WO1995013632A1 - Passive conductor component for surface mounting on a printed circuit board - Google Patents

Passive conductor component for surface mounting on a printed circuit board Download PDF

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Publication number
WO1995013632A1
WO1995013632A1 PCT/FR1994/001289 FR9401289W WO9513632A1 WO 1995013632 A1 WO1995013632 A1 WO 1995013632A1 FR 9401289 W FR9401289 W FR 9401289W WO 9513632 A1 WO9513632 A1 WO 9513632A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
printed circuit
component according
circuit board
face
Prior art date
Application number
PCT/FR1994/001289
Other languages
French (fr)
Inventor
Eugène Lecourtois
Original Assignee
Nicomatic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nicomatic filed Critical Nicomatic
Publication of WO1995013632A1 publication Critical patent/WO1995013632A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections

Definitions

  • the present invention relates to a passive conductive component, used as a conductive bridge or as a test component on printed circuit boards, as well as a strip of components intended for automatic laying machines.
  • Printed circuit boards are increasingly produced by the surface mounting technique in which printed circuit boards no longer need to be drilled, since conductive pads are formed on at least one face of the board and are directly soldered to the components.
  • the invention relates to a passive conductive component which allows the formation of a conductive pad facilitating continuity tests and allowing the attachment of an oscilloscope probe in a simple and convenient manner.
  • the invention relates to a passive conductive component for surface mounting on a printed circuit board, which comprises a body having two substantially parallel conductive faces, a first of which is intended to be soldered to one face of a printed circuit board. and the second face is intended to form an apparent conductive surface, and a cavity formed between the two faces.
  • the first face is longer than the second, and the two faces have the same width.
  • the component is formed by folding a ribbon so that it has a trapezoidal configuration.
  • the connection of the ends of the ribbon is advantageously placed in the middle of the first face or at a corner of the trapezoidal configuration.
  • the component is formed by folding a ribbon to a U-shaped configuration, the two faces being formed by the branches of the U.
  • the first face is intended to be soldered to at least one conductive pad of the surface of a printed circuit board, and the component is intended to constitute a test component. It is then advantageous that the first face is intended to be soldered to two areas of a printed circuit, and that the component constitutes a connection bridge and, optionally, a test component.
  • the length and width dimensions of the component are standard dimensions for surface mount printed circuit board components.
  • the invention also relates to a strip of components for an automatic component laying machine, which comprises a cellular film, the cells of which each contain a component which is the subject of the preceding paragraphs, and the components are arranged so that, during the use of the strip in an automatic laying machine, the second face is turned to the accessible side for a gripping member of the machine.
  • FIG. 1 is a side elevation view of an example of passive conductive component according to the invention
  • Figure 2 is a section along line 2—2 of Figure 1.
  • FIG. 1 represents a passive conductive component according to the invention.
  • This component is formed from a tape 10 of a conductive material, for example a metal.
  • the tape 10 has for example a thickness of 0.2 mm and a length of 8 mm. It is folded to the trapezoidal configuration indicated in FIG. 1, comprising a wide lower base 12 in the middle of which the ends of the ribbon define a space 14, a narrow upper base 16 and two inclined sides 18, 20.
  • the two bases 12, 16 are substantially parallel.
  • the upper base 16 delimits a surface 22 allowing contact with a test probe.
  • the upper base 16 allows the attachment of a probe connected to an oscilloscope on the edge of the ribbon.
  • the lower base 12 has an external face (facing downwards in FIG. 1) which is intended to be soldered to a printed circuit board by surface mounting, this face being separated into two parts 24, 26 by the space 14 , in the embodiment shown.
  • the cell closure sheet is separated from the honeycomb film shortly before the laying station so that each component is accessible by its upper face 22 in the cell corresponding.
  • the aspirating component removal member then comes into contact with the surface 22, it lifts the component and it comes to place it at the desired location on a surface-mounted printed circuit board.
  • the fitting member places the lower face 24, 26 on one or more conductive pads. When the component is placed on several conductive pads, it constitutes a conductive bridge.
  • the component can be used as a test component, that is to say that it forms both an upper surface 22 for the contact of a continuity test probe and a snap edge of an oscilloscope test probe.
  • the ends of the tape 10 are shown in the middle of the large base of the component. However, the edges can be placed anywhere else, for example at a corner or in the middle of a side. In a variant, a side is even deleted, so that the component has a U shape. The side does not have to be inclined. This U-shaped arrangement facilitates the attachment of oscilloscope probes.
  • the invention also relates to a strip of components of the aforementioned type.
  • the trigger guard can have dimensions corresponding to the standardized dimensions of the active or passive components existing.
  • the total dimension of the component is 2.5 mm at the level of the large base and 1.5 mm at the level of the small base.
  • the total height of the component is 1.5 mm.
  • the width of the ribbon is 1.3 mm, and its thickness is 0.2 mm. These dimensions correspond to those of the most commonly used printed circuit boards.

