WO1993009276A1 - Revetements de soudure resistants au vieillissement - Google Patents

Revetements de soudure resistants au vieillissement Download PDF

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Publication number
WO1993009276A1
WO1993009276A1 PCT/US1992/009134 US9209134W WO9309276A1 WO 1993009276 A1 WO1993009276 A1 WO 1993009276A1 US 9209134 W US9209134 W US 9209134W WO 9309276 A1 WO9309276 A1 WO 9309276A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
accordance
metal substrate
solder
aromatic aldehyde
Prior art date
Application number
PCT/US1992/009134
Other languages
English (en)
Inventor
Ronald J. Rife
Ronald L. Bishop
Robert J. Edgington
Original Assignee
National-Standard Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National-Standard Company filed Critical National-Standard Company
Publication of WO1993009276A1 publication Critical patent/WO1993009276A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Definitions

  • the present invention relates to an electronic lead- in metallic substrate coated with a fusible solder coating possessing enhanced resistance to loss of solderability due to aging.
  • an aromatic aldehyde selected from a group including aminobenzaldehyde , benzaldehyde , chlorobenzaldehyde, dichlorobenzaldehyde, meth lbenzaldehyde , nitrobenzaldehyde and trichlorobenzaldehyde.
  • a further object of the present invention is to provide a novel method of depositing and controlling a Sn/Pb solder coating onto the electronic lead-in metal substrate to provide lead-in metal substrates which resist corrosion and oxidation, thus rendering the metal substrate resistant to the loss of solderability due to natural aging.
  • a further object of the present invention is the novel method of depositing and controlling an alloy solder coating onto a electronic lead-in metal substrate which consist of plating the Sn/Pb solder alloys from a fluoborate or methylsulfonic acid solution containing aromatic aldehydes, to provide a tin-lead solder coating containing molecules of the organic material included or entrapped therein.
  • the phrase electronic lead-in wire or metallic substrate is used to designate the current carrying conductor containing the solder coating.
  • solder coating will be referred to as including the elements Sn/Pb.
  • the electronic lead-in metal substrate useful as a electronic lead-in component which possesses increased resistance to the loss solderability due to natural or accelerated steam aging, is first cleaned utilizing conventional methods and then a Sn/Pb solder coating is applied to the lead-in metal substrate with the solder coating containing between about 0.5-20 x 10 "4 weight per cent of an aromatic aldehyde.
  • the aromatic aldehyde may be selected from a group which includes a inobenzaldehyde, chlorobenzaldehyde, benzaldehyde, dichlorobenzaldehyde, methy 1 be n z a 1 d yd e , n i tr o be n z a 1 d e hyd e , and trichlorobenzaldehyde.
  • the method of applying the fusible Sn/Pb solder coating to the electronic lead-in metal substrate consists of plating the solder coating from either a fluoborate or methylsulfonate plating solution containing the selected aromatic aldehyde.
  • the plating solution may include a long chain alcohol and wetting agents, as is known in the art.
  • a typical fluoborate solder plating bath preferably includes, between about 100-400 grams per liter of stannous (Sn) fluoborate, between about 20-100 grams per liter of lead (Pb) fluoborate, between about 100-300 grams per liter fluoboric acid and between about 0.1-0.5 grams per liter of the age resistant additive or aromatic aldehyde.
  • the bath may further include a long chain alcohol and wetting agent.
  • the resultant coating may be applied to the lead-in metal substrate at a thickness of between 5-800 micro inches.
  • the wire may be coated with a solder coating at a thickness of about 350 micro inches and then the wire may be drawn through a die such that the wire drawn fusible soldered coating has a reduced thickness relative to the applied thickness.
  • solder acts as a lubricant and the entrapped or included organic aromatic aldehyde molecules that are randomly and uniformly distributed throughout the deposited solder coating do not detract from the ability of the coated lead-in substrate to be drawn to a reduced size nor does drawing the wire detract from the solder coatings effectiveness in reducing the loss of solderability due to natural aging or steam aging.
