WO1994006037A1

WO1994006037A1 - Color filter and production method therefor

Info

Publication number: WO1994006037A1
Application number: PCT/JP1993/001269
Authority: WO
Inventors: Mitsuru Eida; Hideaki Kurata; Jun-Ichi Kantano
Original assignee: Idemitsu Kosan Co., Ltd.
Priority date: 1992-09-08
Filing date: 1993-09-07
Publication date: 1994-03-17

Abstract

A color filter having a display (81) produced by sequentially laminating an insulating substrate (80), a transparent conductive film (82), micelle electrolytic process film (R, G, B, BL) colorant layers (83a, 83b, 83c, 83d), and transparent resist films (84a, 84b, 84c and 84d) hardened through photo-curing (formed on the micelle electrolytic process films R, G, B, BL colorant layers (83a to 83d) (84a, 84b, 84c, 84d)) in order named. Further, a protective film (105) is formed in lamination on the transparent resist films (84a to 84d), whenever necessary.

Description

Akira Itoda Color filter and its manufacturing method

The present invention relates to a color filter used for a large-sized indoor / outdoor screen image such as a color liquid crystal display and an aurora vision, an information display device, a solid-state imaging device (CCD), and the like. The present invention relates to a color filter capable of improving the production efficiency (yield) as well as a color filter, and a method for manufacturing the same. Background art

In the following, a description will be given of a case where a conventional color filter is used in a color liquid crystal display as an example.

In recent years, color liquid crystal displays have been used for displays such as liquid crystal televisions, liquid crystal projectors, laptop computers, and notebook personal computers. In this color liquid crystal display, a color filter is used in which a dye layer is patterned in a plane on an insulating transparent substrate, that is, separated and arranged.

Fig. 32 shows the configuration of a general color liquid crystal display. This color liquid crystal display sandwiches liquid crystal between two substrates. That is, a color filter is used as one of the substrates, and liquid crystal 30 is sealed between the color filter substrate 10 and the driving substrate 20. After sealing the liquid crystal 30, it is sealed with adhesive (sealing material) 40a and 40b.

The color filter substrate 10 has three primary colors, namely, red (red, R), green (green, G), and blue (blue, B) (hereinafter referred to as necessary) on a glass substrate 1 as an insulating transparent substrate. Simply write R, G, B) The dye layers 5a, 5b, 5c are formed and repeated. In addition, a black matrix (hereinafter referred to as BM or BM as necessary) is provided between the dye layers 5a to 5c to prevent a decrease in contrast and color purity due to leakage light there. BL) 2a, 2b, 2c, 2d are provided repeatedly.

Also, black matrixes 2a to 2d and dye layers 5a to 5d. A protective film 6 is formed on the upper surface and flattened, and a liquid crystal driving transparent electrode is provided on the upper surface. On the other hand, the driving substrate 20 is formed by repeatedly forming the driving transparent electrodes 22 a, 22 b, and 22 c on the insulating transparent substrate 21.

The dye layer of such a color filter is usually formed by printing an ink obtained by kneading a pigment or dye (dye) and resin of the three primary colors R, G, and B on an insulating transparent substrate such as a glass substrate using a printing machine. It is formed by a conventional printing method.

Also, an ultraviolet-curable resin (resist) containing a pigment or dye (dye) dispersed therein is applied on a glass substrate, and mask exposure by photolithography, development, and heat curing are performed by R, G, and R, respectively. A dispersion method in which a dye layer is formed by repeating three times for each B, or a photosensitive natural polymer such as gelatin is coated on a glass substrate, and mask exposure by photolithography is performed. After development, R, G, B The dyeing method of forming a dye layer by repeating the process of dyeing gelatin that has been buttered with one of the dyes and thermally curing the same for the remaining two colors is also used.

In addition, the electrodeposition polymer and pigment or dye (dye) are dispersed in a liquid such as water, and the R, G, and B are formed on this electrode using the conductive thin film pattern (electrode) formed on the substrate. The dye layer is sequentially electrodeposited to form a dye layer composed of a pigment or paint (dye) and an electrodeposition polymer by an electrodeposition method, or a surfactant and a pigment or dye (dye) are mixed with water or the like. A micellar electrolysis method is used in which a pigment layer is formed by sequentially dispersing R, G, and B pigments or dyes on a previous electrode to form a pigment layer. The case where a force filter is formed by this micelle electrolysis method will be described.

The structure of the force filter in the micellar electrolysis method is described in the following structure (1) disclosed in Japanese Unexamined Patent Publication No. 3-102302 and Japanese Unexamined Patent Application Publication No. Hei 4-110901. The disclosed structure (2) and the structure (3) disclosed in Japanese Patent Application Laid-Open No. 5-142418 have been proposed.

FIG. 33 (a) is a front view showing the structure of the structure (1), and FIG. 33 (b) is a sectional view taken along the line AA in FIG. 33 (a).

In this example, the display section 41 is formed by laminating an insulating substrate, a transparent conductive thin film, a colorant layer, a protective film, a liquid crystal driving electrode, and the like. That is, first, a transparent conductive thin film such as indium or tin oxide (ITO) is patterned on an insulating transparent substrate 42 such as a glass substrate to form a dye layer to be connected to the electrode extraction portion 43. The transparent electrodes 44a, 44b, 44c are formed. Furthermore, an electrode take-out layer 43 and a black matrix layer 4 made of an acrylic acid-based photocurable resist cured product containing a black pigment (black pigment mixture) (Japanese Patent Application Laid-Open No. Hei 4-131106). 6a, 46b, 46c and 46d are patterned and laminated simultaneously, and pigments of R, G and B primary colors are formed by micellar electrolysis to form dye layers 48a, 48b and 48c. Is formed. Then, a protective film is formed using a protective film agent 50 containing an acrylic resin or a siloxane resin as a main component, and a transparent conductive thin film such as an oxide of indium or tin (IT0) is laminated on the upper surface. A liquid crystal driving electrode 52 is provided.

FIG. 34 (a) is a front view of the structure (2), and FIG. 34 (b) is a sectional view taken along line C-C in FIG. 34 (a).

In this example, a black matrix 6 in which a metal or metal oxide thin film such as metal chrome and chromium oxide is patterned on an insulating transparent substrate 60 such as a glass substrate to form the display section 56 1 a, 6 lb, 61 c, 61 d, insulating film 62 such as silica or acrylic resin, and transparent conductive thin film such as oxides of indium and tin (IT0) The dye layer forming electrodes 63a, 63b, and 63c are sequentially laminated. In addition, electrode extraction layers 66a and 66b made of a cured acrylic acid-based photocurable resist containing a dye (pigment or dye) or a cured acrylic acid-based photocurable resist are used. After being formed on the electrode for forming a color layer which is extended out of the display section 56, pigments or dyes of the three primary colors R, G and B are formed by micellar electrolysis to form the dye layers 64a and 64. b and 64c are formed.

Then, a protective film 67 is formed using a protective film agent containing an acrylic resin or a siloxane resin as a main component, and a transparent conductive material such as indium or tin oxide (ITO) is formed on the protective film 67. A thin film is laminated on the entire surface to form a liquid crystal driving electrode 68.

FIG. 35 (a) is a front view of the structure (3), and FIG. 35 (b) is a cross-sectional view taken along the line EE in FIG. 35 (a). In this example, in order to form the display section 70, first, a dye layer in which a transparent conductive thin film such as indium or tin oxide (IT0) is patterned on an insulating transparent substrate 71 such as a glass substrate. Forming electrodes 72a, 72b, and 72c are formed. The electrode extraction layers 77a and 77b made of a cured acrylate-based photocurable resist or a cured acrylate-based photocurable resist containing a dye (pigment or dye) are displayed. After laminating on the electrode for forming a dye layer extended outside part 70, pigments or dyes of three primary colors of R, G, B are formed by micellar electrolysis to form dye layers 73a, 73b, 7 3c is formed.

Thereafter, the protective film 74 is formed using a protective film agent mainly composed of an acrylic resin or a siloxane resin. Further, a transparent conductive thin film such as an oxide of indium or tin (IT0) is laminated on one surface to form a transparent electrode 75 for driving a liquid crystal. In addition, black matrixes 76a, 76b, 76c, and 76d, which are patterned metal or metal oxide thin films such as metal chrome and oxide chromium, are provided. In this structure 3, the order of lamination of the liquid crystal driving electrode and the black matrix may be reversed. FIG. 36 (a) is a front view showing a configuration of a conventional force filter according to the dispersion method, and FIG. 36 (b) is a cross-sectional view taken along line SS in FIG. 36 (a).

In this example, the insulating substrate 78, the metal or metal oxide thin film black matrix BL (formed on the insulating substrate 78) 78a, 78b, 78c, 78d, and R, G, B dye-containing resist cured product (formed on insulating substrate 78) 78e, 78f, 78g, protective film 79a, and transparent conductive thin film (liquid crystal drive electrode) The display section 79c is formed by sequentially stacking 79b.

However, in the above-described conventional structures (1) to (3), a transparent conductive thin film is patterned, and a dye layer forming electrode continuously connected to each color of RGB and an electrode extraction layer are indispensable. (The same applies to the electrodeposition method). First, patterning of transparent conductive thin film, which is mainly ITO, requires high-definition patterning such as triangle-diagonal arrangement and fine processing according to the pattern of complex dye (pixel) arrangement. Except for simple patterns such as stripes, shorts or breaks in the transparent conductive thin film were likely to occur. In other words, the width of the lines of the electrode pattern for dye formation and the width of the gear between the lines became smaller in the case of the diagonal and triangle arrangements, and the probability of defects due to short-circuit and disconnection increased as compared with the stripe pattern. Next, it was necessary to similarly pattern the electrode extraction layer, and the process was complicated. As a result, the production yield of color filters and evenings had to be reduced.

In addition, the continuous connection of fine dye layer forming electrodes causes a voltage drop due to the resistance of the transparent conductive thin film, and forms a film near the electrode extraction layer and at a remote part by micellar electrolysis. In some cases, a difference in the thickness of the dye layer, that is, color unevenness in a color filter was generated. In addition, since the dye layer is formed on the fine transparent conductive thin film pattern, the difference in the thickness of the dye layer between the center and the end of the pattern line, that is, the step between pixels, is reduced. May have occurred. As a result, the contrast of the color filter was reduced, and the image quality was sometimes reduced.

In addition to the problems based on the micellar electrolysis method, the following problems also exist with color filters manufactured by other methods. In other words, the color filter based on the dispersion method uses a dye-containing, that is, a photocurable resist in which the colorant is dispersed, so that the exposure sensitivity and the definition (resolution) of the dye pattern are determined by the light absorption of the dye. It had to be worse than the transparent registry.

Furthermore, the dye-containing resist is applied all over the surface of a color filter or a roll coater. However, there is a difference in the thickness of the resist between the center and the end of the color filter, and this difference in thickness causes color unevenness. However, it was difficult to align the R, G, and B successively in the _T- printing method, and it was difficult to obtain a high-resolution (high-definition) dye pattern.

In the dyeing method, since the dye is a dye, there was a problem in heat treatment in post-processing of the color filter and in light resistance as a color filter.

Further, in any of the above cases, it was difficult to control the thickness step between the dye layers (step between pixels) to be small. That is, it is difficult to flatten the color filter, and cracks and disconnections are likely to occur when the conductive thin film for driving a liquid crystal is laminated.

Next, regarding the black matrix, other than the force filter by the micellar electrolysis method, the color filters by the electrodeposition method, the dispersing method, the printing method, and the dyeing method also use the chromium and chromium oxide as described above. A cured layer of a photocurable resist containing a metal or metal oxide thin film or a black dye has been used.

These metal or metal oxide thin films have the advantage of being able to form a high-definition black matrix pattern because of their high light-shielding degree (optical density) required as a black matrix and small film thickness. is there.

However, the pattern of this black matrix is 2 0 o ° or c), must be by connexion made film deposition or spatter-ring under reduced pressure (hundreds Mi ⁷ Y Torr) there - because, formed condition stricter, accompanied by difficulty in manufacturing Was something. On the other hand, since the film thickness is small, the gap between the dye layers (R, G, Β) of the color filter is reduced, and the step between pixels is increased, so that it is difficult to flatten the color filter. . As a result, oblique light leaks from the backlight of the color liquid crystal display, which inevitably results in a narrow viewing angle, and when a thin film with high reflectivity such as a metal chrome is used, the light is not reflected. The visibility had to be reduced by the light.

On the other hand, a cured product of a photocurable resist containing a black pigment has a low light-blocking degree (optical density) required as a black matrix, and contains a light-blocking black pigment. The exposure sensitivity was low, and the resolution required to form a high-definition pattern was low. For this reason, it has been difficult to improve the definition of the color liquid crystal display.

In order to increase the exposure sensitivity and the resolution, a method is known in which a black dye-containing resist is applied to the step of forming a black matrix, and then a step of laminating an oxygen barrier film is added. However, this process could not be spared.

Therefore, in the black matrix, the formation conditions are mild and the formation process is simple, and the gap between the dye layers (R, G, Β) is filled, and the color filter is flattened. There is a need for a light-shielding material capable of forming a high-definition (high-resolution) pattern, and improvement of these has been an issue.

The present invention has been made in view of the above-described problems, and it is possible to increase the definition of a display image using a color filter, for example, a color liquid crystal display, improve the image quality, and improve production efficiency ( It is an object of the present invention to provide a color filter capable of improving the yield and a method for manufacturing the same. Disclosure of Invention _ ⁸ —

In order to achieve the above-mentioned object, according to the present invention, in a color filter in which a plurality of color dye layers are separately arranged on an insulating substrate and a predetermined dye pattern is formed, at least Also, a transparent conductive thin film formed by laminating the entire display area or a portion corresponding to a continuous pattern including the display pixel section. The entire or a part of the transparent conductive thin film is formed by micellar electrolysis. There is provided a color filter comprising a plurality of dye layers separately arranged and a cured product of a transparent photocurable resist formed by laminating on the dye layers in this order. .

Further, there is provided a color filter in which the plurality of color layers correspond to three primary colors.

Further, there is provided a color filter in which the plurality of color layers correspond to three primary colors and four black colors.

Further, there is provided a color filter further comprising a protective film formed by laminating on the cured product of the transparent photo-curable resist.

Further, in a method of manufacturing a color filter in which a plurality of color dye layers are separated and arranged on an insulating substrate to form a predetermined dye pattern, a) at least the entire display portion or the display pixel portion on the insulating substrate is A step of laminating and forming a transparent conductive thin film on a portion corresponding to a continuous pattern including

b) a step of forming a dye layer of one color selected from a plurality of colors on the entire surface or a part of the transparent conductive thin film by film formation by micellar electrolysis, c) transparent on the dye layer of one color A layer of a photo-curable resist is laminated, exposed using a mask corresponding to the dye layer of one color selected from the above-mentioned plurality of colors, and before and / or after the heat treatment of the exposed portion, photo-curing of the unexposed portion Removing the resist and the dye layer to arrange a dye layer of one color, d) The same as the above steps b) and c)) The step i) is further repeated one or more times to separate the dye layers of the remaining colors of the plurality of colors onto the entire surface or a part of the transparent conductive thin film, respectively. Disposing and forming a multi-color dye pattern,

And a method for producing a color filter, characterized by comprising:

Also provided is a method for producing a color filter in which the plurality of color layers correspond to three primary colors.

Further, there is provided a method for manufacturing a color filter, wherein the plurality of color layers correspond to three primary colors and four black colors.

Further, after the step d), the pattern of the transparent conductive thin film is formed by etching the transparent conductive thin film in the portion where the dye pattern is not present using the dye pattern of a plurality of colors as a mask. A method for producing a color filter is provided.

Further, in a method of manufacturing a color filter for forming a predetermined dye pattern by separately arranging three primary color dye layers on an insulating substrate and forming a black matrix,

a) a process of laminating a metal or metal oxide thin film in a predetermined shape on an insulating substrate as a black matrix,

b) a step of laminating a transparent conductive thin film on at least the entire display portion or a portion corresponding to a continuous pattern including the display pixel portion of the metal or metal oxide film thin film,

c) a step of forming a dye layer of one of the three primary colors on the entire surface or a part of the transparent conductive thin film by film formation by micellar electrolysis, d) a transparent photocurable resist on the dye layer. Are exposed using a mask corresponding to the dye layer of one of the three primary colors, and before and / or after the heat treatment of the exposed portion, the unexposed portion of the resist and the dye layer are removed. Removing and placing the first color dye layer,

e) The same steps as the above steps c) and d) are further repeated one or more times so that the dye layers of the remaining three primary colors are entirely or partially covered by the transparent conductive thin film. And a method of forming a three-primary-color dye pattern.

