then converted rapidly to a continuous solid layer by the application of heat, such that the relief pattern remains substantially unchanged.
Embodiments of this invention will now be described by way of examples only and with reference to the accompanying drawings, in which: FIGURE 1 is an enlarged cross-section through a base material prior to embossing;
FIGURE 2 is a similar cross-section through the material after embossing;
FIGURE 3 is a similar cross-section through the material after the application of a protective layer over the embossed surface; and
FIGURE 4 is a similar cross-section through a hot stamp foil in accordance with this invention.
Referring to Figure 1, there is shown a material prior to embossing, comprising a carrier film 10 for example of PET, OPP, PVC etc., having a layer of thermoplastic resin 12 on one surface, which in turn has a thin coating 14 of a material of high refractive index relative to the resin 12: coating 14 may instead be applied after embossing. Figure 2 shows the material after formation of the micro-relief pattern 16 in its outer surface. Figure 3 shows the material after application of a protective coating 18, of essentially the same resin as the embossed resin layer 12, and an adhesive coating 20 to enable the device to be adhered to a document or other article to be authenticated.
Figure 4 shows an embodiment of foil for hot stamping uses. In this, a release layer 11 is provided between the carrier film 10 and the resin layer 12, so that the carrier film 10 can be removed as the structure is secured, by means of its adhesive coating 20, to the document or other article to be authenticated.
It will be appreciated that in Figures l to 4 , the resin substrate 12 is transparent: in Figures 1 to 3 the carrier film is also transparent. The coating 14 typically comprises aluminium but may comprise other metals, and is typically applied by sputtering, vacuum deposition or electron beam deposition to a thickness of several molecules only. The coating 14 may comprise a rare earth oxide (e.g. titanium oxide) instead of metal. The coating 14 provides a degree of reflectivity so that the hologram or other image is visible through the carrier film 10 and substrate 12.
Preferably after the coating 14 is applied, it is partially removed by firstly covering discrete areas with a resin and then etching away the exposed areas of the coating 14 e.g. with caustic soda, before then the protective layer 18 is applied.
The protective layer 18 and the substrate 12 are chosen of the same base materials, or of materials soluble in the same solvents. Accordingly, any solvent used to dissolve the protective layer 18 will also attack the substrate 12 and so destroy its relief pattern.
The substrate 12 may comprise a water-based or solvent- based lacquer or coating formulation: after this has been applied to the carrier 10 and cured, the surface relief pattern 16 is formed by embossing (before or after application of the high refractive index coating 14) . The protective layer 18 is then applied: this also preferably comprises a water-based or solvent-based lacquer or coating formulation which is then subjected to high temperatures to dry it or drive off the solvents, before these have time to attack the substrate 12.
The surface relief pattern 16 may be any form of optically variable relief pattern, i.e. providing a different image or appearance when viewed (through the substrate) from different angles. For example the relief pattern may comprise a micro-fringe relief pattern or an interference relief pattern (particularly a diffraction grating pattern such as a hologram) .

Claims

1) A surface relief structure which comprises a substrate having a surface formed with an optically variable relief pattern, and a protective layer covering said surface, in which the material comprising the substrate and the material comprising the protective layer are each independently soluble in the same solvent, and/or in which the material comprising the protective layer changes physical phase at a temperature not substantially less than that of the material comprising the substrate.
2) A surface relief structure according to claim 1, wherein the protective layer comprises an aqueous based coating formulation.
3) A surface relief structure according to claim 1, wherein the protective layer comprises a solvent based coating formulation.
4) A surface relief structure according to claim 2 or 3, wherein said coating formulation comprises a base polymer, and the material comprising the substrate comprises substantially the same base polymer.
5) A surface relief structure according to any of claims 1 to 4, wherein the substrate is in the form of a coating applied to a carrier.
6) A surface relief structure according to claim 5, wherein said carrier comprises a film or sheet of plastics.
7) A surface relief structure according to any of claims 1 to 6, which includes an intermediate layer interposed between said relief pattern and said protective layer, said intermediate layer having a higher refractive index than that of the substrate. 8) A surface relief structure according to claim 7, wherein the intermediate layer comprises a metal.
9) A surface relief structure according to claim 7 or 8, wherein said intermediate layer is porous.
10) A surface relief structure according to claim 9, wherein said intermediate layer is foraminous.
11) A surface relief structure as claimed in any preceding claim, in which said substrate is transparent.
12) A surface relief structure as claimed in any preceding claim, further comprising an adhesive coating applied to said protective layer.
13) A surface relief structure as claimed in any preceding claim, in which said relief pattern comprises a micro-fringe relief pattern.
14) A surface relief structure as claimed in any one of claims 1 to 13, in which said relief pattern comprises an optical interference relief pattern.
15) A surface relief structure as claimed in claim 14, in which said relief pattern comprises a diffraction grating pattern.
16) A surface relief structure as claimed in claim 15, in which said relief pattern comprises a hologram.
17) A method of producing a surface relief structure, which comprises providing a substrate with an optically variable relief pattern, and applying a protective covering layer to said relief pattern, the material comprising the substrate and the material comprising the protective layer being each independently soluble in the same solvent and/or the material comprising the protective layer changes physical phase at a temperature not substantially less than that of the material comprising the relief pattern.
PCT/GB1995/000804 1994-04-06 1995-04-06 Protected relief patterns WO1995027925A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9406794A GB9406794D0 (en) 1994-04-06 1994-04-06 Protected relief patterns
GB9406794.9 1994-04-06

Publications (1)