Abstract

Passive conductor component for surface mounting on a printed circuit board. The invention relates to a conductor component comprising a body with two substantially parallel conducting faces, the first face (24, 26) to be welded to a printed circuit board surface and the second face (22) designed to form an apparent conducting surface, a cavity being formed between the two faces. Application to surface-mounted printed circuit boards.

Description

Composant conducteur passif pour montage en surface sur une carte de circuit impriméPassive conductive component for surface mounting on a printed circuit board
La présente invention concerne un composant conducteur passif, utilisé comme pontet conducteur ou comme composant de test sur des cartes de circuit imprimé, ainsi qu'une bande de composants destinée à des machines de pose automatique.The present invention relates to a passive conductive component, used as a conductive bridge or as a test component on printed circuit boards, as well as a strip of components intended for automatic laying machines.
Les cartes de circuit imprimé sont fabriquées de plus en plus par la technique du montage en surface dans laquelle les cartes de circuit imprimé n'ont plus besoin d'être percées, car des plages conductrices sont formées sur une face au moins de la carte et sont directement soudées aux composants.Printed circuit boards are increasingly produced by the surface mounting technique in which printed circuit boards no longer need to be drilled, since conductive pads are formed on at least one face of the board and are directly soldered to the components.
Dans cette technique du montage en surface, il est encore parfois nécessaire de réaliser des pontets conducteurs entre des plages conductrices et surtout d'effectuer des tests de circuit, par exemple par mesure de la continuité électrique, par mesure à l'aide d'une sonde reliée à un oscilloscope, etc. Le test de détermination de continuité d'un circuit peut être réalisé par application d'une sonde conductrice sur une plage conductrice. Cependant, cette plage conductrice risque d'être détériorée, et l'accès à cette plage n'est pas toujours commode. En outre, dans un test réalisé à l'oscilloscope, la sonde utilisée comporte habituellement un crochet qui doit être fixé à une partie quelconque du circuit.In this surface mounting technique, it is still sometimes necessary to make conductive bridges between conductive pads and above all to perform circuit tests, for example by measuring electrical continuity, by measuring using a probe connected to an oscilloscope, etc. The test for determining the continuity of a circuit can be carried out by applying a conductive probe to a conductive pad. However, this conductive pad may be deteriorated, and access to this pad is not always convenient. In addition, in an oscilloscope test, the probe used usually has a hook that must be attached to any part of the circuit.
L'invention concerne un composant conducteur passif qui permet la formation d'une plage conductrice facilitant les tests de continuité et permettant l'accrochage d'une sonde pour oscilloscope de manière simple et commode.The invention relates to a passive conductive component which allows the formation of a conductive pad facilitating continuity tests and allowing the attachment of an oscilloscope probe in a simple and convenient manner.
Plus précisément, l'invention concerne un composant conducteur passif pour montage en surface sur une carte de circuit imprimé, qui comporte un corps ayant deux faces conductrices sensiblement parallèles dont une première est destinée à être soudée à une face d'une carte de circuit imprimé et la seconde face est destinée à former une surface conductrice apparente, et une cavité formée entre les deux faces. De préférence, la première face est plus longue que la seconde, et les deux faces ont la même largeur.More specifically, the invention relates to a passive conductive component for surface mounting on a printed circuit board, which comprises a body having two substantially parallel conductive faces, a first of which is intended to be soldered to one face of a printed circuit board. and the second face is intended to form an apparent conductive surface, and a cavity formed between the two faces. Preferably, the first face is longer than the second, and the two faces have the same width.
Dans un mode de réalisation, le composant est formé par pliage d'un ruban de manière qu'il ait une configuration trapézoïdale. Le raccord des extrémités du ruban est avantageusement placé au milieu de la première face ou à un coin de la configuration trapézoïdale.In one embodiment, the component is formed by folding a ribbon so that it has a trapezoidal configuration. The connection of the ends of the ribbon is advantageously placed in the middle of the first face or at a corner of the trapezoidal configuration.