Ό

a) a step of laminating a transparent conductive thin film on at least the entire display portion or a portion corresponding to a continuous pattern including the display pixel portion on the insulating substrate;

b) a step of forming a dye layer of one of the three primary colors on the entire surface or a part of the transparent conductive thin film by film formation by micellar electrolysis, c) a transparent photocurable resist on the dye layer. Are exposed using a mask corresponding to the dye layer of one of the three primary colors, and before and / or after the heat treatment of the exposed portion, the unexposed portion of the resist and the dye layer are removed. Removing and placing the first color dye layer,

d) The same steps as in steps b) and c) are repeated one or more times, and the dye layers of the remaining three primary colors are separately arranged on the entire surface or a part of the transparent conductive thin film, respectively. The process of forming the dye pattern of

e) a photocurable material containing a black pigment before, during, or after each of the three primary color layers is separately disposed, at a position between the three primary color layers to be disposed, or between the disposed three primary color layers; Forming a resist in a predetermined shape as a black matrix by a photolithography method, and forming a black matrix;

And a method for producing a color filter, characterized by comprising:

In addition, in a method of manufacturing a color filter for forming a predetermined dye pattern by separately arranging three primary color dye layers on an insulating substrate and forming a black matrix,

a) On the insulating substrate, at least the entire display area or the area including the display pixel area A portion corresponding to the pattern that follows, a process of laminating and forming a transparent conductive thin film,

b) A photo-curable resist containing a dye of one color selected from the three primary colors is laminated on the entire surface or a part of the transparent conductive thin film, and a mask corresponding to the dye layer of one color selected from the three primary colors is used. Exposing and developing the resist, removing the unexposed resist, and arranging the dye layer of the first color, c) repeating the same step as step b) one or more times to obtain Disposing the dye layers of the remaining colors of the color on the entire surface or a part of the transparent conductive thin film, respectively, to form a dye pattern of three primary colors; d) separately disposing the dye layers of the three primary colors, After that, a black dye layer is formed in a predetermined shape at a position between the arranged three primary color dye layers by film formation by micellar electrolysis, thereby forming a black matrix.

And a method for producing a color filter, comprising:

In addition, before the step a), a cured product of a photo-curable resist containing a black dye, or a metal, at a position corresponding to the black dye layer formed in the step d) on the insulating substrate. Or a method for manufacturing a color filter, characterized by forming a metal oxide thin film.

In addition, there is provided a method for producing a color filter, wherein the method of laminating the transparent photocurable resist is a film formation method by a micelle electrolysis method or an electrodeposition method.

Further, there is provided a method for producing a force filter, wherein the dye layer is subjected to ultraviolet washing before laminating the transparent photocurable resist.

In addition, the insulating substrate or the display portion on the transparent conductive thin film formed by laminating at least the entire display portion of the metal or metal oxide thin film or the portion corresponding to the continuous pattern including the display pixel portion is formed. A method for manufacturing a filter is provided, wherein a protective film is formed by laminating a portion except for a corresponding portion. Further, there is provided a method for producing a color filter, wherein a protective film is further formed by laminating after forming the dye pattern of a plurality of colors or the dye pattern of three primary colors and black matrix. You.

Furthermore, there is provided a black matrix manufacturing method characterized in that a black dye is formed on the conductive thin film between the three primary color dye patterns of the color filter by micellar electrolysis. Is done.

Hereinafter, a color filter and a method of manufacturing the same according to the present invention will be described in detail with reference to the drawings.

First, the outline of the configuration of the color filter of the present invention will be described by taking Structure 4 to Structure 31 as an example.

As shown in the plan view of FIG. 1 (a), the cross section taken along the line GG of FIG. 1 (b), and the cross section taken along the line H—H of FIG. Insulating substrate 80, transparent conductive thin film 82, micellar electrolytic R, G, B, BL dye layers 83a, 83b, 83c, 83d, and transparent light Curable resist cured product (formed on micelle electrolytic film R, G, B, BL dye layers 83a to 83d) 84a, 84b, 84c, 84d are laminated in this order ing.

The color filter of Structure 5 is composed of insulating substrate, transparent conductive thin film, R, G, B, BL dye layer formed by the method of micellar electrolysis, and transparent photo-curable resist cured product (R, G, B, BL dye layer). ) And a protective film are sequentially laminated.

As shown in the plan view of FIG. 2 (a) and the cross-section taken along the line I-I of FIG. 2 (b), the color filter of structure 6 has an insulating substrate 90, a transparent conductive Functional thin film 92, R, G, B, BL dye layers 93a, 93b, 93c, 93d, 93e, 93f, 93g, transparent light curable Cured resist (formed on G, B, BL dye layers 93a to 93g) 94a, 94b, 94c, 94d, 94e, 94f, 94g, and liquid crystal drive Transparent conductive thin films 95 are sequentially laminated.

The color filter of Structure 7 consists of an insulating substrate, a transparent conductive thin film, R, G, B, B

Layer, a transparent photocurable resist cured product (formed on the R, G, B, and BL dye layers), a protective film, and a transparent conductive thin film for driving a liquid crystal.

The color filter of Structure 8 is composed of insulating substrate, transparent conductive thin film, R, G, B, BL dye layer formed by the method of micellar electrolysis, and transparent photo-curable resist cured product (R, G, B, BL dye layer). And a protective film are formed in this order.

As shown in the plan view of Fig. 3 (a) and the cross section taken along the line J-J in Fig. 3 (b), the color filter of structure 9 has an insulating substrate 101, a transparent conductive thin film 102, a micellar electrolytic cell. Method R, G, B, BL dye layers 103a, 103b, 103c, 103d, 103e, 103f, 103g, and transparent light-curable resist curing Object (formed on the three dyes in the R, G, B dye layers 103a to 103c) 104a, 104b, 104c, protective film 105, and transparent for driving liquid crystal The display portions 107 are formed by sequentially stacking the conductive thin films 106.

The color filter of structure 10 is composed of an insulating substrate, a transparent conductive thin film, a micelle electrolytic R, G, B, BL dye layer, and a transparent photo-curable resist cured product (R, G, B, BL dye). Formed on the three dyes in the layer), and a transparent conductive thin film for driving a liquid crystal.

The color filter of structure 11 is composed of an insulating substrate, a transparent conductive thin film, a R, G, B dye layer formed by micellar electrolysis, and a transparent photo-curable resist cured product (formed on the R, G, B dye layer). ), And a BL dye-containing photocurable resist cured product are sequentially laminated.

The color filter of structure 12 is formed on an insulating substrate, a transparent conductive thin film, a R, G, B dye layer formed by micellar electrolysis, and a transparent photo-curable resist cured product (R, G, B dye layer). ), A BL dye-containing photocurable resist cured product, and a protective film are sequentially laminated.

As shown in the plan view of Fig. 4 (a) and the cross section taken along line K-K in Fig. 4 (b), the color filter of structure 13 has an insulating substrate 1 1 1 Thin film 112, micellar electrolytic film-forming "—G, B dye layer 113a, 113b, 113c, transparent photocurable resist cured product (micelle electrolytic film RG, B dye layer 1 13 a to 1 13 c layer) 1 1 4 a, 1 1 4 b, 1 1 4 c, BL dye-containing photo-curable resist cured product 1 1 5 a, 1 1 5 b, The display section 117 is formed by sequentially stacking 115c, 115d and the transparent conductive thin film 116 for driving the liquid crystal.

The color filter of structure 14 is formed on an insulating substrate, a transparent conductive thin film, a R, G, B dye layer formed by micellar electrolysis, and a cured transparent photo-curable resist layer (R, G, B dye layer). ), A cured material of a photo-curable resist containing a BL dye, a protective film, and a transparent conductive thin film for driving a liquid crystal.

The color filter of Structure 15 is basically the same as the structure of Structure 12 described above, except that the cured transparent light-curable resist is applied to any two of the R, G, and B dye layers. Is different.

The color filter of structure 16 is basically the same as the structure of structure 13 described above, but the cured transparent light-curable resist is applied to any two of the R, G, and B dye layers. Is different.

The color filter of structure 17 is basically the same as the structure of structure 14 described above, except that the transparent light-curable resist cured product is applied on any two of the R, G, and B dye layers. Is different.

In the structures 4 to 17 described above, the photocurable resist cured product containing a BL dye is used as a black matrix.

The structure 18 color filter is composed of an insulating substrate, a metal or metal oxide thin film, a transparent conductive thin film, a R, G, B dye layer formed by micellar electrolysis, and a transparent photo-curable resist cured product (R, G , Formed on the B dye layer) in this order.

The color filter of structure 9 is composed of insulating substrate, metal or metal oxide thin film, transparent conductive thin film, micelle electrolytic film R, G, B dye layer, transparent photo-curable resist cured product (R, G, B Formed on the dye layer),, and A transparent conductive thin film for driving a liquid crystal is sequentially laminated.

The color filter of structure 20 is composed of an insulating substrate, a metal or metal oxide thin film, a transparent conductive thin film, a micelle electrolytic film R, G, B dye layer, and a transparent photo-curable resist cured product (R, G, B). And a protective film are sequentially laminated.

As shown in the plan view of FIG. 5 (a) and the cross section taken along line L-L in FIG. 5 (b), the color filter of the structure 21 has an insulating substrate 121, a metal or metal oxide thin film 1 2 2 a, 1 2 2 b, 1 2 2 c, Transparent conductive thin film 1 2 3, R, G, B dye layer formed by micellar electrolysis method 1 2 4 a, 1 24 b, 1 2 4 c, Transparent light curing Cured resist (formed on micelle electrolytic film R, G, B dye layers 124a to 124c) 125a, 125b, 125c, protective film 126, and The display section 128 is formed by sequentially laminating the transparent conductive thin films 127 for driving the liquid crystal.

The color filter of Structure 22 is basically the same as the structure of Structure 19, except that a transparent photocurable resist cured product is laminated on any two of the R, G, and B dye layers. Is different.

The color filter of Structure 23 is basically the same as the structure of Structure 20, except that a transparent photo-curable resist cured product is laminated on any two of the R, G, and B dye layers. Are different.

The color filter of structure 24 is basically the same as the structure of structure 21 but is transparent light-cured as shown in the plan view of Fig. 6 (a) and the cross section taken along line M-M of Fig. 6 (b). The cured resist 13 1 a, 13 1 1) is laminated on any two dyes (R, G) 1 32 a, 13 2 b of the 1 ^, G, B dye layers, The difference is that the protective film 13 3 is laminated only on the display portion 1 38 including the upper part of B.

In the structures 4 to 24, a metal or metal oxide thin film may be laminated on the liquid crystal driving transparent conductive thin film.

The color filter of structure 25 is composed of an insulating substrate, a transparent conductive thin film, micellar electrolytic R, G, and B dye layers, and a transparent photo-curable resist cured product ( R, G, and B dye layers), a protective film, a transparent conductive thin film for driving a liquid crystal, and a metal or metal oxide thin film.

The color filter of structure 26 is basically the same as the structure of structure 25, except that the transparent photocurable resist cured product is laminated on the two dyes in the R, G, and B dye layers. Are different.

The metal or metal oxide thin film in the above structures 18 to 26 is used as a black matrix.

In the above structure, at least the portion corresponding to the display portion on the transparent conductive thin film formed by laminating at least the entire display portion of the insulating substrate or the portion corresponding to the continuous pattern including the display pixel portion was removed. It can be formed by laminating a cured product of a photocurable resist or a protective film on the portion.

In this structure, the transparent conductive thin film may be laminated on the entire surface of the insulating substrate, and an operation such as masking is not required. Furthermore, when the dye pattern is formed, the dye layer is formed and etched only on the transparent conductive thin film portion laminated on the entire display portion or the portion corresponding to the continuous pattern including the display pixel portion, so that the process efficiency is improved. Is improved.

The structure 27 color filter is composed of an insulating substrate, a transparent conductive thin film, a protective film, a micelle electrolytic R, G, B, and BL dye layer, a transparent photo-curable resist cured product, a protective film, and a A transparent conductive thin film for driving a liquid crystal is sequentially laminated.

The structure 28 color filter is composed of an insulating substrate, a transparent conductive thin film, a protective film, a film formed by micellar electrolysis R, G, and B dye layers, a transparent photocurable resist cured product, and a BL dye-containing photocurable resist. A cured product and a transparent conductive thin film for driving a liquid crystal are sequentially laminated.

As shown in the plan view of FIG. 7 (a) and the cross section taken along the line NN of FIG. 7 (b), the color filter of the structure 29 has an insulating substrate 141, a metal or metal oxide thin film 1 42 a, 142 b, 142 c, 142 d, transparent conductive thin film 144, protective film 144 a, 144 b, micelle electrolytic film R, G, B dye layer 1 45 a, 1 45 b, 1 45 c, transparent light-curing resist The display section 148 is formed by sequentially laminating a cured product 146a, 146b, 146c and a transparent conductive thin film 147 for driving a liquid crystal. On the other hand, red and blue color filters formed by the dispersion method, printing method, dyeing method, etc. as well as the micellar electrolysis method. If the color filter is formed on the conductive thin film, the film is formed by the micelle electrolysis method. The black dye layer thus obtained can be used as a black matrix.

For example, when a dye pattern is formed by a dispersion method in three primary colors of R, G, and B, the following structure 30 can be given.

As shown in the plan view of FIG. 8 (a) and the cross section taken along the line 0-0 of FIG. 8 (b), the color filter having the structure 30 has an insulating substrate 151, a transparent conductive thin film 152, Photocurable resist cured product containing R, G, B dyes 15 3 a, 15 3 b, 15 3 c, Micelle electrolytic process BL dye layer 154 a, 154 b, 154 c, 1 The display section 159 is formed by sequentially laminating 54 d, a protective film 157, and a transparent conductive thin film 158 for driving a liquid crystal.

In addition, as a black matrix, a cured product of a photocurable resist containing a black dye, a metal or metal oxide thin film, and a dye formed by micellar electrolysis on a conductive thin film. By superimposing layers (not necessarily black dye), it is possible to reduce the binholes of the black matrix and prevent the reflection of metal or metal oxide. For example, when a dye pattern is formed by the dispersion method in three primary colors of R, G, and B, the following structure 31 can be given.

As shown in the plan view of FIG. 9 (a) and the cross section taken along the line P--P in FIG. 9 (a) of FIG. 9 (b), the color filter of the structure 31 has an insulating substrate 161, Metal or metal oxide thin film 162a, 162b, 162c, 162d, transparent conductive thin film 163, photocurable resist cured material containing R, G, B dye 163 a, 163b, 163c, film formed by micellar electrolysis method BL (formed on metal or metal oxide thin film 162a to l62d) Dye layer 164a, 164b, 164c , 1 64 d, protective film 1 65, and transparent conductive thin film 1 66 for driving liquid crystal 1 6 7 are formed.

As shown in the plan view of Fig. 37 (a) and the cross section taken along line TT in Fig. 37 (a) of Fig. 37 (b), the color filter of structure 32 has an insulating property. Substrate 171, metal or metal oxide thin film 172a, 172b,

172c, 172d, insulating film 119, transparent electrode for film formation and liquid crystal drive 173a, 173b, 173c, micelle electrolytic film R, G, B color layers 174a, 174b, 174c, transparent photocurable resist 175a, 175b, 175c, and protective film 176 Has formed.

As shown in the plan view of FIG. 38 (a) and the cross section taken along the line U—U in FIG. 38 (a) of FIG. 1, Transparent electrode for film formation and liquid crystal drive 18 2, Micellar electrolytic film formation R, G, B dye layers 18 3a, 18 3b, 18 3c, transparent photo-curable resist 18 4 a, 184b, and 184c are sequentially laminated, and a black matrix 185 is formed to form a display unit.

As shown in the plan view of FIG. 44 (a) and the cross section taken along the line V--V in FIG. 44 (a) of FIG. 44 (b), the color filter of the structure 34 has an insulating substrate 191, Transparent electrode 192 for film formation and liquid crystal drive, R, G, B dye layers 193a, 193b, 193c, transparent photocurable resist 194a, 194c b, 194c are sequentially laminated, and a black matrix 195 is formed to form a display section. Next, materials used for the color filters of the present invention described above, for example, Structures 4 to 34, methods of use thereof, and methods of manufacturing the color filters of the present invention will be described.

#

Glass plate (low expansion glass, alkali-free glass (Corning's 705 9; HOYA NA 45), etc., quartz glass plate, soda-lime glass), glass plate with microlenses, or plastic plate (poly Use ethylene terephthalate). In this case, glass Plates are preferred and are preferably polished, but may be non-polished.诱 Mine lightning 件

Any metal or conductor that is nobler than the oxidation potential of the two-mouthedene derivative of the micellizing agent may be used. For example, a mixed oxide of indium and tin (IT0) tin dioxide, a transparent conductive polymer, or the like is used. However, it is preferable that the visible light transmittance is 95% or more (thin film only), the film thickness is 1,000 to 2,000 A, and the sheet resistance is 500 or less.

