WO1995011581A1 - Treatment of substrates - Google Patents
Treatment of substrates Download PDFInfo
- Publication number
- WO1995011581A1 WO1995011581A1 PCT/GB1994/002317 GB9402317W WO9511581A1 WO 1995011581 A1 WO1995011581 A1 WO 1995011581A1 GB 9402317 W GB9402317 W GB 9402317W WO 9511581 A1 WO9511581 A1 WO 9511581A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coating
- pad
- composition
- group
- board
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
- B05C1/086—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line a pool of coating material being formed between a roller, e.g. a dosing roller and an element cooperating therewith
- B05C1/0865—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line a pool of coating material being formed between a roller, e.g. a dosing roller and an element cooperating therewith the cooperating element being a roller, e.g. a coating roller
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
- B05C1/0826—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
- B05C1/0834—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets the coating roller co-operating with other rollers, e.g. dosing, transfer rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/16—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length only at particular parts of the work
- B05C1/165—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length only at particular parts of the work using a roller or other rotating member which contacts the work along a generating line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/04—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to opposite sides of the work
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0537—Transfer of pre-fabricated insulating pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Definitions
- the present invention relates to the treatment of substrates and apparatus for carrying out such treatment.
- the present invention relates particularly to the printing or coating of one or both sides of a substrate, especially to the printing or coating of printed circuit boards.
- PCBs are often provided with a 'robber' or 'thieving ' band - that is. a thin border of copper, typically in the region of 10 - 15mm around the edge o f the substrate board, for earthing or drawing current from the board during manufacture of the board and assembly of the components on the board.
- This band also allows for handling of the board without interfering with the printed circuit area.
- resists and masks application to this area is conventionally avoided by screen printing only the central area of the board.
- this procedure is slow particularly when printing a double-sided PCB. when normally the first side must be printed and allowed to dry before the second side can be printed.
- Automated screen printing onto both sides of a substrate is known but requires machinery of high capital cost and inconveniently slow working. Also changing screens for different tasks is a time consuming procedure .
- the present invention provides a process for printing a composition onto a printed circuit board (PCB). the process comprising applying a composition to the PCB from a pad supported on a rotating cylinder, the pad being positioned so as to leave an uncoated band on at least one edge of the PCB. Preferably all four edges remain uncoated.
- PCB printed circuit board
- the PCB is passed between a pair of opposed cylinders, each with a pad, such as a stencil or impression pad so as to coat both sides on a single pass.
- a pad such as a stencil or impression pad
- the pad is of a cellular foamed material more preferably a closed cell foamed material.
- the method of the invention is especially suitable for applying to PCBs (that may already have undergone a first imagewise exposure and etching to produce a copper track pattern) compositions for many purposes, such as soldering pre-treatments .
- the masking composition is typically a commercially available liquid photoimageable composition designed for solder or PCB pad masks.
- the (foam) pad is typically of rectangular configuration but may be cut to any required shape to coat the whole or a part of the track area while leaving the edges of the PCB uncoated.
- Apparatus for use in the method typically comprises two groups of rollers, one on each side of the path followed by the PCB.
- each group comprising a coating cylinder with a pad for transferring the composition to the PCB and a transfer roller to transfer the composition from a reservoir to the pad.
- a pair of transfer and doctor rollers in contact with each other form a crotch or trough therebetween to receive composition pumped from a reservoir.
- the crotch is preferably closed by a pair of end plates to retain the composition in the crotch.
- the coating cylinder of one group is positioned directly vertically above that of the other group.
- Figure 1 illustrates schematically an arrangement of rollers in accordance with a preferred embodiment of the apparatus of the present invention
- Figure 2 is an outline illustration of certain features of an embodiment of the apparatus of the present invention, showing for clarity a single group of rollers.
- FIG 1 illustrates a substrate 10 passing between an upper group of rollers A and a lower group of rollers B.
- Each group (both Figures) includes a coating cylinder 11 on which is provided a pad 12.
- a transfer roller 13 adjacent coating cylinder 11 and a doctor .
- roller 14 substantially coplanar with and contacting the transfer roller 13.
- a reservoir of a printing or coating composition (ink) is held in the crotch or trough 15 formed between the contacting transfer and doctor rollers 13.14 to which it is pumped via pipe 24 from a common reservoir .
- the composition is retained in the crotch by conventional end plates 16.
- the coating cylinder 11 of group B is directly below that of group A.
- the coating cylinders 11 of the two groups are preferably adjustable with respect to each other in order to allow for the treatment of substrates of different thicknesses. This can typically be achieved by providing that cylinder 11 of group B is fixed in position, whereas cylinder 11 of group A is adjustable in the vertical plane for example by means of a jack (not shown) adjustable by means of a hand screw 20.