Dans un autre mode de réalisation, le composant est formé par pliage d'un ruban à une configuration en U, les deux faces étant formées par les branches du U.In another embodiment, the component is formed by folding a ribbon to a U-shaped configuration, the two faces being formed by the branches of the U.
Dans un mode de réalisation, la première face est destinée à être soudée à au moins une plage conductrice de la surface d'une carte de circuit imprimé, et le composant est destiné à constituer un composant de test. Il est alors avantageux que la première face soit destinée à être soudée à deux plages d'un circuit imprimé, et que le composant constitue un pontet de connexion et, éventuellement, un composant de test.In one embodiment, the first face is intended to be soldered to at least one conductive pad of the surface of a printed circuit board, and the component is intended to constitute a test component. It is then advantageous that the first face is intended to be soldered to two areas of a printed circuit, and that the component constitutes a connection bridge and, optionally, a test component.
De préférence, les dimensions de longueur et de largeur du composant sont des dimensions normalisées pour composants de cartes de circuit imprimé à montage en surface.Preferably, the length and width dimensions of the component are standard dimensions for surface mount printed circuit board components.
L'invention concerne aussi une bande de composants pour machine automatique de pose de composants, qui comprend un film alvéolé dont les alvéoles contiennent chacun un composant objet des précédents paragraphes, et les composants sont disposés afin que, pendant l'utilisation de la bande dans une machine automatique de pose, la seconde face soit tournée du côté accessible pour un organe de prise de la machine.The invention also relates to a strip of components for an automatic component laying machine, which comprises a cellular film, the cells of which each contain a component which is the subject of the preceding paragraphs, and the components are arranged so that, during the use of the strip in an automatic laying machine, the second face is turned to the accessible side for a gripping member of the machine.
D'autres caractéristiques et avantages de l'invention ressortiront mieux de la description qui va suivre, faite en référence au dessin annexé sur lequel : la figure 1 est une vue en élévation latérale d'un exemple de composant conducteur passif selon l'invention ; et la figure 2 est une coupe suivant la ligne 2—2 de la figure 1. La figure 1 représente un composant conducteur passif selon l'invention. Ce composant est formé d'un ruban 10 d'une matière conductrice, par exemple d'un métal. Le ruban 10 a par exemple une épaisseur de 0,2 mm et une longueur de 8 mm. Elle est pliée à la configuration trapézoïdale indiquée sur la figure 1, comprenant une base inférieure large 12 au milieu de laquelle les extrémités du ruban délimitent un espace 14, une base supérieure étroite 16 et deux côtés inclinés 18, 20. Les deux bases 12, 16 sont sensiblement parallèles. La base supérieure 16 délimite une surface 22 permettant le contact avec une sonde de test. En outre, la base supérieure 16 permet l'accrochage d'une sonde reliée à un oscilloscope sur le bord du ruban.Other characteristics and advantages of the invention will emerge more clearly from the description which follows, given with reference to the appended drawing in which: FIG. 1 is a side elevation view of an example of passive conductive component according to the invention; and Figure 2 is a section along line 2—2 of Figure 1. FIG. 1 represents a passive conductive component according to the invention. This component is formed from a tape 10 of a conductive material, for example a metal. The tape 10 has for example a thickness of 0.2 mm and a length of 8 mm. It is folded to the trapezoidal configuration indicated in FIG. 1, comprising a wide lower base 12 in the middle of which the ends of the ribbon define a space 14, a narrow upper base 16 and two inclined sides 18, 20. The two bases 12, 16 are substantially parallel. The upper base 16 delimits a surface 22 allowing contact with a test probe. In addition, the upper base 16 allows the attachment of a probe connected to an oscilloscope on the edge of the ribbon.
La base inférieure 12 a une face externe (tournée vers le bas sur la figure 1) qui est destinée à être soudée à une carte de circuit imprimé par montage en surface, cette face étant séparée en deux parties 24, 26 par l'espace 14, dans le mode de réalisation représenté.The lower base 12 has an external face (facing downwards in FIG. 1) which is intended to be soldered to a printed circuit board by surface mounting, this face being separated into two parts 24, 26 by the space 14 , in the embodiment shown.