This transparent conductive thin film is formed by a sputtering method, an evaporation method, a CVD method, a coating method, a biosol method, or the like.

In the case of forming a black matrix by forming a black dye film by the micelle electrolysis method, it is sufficient that a conductive thin film is formed at a place where the black matrix is formed.

Lightning lightning 蒗腾-Any metal or conductor that is nobler than the oxidation potential of the humic acid derivative of the micellizing agent is acceptable. For example, platinum, gold, silver oxide, tin dioxide, a conductive polymer, or the like can be used.

The above transparent conductive thin film or conductive thin film is formed on the entire surface of the insulating substrate or on at least the entire display portion or a portion corresponding to a continuous pattern including the display pixel portion by a masking method and a photolithography method. I do.

Black matrix

① Metal or metal oxide thin film

As the metal or metal oxide, for example, chromium (Cr), nickel (Ni), titanium (Ti), copper (Cu), or the like or an oxide thereof can be used. Alternatively, a mixture of a metal and a metal oxide may be used. It is preferable that the optical density be 3.0 or more (film thickness: 1,000 to 3000 A).

In this case, the entire insulating substrate is formed by sputtering, vapor deposition, CVD, or the like, or at least the entire display is formed by masking. After forming a film on a portion corresponding to a continuous pattern including a display pixel portion, patterning is performed by a photolithography method. In other words, resist coating, exposure (using a black matrix forming mask), development, post baking, metal or metal oxide thin film etching, resist stripping

(Removal) in order to form a pattern.

(2) Photocurable resist cured product containing black pigment

(A) As the black pigment, carbon black, titanium black, aniline black, berylen black, a pigment or a dye in which at least two or more kinds are mixed, or a mixture thereof can be used. .

(B) Black, red, blue, green, purple, cyanine, and magenta organic pigments (mainly pigments or dyes used in the film pigment layer for micellar electrolytic method described below) are used in which at least two or more kinds are mixed. Blackening pigments or dye mixtures can also be used.

Alternatively, each of the above (A) and (B) may be used alone or as a mixture (Japanese Patent Application Laid-Open Nos. 4-131106 and 4-190362).

As the photocurable resist, for example, a mixture of an acrylic or methacrylic acid derivative and a copolymer (binder) thereof can be used. As the acrylic or methacrylic acid derivative, Those into which an epoxy group, a siloxane group or a polyimide precursor is introduced can be suitably used.

As the photoinitiator, a triazine type, an acetophenone type, a benzine type, a benzophenone type, a thioxanthone type or the like can be suitably used.

As the dispersant, a nonionic or ionic surfactant, an organic pigment derivative, or a polyester-based material or a mixture of two or more thereof can be used. As the solvent, a single substance or a mixture of two or more of ketones such as hexahexanone and esters such as cellosolve acetate can be used.

Mix, disperse and filter these to adjust the registry.

The oxygen barrier film (polyvinyl alcohol) after the application of the resist is preferably applied in a laminated manner in order to enhance the sensitivity of the resist, and is not necessarily required in the present invention. In general, exposure is performed (using a mask for forming a black matrix), followed by development and heat treatment (postbaking) to form a black matrix.

In some cases, it is not necessary to use a black matrix forming mask due to exposure from the back side of the substrate (back exposure). For example, when the R, G, B dye layer (dye pattern) has already been formed, the R, G, B dye layer can be used as a mask for forming a black matrix.

The optical density is preferably set to 2.0 or more (film thickness: 1.0 m). Specific product names include CK-2000 (manufactured by Fuji Handeltronics Technology), V-259 Black (manufactured by Nippon Steel), and the like.

③ Black dye layer made by micellar electrolytic method

(A) As a black pigment (BL), carbon black, titanium black, aniline black, berylen black, a metal such as cobalt or iron, or a pigment obtained by mixing two or more metals or metal oxides Alternatively, a dye or a mixture thereof can be used.

(B) Black, red, blue, green, purple, cyanine, magenta organic pigments (mainly pigments or dyes used in the film dye layer for micellar electrolytic method described below may be used). Mixed pseudo-blackening pigments or dye mixtures can also be used.

Further, each of the above (A) and (B) may be used alone or as a mixture. The above dyes are formed into a film by micellar electrolysis.

Here, the optical density is preferably set to 3.0 or more (film thickness: 1.0 m).

Micellar lightning solution

① Red (R) dye layer

Perylene pigments, lake pigments, azo pigments, quinacridone pigments-anthraquinone pigments, anthracene pigments, disazo pigments, isoindolin pigments, isoindolinone pigments And the like, or a mixture of at least two or more.

②Green (G) dye layer

Halogen poly-substituted cyanine pigments, Halogen poly-substituted copper lid cyanine-based pigments, triunilmethane-based basic dyes, disazo pigments, isoindolin pigments, isoindolinone pigments Or a mixture of at least two or more of these.

③ Blue (B) dye layer

A copper phthalocyanine pigment, a phthalocyanine pigment, an indone pigment, an indanol pigment, a cyanine pigment, a dioxazine pigment or the like can be used alone or as a mixture of at least two or more.

The above is formed by a micellar electrolysis method. The thickness and transmittance of each dye layer are as follows: R is 0.5 to 1.5 m (transmittance of 60% or more Z610nm), and G is 0.5 to 1. Transmittance should be 60% or more, 545 nm), and B should be 0.2 to: 1.5 m (transmittance should be 60% or more)

460 nm) is preferable.

Conditions for micellar lightning solution

The pigment (dye or pigment) that has been subjected to the hydrophobic treatment is dispersed in an aqueous medium using a surfactant (micelleizing agent) composed of a fluorene derivative to prepare a micelle dispersion. In this case, the aqueous medium to be used includes various media such as water, a mixed solution of water and alcohol, and a mixed solution of water and acetone. I can raise my body.

For example, the following furocene derivative surfactants can be mentioned.

Cellulant: Prorocene derivative surfactant Ether type (FPEG):

Ester type (FE ST)

Ammonium type (FTMA)

Br-

(CHsWN + Cu

In addition, the urocene derivative is described in International Publication W089 / 0193, Japanese Patent Application Laid-Open No. Hei 1-445370, Japanese Patent Application Laid-Open No. Hei 1-268964. And those manufactured by the methods described in JP-A-2-83387, JP-A-2-250892, and the like can be used.

As the surfactant (micelleizing agent), one kind of fluorene derivative may be used, or two or more kinds may be used in combination. Alternatively, the ferrocene derivative may be combined with another surfactant.

Other surfactants include, for example, nonionic surfactants such as polyoxyethylene alkyl ether, polyoxyethylene fatty acid ester, polyoxyethylene alkyl phenyl ether, and polyoxyethylene polyoxybutene vinyl alkyl ether. And ionic and anionic surfactants such as alkyl sulfates, polyoxyethylene alkyl ether sulfates, alkyl trimethylammonium chloride, and fatty acid getylaminoethylamide.

Preparation of micelle dispersion

A funicone derivative, other surfactants used as required, and a desired pigment (pigment) are placed in an aqueous medium, and a mechanical homogenizer, an ultrasonic homogenizer, a ball mill, a sand mill are prepared. And stir well.

When ultrasonic waves are used, it is preferable that the volume be 5 hours or less, and when centrifugation is used, the volume is 4 G or less.

By this operation, the pigment is uniformly dispersed or formed into micelles in the aqueous medium by the action of the surfactant, and becomes a dispersion or a micelle solution. The concentration of the micellizing agent at this time is not particularly limited, but usually, the total concentration of the fluorene derivative and other surfactants is equal to or higher than the critical micelle concentration, preferably 0.1 miM Z liter. Select within the range of ~ 1 mol / liter _c

On the other hand, the concentration of the pigment or dye is usually selected within a range of 1 to 500 gm. In addition, a supporting salt (supporting electrolyte) can be added as needed to adjust the electric conductivity of the aqueous medium. The amount of the supporting salt to be added may be within a range that does not hinder the precipitation of the dispersed pigment, and is usually selected in the range of 0.05 to 10 mol / liter.

Electrolysis can also be performed without adding this supporting salt. In this case, a highly pure thin film (dye layer) containing no supporting salt can be obtained. When a supporting salt is used, the type of the supporting salt is not particularly limited as long as the electric conductivity of the aqueous medium can be adjusted without hindering formation of micelles and precipitation of the pigment on the electrode.

Specifically, sulfates (salts such as lithium, potassium, sodium, norebidium, and aluminum) and acetates (lithium, potassium, and natrium) which are generally widely used as supporting salts are generally used. Salts such as tritium, norredium, beryllium, magnesium, calcium, strontium, norium, and aluminum), and ammonium salts are suitable. For example, LiBr, _{KC 1, L i 2 S 0} 4, and the like (NH) BF 4.

Further, it is preferable to filter with a filter of 0.5 // m or less. In this way, four types of micelle dispersions in which a red pigment (pigment or dye), a green pigment (pigment or dye), a blue pigment (pigment or dye), and a black pigment (pigment or dye) are dispersed are prepared. I do.

The micellar dispersion of the mixed pigment may be prepared by adding and dispersing the pigment or paint to be mixed in the aqueous medium once with the micelle agent, or may be prepared by dispersing a single pigment to be mixed in the aqueous medium. May be added together with the micellizing agent, and the respective micellar dispersions obtained by dispersion may be mixed and prepared.

Micellar lightning vagina

Next, an insulating substrate formed on at least the entire surface of the display portion or a portion corresponding to a continuous pattern including the display pixel portion is inserted into one of the micelle dispersions, and Energize and conduct micellar electrolysis Is performed to form a desired thin film (dye layer) on the transparent conductive thin film of the substrate.

The electrolysis conditions may be appropriately selected according to various situations, but usually the solution temperature is selected within the range of 0 to 90 ° C, preferably 20 to 70 ° C. The voltage is selected from the range of 0.3 to 0.5 V, preferably 0.1 to 0.9 V. Also, the current density is usually 1 0 m AZ cm ² or less, preferable properly is selected in the range of 5 0~ 3 0 0 AZ cm 2 .

When this electrolytic treatment is performed, a reaction according to the principle of micellar electrolysis proceeds. This Focusing on the behavior of F e ion Fuwerosen derivative in the positive electrode is in Hue spout F e ^{2 +} are the F e ^3+, micelles collapse, Pigment or dye particles are anode (transparent conductive thin film ) Deposits on top. On the other hand, in the cathode, the Fe ³⁺ oxidized at the anode is reduced to ^{Fe 2+} and returns to the original micelle, so that the film forming operation can be repeatedly performed with the same solution.

Next, the thin film (dye layer) formed by micellar electrolytic treatment may be usually washed with pure water or the like, and then air-dried at room temperature or, if necessary, in a temperature range up to 220 ° C. May be used for heat treatment.

Transparent light curing resist cured product

A mixture of an acrylic or methacrylic acid derivative and a copolymer (binder) thereof can be used. A derivative obtained by introducing an epoxy group, a siloxane group, or a polyimide precursor into this acrylic or methacrylic acid derivative can be suitably used.

As the photoinitiator, a triazine type, an acetophenone type, a benzine type, a benzophenone type, a thioxanthone type or the like can be used.

As the solvent, a ketone such as cyclohexanone or an ester such as cellosolve acetate or a mixture of two or more thereof can be used.

The above is mixed and filtered to prepare a resist, and the resist is at least put on the micelle electrolytic film-forming dye layer using a roll coater or a sub coater. Is also applied over the entire display section. Next, after photopolymerization and photocrosslinking (exposure) through a color filter mask pattern corresponding to the desired dye layer. For example, after unetched portions are etched, they are completely cured by heat treatment.

In addition, as a method of applying a light-curable resist (preferably a transparent ultraviolet-curable resist), a transparent light is applied by a micellar electrolysis method or an electrodeposition method instead of a conventional roll coat or svin coat. By applying the curable resist, not only the drying step of the substrate after the film formation can be omitted, but also it becomes possible to prevent foreign substances from being mixed.

Specific names of these registry are CT (Fuji Hunt), V259PA (Nippon Steel), JNPC06, JNPC09, JNPC16 (JSR). , CFGR (manufactured by Tokyo Ohkasha), Photo Nice UR310 (manufactured by Toray Industries, Inc.) and the like.

The film thickness and transmittance of the transparent photocurable resist cured product are preferably from 0.1 to 4.0 μτη ^, transmittance of 90% or more and 460 nm.

The film thickness is controlled according to the resist viscosity and the number of rotations of the sine coat according to the film thickness of each dye layer, or by the film forming potential and the film forming time in the micelle electrolytic method or the electrodeposition method. It is possible and it is possible to minimize the step of the thickness of each dye layer and to make it flat.

Protective film

Examples of the protective film include a cured transparent light-curable resist and a cured transparent thermosetting resin.

(1) Transparent light-curable resist cured product (the same materials as those described above can be used)

Reduce the amount of transparent photocurable resist on the dye layer formed by micellar electrolysis or on the cured product of transparent photocurable resist (including on black matrix) using a roll coater or a spin coater. Both layers are applied over the entire display area, and are completely cured by heat treatment.

In addition, the dye patterns of the three primary colors R, G, Only the area where the matrix is present, that is, the display area is exposed through a mask for protective film, the unexposed area (outside the display area) is etched, and the resist remaining on the display area is completely treated by heat treatment. Let it cure.

When a dye layer made of micelle electrolytic method exists outside the display section, the protective layer can be formed by etching the dye layer at the same time as the resist is etched or after the resist is thermally cured.

At least before the first color dye layer is formed by the micelle electrolysis method on the transparent conductive thin film formed at least on the entire display portion or on a portion corresponding to a continuous pattern including the display pixel portion. In the process of forming the three primary colors and the black pigment pattern, the resist is laminated and applied with a roll coater or a sbin coater, and only the outside of the display is exposed through a mask and the unexposed part (display) is etched to form a display. The resist remaining outside may be completely cured by heat treatment, and a protective film may be laminated outside the display portion.

② Transparent thermosetting resin cured product

A mixture of an acrylic or methacrylic acid derivative and a copolymer thereof (a binder) can be used. Further, those obtained by introducing an epoxy group, a siloxane group, or a polyimide precursor into this acrylic or methacrylic acid derivative can be suitably used.

As the initiator, a triazine type, an acetophenone type, a benzine type, a benzophenone type, a thioxanthone type, or the like can be used.

As the solvent, a single product of a ketone such as cyclohexanone and an ester such as cellosolp acetate or a mixture of two or more thereof can be used. After mixing, filtering and applying, they are completely cured by heat treatment.

At this time, the coating is performed on at least the entire display unit using a roll coater or a sub coater, but it is also possible to selectively print the display unit and the outside of the display unit with an offset printing machine to form a protective film. I can do it. Specific product names are Obtomer SS-7265, JHR-8484, JSS-8119, JSS715 (manufactured by JSR), 0S-808 (manufactured by Nagase & Co., Ltd.) ), LC2001 (manufactured by Sanyo Chemical Industries, Ltd.) and the like.

The thickness and transmittance of the protective film are preferably 0.5 to 4.0 m and the transmittance is 90% or more / ^ 460 nm.

The film thickness can be controlled by the viscosity of the protective film agent and the number of rotations of the spin coat according to the film thickness of each dye layer.

Transparent conductive thin film for driving LCD

A material and a formation method similar to those of the transparent conductive thin film can be used.

Method for producing color filter of the invention

Here, a general manufacturing method of forming a dye pattern and a black matrix by laminating a transparent photocurable resist on a dye layer formed by micellar electrolysis is shown in Figs. 10 (3) to (£). , 11 (3) to ((

A substrate having a transparent conductive thin film 191 formed on at least the entire surface of the insulating substrate 190 or a portion corresponding to a continuous pattern including the display pixel portion is manufactured (FIG. 10 (a)). , (b)). On this substrate, one dye 192 selected from dyes (R, G, B, BL) is formed into a film by micellar electrolysis (FIG. 10 (c)). After drying and baking at room temperature to 220 ° C, perform cleaning treatment such as high pressure water cleaning and UV cleaning. Next, the transparent photocurable resist 1993 is applied with a sub coater or a roll coater and heat-treated (room temperature to 150 (: pre-baked for 5 minutes to 2 hours). (FIG. 10 (d), (e)) using a mask pattern 1994. In this case, the contact method, the aperture limit, the one-way method, the stepper method, and the brochure method are used. Exposure energy is preferably, for example, 10 to: L 200 mJZc m2 for ultraviolet i-ray (365 nm). No.