- the transfer and doctor rollers 13.14 of each group are preferably adjustable by hand screws with respect to the coating cylinder 11 of that group. By providing adjustability, adequate coating using a variety of pads 12 of differing sizes is provided for.
- Both transfer and doctor rollers 13.14 of each group may be adjustable together, or. as shown, roller 13 is adjustable by means of a hand screw 21 actually a jack (not shown) to raise or lower roller 13 to increase or decrease the degree of contact between cylinder 11 and roller 13 of each group.
- the pad 12 is preferably formed of a cellular, especially closed-cell, material, although open cell materials such as foamed neoprene rubber may also be suitable.
- the open-cell structure provides an internal reservoir that assists in overcoming problems of incomplete coating of the PCB. In particular we have found this allows adequate filling of steps formed between the edge of copper tracks and the underlying substrate as well as the edges and surfaces of the tracks themselves.
- open cell materials may. with use. take up large volumes of composition which can set solid if there is a break in use of the machinery. This necessitates frequent replacement of the pad.
- the use of a closed cell pad 12 overcomes this problem. It has been found that the surface of broken cells on such a pad provides a sufficient reservoir for the coating composition to ensure fully conformal coating of the PCB. in particular the steps formed by the copper tracks described above.
- the apparatus can readily apply a coating of 50-60 um with a dry coat of 45-50 ⁇ m.
- thicker or considerably thinner coatings can be readily achieved.
- coating cylinders 11 and rollers 13.14 are caused to rotate such that rollers 13 become coated with the composition, which is then transferred to the pads 12 on each cylinder 11.
- the composition coated pads 12 contact an adjacent face of the substrate 10 depositing the composition in an impression of the pad on both faces thereof.
- the pad 12 on the cylinder 11 of group A may be the same as or different from that on the cylinder 11 of group B. depending upon the particular requirements of the task in hand.
- the coating cylinder carries out a non-printing rotation between coating each PCB in order to take up further composition from roller 13.
- it may be advantageous to coating quality to rotate doctor roller 14 at a slower peripheral speed than transfer roller 13. or in many cases to hold roller 14 stationary.
- a brake 23 is provided to hold the roller stationary.
- the rotational speed of the coating rollers 11 is slowed when not coating boards, for example whilst awaiting space for coated PCBs in a drying oven.
- one complete group of rollers (typically group A) can be jacked or raised with respect to the other group in order to separate the respective pads when no PCB is passing therebetween, so avoiding contact between the pads.
- the pad 12 may be attached directly to the cylinder 11. for example by an adhesive, or may be adhered to a metal plate or foil which can then be mounted upon the cylinder in a substantially conventional manner as is known in the field of lithographic printing.
- the use of the impression or stencil pad allows for the provision of a ink-free 'robber' band as described above.
- the substrate is typically guided into the apparatus along a conveyor 22 having provision for edge alignment or centralising.
- the edge alignment or centralising can be adjusted with respect to the pad 12 to provide a border of the desired width.
- the conveyor is preferably also provided with one or more sensors to detect the leading edge of the substrate.
- the sensors are used to trigger a mechanism which guides the substrate into the roller system with the leading edge ahead of pad 12 such that on contact a 'robber' band along the leading edge of the treated substrate remains uncoated.
- the sensor can be used to ensure that the substrate passes into the apparatus in exact registration with the pad 12.
- a printed circuit board passes along conveyor 22 until its leading edge passes over sensor 30 where upon the conveyor is stopped.
- a piston bar 31 driven by a mechanism 32 pushes the board into edge alignment with a guide 33 on the other side of the apparatus.
- a further sensor 34 on the leading edge of guide 33 detects when edge alignment is correct.
- a sensor 35 mounted on the spindle of coating roller 11 monitors the rotational position of roller 11 and restarts conveyor 22 at an appropriate time to ensure exact registration between the PCB and the edge of pad 12.
- the substrate can be supported by short rollers on the uncoated side edge and by tapered or point contact rollers on the other side edge, causing no damage to the substrate regardless of whether coated to the edges or left uncoated on a particular edge.
- the robber band also allows the PCB to be handled subsequently for drying etc. using the gripping system described in patent application WO 92/18402 or WO 91/15940.
- the coated substrate may be passed through an oven as described in patent application WO 92/08940.
- the impression or stencil pad is typically of rectangular configuration to coat the copper tracks and leave the edges of the PCB uncoated.
- the shape and size of the pad can be varied as necessary to provide selective coating of the substrate.
- the present invention allows for coating of irregular shaped PCBs including boards having holes therein: for example PCBs for vehicle speedometers where the cable for the speedometer has to pass through the PCB.
- boards with holes are prepared by cutting the hole as a final step in the preparation of the boards. This can often result in damage to the tracks or coatings of the board.