  • the fusible Sn/Pb solder coating must contain between about 0.5-20 x 10 "4 weight per cent aromatic aldehyde in the solder coating deposit or the enhanced and superior corrosion and oxidation resistance of the lead metal substrate is not achieved. If the concentration of the aromatic aldehyde in the coating is below the given range, the resultant coated lead-in metal substrate does not exhibit satisfactory long term resistance to normal aging conditions, and if the concentration of the aromatic aldehyde is above a given range, the resultant lead-in metal substrate severely out gasses upon soldering thereby adversely effecting the solderability of the lead-in metal substrate.
  • the present invention is directed to a novel lead-in metallic substrate possessing superior resistance to corrosion and oxidation and to the loss of solderability due to aging.
  • the resultant lead-in metallic substrate is coated with a fusible solder coating containing between about 0.5-20 x 10 "4 weight per cent of an aromatic aldehyde.
  • the aromatic aldehyde preferably, is selected from a group comprising nitro, amino, alkyl, halogenated substituted and normal benzaldehydes.
  • the aromatic aldehydes that are particularly applicable in steam aged solder coatings include aminobenzaldehyde, benzaldehyde, chlorobenzaldehyde, dichlorobenzaldehyde, trich1orobenza 1dehyde , methyl benzaldehyde, nitrobenzaldehyde.
  • the age resistant material may be a mixture of single ring aromatic aldehydes.
  • the method of applying the fusible Sn/Pb solder coating to the lead-in metal substrate consists of first cleaning the metal substrate and then plating the solder coating from a fluoborate or methylsulfonic acid plating solution containing the selected age resistant additive or aromatic aldehyde.
  • the fluoborate plating solution may include a long chain alcohol and a wetting agent, as is known in the art.
  • typical fluoborate solder plating bath includes between about 100-400 grams per liter of stannous(Sn) fluoborate, between about 20-100 grams per liter of lead(Pb) fluoborate, between about 100-300 grams per liter fluoboric acid and between about 0.1.5 gram per liter of the age resistant additive or aromatic aldehyde.
  • the bath may further include a long chain alcohol and a wetting agent.
  • a typical methylsulfonic acid solder plating bath preferably includes, between about 150-400 grams per liter of stannous(Sn) methylsulfonic acid, between about 80-150 grams per liter of lead(Pb) methylsulfonic acid, between about 100-400 grams per liter of ethonesulfonic acid and between about 0.2-1.0 grams per liter of the age resistant additive or aromatic aldehyde.
  • the plating solution may include a long chain alcohol and a wetting agent, as is known in the prior art.
  • either the fluoborate or methylsulfonic coating may be applied to the lead-in metal substrate at a thickness of between 5-800 micro inches.
  • the wire may be coated with a solder coating at a thickness of about 350 micro inches. Then, the wire may be drawn through a die such that the wire drawn fusible soldered coating has a reduced thickness relative to the applied thickness.
  • solder acts as a lubricant and it is believed that the entrapped " or included organic aromatic aldehyde molecules that are randomly and uniformly distributed or occluded throughout the deposited solder coating layer and on the surface thereof do not detract from the ability of the coated lead-in substrate to be drawn to a size thickness nor does drawing the wire detract from the solder coating's effectiveness in reducing the loss of solderability due to natural aging or steam aging.
  • solder coating to a lead- in metal substrate is the working of plated lead-in metal substrate by cold forging to change the shape and, as a consequence, thereby thinning the solder coating to approximately 5 micro inches.
  • the fusible Sn/Pb solder coating must contain between about 0.5-20 x 10 "4 weight per cent aromatic aldehyde in the solder coating deposit layer or the enhanced and superior corrosion and oxidation resistance of the lead-in metal substrate is not achieved. If the concentration of the aromatic aldehyde in the coating is below this predetermined range, the resultant coated lead-in metal substrate does not exhibit satisfactory long term resistance to normal aging conditions and possesses very poor solderability, and if the concentration of the.
  • the preferred range of weight per cent aromatic aldehyde in the solder coating deposit layer is about 1.0-10.0 x 10 " to provide superior corrosion and oxidation resistance.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemically Coating (AREA)
  • Coating With Molten Metal (AREA)

