WO1992006561A1 - Tampon stabilisateur de temperature pour composants electroniques a semi-conducteurs - Google Patents

Tampon stabilisateur de temperature pour composants electroniques a semi-conducteurs Download PDF

Info

Publication number
WO1992006561A1
WO1992006561A1 PCT/US1991/007043 US9107043W WO9206561A1 WO 1992006561 A1 WO1992006561 A1 WO 1992006561A1 US 9107043 W US9107043 W US 9107043W WO 9206561 A1 WO9206561 A1 WO 9206561A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
ccd array
solid state
ccd
electronic component
Prior art date
Application number
PCT/US1991/007043
Other languages
English (en)
Inventor
Frank Charles Brasington
Original Assignee
E.I. Du Pont De Nemours And Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E.I. Du Pont De Nemours And Company filed Critical E.I. Du Pont De Nemours And Company
Publication of WO1992006561A1 publication Critical patent/WO1992006561A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates to a solid-state device, such as a CCD, where the operating temperature is kept substantially constant to stabilize dark current noise.
  • dark current is the amount of ambient current detectable in individual imaging elements when the CCD is energized in the absence of the imaging beam.
  • dark current in each element of the CCD array is measured prior to a scan and stored as an offset value for later correction of image readings.
  • Technologists working with solid- state imagers wish that the problem of dark current noise were resolved so easily, unfortunately it is not.
  • the present invention does not require significant cooling of the CCD. As it operates at near room temperature, it is much less susceptible to humidity problems. Consequently, it does not require the energy and expense of evacuating an enclosure and filling it with dry gas to keep the CCD cooled significantly below its operating environment,-
  • the present invention is a relatively inexpensive and easily-implement ble solution to a well known problem of resolving the floating dark current problem for solid state devices.
  • This invention is based on two fundamental principles. First, it is often important that the temperature of a solid state electronic component, such as a CCD array, remain substantially constant during use.
  • the dark current problem is largely related to the fact that the offset calibration values change while the CCD is in use.
  • the apparatus of Applicant's invention successfully fixes the operating temperature of the CCD array to just below room temperature so that the offset values remain a substantially accurate representation throughout image scanning and may be used to adjust the actual data.
  • This approach has been successfully employed by Applicant in an industrial non-destructive testing radiographic system comprising scanner means, interactive display means, and storage and retrieval means.
  • this invention does not require cooling of the CCD to very low temperatures, it alleviates the time-consuming, costly and difficult measures that were heretofore undertaken to enclose and "refrigerate” the CCD.
  • This invention provides” good image signal resolution at near ambient air temperatures.
  • an image detecting system comprising a CCD array and a cooling element used to control the temperature of said CCD array
  • the improvement comprises: a temperature buffering means interposed in thermal contact between said CCD and said cooling element.
  • Figure 1 represents a prior art approach to cooling of a CCD array.
  • FIG. 1 shows the invention.
  • FIG. 3 is a schematic representation of circuitry employing the invention.
  • a heat transfer means 20 is thermally connected to the rear face of solid-state CCD imager 3, that is, opposite the face where the imaging beam is received. Heat transfer means 20 is utilized to provide a substantially uniform temperature exchange from the rear face of the CCD 3 to heat buffering means 4. To be most effective, the heat transfer means 20, such as a thermal pad or thermally conductive glue, should remain in thermal contact with both heat buffering means 4 and
  • Heat buffering means 4 is comprised of a relatively highly thermally conductive material, such as aluminum or copper. It extends along the full length of CCD 3 and acts to integrate small temperature fluctuations along the CCD.
  • a thermally conductive mounting plate 5 is centered and fixed orthogonal to heat buffering means 4.
  • Thermistor 18 may be placed longitudinally into a grooved out section of mounting plate 5 such that the thermistor thermal contacts both heat buffering means 4 and mounting plate 5.
  • the thermistor's output Upon sensing a change in temperature of the heat buffering means, the thermistor's output, which is continuously compared with a reference temperature voltage, triggers the application of sufficient current to cooling element 10 to maintain the reference temperature. This feedback control is accomplished using standard servo amplifier and power control techniques which are well known in the art. See Figure 3.
  • Cooling element 10 is attached by means of a thermally conductive medium to mounting plate 5 on the side opposite heat buffering means 4. Cooling element 10 might typically be a thermoelectric cooler with the "cool” side fixed to mounting plate 5. The "hot” side of 10 is attached to heat sink 6 to vent away heat during temperature cooling and maintenance.
  • the prior art response to the variable dark current problem can be found in figure 1.
  • the emphasis is upon cooling the CCD array substantially below room temperature to about 10°C.
  • a further definition of the dark current noise problem reveals that acceptable resolution of most signals can be obtained at about room temperature if that temperature can be sustained during imaging of the light source on the CCD. Unless the image signals are very small (e.g. astronomy signals), the key to relative freedom from temperature-dependent dark noise is to maintain a constant temperature so that the offset dark current values, established in the absence of light, will remain useful for making corrections to image data values.
  • thermoelectric cooling device (312, 314, and 316) directly to non-imaging side of the CCD (220) .
  • This solution may not be satisfactory in that the size of the cooling device may be smaller than the active area of the CCD array thus permitting uneven cooling.
  • thermoelectric cooler itself is not a perfect device and due to manufacturing differences in its internal metallic junctions, there may be differences in temperature across its surface. Also, as heat from the
  • the instant invention avoids the problem of improper sizing of TE 10 to the CCD by extending heat transfer means and heat buffering means over the full length of the CCD.
  • the heat buffering means smooths out changes in temperature so that: 1) no one element in the CCD array will experience any substantial difference in temperature from any other element along the array and, 2) any change in temperature will be slight and gradual.
  • Heat buffering means 4 integrates temperature fluctuations and evenly distributes just-below-room temperature coolness of the TE as required. With the thermistor 18 being employed, it can respond to minute changes in temperature. Additionally, the operating temperature of the TE, e.g. 70 ⁇ F, makes it unlikely that condensate or "dew" will form on imaging window 13 of the CCD. Thus, the substantially constant temperature during imaging of the CCD yields a substantially constant source of dark current noise which can be adequately compensated for through use of measured offset values during calibration.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