Next, the etching of the transparent photocurable resist and the dye layer in the unexposed areas was performed.

This etching method includes the following (1) dry etching, (2) jet etching, (3) etching with release material, and (4) electrolytic etching.

①Dry etching includes UV ozone ashes, plasma etching, sbutter etching, and ion beam etching.

(2) As for the etch etching, a developing solution dedicated to various resists, a developing solution of alkali type (alkali carbonate salt and an alkali hydroxide type as inorganic type, and tetramethyl ammonium salt as an organic type). Demide mouth oxide (

Etching method by static or dynamic contact with quaternary amine aqueous solution such as TMAH) or organic solvent (methanol, ethanol, acetone, etc.).

(3) Etching with a release material includes lamination of a solvent-soluble polymer, release, and sticking of an adhesive film.

(4) As electrolytic etching, a supporting salt is added to a water solution containing a surfactant (eg, non-ionic), or (2) a developer for organic etching or an organic solvent to apply a potential.

Even if the unexposed resist can be removed by dissolving, if the dye layer is not sufficiently peeled, the above-mentioned (1) dry etching and (2) jet etching are used to completely remove the dye layer. (3) Etching with release material, and (4) electrolytic etching are performed at least on one side before and after thermal curing of the exposed part of the transparent photocurable resist. Note that different methods may be used in combination.

The dye layer formed by micellar electrolysis is a thin film of only a resist as a binder and a dye (pigment) containing no polymer, and is easily dissolved and peeled by these etchings. It can be performed under mild conditions in which the transparent conductive thin film is not damaged such as discoloration, insulation, and erosion. For example, as described below, the etching can be performed under the etching conditions in which the wet etching and the dry etching are used in combination.

Room temperature to 70. C developer (organic alkaline water; Tetramethylammonium hydroxide mouth oxide (TMAH) 2.38% aqueous solution, inorganic alkaline water: sodium carbonate and carbonated aqueous solution Use a hydrogen ion concentration of PH 8 to 14), immerse the substrate on which the resist has been applied and exposed, rinse with water after development (high-pressure pure water spray, ultrasonic wave, brush scrub, detergent cleaning, etc.) Rinse Then, the resist and the dye layer in the unexposed area are dissolved or removed.

Next, the resist in the exposed area is heat-cured (150 ° C to 350 ° C) .c If the resolution of the pattern of the transparent light-curable resist and the dye layer in the exposed area is to be better formed, is, UVZ Ozon'atsu the registry and the dye layer of the unexposed portion in single device correct preferred to remove by ozonolysis _c in this case, UV dancing has a bright line of a mercury lamp, mainly 1 85 nm and 2 54 nm Things are preferred. The substrate temperature is preferably room temperature to 250 ° C., ozone concentration: 10 ppm or more, and time: 30 seconds to 3 hours.

In this way, the formation of one of the three primary colors, dye patterns 192 and 193, is completed (FIG. 10 (f)). Next, the same process is repeated for the remaining two dyes. (Fig. 11 (a), (b)).

Next, a black matrix 195 is formed as a dye pattern of the BL dye (FIG. 11 (c)). Thus, a color filter is completed.

Further, a protective film and a transparent conductive thin film for driving a liquid crystal may be laminated on a dye pattern of three primary colors and a black matrix.

In addition, on the insulating substrate, a transparent conductive thin film is formed on at least the entire display portion or a portion corresponding to a continuous pattern including the display pixel portion of a metal or metal oxide thin film buttered in a black matrix shape. Then, on the transparent conductive thin film, red, blue and green Mihara A color dye pattern is formed to complete the color filter.

Further, on a substrate on which a transparent conductive thin film is formed on at least the entire display portion or a portion corresponding to a continuous pattern including a display pixel portion on an insulating substrate, the three primary color dye patterns are similarly formed. Before, in the middle, or after separating, the resist containing the black dye is patterned in a black matrix shape by a photolithography method at a position between the three primary color dye patterns to form a color filter. In addition, the protective film and the transparent conductive thin film for driving the liquid crystal may be laminated on the three primary color dye patterns and the black matrix.

In addition, at least a portion of the conductive thin film formed on a portion corresponding to a continuous pattern including the display portion or a continuous pattern including the display pixel portion except for a portion corresponding to the display portion has an insulating film laminated thereon. Using the substrate, a color filter can be manufactured by the method described above.

On the other hand, a dye pattern of three primary colors of red, blue and green formed by the micellar electrolysis method is formed (in this case, a transparent photo-curable resist is formed on all the dye layers of the three primary colors formed by the micelle electrolysis method). Laminating) Three primary color dye patterns are formed on a conductive thin film by the method of the present invention, the dispersion method, the printing method, the dyeing method, or the like, or the conductive pattern is formed between the three primary color dye patterns by photolithography. Regardless of the method of forming the conductive thin film, if a conductive thin film exists between the three primary color dye patterns, a black dye can be formed on this conductive thin film by micellar electrolysis. Can form bear matrix.

By the way, a transparent electrode for film formation by micellar electrolysis is patterned into a stripe pattern in which only the tip is shorted, and a dye layer is formed by micellar electrolysis, a transparent photocurable resist is applied, and a dye layer is formed. After buttering (etching), a liquid crystal panel is assembled using a MIM substrate or the like, and the liquid crystal can be driven using the electrodes used for film formation. In addition, using a transparent electrode formed on the entire surface, forming a pigment layer by micellar electrolysis, applying a transparent photocurable resist, and patterning (etching) the pigment layer, the light on the pigment layer Using the curable resin as a mask, the entire substrate is immersed in an etching solution, and the transparent electrode formed on the entire surface is patterned (etched) to produce a color filter substrate. Similarly, a liquid crystal using a MIM substrate etc. A liquid crystal can be driven by using electrodes (patterned) by using a panel and using it for film formation.

As described above, in the color filter and the method of manufacturing the same according to the present invention, a display image using a color filter, for example, on a color liquid crystal display can be made high definition, image quality can be improved, and production efficiency can be improved. (Yield) is improved.

Hereinafter, this effect will be described in detail.

First, it is not necessary to form a complicated pattern such as a triangle or a diagonal by performing fine processing on the transparent conductive thin film, and it is possible to avoid a reduction in yield due to a short circuit or disconnection, which has been a problem in the past.

In addition, diagonal and triangular patterns can be easily applied to the dye layer (dye pattern) of the color filter.

Further, it is not necessary to continuously connect the fine patterns of the transparent conductive thin film for one color of the dye layer, and it is possible to reduce the color unevenness of the color filter due to the previous voltage drop.

In addition, since the dye pattern of the color filter is formed using a transparent light-curable resist, the light absorption of the dye of a light-curable resist containing a dye (pigment or dye), such as a dispersion-type labyrinth filter, is used. The exposure sensitivity and resolution of the liquid crystal are not reduced, and a high-definition color liquid crystal display can be manufactured.

Also, by controlling the film thickness of the transparent photocurable resist and the protective film laminated on the dye layer, the film thickness between each dye (pattern) can be controlled. Steps can be reduced. That is, since the color filter can be flattened, cracks and disconnections in the laminated transparent conductive thin film for driving a liquid crystal can be reduced. In addition, variations in the gap of the liquid crystal cell are reduced, thereby reducing display unevenness and improving the contrast of the color filter.

In addition, since one dye layer selected from the three primary colors is formed on the entire surface of the transparent conductive thin film and the dye layer is formed flat, the steps in the same dye pattern are reduced, and the scattering of transmitted light is reduced. In addition, the contrast of the color filter can be improved.

Furthermore, since the pigment or dye of the pigment can be selected in the micelle electrolytic filter, the advantages of high heat resistance and high light resistance can be utilized.

Further, according to this structure, it is not necessary to form an electrode extraction layer, and the color filter manufacturing process can be simplified.

Secondly, there are the following effects on the black matrix.

In a color filter in which red, blue and green primary colors are formed not only by the method of the present invention but also by a dispersion method, a printing method, a dyeing method, etc. on the conductive thin film, the conductive thin film is formed by a micelle electrolytic method. It is possible to form a black matrix by forming a black pigment on the film, and it can be formed under mild conditions, for example, aqueous system, 100 or less at normal pressure.

In addition, since the dye layer formed by the micellar electrolysis method has a configuration in which only a dye (pigment or dye) is laminated, the degree of light shielding that cannot be achieved with a cured product of a resist containing a black dye obtained by a dispersion method, for example, The optical density of 3.0 or more can be achieved.

Further, by controlling the film formation conditions by the micelle electrolysis method, the gap between the three primary color (R, G, B) dye patterns can be filled, and the flatness of the color filter can be improved. Further, since the leakage of white light due to oblique light from the backlight can be prevented, the visibility can be improved. Also, there is no decrease in visibility with reflected light as in the case of a metal thin film (metal chrome). In addition, since it is possible to laminate (pattern) a transparent photocurable resist cured product and etch a black pigment, it is possible to form a high-definition black matrix. In addition, a black matrix The resist cured product containing a metal thin film and a black dye can be superimposed on the dye layer formed by micellar electrolysis to prevent the reflected light of the black matrix and fill the binhole You can also.

In addition, the same procedure as when a transparent conductive thin film formed on the entire surface is used by using a transparent conductive thin film that has been patterned in a simple shape such as a stripe shape in advance and conducting all the electrodes. The dye layer is formed by forming a dye layer (dye pattern) with or after forming the dye pattern, using the dye pattern as a mask and etching the transparent conductive thin film in a region where the dye pattern is not formed. The transparent conductive thin film underlying the (dye pattern) can also be applied as a liquid crystal drive electrode for a panel driven by a MIM or a panel driven by a simple matrix (STN, TN).

Before laminating and applying the photocurable resist, the dye layer formed by the micellar electrolysis method is subjected to UV washing to decompose foreign substances such as oils and fats present in the dye, thereby forming the photocurable resist. By improving wettability and reducing uneven coating and binholes, the final yield of color filter production can be further improved. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a plan view and a sectional view schematically showing a structure 4 according to a color filter for a color liquid crystal display of the present invention,

FIG. 2 is a plan view and a sectional view schematically showing a structure 6 in the present invention,

FIG. 3 is a plan view and a sectional view schematically showing a structure 9 according to the present invention. And

FIG. 4 is a plan view and a sectional view schematically showing the structure 13 according to the present invention,

FIG. 5 is a plan view and a sectional view schematically showing a structure 21 according to the present invention,

FIG. 6 is a plan view and a sectional view schematically showing a structure 24 according to the present invention,

FIG. 7 is a plan view and a sectional view schematically showing a structure 29 according to the present invention,

FIG. 8 is a plan view and a cross-sectional view schematically showing a dispersion force filter and a micelle electrolytic black matrix in structure 30 of the present invention.

FIG. 9 is a plan view and a cross-sectional view schematically showing a dispersion method force filter and a micelle electrolytic black matrix in Structure 31 of the present invention. And

FIG. 10 is a cross-sectional view showing a manufacturing process of the color filter for a color liquid crystal display of the present invention,

FIG. 11 is a cross-sectional view showing a manufacturing process subsequent to FIG. 10, FIG. 12 is a schematic view showing a mask for forming a transparent conductive thin film, and FIG. FIG. 3 is a schematic diagram showing a mask for forming a G dye pattern for explanation.

FIG. 14 is a schematic diagram showing a mask for forming a B dye pattern, which is provided for explanation of the embodiment,

FIG. 15 is a schematic diagram showing a mask for forming an R dye pattern, which is provided for explanation of an example,

FIG. 16 is a schematic view showing a mask for forming stripes and diagonal black matrix for use in the description of the embodiment. FIG. 17 is a schematic view showing a diagonal black mask for use in the description of the embodiment. FIG. 2 is a schematic view showing a mask for forming an R dye pattern, FIG. 18 is a schematic diagram showing a mask for forming a diagonal G dye pattern, which is used for describing the embodiment.

FIG. 19 is a schematic diagram showing a mask for forming a diagonal B dye pattern for use in explaining the embodiment,

FIG. 20 is a schematic diagram showing a mask for forming a B dye pattern of a triangle, which is used for describing an example or a comparative example,

FIG. 21 is a schematic diagram showing a mask for forming a G dye pattern of a triangle, which is used for describing an example or a comparative example,

FIG. 22 is a schematic view showing a mask for forming an R dye pattern of a triangle, which is used for describing an example or a comparative example,

FIG. 23 is a schematic view showing a mask for forming a black matrix of a striped or diagonal metal or metal oxide thin film, which is provided for explanation of an example or a comparative example,

FIG. 24 is a schematic diagram showing a mask for forming a black matrix of a triangular metal or metal oxide thin film, which is used for explaining the example or the comparative example,

FIG. 25 is a schematic view showing a stripe transparent conductive thin film (IT0) buttering mask, which is provided for explanation of a comparative example.

FIG. 26 is a schematic diagram showing a black matrix and a mask for forming an electrode take-out, which is provided for explanation of a comparative example,

FIG. 27 is a schematic diagram illustrating a connection state of each of R, G, and B using a silver base at the time of producing a dye layer,

FIG. 28 is a schematic view showing a diagonal I T0 patterning mask, which is used for explaining a comparative example.

FIG. 29 is a schematic view showing a mask of a diagonal electrode take-out portion, which is provided for explanation of a comparative example,

FIG. 30 is a schematic diagram showing a connection state for each of R, G, and B in the production of the dye layer, which is provided for describing a comparative example.

FIG. 31 shows a color filter for a color liquid crystal display of the present invention. It is a diagram for explaining the surface step in the,

FIG. 32 is a cross-sectional view showing the configuration of a general color liquid crystal display in the description of the conventional example.

FIG. 33 is a plan view and a sectional view schematically showing a structure 1 according to a conventional color filter for a color liquid crystal display,

FIG. 34 is a plan view and a sectional view schematically showing a structure 2 according to a conventional color filter for a color liquid crystal display,

FIG. 35 is a plan view and a sectional view schematically showing a structure 3 according to a conventional color filter for a liquid crystal display.

FIG. 36 is a plan view and a sectional view showing the structure of a color filter for a color liquid crystal display according to a conventional dispersion method.

FIG. 37 is a plan view and a cross-sectional view schematically showing a structure 32 according to the present invention.

FIG. 38 is a plan view and a cross-sectional view schematically showing a structure 33 according to the present invention.

FIG. 39 is a schematic diagram showing a mask for forming an R dye pattern, which is provided for explanation of an example,

FIG. 40 is a schematic diagram showing a mask for forming a G dye pattern, which is provided for explanation of an embodiment,

FIG. 41 is a schematic diagram showing a mask for forming a B dye pattern, which is provided for explanation of an embodiment,

FIG. 42 is a schematic view showing a mask for stripe transparent conductive thin film (ITO) patterning, which is provided for explanation of the embodiment,

FIG. 43 is a schematic diagram showing a mask for forming a black matrix, which is used for describing the embodiment,

FIG. 44 is a plan view and a sectional view schematically showing a structure 34 in the present invention. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described more specifically with reference to Examples, but the present invention is not limited thereto.

[Production Example 1]

诱明瀵雷蒗蒗 Bi 膛 Creating a board

FIG. 12 is a plan view showing the state of production of a transparent conductive thin film-formed substrate.

In this example, an IT0 thin film is formed on a mirror-polished 300 mm square white glass substrate (7059, manufactured by Coatings Co., Ltd.) using a sputtering device (SDP-550 VT, manufactured by ULVAC, Inc.). At about 1300 A, masking deposition was performed on a white glass substrate through a design metal mask connected to the entire surface of the display section 201 and the electrode extraction terminal sections 202 a and 202 b. In this case, the substrate temperature was adjusted to 250, and the surface resistance of the ITO film was adjusted to 20 ΩΖΟ.

Preparation of micellar dispersion

In one liter of pure water, dianthraquinonyl red (manufactured by Ciba Geigy) was used as a pigment, and the pigment concentration was 11.3 liter. Oxyethylene ether), and mixed at a concentration of 2.75 milliliters with lithium bromide as the supporting salt at a concentration of 0.1 molar, and as a pigment, disazoyellose (Dainippon Ink). Chemical Industry) was used. Then, the pigment concentration was mixed at a concentration of 12.45 g liter, FPEG at a concentration of 2.00 mmol / liter, and lithium bromide at a concentration of 0.1 mol Z liter. After dispersing with an ultrasonic homogenizer for 30 minutes, the respective pigment dispersions are mixed at a weight ratio of 9: 1, and the mixture is further dispersed with an ultrasonic homogenizer for 30 minutes to obtain a mixed micelle dispersion of R. Was prepared.