Publication Number Publication Date
WO1995027925A1 true WO1995027925A1 (en) 1995-10-19

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2780914A1 (en) * 1998-07-10 2000-01-14 Breger Emballages Sa METHOD FOR MANUFACTURING LABELS
FR2780915A1 (en) * 1998-07-10 2000-01-14 Breger Emballages Sa Security labels, for e.g. bank notes and electronic products, are made by base deposition on a film, label shape definition, bordered printing window formation, window printing with a passivation coating and window development
WO2001008901A1 (en) * 1999-07-30 2001-02-08 Cabinet Erman S.A.R.L. Method for producing security marks and security marks
WO2002020280A1 (en) * 2000-09-08 2002-03-14 Giesecke & Devrient Gmbh Data support with an optically variable element
NL1017307C2 (en) * 2001-02-07 2002-08-08 Enschede Sdu Bv Successfully laminated structure.
US7875338B2 (en) 1999-11-19 2011-01-25 Hologram Industries (S.A.) Security protection of documents or products by affixing an optically active component for verification of authenticity
WO2012068117A3 (en) * 2010-11-15 2012-07-12 Illinois Tool Works Inc. Decorative and/or secure element for homogeneous card construction
WO2014118567A1 (en) * 2013-02-01 2014-08-07 De La Rue International Limited Security devices and methods of manufacture thereof
JP2015061753A (en) * 2013-08-09 2015-04-02 レオンハード クルツ シュティフトゥング ウント コー． カーゲー Manufacturing process of multilayer product, and multilayer product

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GB1165556A (en) * 1966-05-02 1969-10-01 Ibm Record Structure for Fraud Preventing.
US3703407A (en) * 1970-12-15 1972-11-21 Rca Corp Relief phase holograms
US4119361A (en) * 1975-08-14 1978-10-10 Landis & Gyr Multilayer identification card
GB2093404A (en) * 1981-02-19 1982-09-02 Rca Corp Authenticated item with diffractive-substractive authenticating device
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Cited By (24)

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Publication number Priority date Publication date Assignee Title
FR2780914A1 (en) * 1998-07-10 2000-01-14 Breger Emballages Sa METHOD FOR MANUFACTURING LABELS
FR2780915A1 (en) * 1998-07-10 2000-01-14 Breger Emballages Sa Security labels, for e.g. bank notes and electronic products, are made by base deposition on a film, label shape definition, bordered printing window formation, window printing with a passivation coating and window development
WO2000002733A1 (en) * 1998-07-10 2000-01-20 Breger Emballages S.A. Method for making safety labels
US6607792B1 (en) 1998-07-10 2003-08-19 Breger Emballages S.A. Method for making safety labels
AU767233B2 (en) * 1998-07-10 2003-11-06 Breger Emballages S.A. Method for making safety labels
WO2001008901A1 (en) * 1999-07-30 2001-02-08 Cabinet Erman S.A.R.L. Method for producing security marks and security marks
US7029757B1 (en) 1999-07-30 2006-04-18 Gaj Developpement Sas Method for producing security marks and security marks
US7875338B2 (en) 1999-11-19 2011-01-25 Hologram Industries (S.A.) Security protection of documents or products by affixing an optically active component for verification of authenticity
WO2002020280A1 (en) * 2000-09-08 2002-03-14 Giesecke & Devrient Gmbh Data support with an optically variable element
US8137899B1 (en) * 2000-09-08 2012-03-20 Giesecke & Devrient Gmbh Data support with an opticallly variable element
NL1017307C2 (en) * 2001-02-07 2002-08-08 Enschede Sdu Bv Successfully laminated structure.
EP1231076A1 (en) * 2001-02-07 2002-08-14 Enschéde/Sdu B.V. Laminated structure
WO2012068117A3 (en) * 2010-11-15 2012-07-12 Illinois Tool Works Inc. Decorative and/or secure element for homogeneous card construction
CN103209837A (en) * 2010-11-15 2013-07-17 伊利诺斯工具制品有限公司 Decorative and/or secure element for homogeneous card construction
CN103209837B (en) * 2010-11-15 2015-11-25 伊利诺斯工具制品有限公司 For the ornamental of homogeneous card structure and/or safety element
US10457018B2 (en) 2010-11-15 2019-10-29 Illinois Tool Works Inc. Decorative and/or secure element for homogeneous card construction
WO2014118567A1 (en) * 2013-02-01 2014-08-07 De La Rue International Limited Security devices and methods of manufacture thereof
CN105339177A (en) * 2013-02-01 2016-02-17 德拉鲁国际有限公司 Security devices and methods of manufacture thereof
EP2951023B1 (en) 2013-02-01 2017-10-18 De La Rue International Limited Security devices and methods of manufacture thereof
AU2014210897B2 (en) * 2013-02-01 2018-02-22 De La Rue International Limited Security devices and methods of manufacture thereof
AU2014210897C1 (en) * 2013-02-01 2019-05-16 De La Rue International Limited Security devices and methods of manufacture thereof
JP2015061753A (en) * 2013-08-09 2015-04-02 レオンハード クルツ シュティフトゥング ウント コー． カーゲー Manufacturing process of multilayer product, and multilayer product
EP2860041A1 (en) * 2013-08-09 2015-04-15 Leonhard Kurz Stiftung & Co. KG Multi-layer body and method for producing a multi-layer body
US9969203B2 (en) 2013-08-09 2018-05-15 Leohnard Kurz Stiftung & Co. Kg Process for producing a multilayer body, and multilayer body

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