Lors de l'utilisation, plusieurs composants selon l'invention sont logés dans des alvéoles d'un film dans lesquels ils sont retenus par une feuille auxiliaire collée au film.' L'ensemble de la bande de composants formée par le film et la feuille est enroulée, de manière connue dans la technique. Lorsque la bande de composants doit être utilisée dans une machine automatique de pose de composants, la feuille de fermeture des alvéoles est séparée du film alvéolé peu avant le poste de pose si bien que chaque composant est accessible par sa face supérieure 22 dans 1 'alvéole correspondant. L'organe aspirant de prélèvement de composant vient alors au contact de la surface 22, il soulève le composant et il vient le placer à 1'endroit voulu sur une carte de circuit imprimé à montage en surface. L'organe de pose place la face inférieure 24, 26 sur une ou plusieurs plages conductrices. Lorsque le composant est placé sur plusieurs plages conductrices, il constitue un pontet conducteur. Dans tous les cas, le composant peut être utilisé comme composant de test, c'est-à-dire qu'il forme à la fois une surface supérieure 22 pour le contact d'une sonde de test de continuité et un bord d'accrochage d'une sonde de test d'oscilloscope.During use, several components according to the invention are housed in cells of a film in which they are retained by an auxiliary sheet bonded to the film. 'All of the component tape formed by the film and the sheet is wound in a manner known in the art. When the strip of components is to be used in an automatic component laying machine, the cell closure sheet is separated from the honeycomb film shortly before the laying station so that each component is accessible by its upper face 22 in the cell corresponding. The aspirating component removal member then comes into contact with the surface 22, it lifts the component and it comes to place it at the desired location on a surface-mounted printed circuit board. The fitting member places the lower face 24, 26 on one or more conductive pads. When the component is placed on several conductive pads, it constitutes a conductive bridge. In all cases, the component can be used as a test component, that is to say that it forms both an upper surface 22 for the contact of a continuity test probe and a snap edge of an oscilloscope test probe.
On a représenté les extrémités du ruban 10 au milieu de la grande base du composant. Cependant, les bords peuvent être placés à ' importe quel autre endroit, par exemple à un coin ou au milieu d'un côté. Dans une variante, un côté est même supprimé, si bien que le composant a une forme en U. Il n'est pas nécessaire que le côté soit alors incliné. Cette disposition en U facilite l'accrochage des sondes d'oscilloscope.The ends of the tape 10 are shown in the middle of the large base of the component. However, the edges can be placed anywhere else, for example at a corner or in the middle of a side. In a variant, a side is even deleted, so that the component has a U shape. The side does not have to be inclined. This U-shaped arrangement facilitates the attachment of oscilloscope probes.
L'invention concerne aussi une bande de composants du type précité.The invention also relates to a strip of components of the aforementioned type.
La mise en oeuvre de l'invention est particulièrement avantageuse lorsqu'elle s'intègre à l'utilisation des machines automatiques de pose. Par exemple, dans l'exemple décrit, le pontet peut avoir des dimensions correspondant aux dimensions normalisées des composants actifs ou passifs existants. Par exemple, la dimension totale du composant est de 2,5 mm au niveau de la grande base et de 1,5 mm au niveau de la petite base. La hauteur totale du composant est de 1,5 mm. La largeur du ruban est de 1,3 mm, et son épaisseur de 0,2 mm. Ces dimensions correspondent à celles des cartes de circuit imprimé utilisées le plus couramment. The implementation of the invention is particularly advantageous when it is integrated with the use of automatic laying machines. For example, in the example described, the trigger guard can have dimensions corresponding to the standardized dimensions of the active or passive components existing. For example, the total dimension of the component is 2.5 mm at the level of the large base and 1.5 mm at the level of the small base. The total height of the component is 1.5 mm. The width of the ribbon is 1.3 mm, and its thickness is 0.2 mm. These dimensions correspond to those of the most commonly used printed circuit boards.