In one liter of pure water, copper halide phthalocyanine (manufactured by BASF) was used as a pigment, and the pigment concentration was 14.85 liters. Toluene and FPEG were mixed at a concentration of 3.0 millimoles Z liter and lithium bromide as a supporting salt at a concentration of 0.1 mol / litre. (Manufactured by Dainippon Ink and Chemicals, Inc.) and a pigment concentration of 12.45 gZ liter, FPEG of 2.0 millimol / liter, and lithium bromide of 0.1 mol Z liter. Mix at torr concentration. After dispersing each mixture for 30 minutes with an ultrasonic homogenizer, the respective pigment dispersions are mixed at a weight ratio of 6: 4, and the mixture is further mixed with an ultrasonic homogenizer. The mixture was dispersed for 0 minutes to prepare a mixed micelle dispersion of G.

Further, in 1 liter of pure water, copper phthalocyanine (manufactured by BASF) was used as a pigment, and a pigment concentration of 6.90 g / liter. Lithium bromide was used as the supporting salt, and the mixture was mixed at a concentration of 0.1 mol liter. In addition, dioxazine biorett (manufactured by Sanyo Dyestuffs Co., Ltd.) was used as the pigment, and the pigment concentration was 4.88 g liter, FPEG was 3.0 millimol / liter, and lithium bromide. Was mixed at a concentration of 0.1 molar Z liter. Then, after dispersing each mixture for 30 minutes with an ultrasonic homogenizer, the respective pigment dispersions are mixed at a weight ratio of 7: 3, and the mixture is further dispersed for 30 minutes with an ultrasonic homogenizer. The mixture was dispersed to prepare a mixed micelle dispersion of B.

In one liter of pure water, carbon black was used as a pigment.

(Manufactured by Mitsubishi Kasei Kogyo Co., Ltd.) with a pigment concentration of 6.88 g and a FPEG, 2.50 milliliters, and with lithium bromide as the supporting salt, 0.1. mol were mixed at a concentration of Li Tsu torr, was prepared micelle dispersion of BL was dispersed for 30 minutes by an ultrasonic ho homogenizer _c

[Example 1]

The substrate prepared in Production Example 1 was inserted into the micelle dispersion of G prepared in Production Example 1, and the electrode terminal of the transparent conductive thin film was connected to the anode of the potentiostat. After this connection, a constant potential of 0.4 V for 18 minutes Solved. In addition, a G dye layer (thin film) was formed on the transparent conductive film, washed with pure water, drained off with an air blow, and dried in a 50 ° C oven.

Next, a transparent photocurable resist (V-259PA: manufactured by Nippon Steel Chemical Co., Ltd.) was spin-coated at 1300 rpm on the dye layer, and baked at 80 ° C hot plate for 5 minutes. Through a mask for G dye pattern (for stripes: (Fig. 13)), use a one-way exposure machine (proximity gap 60 m) to expose 300 m J Zcm2 to i-line, then organic at room temperature. It was immersed in an alkaline aqueous solution developer (0.14% TM AH aqueous solution: FHD-15, manufactured by Fuji Hunt Electronics Technologies) for 1 minute to develop.

Furthermore, brush scrub cleaning with pure water is performed.As a result, the G pigment and the transparent photocurable resist in the exposed area remain, and the G pigment and the transparent photocurable resist in the other unexposed areas are removed by etching. Was done.

In addition, 200. Heat treatment (postbaking) was performed for 60 minutes in the oven of C to form a G dye pattern.

Next, the substrate on which the G dye pattern was formed was inserted into the micelle dispersion of B prepared in Production Example 1, and the electrode terminal of the transparent conductive thin film was connected to the anode of the potentiostat. After connection, constant potential electrolysis was performed at 0.7 V for 10 minutes. Then, a dye layer (thin film) of B was formed on the transparent conductive thin film, washed with pure water, drained with an air blow, and dried with a 5 CTC oven.

Next, a transparent photocurable resist (V-259PA: Nippon Steel Chemical Co., Ltd.) was spin-coated on the G-dye pattern and B-dye layer with l OOO rpm, and 80. We baked for 5 minutes with C's hot plate. I-line exposure at 300 mJ / cm2 with a proximity-type exposure machine (proximity gap 60 m) through a mask for B dye pattern (for stripes: (Fig. 14)) After that, a developer of an organic solvent-based aqueous solution at room temperature (0.14% TMAH aqueous solution: Fuji Hunterectronics Tech.) It was immersed for 1 minute in NORDIG Co., Ltd., FHD-5 diluted product) and developed. Thereafter, when brush scrubbing was performed with pure water, the B dye and the transparent light-curable resist in the exposed area remained, and the B dye and the transparent light-curable resist in the other unexposed areas were removed by etching. . In addition, 200. Heat treatment (postbaking) was performed for 60 minutes in a C oven to form G and B dye patterns.

Further, the substrate on which the G and B dye patterns were formed was inserted into the micelle dispersion of the length prepared in Production Example 1, and the electrode terminal portion of the transparent conductive thin film was connected to the anode of the potentiostat. . 8 V, 15 minutes of constant potential electrolysis was performed. Further, the dye layers of R (the thin film) is formed on the transparent conductive thin film, drained by air blow After washing with pure water and dried 5 0 ^e C O over oven.

Next, a transparent photocurable resist (V-259 PA: manufactured by Nippon Steel Chemical Co., Ltd.) was spin-coated on the G and B dye patterns and the R dye at 150 rpm, and the temperature was adjusted to 80 ° C. Heat treatment (pre-bake) for 5 minutes using a hot plate.

Through a mask for R dye pattern (for stripes: (Fig. 15)), i-line exposure at 300 mJZ cm2 with a proximity type exposure machine (proximity gap 60 μτη), then room temperature It was immersed for 1 minute in a developing solution of an organic solvent-based aqueous solution (0.14% TMAH aqueous solution: FHD-5 diluted product of Fuji Hunt Electronics Technologies, Inc.) and developed. As a result, the exposed portion of the R dye and the transparent photocurable resist remained, and the remaining unexposed portion of the R dye and the transparent photocurable resist were removed by etching. The substrate was heat-treated (postbaked) in an oven at 200 ° C for 60 minutes to form G, B, and R dye patterns.

Furthermore, the substrate on which the dye patterns of G, B, and R were formed was inserted into the micelle dispersion of BL prepared in Production Example 1, and the electrode terminal of the transparent conductive thin film was connected to the anode of the potentiostat. 0.7 V, 15 minutes constant potential electrolysis, BL dye layer on transparent conductive thin film (thin film) After washing with pure water, the water was removed by air blow and dried at 50 ° C even.

Next, a transparent photocurable resist (V-259PA: Nippon Steel Chemical Co., Ltd.) was spin-coated at 1500 rpm on the G, B, and R dye patterns and the BL dye layer, and heated at 80 ° C. The plate was heat-treated (brybake) for 5 minutes. Through a mask for BL dye pattern (stripe, black matrix forming mask: Fig. 16), 300m JZ cm ² with a proximity type exposure machine (proximity gap 60m) After exposure with i-ray at room temperature, a developing solution of an organic aqueous solution at room temperature (0.

14% TM AH aqueous solution: immersed in Fuji Hunt Electronics Technology, FHD-5 diluted product) for 1 minute to develop, and then brush scrubbed with pure water.

As a result, the BL dye and the transparent light-curable resist in the exposed area remained, and the other transparent light-curable resist in the unexposed area was removed by etching. In addition, 200. Heat treatment (boss bake) in a C oven for 60 minutes to form G, B, R, and BL dye patterns.

Finally, the ITO thin film is sputtered on the protective film at about 1200 A using a sputtering device (Surveyed by ULVAC: SDP-550VT) to form a transparent conductive thin film for driving the liquid crystal. Formed. In this case, the substrate temperature was adjusted to 200, and the surface resistance of the ITO film was adjusted to 20.

In this way, a color filter according to Structure 6 shown in FIG. 2 was manufactured.

[Example 2]

The substrate prepared in Production Example 1 was inserted into the micelle dispersion of R prepared in Production Example 1, and the electrode terminal of the transparent conductive thin film was connected to the anode of the potentiostat, and 0.8 V, 15 minutes Was performed. As a result, an R dye layer (thin film) was formed on the transparent conductive thin film, washed with pure water, drained with an air blow, and dried in a 50 ^eC oven.

Next, a transparent light-curable resist (CT: Fuji Hunt Electronics) (Technology Co., Ltd.) was spin-coated on the R dye layer at 100 rpm and heat-treated (pre-baked) in a 100 ° C. oven for 30 minutes. Through a mask for R dye pattern (for diagonal: Fig. 17), i-line exposure with AO m JZ cmS using a proximity type exposure machine (proximity gap 60 / m), then room temperature The image was immersed for 1 minute in a developer of an inorganic alkaline aqueous solution (0.1 N sodium carbonate aqueous solution: manufactured by Fuji Hunt Electronics Technology Co., Ltd., diluted with CD). It was washed with a pure water shower. As a result, the R colorants and the transparent light-curable resist in the exposed area remained, and the other transparent light-curable resist in the unexposed area was removed by etching.

Then, 200. Heat-treated (postbaked) in a C oven for 60 minutes. In addition, this substrate is passed through a UV / ozone asher system (manufactured by Toshiba Lighting & Technology Corp.), under a low- or high-pressure mercury lamp generating 185 nm and 254 nm emission lines, at a substrate temperature of 100, and an ozone concentration. The mixture was treated at 10,000 rpm for 5 minutes, and the unexposed R dye layer was decomposed and etched to form an R dye pattern.

Next, the substrate on which the R dye pattern was formed was inserted into the micelle dispersion of G prepared in Production Example 1, and the electrode terminal portion of the transparent conductive thin film and the anode of the potentiostat were connected. Performed constant potential electrolysis at 4 V for 18 minutes to form a G dye layer (thin film) on the transparent conductive thin film, washed with pure water, drained with an air blow, and dried in a 50 ^eC oven .

Next, a transparent photocurable resist (CT: manufactured by Fuji Hunt Electronics Technology) was spin-coated at 800 rpm on the R dye pattern and the G dye layer, and then 100. Heat-treated (brybake) in oven C for 30 minutes. Through a mask for the G dye pattern (for diagonal: Fig. 18), use a one-way exposure machine (proximity gap 60 m) to expose 40m J Zcm2 to i-line, and then use a room temperature inorganic alcohol. 1 solution with a 0.1% aqueous solution of sodium carbonate (manufactured by Fuji Hunt Electronics Technologies, Inc., diluted with CD) It was immersed for minutes and developed. After this, it is washed with pure water shower,

The G dye and the transparent photo-curable resist remain, and the remaining unexposed portions of the transparent photo-curable resist are removed by etching, and further heat-treated at 200 ° C for 60 minutes ( Post bake).

In addition, this substrate is passed through a UVZ ozone asher apparatus (manufactured by Toshiba Lighting & Technology Corporation) under a low-pressure mercury lamp generating a 254 nm emission line, at a substrate temperature of 100 (:, ozone concentration of 10,000 ppm, for 3 minutes). After the treatment, the unexposed portion of the G dye layer was etched by ozonolysis to form R and G dye patterns, and the substrate on which the R and G dye patterns were formed was mixed with the micelle of B prepared in Production Example 1. The electrode was inserted into the dispersion and the electrode terminal of the transparent conductive thin film was connected to the anode of the potentiostat.After this, constant potential electrolysis was performed at -0.7 V for 10 minutes, and B was placed on the transparent conductive thin film. A dye layer (thin film) was formed, washed with pure water, drained by air blow, and dried in a 50 ^eC oven.

Next, a transparent photo-curable resist (CT: manufactured by Fuji Hunt Electronics Technology) was applied to the R and G dye patterns and the B dye layer at 700 rpm to obtain a value of 100. Heat-treated (brybake) for 30 minutes in a C oven. Through a mask for D dye pattern (for diagonal: Fig. 19), 40m JZ cm2 is exposed to i-line with a proximity type exposure machine (Proximity gap 60m), then room temperature inorganic It was immersed in a developer (0.1 N sodium carbonate solution: Fuji Hunt Electronics Technology, Inc., CD) for 1 minute to develop, and then washed with pure water shower.

Thereafter, the remainder B dye and the transparent photocurable registry of the exposure unit, it transparent photocurable registry of other than unexposed portion is removed by etching, in the et, 200 ^e oven 6 0 C Heat treatment (postbaking) for minutes. Thereafter, the substrate is passed through a UVZ ozone asher device (manufactured by Toshiba Lighting & Technology Corporation) for 1 minute under a low-pressure mercury lamp generating a 254 nm emission line at a substrate temperature of 100 ° C and an ozone concentration of 10,000 ppm. processing Then, the unexposed B dye layer was decomposed with ozone and etched to form R, G, and B dye patterns.

Further, the substrate on which the R, G, and B dye patterns were formed was inserted into the BL micelle dispersion prepared in Production Example 1, and the electrode terminal of the transparent conductive thin film was connected to the anode of the potentiostat. , 0.7 V, 15 minutes of constant potential electrolysis to form a BL dye layer (thin film) on the transparent conductive thin film, wash with pure water, drain off the water with air blow, After drying in an oven, the R, G, B dye pattern and the BL (black matrix) dye layer were formed.

Next, a transparent thermosetting resin (Obtomer SS7265: manufactured by Nippon Synthetic Rubber Co., Ltd.) was applied as a protective film agent on the substrate at 800 rpm to obtain a resin. It was heat-treated (post-baked) in a C oven for 60 minutes and heat-cured.

Finally, using a sputtering device (manufactured by ULVAC, SDP—550 V T), the ITO thin film was sputtered on the protective film at about 1,200 to form a transparent conductive thin film for driving a liquid crystal. At this time, the substrate temperature was adjusted to 200, and the surface resistance of the ITO film was adjusted to 20 ΩΖΟ.

As described above, the color filter according to the structure 9 shown in FIG. 3 was manufactured.

[Example 3]

The substrate prepared in Production Example 1 was inserted into the micellar dispersion of 製造 prepared in Production Example 1, and the electrode terminal of the transparent conductive thin film was connected to the anode of the potentiostat, and 0.7 V, 10 For a minute. A 色素 dye layer (thin film) was formed on the transparent conductive thin film, washed with pure water, drained by air blow, and dried in a 50 ° C oven. Next, a transparent photocurable resist (JNPC06: manufactured by Nippon Synthetic Rubber Co., Ltd.) was spin-coated at 150 rpm on the B color element layer, and the resulting mixture was dried at 80 rpm. Heat treatment (pre-bake) was performed for 5 minutes using a hot plate of C.

After this, a mask for B dye pattern (for triangle: 20th Through Figure), after i-line exposure with 3 OO m J cm ² in Mi La one Purojiweku to emission schemes exposure machine, the developing solution of an organic alkali-based aqueous solution at room temperature (2. 3 8% TMAH solution: Fuji Han Toereku DOO Spin-developed with RHDIX Technology, FHD-5) for 2 minutes, brush-scrub-washed with pure water, B-dye in exposed area and transparent light-curable resist remain, and B-dye in other unexposed areas And the transparent photocurable resist were removed by etching.

In addition, 200. Heat treatment (postbaking) was performed in the oven of C for 60 minutes to form a B dye pattern.

Next, the substrate on which the B dye pattern was formed was inserted into the micelle dispersion of G prepared in Production Example 1, and the electrode terminals of the transparent conductive thin film and the anode of the potentiostat were connected. Electrostatic potential electrolysis was performed at 4 V for 18 minutes. Thereafter, a G dye layer (thin film) was formed on the transparent conductive thin film, washed with pure water, then drained with an air blow, and dried in a 50 ° C oven.

Next, a transparent photocurable resist (JNPC06: manufactured by Nippon Synthetic Rubber Co., Ltd.) is spin-coated at 2000 rpm on the B dye pattern and the G dye layer, and heated at 80 ° C for 5 minutes at a hot plate. Heat treated (pre-baked).

G dye pattern of the mask (for Triangle: second 1 view) the Through, 300 meters J // after i-line exposure in cm ^2, organoaluminum force Li-based aqueous solution at room temperature with myristoyl Raab Logistics We click sucrose emission type exposure machine The solution was spin-developed with a developer (2.38% TMA aqueous solution: FHD-5, manufactured by Fuji Hunt Electronics Technologies, Inc.) for 2 minutes, and brush-scrubbed with pure water. As a result, the G dye and the transparent light-curable resist in the exposed part remain, and the G dye layer and the transparent light-curable resist in the other unexposed part are removed by etching. Heat treatment (post bake) for 60 minutes in a C oven was performed to form G and B dye patterns.

Further, the substrate on which the G and B dye patterns were formed was inserted into the micelle dispersion of R prepared in Production Example 1, and the electrode terminal portion of the transparent conductive thin film was connected to the anode of the potentiostat to obtain 0 8 V, 15 minutes constant power Electrolysis was performed. Furthermore, an R dye layer (thin film) was formed on the transparent conductive thin film, washed with pure water, drained with an air blow, and dried at 50 ° C.