Abstract

Substrat métallique d'amenée de courant possédant une résistance accrue à la corrosion et à l'oxydation et à la diminution de l'aptitude à la soudure due au vieillissement. Le substrat métallique d'amenée de courant présente un revêtement de soudure fusible contenant entre environ 0,5 et 20 x 10-4 % en poids d'un aldéhyde aromatique.
PCT/US1992/009134 1991-11-01 1992-10-28 Revetements de soudure resistants au vieillissement WO1993009276A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78659491A 1991-11-01 1991-11-01
US786,594 1991-11-01

Publications (1)

Publication Number Publication Date
WO1993009276A1 true WO1993009276A1 (fr) 1993-05-13

Family

ID=25139043

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1992/009134 WO1993009276A1 (fr) 1991-11-01 1992-10-28 Revetements de soudure resistants au vieillissement

Country Status (2)

Country Link
AU (1) AU2927392A (fr)
WO (1) WO1993009276A1 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007137227A1 (fr) 2006-05-22 2007-11-29 Vanda Pharmaceuticals, Inc. Traitement pour troubles dépressifs
WO2008121899A2 (fr) 2007-03-29 2008-10-09 Vanda Pharmaceuticals Inc. Procédé permettant de prédire une prédisposition à la prolongation du qt
WO2010117943A1 (fr) 2009-04-06 2010-10-14 Vanda Pharmaceuticals, Inc. Procédé de prédiction d'une prédisposition à une prolongation de qt sur la base d'une séquence de gène bai3 ou d'un produit de celle-ci
WO2010117931A1 (fr) 2009-04-06 2010-10-14 Vanda Pharmaceuticals, Inc. Méthode de traitement basée sur les polymorphismes du gène kcnq1
WO2010117941A1 (fr) 2009-04-06 2010-10-14 Vanda Pharmaceuticals, Inc. Procédé de prédiction d'une prédisposition à une prolongation de qt sur la base d'une séquence de gène abcc2 ou d'un produit de celle-ci
WO2010117937A1 (fr) 2009-04-06 2010-10-14 Vanda Pharmaceuticals, Inc. Procédé de prédiction d'une prédisposition à une prolongation de qt
US8652776B2 (en) 2007-09-10 2014-02-18 Vanda Pharmaceuticals, Inc. Prediction of QT prolongation based on SNP genotype
EP3075865A2 (fr) 2007-05-18 2016-10-05 Vanda Pharmaceuticals Inc. Marqueurs génétiques d'efficacité de l'ilopéridone dans le traitement de symptômes psychotiques
US10570453B2 (en) 2007-03-29 2020-02-25 Vanda Pharmaceuticals Inc. Method of predicting a predisposition to QT prolongation
WO2023201182A1 (fr) 2022-04-13 2023-10-19 Vanda Pharmaceuticals Inc. Traitement de la maladie de parkinson et de la psychose de la maladie de parkinson