Claims

REVENDICATIONS 1. Composant conducteur passif pour montage en surface sur une carte de circuit imprimé, caractérisé en ce qu'il comporte un corps ayant deux faces conductrices (22, 24, 26) sensiblement parallèles dont la première (24, 26) est destinée à être soudée à une face d'une carte de circuit imprimé et la seconde (22) est destinée à former une surface conductrice apparente, et une cavité formée entre les deux faces. CLAIMS 1. Passive conductive component for surface mounting on a printed circuit board, characterized in that it comprises a body having two substantially parallel conductive faces (22, 24, 26) of which the first (24, 26) is intended for be soldered to one side of a printed circuit board and the second (22) is intended to form an apparent conductive surface, and a cavity formed between the two faces.
2. Composant selon la revendication 1, caractérisé en ce que la première face (24, 26) est plus longue que la seconde (22) , et les deux faces (22, 24, 26) ont la même largeur.2. Component according to claim 1, characterized in that the first face (24, 26) is longer than the second (22), and the two faces (22, 24, 26) have the same width.
3. Composant selon l'une des revendications 1 et 2, caractérisé en ce qu'il est formé par pliage d'un ruban (10) de manière qu'il ait une configuration trapézoïdale.3. Component according to one of claims 1 and 2, characterized in that it is formed by folding a strip (10) so that it has a trapezoidal configuration.
4. Composant selon la revendication 3, caractérisé en ce que le raccord des extrémités du ruban (10) est placé au milieu de la première face (24, 26) . 4. Component according to claim 3, characterized in that the connection of the ends of the ribbon (10) is placed in the middle of the first face (24, 26).
5. Composant selon la revendication 3, caractérisé en ce que le raccord des extrémités du ruban (10) est placé à un coin de la configuration trapézoïdale.5. Component according to claim 3, characterized in that the connection of the ends of the ribbon (10) is placed at a corner of the trapezoidal configuration.
6. Composant selon l'une des revendications 1 et 2, caractérisé en ce qu'il est formé par pliage d'un ruban à une configuration en U, les deux faces étant formées par les branches du U.6. Component according to one of claims 1 and 2, characterized in that it is formed by folding a ribbon to a U-shaped configuration, the two faces being formed by the branches of the U.
7. Composant selon l'une quelconque des revendications précédentes, caractérisé en ce que la première face (24, 26) est destinée à être soudée à deux plages d'un circuit imprimé, et il constitue un pontet de connexion.7. Component according to any one of the preceding claims, characterized in that the first face (24, 26) is intended to be soldered to two areas of a printed circuit, and it constitutes a connection bridge.
8. Composant selon l'une quelconque des revendications 1 à 6, caractérisé en ce que la première face (24, 26) est destinée à être soudée à au moins une plage conductrice de la surface d'une carte de circuit imprimé, et le composant est destiné à constituer un composant de test.8. Component according to any one of claims 1 to 6, characterized in that the first face (24, 26) is intended to be soldered to at least one conductive pad of the surface of a printed circuit board, and the component is intended to constitute a test component.
9. Composant selon l'une quelconque des revendications précédentes, caractérisé en ce que les dimensions de longueur et de largeur du composant sont des dimensions normalisées pour composants de cartes de circuit imprimé à montage en surface.9. Component according to any one of the preceding claims, characterized in that the length and width dimensions of the component are dimensions Standard for surface mount circuit board components.
10. Bande de composants pour machine automatique de pose de composants, caractérisée en ce qu'elle comprend un film alvéolé dont les alvéoles contiennent chacun un composant selon l'une quelconque des revendications précédentes, et les composants sont disposés afin que, pendant l'utilisation de la bande dans une machine automatique de pose, la seconde face (22) soit tournée du côté accessible pour un organe de prise de la machine. 10. Strip of components for an automatic component laying machine, characterized in that it comprises a honeycomb film, the cells of which each contain a component according to any one of the preceding claims, and the components are arranged so that, during the use of the strip in an automatic laying machine, the second face (22) is turned towards the accessible side for a gripping member of the machine.
PCT/FR1994/001289 1993-11-08 1994-11-07 Passive conductor component for surface mounting on a printed circuit board WO1995013632A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR93/13255 1993-11-08
FR9313255A FR2712454B3 (en) 1993-11-08 1993-11-08 Passive conductive component for surface mounting on a printed circuit board.