Next, a transparent photo-curable resist (JNPC 06: manufactured by Nippon Synthetic Rubber Co., Ltd.) was spin-coated at 300 rpm on the B and G dye patterns and the R dye layer, and the resulting mixture was dried at 80 rpm. Heat treatment (pre-bake) was performed for 5 minutes with a C hot plate. (For Triangle: second FIG. 2) mask for R dye pattern through, after i-ray exposure at 3 00m JZ cm ² in the exposure machine Mi Raab Roger click cane down method, development of an organic Al force Li-based aqueous solution at room temperature The solution was spun developed with a liquid (2.38% TMAH aqueous solution: FHD-5, manufactured by Fuji Hunt Electronics Technologies, Inc.) for 2 minutes, and brush scrubbed with pure water. As a result, the R dye in the exposed area and the transparent light-curable resist remain, and the other unexposed area of the R dye layer and the transparent light-curable resist are removed by etching, and the 200 ° C. After heat treatment (postbaking) in a C oven for 60 minutes, R, G, and B dye patterns were formed.

Next, a black pigment (carbon black) -containing photocurable resist (CK1200: manufactured by Fuji Hunt Electronics Technologies, Inc.) was spin-coated on the substrate at 500 rpm, and 85. The sample was heat-treated (pre-baked) for 5 minutes using a C hotplate.

Next, the substrate surface was exposed to i-line at 3 OO m JZ cm ² through a mask that can expose only the display unit using a mirror projection type exposure machine using a mirror projection type exposure machine. 1N sodium carbonate aqueous solution: spin-developed with Fuji Hunt Electronics Technology, Inc., CD diluted product) for 2 minutes, and brush scrubbed with pure water. In addition, 2 20. Heat treatment (boss bake) was performed for 60 minutes in the oven of C, and the black dye-containing resist cured product was embedded between the R, G, and B dyes to form a black matrix.

Finally, the ITO thin film is sputtered on the protective film at about 1200 ^ using a sputtering device (manufactured by ULVAC, Inc .: SDP-550VT). To form a transparent conductive thin film for driving a liquid crystal. At this time, the substrate temperature was adjusted to 200 and the surface resistance of the ITO film was adjusted to 20 Ω.

As described above, the color filter according to the structure 13 shown in FIG. 4 was manufactured.

[Production Example 2]

^ mm (black matrix) attached

On a polished 300 mm square white glass substrate (NA 45: manufactured by HOYA), a Cr thin film was applied to a thickness of about 1200 by using a sputtering device (manufactured by ULVAC: SDP-550 VT). A deposited. At this time, the substrate temperature was adjusted to ²⁵⁰ eC. Next, a UV-solubilized positive resist (HPR 204: manufactured by Fuji Hunt Electronix Technology Co., Ltd.) was coated on the evaporated Cr thin film to a thickness of 1.5 m using a roll coater. 1 10 ° oven at for 30 minutes heat treatment C was (pre-baking), through its mask (Figure 23) for bra Kkuma bird box formation, i in contactor preparative exposure machine with 6 0 m J cm ² Line exposure.

Next, spin-develop with a developer of an organic alkaline aqueous solution at room temperature (2.38% TM AH aqueous solution: FHD-15, manufactured by Fuji Hunt Electronics Technologies, Inc.) for 2 minutes, and wash with pure water shower. , And 130. Heat treatment (post bake) was performed in a C oven for 60 minutes to form a resist pattern.

Next, a 1-liter concentration of a Cr etchant was prepared with 165 g of ceric ammonium nitrate, 42 ml of perchloric acid and pure water, and the substrate on which the resist pattern was formed was allowed to stand at room temperature. It was immersed for 2 minutes and washed with pure water. Then, the Cr thin film in the area without the resist pattern is etched, and further immersed in a resist release material (N-303: manufactured by Nagase & Co., Ltd.) of an organic alkaline aqueous solution at room temperature for 5 minutes. Then, the substrate was washed with pure water one by one to form a black matrix of a metal thin film (Cr).

Next, a sputtering device (made by ULVAC: SDP—550 V) Using T), masking deposition is performed on the substrate through a metal mask of a design (Fig. 12) that connects the entire display area to the electrode extraction terminal at about 1300 A using a Ι Τ 0 thin film. went. At this time, the substrate temperature was adjusted to 250 ° C., and the surface resistance of the IT0 film was adjusted to 20 ΩΖΙΙ].

[Example 4]

Using the substrate prepared in Production Example 2 and the micelle dispersion prepared in Production Example 1, R, G, and Β dye patterns were formed in the same manner as in Example 2. Next, a transparent thermosetting resin (LC2001: manufactured by Sanyo Kasei Kogyo Co., Ltd.) is spin-coated on this substrate at 700 rpm as a protective film agent, and heat-treated in a 220 oven for 60 minutes (postbaking). ) And heat cured.

Finally, using a sputtering device (manufactured by ULVAC, Inc .: SDP-550VT), the ITO thin film is sputtered on the protective film at about 1200 A to form a transparent conductive thin film for driving liquid crystals. did. At this time, the substrate temperature was adjusted to 200 ° (the surface resistance of the ITO film was set to 20 Ω / Ε).

As described above, the color filter according to the structure 21 shown in FIG. 5 was manufactured.

[Example 5]

Using a sputtering device (manufactured by ULVAC, Inc .: SDP-550 VT), an ITO thin film was formed on a glass substrate with a black matrix (Cr thin film) prepared in Production Example 2 for about 130 μm. At 0 A, evaporation was performed on the entire surface without using a metal mask, and the surface resistance of the IT0 film was adjusted to 20. Using the micelle dispersion prepared in Production Example 1, an R, G dye pattern and a B dye layer on which the cured product of the photocurable resist has not yet been laminated are formed on this substrate in the same manner as in Example 2. did.

Next, a transparent photocurable resist (V-259PA: manufactured by Nippon Steel Chemical Co., Ltd.) was spin-coated at 700 rpm on this substrate as a protective film agent, and the substrate was heated in an oven at 80 ° C for 3 minutes. Heat-treated (pre-bake) for 0 minutes, and exposed to i-line with a proximity exposure machine (proximity gap 500 m) at 300 mJZ cm2 through a mask that can expose only the display unit. Was.

In addition, spin development was performed for 5 minutes with a developing solution of an organic solvent-based aqueous solution at room temperature (0.14% TMAH aqueous solution: FHD-5 dilution product, manufactured by Fuji Hunt Electronics Technologies, Inc.). Thereafter, the substrate was washed with a pure water brush rub, and the photo-curable resist and the B dye layer outside the display area which were not exposed were etched. Next, a heat treatment was performed in an oven at 220 ° C. for 60 minutes, followed by heat curing to form a protective film on the display unit.

Finally, using a sputtering device (manufactured by ULVAC, Inc .: SDP-550VT), the ITO thin film is sputtered on the protective film at about 120 OA to form a transparent conductive thin film for driving liquid crystals. did. At this time, the substrate temperature was adjusted to 200 ° C, and the surface resistance of the ITO film was adjusted to 2Ω.

As described above, the color filter according to the structure 24 shown in FIG. 6 was manufactured.

[Example 6]

The substrate with the black matrix of the metal thin film (Cr) prepared in Production Example 2 was laminated with an IT0 thin film for about 130,000 using a sputtering device (manufactured by ULVAC, Inc .: SDP-550 VT). A vapor deposition was performed on the entire surface without using a metal mask.

A transparent photocurable resist (V-259 PA: manufactured by Nippon Steel Chemical Co., Ltd.) was spin-coated at 1500 rpm on a substrate with the surface resistance of this IT0 film adjusted to 20 Ω, and the temperature was adjusted to 80 °. Heat-treated (bake bake) in a C oven and passed through a mask that can expose the outside of the display (excluding the connection with the potentiostat) to 300 mJZ cm2 using a proximity exposure machine (proximity gap 60 m). Was exposed to i-rays.

Next, spin-develop for 2 minutes with a developing solution of an inorganic alkaline aqueous solution at room temperature (a 0.1 N sodium carbonate aqueous solution: manufactured by Fuji Hunt Electronics Technologies, Inc., diluted with CD). After washing with a water shower, a heat treatment was performed for 60 minutes in a 200 ° C. oven to form a protective film outside the display section. Using this substrate, G, B, and R dye patterns were formed in the same manner as in Example 1. Next, a transparent thermosetting resin (LC2001: (Sanyo Kasei Kogyo Co., Ltd.) at 700 rpm. Heat treatment (postbaking) was performed in a C oven for 60 minutes to cure by heat.

Finally, using a sputtering device (ULVAC: SDP-5500VT), the IT0 thin film is sputtered on the protective film at about 1200 A to form a transparent conductive thin film for driving liquid crystal. Formed. At this time, the substrate temperature was adjusted to 200 ° C., and the surface resistance of the ITO film was adjusted to 20 ΩΖΟ.

As described above, the color filter according to the structure 29 shown in FIG. 7 was manufactured.

[Example 7]

An R dye-containing photocurable resist (CR-2000: manufactured by Fuji Hunt Electronics Technologies, Ltd.) was spin-coated on the substrate prepared in Production Example 1 at 500 rpm, and 85. Heat treatment (pre-bake) for 5 minutes with a C hot plate, and through a mask for R dye pattern formation (for triangles: Fig. 22), a proximity exposure machine (Proximity gap 6) 0 zm) and l S Om JZ cn ^ for i-line exposure o

Next, spin-develop for 2 minutes with a developing solution of an inorganic alkaline aqueous solution at room temperature (0.1 N sodium carbonate aqueous solution: manufactured by Fuji Hunt Electronics Technologies, Inc., CD dilution), and then purify pure water. After washing with a water bath, heat treatment was performed in an oven at 220 ° C. for 60 minutes to form an R dye pattern.

Hereinafter, similarly, a photo-curable resist containing a B dye (CB-2000: manufactured by Fuji Hunt Electronics Co., Ltd.) and a photo-curable resist containing a G dye (CB-2000: FUJI HAND ELECTRONIC TECHNOLOGY CO., LTD.) Using a mask for forming a B dye pattern (for triangles: Fig. 20) Ryangle: Fig. 21) Through exposure, development, and heat treatment at 220 ° C were repeated to form R, B, and G dye patterns in this order. Insert into the micellar dispersion, connect the electrode terminal of the transparent conductive thin film to the anode of the potentiostat, conduct 0.7 V, 15 minutes of constant potential electrolysis, and apply the BL dye on the transparent conductive thin film. A layer (thin film) was formed, washed with pure water, drained off with an air blower, and dried in a 50 C oven to form a BL dye layer between the R, G, and B dye patterns.

Next, a transparent thermosetting resin (Obtomer SS7265: manufactured by Nippon Synthetic Rubber Co., Ltd.) was spin-coated on this substrate at 800 rpm as a protective film agent, and 220. It was heat-treated (post-baked) in a C oven for 60 minutes and heat-cured. Finally, the ITO thin film is sputtered on the protective film at about 1200 A using a sputtering device (manufactured by ULVAC: SDP-550 VT), and the transparent conductive thin film for driving the liquid crystal is used. Was formed. At this time, the substrate temperature was adjusted to 200, and the surface resistance of the ITO film was adjusted to 20 ΩΖΕ].

As described above, the color filter having the black matrix manufactured by the micellar electrolysis method and having the structure 30 shown in FIG. 8 was completed.

[Example 8]

In this example, a substrate manufactured in the same process as in Production Example 2 except that a black matrix of a Cr thin film was formed using a mask for forming a black matrix for a triangle (FIG. 24) was used. Further, in the same manner as in Example 7, a dye-containing photocurable resist was used to form R, G, and B dye patterns and a BL dye layer formed by micellar electrolysis.

Next, a transparent thermosetting resin (JSS-715: manufactured by Nippon Synthetic Rubber Co., Ltd.) was spin-coated at 900 rpm on this substrate as a protective film agent, and 220. Heat treatment (boss bake) in a C oven for 60 minutes and heat cure I let it.

Finally, using a sputtering device (manufactured by ULVAC, Inc .: SDP-550VT), the ITO thin film is sputtered on the protective film at about 1,200 ^ to form a transparent conductive thin film for driving liquid crystals. Was formed. At this time, the substrate temperature was set to 200 ^eC , and the surface resistance of the ITO film was adjusted to 20 Ω / □.

As described above, a color filter having the black matrix manufactured by the micellar electrolysis method and having the structure 31 shown in FIG. 9 was manufactured.

[Example 9]

After putter-learning the Burakkuma Application Benefits Tsu box of white sheet glass substrate (co twelve Ngusha 7 059) on C r of 3 300 mm angle mirror polished in Production Example _2, S i 0 2 1 8 00 as an insulating film After sputtering, IT0 was formed on the entire surface of the substrate by vapor deposition. A UV-solubilizing positive resist agent FH2130 (manufactured by Fuji Hunt Electronics Technology Co., Ltd.) was spin coated on this substrate at a rotation speed of 1,000 rpm. 50 after spin coating. _C then subjected to pre-baking for 15 minutes in C, and was set to the substrate in the exposure apparatus. The mask was a pattern in which the tip of a vertical stripe was shorted (Fig. 42).

After taking a proximity gap of 70 m and performing i-line exposure with ISO m JZ cmS, the film was developed with a 2.38% TMAH developer for 30 seconds. After development, it was rinsed with pure water. 1 30 for the register. After post-baking with C, prepare an aqueous solution of 1 MF e C 13.6 NHC 1 .0. INHN Os 0. INC e (N 0 ₃ ) 4 as an etchant, Was etched. The end point of the etching was measured by electric resistance. The etching required about 20 minutes. After the etching, the substrate was rinsed with pure water, and the resist was separated with separation liquid N-303 (Nagase Sangyo). Thus, an ITO patterned glass substrate was obtained. In this way, all the stripe butters are short-cut. The R, G, and B dye patterns were formed in the same manner as in Example 2 using the patterned electrodes, and a protective film was formed (the liquid crystal drive was performed using the previously formed transparent electrode). Therefore, it is not necessary to further laminate the IT0 for driving the liquid crystal as in the second embodiment). Finally, the color filter according to the structure 32 shown in FIG. 37 was manufactured by cutting the short portion of the transparent electrode to make each electrode independent.

[Example 10]

A 300 mm square white plate glass substrate (Corning Co., Ltd., 7059) was used to deposit ITO 1300 A over the entire surface of the substrate by vapor deposition. The substrate was spin-coated with a UV-solubilizing positive resist agent FH2130 (manufactured by Fuji Hunt Electronics Technologies) at a rotation speed of 1, O O r pm. 80 after spin coating. A bake was performed for 15 minutes at C. After that, this substrate was set in the exposure machine. The mask was a pattern in which the tip of a vertical stripe was shorted (Fig. 42).

The proximity gap was removed, exposed to i-ray at 120 mJZ cm2, and developed with a 2.38% TMAH developer. After development, it was rinsed with pure water. 1 30 for the register. After post-baking with C, an aqueous solution of 1 MF e C 13.6 NHC 1 .0. IN HN Os 0. INC e (N 0 ₃ ) 4 was prepared as an etchant. IT 0 was etched. The end point of the etching was measured by electric resistance. The etching required about 20 minutes. After the etching, the substrate was rinsed with pure water, and the resist was peeled off with N-303 (Nase Corporation). Thus, an IT0 patterned glass substrate was obtained.

Next, as a black matrix forming resist (a black pigment-containing resist), the color CR, CG, and CB were added to Fuji Hunt Electronics Technologies, Inc.'s Color Mosaic CK in a 3: 1: 1: 1 ratio, respectively. A mixture of parts by weight was used. The IT0 patterning glass substrate prepared earlier was rotated at 10 rpm, and 30 cc of this resist agent was placed on top of this. Was added dropwise. Next, the rotation speed of the spin coat was set to 500 rpm, and a uniform film was formed on the substrate. This substrate was pre-baked at 880 for 15 minutes. Then, while aligning with an exposure machine, exposure was performed using a mask of the design of the black matrix shown in FIG. 43: (pixels having a width of about 90 x 310 / zm).

After taking the proximity gear at 7 O / zm and exposing it to i-line at 100 mJZcm2, Fuji Hunt CD (developer) was diluted 4 times with pure water and developed for 30 seconds. Further, the substrate was rinsed with pure water and postbaked at 200 ° C. for 100 minutes.