- the present invention allows for the board to be cut as the first step, even before the copper tracks are applied.
- the impression or stencil pad can be of such a shape that it does not apply mask to the PCB in the area of the hole.
- High speed conventional machines can typically coat boards on each side following two passes through the machine at a rate of about 12 metres of board per minute.
- the present invention allows for coating at a rate of 21m/min or greater.
- Machines in accordance with the present invention are typically far more compact than conventional machines. This can be an important consideration for apparatus intended to be used in a "yellow” or "clean" room environment, as such rooms are expensive to construct and maintain, and so a compact clean room has cost benefits.
- the apparatus is highly adaptable and can be used for applying a wide range of compositions at many different stages in the production of a finished PCB. For example, in applying liquid soldering pre-treatments . primary etch resists, plating resists, solder mask and so on.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP94930297A EP0724824A1 (en) | 1993-10-21 | 1994-10-21 | Treatment of substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9321679.4 | 1993-10-21 | ||
GB939321679A GB9321679D0 (en) | 1993-10-21 | 1993-10-21 | Treatment of substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1995011581A1 true WO1995011581A1 (en) | 1995-04-27 |
Family
ID=10743875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1994/002317 WO1995011581A1 (en) | 1993-10-21 | 1994-10-21 | Treatment of substrates |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0724824A1 (en) |
GB (1) | GB9321679D0 (en) |
WO (1) | WO1995011581A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998038842A1 (en) * | 1997-02-25 | 1998-09-03 | P.A.C. Circuiti Stampati S.R.L. | Coating device for coating solder resist on both sides of a printed circuit board |
CN103350051A (en) * | 2013-06-26 | 2013-10-16 | 东莞美驰图实业有限公司 | Automatic glue spreading device |
CN109622295A (en) * | 2018-12-19 | 2019-04-16 | 芜湖恒美电热器具有限公司 | Generate heat the automatic brush coating device of wicking surface |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB776206A (en) * | 1954-04-29 | 1957-06-05 | Jagenberg Werke Ag | Machine for applying gum, lacquer or like fluid coatings |
GB1149339A (en) * | 1967-12-18 | 1969-04-23 | Shipley Co | Method of producing coated surfaces |
FR1572818A (en) * | 1967-07-07 | 1969-06-27 | ||
GB2052391A (en) * | 1979-06-05 | 1981-01-28 | Mitsubishi Heavy Ind Ltd | Inking systems for flexographic printing |
JPS6451165A (en) * | 1987-08-24 | 1989-02-27 | Toyo Ink Mfg Co | Pattern painting roll |
WO1991013690A1 (en) * | 1990-03-16 | 1991-09-19 | Vermehren, H., Richard | Gummer roll apparatus |
-
1993
- 1993-10-21 GB GB939321679A patent/GB9321679D0/en active Pending
-
1994
- 1994-10-21 EP EP94930297A patent/EP0724824A1/en not_active Withdrawn
- 1994-10-21 WO PCT/GB1994/002317 patent/WO1995011581A1/en not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB776206A (en) * | 1954-04-29 | 1957-06-05 | Jagenberg Werke Ag | Machine for applying gum, lacquer or like fluid coatings |
FR1572818A (en) * | 1967-07-07 | 1969-06-27 | ||
GB1149339A (en) * | 1967-12-18 | 1969-04-23 | Shipley Co | Method of producing coated surfaces |
GB2052391A (en) * | 1979-06-05 | 1981-01-28 | Mitsubishi Heavy Ind Ltd | Inking systems for flexographic printing |
JPS6451165A (en) * | 1987-08-24 | 1989-02-27 | Toyo Ink Mfg Co | Pattern painting roll |
WO1991013690A1 (en) * | 1990-03-16 | 1991-09-19 | Vermehren, H., Richard | Gummer roll apparatus |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 13, no. 241 (C - 604)<3589> 6 June 1989 (1989-06-06) * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998038842A1 (en) * | 1997-02-25 | 1998-09-03 | P.A.C. Circuiti Stampati S.R.L. | Coating device for coating solder resist on both sides of a printed circuit board |
US6387181B1 (en) | 1997-02-25 | 2002-05-14 | Sandro Bezzetto | Coating device for coating solder resist on both sides of a printed circuit board |
CN103350051A (en) * | 2013-06-26 | 2013-10-16 | 东莞美驰图实业有限公司 | Automatic glue spreading device |
CN109622295A (en) * | 2018-12-19 | 2019-04-16 | 芜湖恒美电热器具有限公司 | Generate heat the automatic brush coating device of wicking surface |
Also Published As
Publication number | Publication date |
---|---|
EP0724824A1 (en) | 1996-08-07 |
GB9321679D0 (en) | 1993-12-15 |
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