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3755096A (en) * 1971-07-01 1973-08-28 M & T Chemicals Inc Bright acid tin plating
US3769182A (en) * 1970-10-22 1973-10-30 Conversion Chem Corp Bath and method for electrodepositing tin and/or lead
US3954573A (en) * 1973-10-18 1976-05-04 Berol Kemi Ab Compositions and process for the electroplating of metal or metal alloy coatings of high brightness on a base surface
US4395294A (en) * 1981-08-17 1983-07-26 Bell Telephone Laboratories, Incorporated Copper corrosion inhibitor
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4849059A (en) * 1988-09-13 1989-07-18 Macdermid, Incorporated Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769182A (en) * 1970-10-22 1973-10-30 Conversion Chem Corp Bath and method for electrodepositing tin and/or lead
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method
US3755096A (en) * 1971-07-01 1973-08-28 M & T Chemicals Inc Bright acid tin plating
US3954573A (en) * 1973-10-18 1976-05-04 Berol Kemi Ab Compositions and process for the electroplating of metal or metal alloy coatings of high brightness on a base surface
US4395294A (en) * 1981-08-17 1983-07-26 Bell Telephone Laboratories, Incorporated Copper corrosion inhibitor
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4849059A (en) * 1988-09-13 1989-07-18 Macdermid, Incorporated Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007137227A1 (fr) 2006-05-22 2007-11-29 Vanda Pharmaceuticals, Inc. Traitement pour troubles dépressifs
WO2008121899A2 (fr) 2007-03-29 2008-10-09 Vanda Pharmaceuticals Inc. Procédé permettant de prédire une prédisposition à la prolongation du qt
US10570453B2 (en) 2007-03-29 2020-02-25 Vanda Pharmaceuticals Inc. Method of predicting a predisposition to QT prolongation
US9074254B2 (en) 2007-03-29 2015-07-07 Vanda Pharmaceuticals, Inc. Method of predicting a predisposition to QT prolongation
EP3075865A2 (fr) 2007-05-18 2016-10-05 Vanda Pharmaceuticals Inc. Marqueurs génétiques d'efficacité de l'ilopéridone dans le traitement de symptômes psychotiques
US8652776B2 (en) 2007-09-10 2014-02-18 Vanda Pharmaceuticals, Inc. Prediction of QT prolongation based on SNP genotype
US9074256B2 (en) 2009-04-06 2015-07-07 Vanda Pharmaceuticals, Inc. Method of predicting a predisposition to QT prolongation
EP3023506A1 (fr) 2009-04-06 2016-05-25 Vanda Pharmaceuticals Inc. Procédé de traitement basés sur des polymorphismes du gène kcnq1
US9072742B2 (en) 2009-04-06 2015-07-07 Vanda Pharmaceuticals, Inc. Method of predicting a predisposition to QT prolongation
WO2010117937A1 (fr) 2009-04-06 2010-10-14 Vanda Pharmaceuticals, Inc. Procédé de prédiction d'une prédisposition à une prolongation de qt
WO2010117941A1 (fr) 2009-04-06 2010-10-14 Vanda Pharmaceuticals, Inc. Procédé de prédiction d'une prédisposition à une prolongation de qt sur la base d'une séquence de gène abcc2 ou d'un produit de celle-ci
US9074255B2 (en) 2009-04-06 2015-07-07 Vanda Pharmaceuticals, Inc. Method of predicting a predisposition to QT prolongation
US9157121B2 (en) 2009-04-06 2015-10-13 Vanda Pharmaceuticals, Inc. Method of treatment based on polymorphisms of the KCNQ1 gene
US8999638B2 (en) 2009-04-06 2015-04-07 Vanda Pharmaceuticals, Inc. Method of treatment based on polymorphisms of the KCNQ1 gene
WO2010117931A1 (fr) 2009-04-06 2010-10-14 Vanda Pharmaceuticals, Inc. Méthode de traitement basée sur les polymorphismes du gène kcnq1
EP3354753A1 (fr) 2009-04-06 2018-08-01 Vanda Pharmaceuticals Inc. Procédé de traitement à basesde polymorphismes du gène kcnq1
US10563261B2 (en) 2009-04-06 2020-02-18 Vanda Pharmaceuticals, Inc. Method of predicting a predisposition to QT prolongation
US10563259B2 (en) 2009-04-06 2020-02-18 Vanda Pharmeceuticals, Inc. Method of treatment based on polymorphisms of the KCNQ1 gene
US10563260B2 (en) 2009-04-06 2020-02-18 Vanda Pharmaceuticals, Inc. Method of predicting a predisposition to QT prolongation
WO2010117943A1 (fr) 2009-04-06 2010-10-14 Vanda Pharmaceuticals, Inc. Procédé de prédiction d'une prédisposition à une prolongation de qt sur la base d'une séquence de gène bai3 ou d'un produit de celle-ci
US10570452B2 (en) 2009-04-06 2020-02-25 Vanda Pharmaceuticals, Inc. Method of predicting a predisposition to QT prolongation
WO2023201182A1 (fr) 2022-04-13 2023-10-19 Vanda Pharmaceuticals Inc. Traitement de la maladie de parkinson et de la psychose de la maladie de parkinson

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Publication number Publication date
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