Using this substrate in which all of the patterned electrodes are in a short-patterned pattern, the B, G, and R dye patterns were formed in the same manner as in Example 3 (the previously formed patterned transparent layer). (Because the system uses the electrodes to drive the liquid crystal, it is not necessary to further stack IT0 for driving the liquid crystal.) Finally, the short portions of the transparent electrodes were pressed to make each electrode independent, and a color filter having a structure 33 shown in FIG. 38 was manufactured.

[Example 11]

ITO was deposited on the entire surface of a mirror-polished 3 O O mm square white glass substrate (Corning Co., Ltd., 7059) by evaporation of 130 O A. A UV-solubilizing positive resist agent HPR204 (manufactured by Fuji Hand Electronics Technologies) was spin-coated on this substrate at a rotation speed of 1,000 rpm. 80 after spin coating. Prebaking was performed for 15 minutes at C. After that, this substrate was set in the exposure machine. The mask was a pattern in which the tip of a vertical stripe was shorted (Fig. 42).

A proximity gap of 70 μm was taken, exposed to i-rays at 100 mJZ cm2, and then developed with 2.38% TM AH in developer. After development, it was rinsed with pure water. After post-baking the resist at 130 ° C, 1 MF e C 13 · 6 NHC 1 · 0.IN as an etch An aqueous solution of HN Os 0. INC e (N O3) 4 was prepared, and IT 0 of the substrate was etched. The end point of the etching was measured by electric resistance. The etching required about 20 minutes. After the etching, the substrate was rinsed with pure water, and the resist was separated with separation liquid N-303 (Nagase Sangyo). Thus, an IT0 buttering glass substrate was obtained.

Using this substrate in which all of the notched electrodes have a short-patterned pattern, the B, G, and R dye patterns were formed in the same manner as in Example 3.

Next, as a black matrix forming resist (a black pigment-containing resist), the CR, CG, and CB were mixed in a ratio of 3: 1: 1: 1 parts by weight to the color mosquito CK of Fuji Hunt Electronics Technologies, Ltd. What was done was used. The previously prepared IT0 buttering glass substrate was rotated at 10 rpm, and 30 cc of the resist agent was dropped thereon. Next, the rotation speed of the sub-coat was set to 5 O rpm, and a uniform film was formed on the substrate. This substrate was pre-baked at 80 ° C for 15 minutes. Then, while aligning with the exposure machine, i-line exposure was performed from the glass surface of the substrate using a mask capable of exposing only the display portion.

After taking the proximity gap and performing i-line exposure at 100 mJZ cm2, Fuji Hunt CD (developer) was diluted 4 times with pure water and developed for 30 seconds. Further, the substrate was rinsed with pure water, and post-baked for 200 minutes (:, 100 minutes) to form black matrix at positions between the B, R, and G dye patterns. Each electrode is made independent by cutting the short part.Since a liquid crystal drive is performed using the patterned transparent electrode formed here, further lamination of the liquid crystal drive IT0 is unnecessary. Thus, a color filter having a structure 33 shown in FIG. 38 was manufactured.

[Example 12]

Instead of applying the transparent photocurable resist with a Sincoater in Example 1, this lg was converted to FPEG: 2 mM, LiBr: 0.1 M solution 1 After addition, the emulsion was dispersed by ultrasonic irradiation to form an emulsion, and a substrate having a dye layer formed by micellar electrolysis was inserted into the solution, and 0.5 V, 30 V The procedure was performed in the same manner as in Example 1 except that the transparent photocurable resist was laminated by electrolysis for one minute.

[Example 13]

In Example 1, the transparent light-curable resist was replaced with a transparent light-curable electrodeposited polymer (Japanese Patent Laid-Open No. 4-104102). A substrate having a dye layer formed by micellar electrolysis was inserted into a neutral electrodeposited polymer electrolyte solution, and the solution was electrolyzed at 100 V for 1 minute to laminate a transparent photocurable electrodeposition polymer. The operation was performed in the same manner as in Example 1.

[Example 14]

Example 3 is the same as Example 3, except that the mask used for forming the RGB dye pattern was replaced with a design mask in which dye patterns of the same color were connected as shown in FIGS. The RGB dye pattern was formed on the surface.

Next, an aqueous solution of 1 MF eC 13.6 NHC 1 .0.INHN Os 0.INCe (N Os) was prepared as an etchant, and the ITO of the non-laminated portion of the dye pattern on the substrate was etched. . The end point of the etching was measured by electric resistance. The etching required about 20 minutes. After etching, it was rinsed with pure water. Thus, IT 0 patterning was performed. Further, to remove the dye and registry of IT 0 portion of driver-connection for, _c to expose the ITO then Burakkuma Application Benefits try form registry agent (black pigment-containing registry) as Fuji Han Toereku Toro Nix Technology Logistics A mixture of 3: 1: 1: 1 parts by weight of the same CR, CG, and CB with one company's color mosaic CK was used. The previously prepared IT0 patterned glass substrate was rotated at 10 rpm, and 30 cc of the resist was sprayed thereon. Next, the rotation speed of the spin coat was set to 50 O rpm, A uniform film was formed on the top. This substrate was pre-baked at 80 ° C for 15 minutes, and exposed using a black matrix design and a mask shown in Fig. 43 while aligning with an exposure machine. .

After taking a proximity gear of 7 μμπι and performing i-line exposure at 100 mJ cm2, Fuji Hunt CD (developer) was diluted 4 times with pure water and developed for 30 seconds. Rinse with pure water and postbake for 200, 100 minutes to form black matrix between the B, R, and G dye patterns. Since the liquid crystal is driven by using the buttered transparent electrode formed here, the filter is manufactured, so that further lamination of ITO for driving the liquid crystal is unnecessary.

[Example 15]

Example 1 was repeated in the same manner as in Example 1 except that each time R, G, and B colors were formed into a film by the micelle electrolysis method, UV cleaning was performed to decompose foreign substances on the pigment surface.

[Comparative Example 1]

I 0 0 腊 patterning (ft surface formation ffl lightning name formation)

I T 0 film-formed glass substrate with a sheet resistance of 20 Ω / □ as an I T O film

(Blue glass, polished, slicing dip product: manufactured by Geomatic Co., Ltd.) and a UV-solubilized positive resist (FH 2030M: manufactured by Fuji Hunt Electronics Technology Co., Ltd.) at 1,000 rpm. I did it. 80 after this spin coating. Heat treatment (prebaking) was performed for 15 minutes at C. After that, this substrate was set in the exposure machine. The mask used was a stripe ITO patterning (Fig. 25). After taking a proxy gap of 70 m and subjecting it to single-line exposure at 8 011 ₁ 1 ^> (; 1112, 25 inorganic developer (LSI developer: Fuji Hunt Electronics Technology Co., Ltd.) After this development, the substrate was rinsed with pure water and then heat-treated (postbaked) at 180 ° C.

Next, as an etchant, an aqueous solution of 1 MF eC 13.6 NHC 1 .0.IN ΗΝ 0 ₃ .0.1 N Ce (Ν0 ₃ ) 4 was prepared. The substrate IT0 was etched. The end point of the etching was measured by electric resistance. The etching required about 10 minutes. After the etching, the substrate was rinsed with pure water, and the resist was peeled off with a release agent (Ν—303: manufactured by Nagase & Co., Ltd.). In this way, an IΤ0 buttering glass substrate was obtained.

Black matrix production process

As a black matrix forming resist (register containing black pigment), the same CR, CG, and CB are added to Fuji Hunt Electronics Technological Co., Ltd.'s Rikmo Razaik CK in a ratio of 3: 1: 1: 1: 1, respectively. A partially mixed product was used.

The above resist was applied at 500 rpm on a previously prepared IT0 buttering glass substrate by a spin coater, and the resulting resist was applied at 80 rpm. Heat treated (prebaked) for 15 minutes in a C oven. Next, an aqueous solution of polyvinyl alcohol (PVA) for an oxygen barrier film (CP: manufactured by Fuji Hunt Electronics Technology) was applied in the same manner as the resist. Then, while aligning with an aligner using an aligner that has an alignment function, the black matrix and the mask for forming the electrode take-out (Fig. 26) are used to achieve 80 zm. After performing a proximity exposure (i-line), the film was developed with an inorganic alkaline developer (0.1 N sodium carbonate aqueous solution: Fuji Hunt Electronics Technology Co., Ltd., dilute CD). Furthermore, it was rinsed with pure water, and heat-treated (boss bake) in an oven at 220 ° C. In this way, the electrode take-out layer 230, the display portion 231 and the black matrix 232 in FIG. 26 were formed.

ft¾ «诰 te

The ITO patterning substrate with black matrix (Fig. 27), which has conduction for each color, such as silver bases 234a, 234b and 234c, is described in Manufacturing Example 1. The silver paste was inserted into the micelle solution of R, and the anode of the potentiostat was connected to the silver paste led to the R row of the drive. Perform constant potential electrolysis at 0.8 V for 15 minutes to remove the R dye thin film. Obtained. Then, after washing with pure water, pre-bake in an oven (100 ° C

X 15 minutes). Next, this substrate was inserted into the micelle solution of G, and a constant potential electrolysis of 0.4 V for 18 minutes was performed in the same manner as described above to obtain a color filter R.

A thin film of G was obtained. After film formation, post-treatment was performed under the same conditions as for the film formation of R. Finally, insert the substrate of:; into the micelle solution of B, and then use 0.7 V, 1

Electrostatic potential electrolysis was performed for 0 minutes, and thin films of color filters R, G, and B were obtained. After film formation, post-treatment was performed under the same conditions as for the film formation of R. In this way, together with the electrode take-out layer 230, the display unit 231, and the black matrix 232 in FIG. 26, the IT0 patterns 23 3a, 233b, An R, G, B color filter dye layer was obtained on 233c.

The formation of cloying

Spin-coat 0S-808 (manufactured by Nagase & Co., Ltd.) as a protective film on the RGB dye layer forming substrate at 800 rpm, then heat-treat (bak) at 240 ° C for 1 hour to cure. I let it.

Thus, a protective film was formed.

Certain plank cut and chamfer

As shown in Fig. 33, the substrate on which the protective film was laminated was cut with a scriber with an accuracy of 0.3 mm or less on the upper chain line, and the cut surface was chamfered and polished with a chamfering machine.

, m m ι τ o 腊

Finally, the ITO thin film is sputtered on the protective film at about 1200 A using a sputtering device (ULDP: SDP-550VT) to form a transparent conductive thin film for driving liquid crystal. did. At this time, the substrate temperature was adjusted to 200, and the surface resistance of the ITO film was adjusted to 20. Thus, a color filter corresponding to the structure 1 described with reference to FIG. 33 is completed.

[Comparative Example 2]

Black matrix formation A Cr thin film was sputtered on an alkali-free glass substrate (NA 45: manufactured by HOYA) at approximately 1,300 A (Alvac: SDP-550 VT). On top of this, a UV-soluble solubilizing positive resist (HPR204: manufactured by Fuji Hunt Electronics Technology Co., Ltd.) was spin-coated at 100 rpm.

Next, prebaking was performed at 100 ° C for 5 minutes with a hot plate. After that, the substrate was set in an exposure machine, and a proximity gap of 60 m was taken through a black matrix pattern mask (Fig. 23), and i-line exposure was performed at 80 mJZ cm2. It was immersed in a developer of an aqueous alkaline solution (2.38% TMAH aqueous solution, Fuji HD Electronics Technology, FHD-5) and developed.

Next, after shower rinsing with pure water, heat treatment (post bake) was performed at 150 ° C. Next, Cr was immersed and etched in a mixed aqueous solution having a concentration of 165 g of cerium ammonium nitrate, 42 ml of perchloric acid and 1 liter of pure water at room temperature as an etchant. After this etching, the resist was rinsed with pure water, and the resist was stripped with a stripper (N-303: manufactured by Nagase & Co., Ltd.) of an organic alkaline aqueous solution. Then, it was sufficiently washed with pure water to obtain a black matrix.

Insulation) I T 0 Vaginal pattern formation Layer formation lightning type 5¾)

Next, a silica dispersion (OCD TYPE-7; manufactured by Tokyo Ohka Co., Ltd.) was applied as a dielectric film on this black matrix by spin coating at 1,000 rpm and baked at 250 ° C for 60 minutes. After that, the substrate was set on SDP-550 VT manufactured by ULVAC, Inc., and IT0 was sputtered at about 1300 from above the substrate. At this time, the work is 200. As C, the surface resistance of I T0 was adjusted to 20 Ω.

Next, a UV-solubilized positive resist (FH203M: manufactured by Fuji Hunt Electronics Technology) was spin-coated on the substrate at 1,000 rpm, and the substrate was subjected to spin coating. Heat treatment (brive bake) was performed in a C oven for 15 minutes. Next, through a diagonal pattern mask (Fig. 28) using a contact exposure machine, the alignment exposure (i-line exposure energy 6

Then, spin development was carried out with a developer of an aqueous inorganic alkaline solution (LSI developing solution: manufactured by Fuji Hunt Electronics Technology Co., Ltd.).

After this development, the substrate was rinsed with a pure water shower, and further subjected to a heat treatment (post bake) at 150 ° C. Next, the substrate was subjected to etching for 3 minutes by using a mixture of an equal amount of an aqueous ferric chloride solution (Boume 42) and hydrochloric acid as an etchant for 3 minutes. The end point of the etching was measured by electrical resistance.o

After the etching, the substrate was rinsed with pure water, and the resist was peeled off with a release agent (N-303: manufactured by Nagase & Co., Ltd.) of an organic alkaline aqueous solution. Furthermore, it washes with pure water to confirm that there was no electrical leakage between adjacent I T0 electrodes.

A substrate with 1T0 patterning black matrix was completed. Thunder 攞 form of extraction ^

Acrylic acid-based resist (CT: manufactured by Fuji Hunt Electronics Technologies) was used to form an electrode take-out layer, and was spin-coated on the substrate at 85 Orm. It was heat-treated (brive bake) in a C oven for 45 minutes. Next, while aligning with a proximity exposure machine (proximity gap 60 m), the exposure (i-line) was performed through a mask (Fig. 29) of only the electrode extraction zone for the diagonal. Exposure energy of 40 mJ / cm2). Then, the film was immersed in a developer of an inorganic alkaline aqueous solution (0.1 N sodium carbonate aqueous solution: a CD-diluted product manufactured by Fuji Hunt Electronics Technologies, Inc.) for 1 minute and developed. Rinse with pure water and 200. Heat treatment (post bake) was performed in a C oven for 60 minutes to complete the substrate for color filter production. In this step, as shown in Fig. 30, the substrate is made of silver for each of R, G, and B. The same steps as in Comparative Example 1 were performed except that the first 25 1 a, 25 1 b, and 25 1 c were formed and conduction was established.

Formation of protective film

Next, a thermosetting resin (Obtomer SS7265: manufactured by Nippon Synthetic Rubber Co., Ltd.) was spin-coated at 900 rpm as a protective film agent on the substrate on which the dye layer was formed. It was heat-treated (boss bake) in a C oven for 60 minutes.

Certain plank cut and chamfer

The same process as in Comparative Example 1 was performed except that the force was applied by the dashed line shown in FIG. 34 described previously.

LCD! ^ Fl fT I T 0

Finally, using a sputtering apparatus (manufactured by ULVAC, Inc .: SDP—550 V T), the ITO thin film was sputtered on the protective film of about 1,200 to form a transparent conductive thin film for driving a liquid crystal. At this time, the substrate temperature was set to 200, and the surface resistance of the I T0 film was adjusted to 20 ΩΖΕΙ. Thus, a color filter corresponding to the structure 2 described with reference to FIG. 34 was completed.

[Comparative Example 3]

IΤ0 thin vagina patterning (formation of lightning for forming ft surface layer)

A UV-solubilized positive resist (HPR 204: manufactured by Fuji Hunt Electronics Technology Co., Ltd.) was applied to the ITO film glass substrate (alkali-free glass; IT 0 film 20 Ω / □) at 1,000 rpm. did. 80 after this spin coating. Heat treatment (prebake) was performed in a C oven for 15 minutes. Then, the substrate was exposed to i-line at 80 mJZ cm ² through a diagonal pattern mask (Fig. 28) using this substrate contact exposure machine, and then a developing solution (2.38% TMAH aqueous solution: developed by immersion in Fuji Hunt Electronics Technologies. After this development, the substrate was rinsed with pure water and postbaked at 150 ° C. Next, the second chloride at 37 ° C was used as an etchant. The IT0 of the substrate was etched for 3 minutes with an equal amount mixture of an aqueous iron solution (Boume 42) and hydrochloric acid. The end point of this etching was measured by electrical resistance. Next, the substrate was rinsed with pure water, and the resist was peeled off with a separating agent (N-303: manufactured by Nagase & Co., Ltd.) of an organic solvent aqueous solution. Further, the substrate was washed with pure water, and it was confirmed that there was no electric leak between adjacent IT0 electrodes. Thus, a substrate for forming a color filter was completed.