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WO1995013632A1 true WO1995013632A1 (en) 1995-05-18

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PCT/FR1994/001289 WO1995013632A1 (en) 1993-11-08 1994-11-07 Passive conductor component for surface mounting on a printed circuit board

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WO (1) WO1995013632A1 (en)

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FR2868661B1 (en) * 2004-03-30 2006-06-23 Valeo Electronique Sys Liaison PLATE FOR ELECTRICAL CONNECTION BETWEEN A SUBSTRATE AND A CONDUCTIVE BODY

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EP0359223A1 (en) * 1988-09-15 1990-03-21 Alcatel Radiotelephone Electrical contact for printed-circuit boards with surface-mounted components, and printed-circuit board comprising at least one such contact
DE4027656A1 (en) * 1990-08-31 1992-03-05 Esser Sicherheitstechnik Contact element for circuit board with surface mounted devices - uses bent sheet metal C=shaped profile fitting around housing of surface mounted device
EP0601900A1 (en) * 1992-11-06 1994-06-15 Thomson-Csf Device for the manual testing of a printed circuit board equipped with surface mount components

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Publication number Priority date Publication date Assignee Title
US3729816A (en) * 1971-12-02 1973-05-01 Western Electric Co Method of forming a circuit
DE3618123A1 (en) * 1986-05-30 1987-12-03 Johann Leonhard Huettlinger Multiple connection using SMD technology
JPS63157076A (en) * 1986-12-22 1988-06-30 Matsushita Electric Ind Co Ltd Chip test post
EP0359223A1 (en) * 1988-09-15 1990-03-21 Alcatel Radiotelephone Electrical contact for printed-circuit boards with surface-mounted components, and printed-circuit board comprising at least one such contact
DE4027656A1 (en) * 1990-08-31 1992-03-05 Esser Sicherheitstechnik Contact element for circuit board with surface mounted devices - uses bent sheet metal C=shaped profile fitting around housing of surface mounted device
EP0601900A1 (en) * 1992-11-06 1994-06-15 Thomson-Csf Device for the manual testing of a printed circuit board equipped with surface mount components

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PATENT ABSTRACTS OF JAPAN vol. 12, no. 422 (P - 783) 9 November 1988 (1988-11-09) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998036625A1 (en) * 1997-02-17 1998-08-20 Magnetek S.P.A. Process for producing printed circuits and printed circuits thus obtained

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FR2712454B3 (en) 1996-03-22
FR2712454A1 (en) 1995-05-19

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