Thunder name extraction formation

This formation was performed in the same process as in Comparative Example 2.

ft element layer formation

This formation was performed in the same process as in Comparative Example 2.

Protective film formation

This formation was performed in the same process as in Comparative Example 2.

Board force and chamfer

This substrate cutting and chamfering were performed in the same steps as in Comparative Example 1 except that the cutting was performed by the dashed line shown in FIG. 35 described above.

^ m ι τ ο Vaginal formation

Finally, using a sputtering device (manufactured by ULVAC, Inc .: SDΡ550 VΤ), the IΤ0 thin film is sputtered on the protective film with a thickness of about 1200 0, and the liquid crystal is driven to be transparent. A conductive thin film was formed. At this time, the substrate temperature was adjusted to 200, and the surface resistance of the ITO film was adjusted to 20 ΩΖΕ1. Black matrix formation

In this case, a Cr thin film was spun on the substrate at about 150 A (manufactured by ULVAC, Inc .: SDP-550VT type). Next, an ultraviolet solubilizing type resist agent (FH2130: manufactured by Fuji Hunt Electronics Technology Co., Ltd.) was spin-coated at 1,500 rpm. After the spin coating, a heat treatment (prebake) was performed in a 90 ° C oven for 15 minutes. The substrate is then set in a proximity-type exposure machine (proximity gap 80 // m) and aligned with the underlying ITO pattern through a black matrix pattern mask (Figure 23). Then, i-line exposure was performed using SO m JZ cm ² . Next, it was immersed in a developing solution of an inorganic alkaline aqueous solution (LSI developer: manufactured by Fuji Hunt Electronics Technologies), rinsed with pure water, and baked at 150C.

Further, as an etchant, Cr was etched for 3 minutes using an aqueous solution mixture of cerium ammonium nitrate (165 g), perchloric acid (42 ml) and 1 liter of pure water in the same amount. The end point of the etching was measured by electric resistance. Next, it was rinsed with pure water, and the resist was peeled off with a stripping agent (N-303: Nagase & Co., Ltd.) of an aqueous solution of organic alkali. Furthermore, it was thoroughly washed with pure water to form a black matrix. Thus, a force filter corresponding to the structure 3 described with reference to FIG. 35 is completed.

[Comparative Example 4] (Dispersion method power filter) ·

Black matrix formation

This formation is performed in the same process as in Comparative Example 2 except that a black matrix is formed using a black matrix for a triangle (FIG. 24) using a chromium oxide thin film instead of the chromium thin film. went.

ft element pattern formation

A red (R) dye-containing resist CR-2000 (manufactured by Fuji Hunt Electronics Technology) is spin-coated at 500 rpm on a substrate on which black matrix is formed, and heat-treated in an 85 ° C oven for 15 minutes. (Pre-bake) Next, an oxygen barrier film (CP: manufactured by Fuji Hunt Electronics Technology Co., Ltd.) was coated in the same manner as the resist. This substrate is set in a contact exposure machine, aligned with the black matrix, and aligned (aligned) with an R dye pattern mask (for triangles: Fig. 22). Exposure to i-rays with cm2, using a developing solution of an inorganic alkaline aqueous solution (0.1 N sodium carbonate aqueous solution: CD: Fuji Hunt Electronics Technology Co., Ltd.) ). In addition, rinse with pure water shower and then 200. Heat treatment (postbaking) in a C oven for 60 minutes formed an R dye pattern.

Hereinafter, similarly, a blue (B) pigment-containing resist (CB-200: manufactured by Fuji Hunt Electronics Technologies) and a green (G) pigment-containing resist (CG-200000: Fuji Hunt Electric) Co., Ltd.) and repeated exposure, development, rinsing, and heat treatment (post bake) with each dye pattern mask (for triangles: Fig. 20, 21). R, G, and B dye patterns were formed.

Protective vaginal formation · ^ m ι τ o Vaginal formation

In this formation, the same steps as in Comparative Example 2 were performed, and a color filter corresponding to the structure described with reference to FIG. 36 was completed.

Next, the evaluation results will be described.

Evaluation of the production yield, color unevenness, step between pixels, definition, contrast, heat resistance, and light resistance of the color filter structure, and the composition of the black matrix, light blocking properties, binhole ratio, and film surface reflectance The evaluation results and are listed (Tables 1 and 2). The items of color filter evaluation and black matrix evaluation in (Tables 1 and 2) are explained.

First, the color filter evaluation items will be described.

The production yield is defined as the ratio (%) of the number of non-defective color filters when 20 insulating substrates (glass substrates) are loaded. As a condition of this non-defective product, it is assumed that there is no white defect or black defect having a size of 30 // m diameter or more.

The standard of color unevenness is ΔΕ10 or less. In this case, in the color filter formed by the micellar electrolysis method, a defect in the color element layer due to the disconnection of the ITO pattern corresponds to a white defect, and a duplication of the dye layer due to a leak in the ITO pattern corresponds to a black defect. For color unevenness, the chromaticity of nine pixels on the substrate is measured separately for R, G, and B, and the one with the largest color difference is evaluated as ΔΕ.

The surface step is measured by a surface roughness meter using the maximum value of the steps of the R, G, and B dye patterns and the black matrix (between pixels), and the center and edge of each of the R, G, and B color pattern. The average of the maximum value (in pixels) of the step is denoted by βm.

The definition is the dimensional accuracy ("in") for the design pattern.

In contrast, a small piece of a power filter is sandwiched between two parallel polarizers, the polarizers are rotated 90 degrees, and the change in brightness (contrast) at that time is measured. Take the value rotated by 90 degrees in the denominator, and take the value without rotation in the numerator at that time. When no small piece of color filter is inserted, the value is 20000.

Heat resistance is defined as the percentage change in color purity (for the G dye pattern) by heat treatment at 260 CX for 1 hour (air atmosphere) (the ratio of the difference between the color purity before heat treatment and the color purity after heat treatment). . Lightfastness is the percentage change in color purity (for the G dye pattern) of a 100,000 lux metalhalide drambe irradiated for 100 hours (the difference between the color purity before irradiation and the color purity after irradiation). ).

The color purity is calculated by taking the chromaticity coordinates for each color, connecting the C light source and the chromaticity coordinates with a straight line, and setting the intersection of the extrapolated line and the outer periphery to 100% color purity. The ratio of the distance of the chromaticity coordinates from the C light source. Next, the black matrix evaluation items are explained.

The light-shielding property is defined as an absorbance at a wavelength of 460 nm, which is converted to a black matrix film thickness of 1.0 m.

The number of binholes shall be the average of the number of binholes of 30 / m or more in 20 input substrates.

The film surface reflectance is the ratio (%) of the reflected light intensity to the visible light (460 nm) intensity incident on the film surface. [table 1 ]

i Upper s s Lower: s¾ mean s difference

£ ·) Top S: R. G. B S / i Bottom: BL color ¾S (black ΐ 'box)

3) ΐΚΒ L: Middle method SS = Color BL register: 色素 Color dye-containing resist cured 1 * M¾KB: Mide ル »^ ¾ Color ^ S Force filter ^ value plaque matrix, sox ^ value color ^ production color unevenness ^ fineness toughness light opacity «3) t ':' book- Ir effect surface /!"') Reflectance comparison example 1 Strife 60 <S 0.?5 ι2 0 6? 0 0 0 BL rest n <5,

(ffigl) 0.15 i 3.0 1.0 Comparative Example 2 Ear] '-na H 25 <5 0.45 ± 2.0 630 0 0 3

(Form 2) 0.15 ± 2.0 Comparative Example 3 ii-n 20 <50.wS I «40 ί 20 590 0 0 m 2 45

0.15 ± 3 0> 3.5 Comparative Example 4 Trian 85 <50.i 3.0 870 0 75 Oxidation DA 3 10

0.05 ± 2.0> 3.5

1) Top: step between elements Bottom: delta element HIS difference

2) Upper row: R.G.B pigment layer Lower S: B L pigment layer (bra, y kumatori, socks)

30 M electrolysis ΒΙ_ ··· Micellar electrode «Ma-made 腠 black dye ^ レ Resist .: Black ^ -containing resist << $ compound

t «B: Miya¾ solution S 睽 color

] ^ 2 The results of the surface step in the color filter evaluation items in Tables 1 and 2 will be described using Example 2 as an example.

FIG. 31 (a) shows Example 2, in which the step between pixels (max — min), which is the maximum value of the steps of the R, G, B dye patterns and black matrix measured by a surface roughness meter, is shown. ), And its value is 0.10 m from (Table 1 and Table 2). Fig. 31 (b) shows the (average) step (maX-min) in the pixel, which is the maximum value of the step between the center and the end of each of the R, G, and B dye patterns. In Tables 1 and 2 is 0.02 / m.

Fig. 31 (c) shows the maximum value of the step of the R, G, B dye pattern and the black matrix measured by the surface roughness meter in Comparative Example 2, that is, the structure 2 described above. Indicates the step between pixels (max-min), and the value is 0.45 m from Tables 1 and 2. Fig. 31 (d) shows the (average) step (max-min) in the pixel, which is the maximum value of the step between the center and the end of each of the R, G, and B dye patterns. (Table 1 and Table 2) It is 0.15 m.

Thus, in the second embodiment, both the step between pixels and the step within the pixel (average) are small. That is, since the dye layer is formed flat, the steps in the same dye pattern are reduced, the scattering of transmitted light is reduced, and the contrast is good.

Further, as shown in (Table 1 and Table 2), the color filter of this embodiment can be produced with a high yield even with various dye pattern arrangements, reduces color unevenness, and improves flatness. Therefore, it was confirmed that the image quality was improved (contrast was improved) and that it was possible to sufficiently cope with future high definition.

In addition, it was confirmed that the advantages of heat and light resistance of the color filter by the micellar electrolysis method were not impaired.

On the other hand, for black matrix, under mild manufacturing conditions such as formation of a black pigment by micellar electrolysis, light shielding metal (Chrom) or metal oxide (oxidation ⁷ ^ rom).

It was also found that the fineness as a black matrix was better than that of a metal and metal oxide thin film and a black dye-containing resist cured product.

In addition, the combined use of a dye layer formed by micellar electrolysis and a metal thin film (chromium) reduced the occurrence of binholes and the reflection of the metal thin film. Industrial applicability

As described above, the power filter and the method of manufacturing the same according to the present invention can be applied to various kinds of electric devices using a large-screen indoor / outdoor image information display device such as a color liquid crystal display, an aurora vision, etc. It can be suitably used in industry, information equipment industry, and the like.

Claims

The scope of the claims

1. In a color filter in which a plurality of color dye layers are separately arranged on an insulating substrate and a predetermined dye pattern is formed, at least the entire display portion or the display pixel portion on the insulating substrate is included in the color filter. A transparent conductive thin film laminated and formed on a portion corresponding to a continuous pattern, a plurality of color dye layers separated and arranged on the entire or a part of the transparent conductive thin film by film formation by a micellar electrolytic method, and A color finish comprising a transparent photocurable resist cured product formed in this order, laminated on the dye layer.

2. The color filter according to claim 1, wherein the plurality of color dye layers correspond to three primary colors.

3. The color filter according to claim 1, wherein the plurality of color dye layers correspond to three primary colors and four black colors.

4. The power filter according to any one of claims 1 to 3, further comprising a protective film formed by being laminated on the cured product of the transparent photocurable resist.

5. A method for manufacturing a power filter that separates and arranges a plurality of color dye layers on an insulating substrate to form a predetermined dye pattern, comprising: a) at least the entire display portion or the display pixel portion on the insulating substrate; A step of laminating and forming a transparent conductive thin film on a portion corresponding to a continuous pattern including

b) a step of forming a dye layer of one color selected from a plurality of colors on the entire surface or a part of the transparent conductive thin film by film formation by micellar electrolysis, c) transparent on the dye layer of one color And then exposing using a mask corresponding to the dye layer of one color selected from the above-mentioned multiple colors, and before and / or after heat treatment of the exposed part, photo-curing of the unexposed part Removing the resist and the dye layer to arrange a dye layer of one color, d) The same steps as steps b) and c) are repeated one or more times, and the dye layers of the remaining colors of the plurality of colors are separately arranged on the entire surface or a part of the transparent conductive thin film. To form a multi-color dye pattern,

A method for producing a color filter, comprising:

6. The method for producing a color filter according to claim 5, wherein the dye layers of the plurality of colors correspond to three primary colors.

7. The method for producing a color filter according to claim 5, wherein the dye layers of the plurality of colors correspond to three primary colors and four black colors.

8. After the step d), the pattern of the transparent conductive thin film is formed by etching the portion of the transparent conductive thin film where there is no dye pattern using the dye pattern of a plurality of colors as a mask. The method for producing a force filter according to any one of claims 5 to 7, characterized in that:

9. In a method of manufacturing a color filter for forming a predetermined dye pattern by separately arranging three primary color dye layers on an insulating substrate, and forming a black matrix,

b) a step of laminating a transparent conductive thin film on at least the entire display portion or a portion corresponding to a continuous pattern including the display pixel portion of the metal or metal oxide thin film,

c) a step of forming a dye layer of one of the three primary colors on the entire surface or a part of the transparent conductive thin film by film formation by micellar electrolysis, d) a transparent photocurable resist on the dye layer. Are exposed using a mask corresponding to a dye layer of one of the three primary colors, and before and / or after the heat treatment of the exposed portion, the resist and the dye layer of the unexposed portion are removed. And disposing the first color dye layer,

e) Repeat the above steps c) and d) one or more times The dye layers of the remaining three primary colors are separately arranged on the entire surface or a part of the transparent conductive thin film to form the three primary color dye patterns,

A method for producing a color filter, comprising:

10. In a method of manufacturing a color filter for forming a black matrix while forming a predetermined dye pattern by separately arranging three primary color dye layers on an insulating substrate,

b) a step of forming a dye layer of one of the three primary colors on the entire surface or a part of the transparent conductive thin film by film formation by micellar electrolysis, c) a transparent photocurable resist on the dye layer. Are exposed using a mask corresponding to the dye layer of one of the three primary colors, and before and / or after the heat treatment of the exposed part, the unexposed resist and the dye layer are removed. Removing and placing the first color dye layer,

d) The same steps as steps b) and c) are repeated one or more times, and the dye layers of the remaining three primary colors are separately arranged on the entire surface or a part of the transparent conductive thin film. Forming the three primary color dye patterns,

A method for producing a color filter, comprising:

11 1. In a method for manufacturing a color filter for forming a black matrix while forming a predetermined dye pattern by separately disposing three primary color dye layers on an insulating substrate, a) a step of laminating a transparent conductive thin film on at least the entire display portion or a portion corresponding to a continuous pattern including the display pixel portion on the insulating substrate;

b) A photo-curable resist containing a dye of one color selected from the three primary colors is laminated on the entire surface or a part of the transparent conductive thin film, and a mask corresponding to the dye layer of one color selected from the three primary colors is used. Exposure and development using, removing the resist of the unexposed portion, and arranging the dye layer of the first color, c) repeating the same process as the above I ¾ b) one or more times, The dye layers of the remaining three primary colors are separately arranged on the entire surface or a part of the transparent conductive thin film to form a three primary color dye pattern, d) separating the three primary color dye layers, respectively. After disposing, a black dye layer is formed in a predetermined shape by a film formation by micellar electrolysis at a position between the arranged three primary color dye layers, thereby forming a black matrix. ,

A method for producing a color filter, characterized by including:

12. Before the step a), at a position corresponding to the black dye layer formed in the step d) on the insulating substrate, a cured product of a photocurable resist containing a black dye, or The method for producing a color filter according to claim 11, wherein a metal or a metal oxide thin film is formed.

13. The method according to any one of claims 5 to 12, wherein the method of laminating the transparent photocurable resist is a film formation method by a micelle electrolysis method or an electrodeposition method. Manufacturing method for color filters.

14. The method for producing a color filter according to any one of claims 5 to 12, wherein the dye layer is washed with ultraviolet light before laminating the transparent photocurable resist.

15. Display on the insulating substrate or on the transparent conductive thin film formed by laminating on at least the entire display portion or a portion corresponding to a continuous pattern including the display pixel portion on the metal or metal oxide thin film Corresponding to the department The method for producing a filter according to any one of claims 5 to 14, wherein a protective film is formed by laminating a portion excluding the portion.

16. The force filter according to any one of claims 5 to 15, wherein a protective film is further formed after the formation of the plurality of color patterns or the three primary color patterns and the black matrix. Manufacturing method.

17 7. A black matrix manufacturing method characterized in that a black dye is formed on a conductive thin film between the three primary color dye patterns of a color filter by micellar electrolysis. .