On intercale un tampon thermique (4) entre un refroidisseur thermoélectrique (10) et un réseau de dispositifs à couplage de charge (3) afin d'assurer une distribution uniforme de température sur tout le réseau (3) de manière à stabiliser le courant d'obscurité.
PCT/US1991/007043 1990-10-05 1991-10-01 Tampon stabilisateur de temperature pour composants electroniques a semi-conducteurs WO1992006561A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59318390A 1990-10-05 1990-10-05
US593,183 1990-10-05

Publications (1)

Publication Number Publication Date
WO1992006561A1 true WO1992006561A1 (fr) 1992-04-16

Family

ID=24373728

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1991/007043 WO1992006561A1 (fr) 1990-10-05 1991-10-01 Tampon stabilisateur de temperature pour composants electroniques a semi-conducteurs

Country Status (1)

Country Link
WO (1) WO1992006561A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994000950A1 (fr) * 1992-06-19 1994-01-06 Honeywell Inc. Camera a infrarouges avec stabilisation thermoelectrique de la temperature
WO1997022860A1 (fr) * 1995-12-19 1997-06-26 Lockheed-Martin Ir Imaging Systems Procede et appareil de stabilisation du gradient thermique de matrices planes focales de microbolometre
US6249002B1 (en) 1996-08-30 2001-06-19 Lockheed-Martin Ir Imaging Systems, Inc. Bolometric focal plane array
US6515285B1 (en) 1995-10-24 2003-02-04 Lockheed-Martin Ir Imaging Systems, Inc. Method and apparatus for compensating a radiation sensor for ambient temperature variations
US6730909B2 (en) 2000-05-01 2004-05-04 Bae Systems, Inc. Methods and apparatus for compensating a radiation sensor for temperature variations of the sensor
US6791610B1 (en) 1996-10-24 2004-09-14 Lockheed Martin Ir Imaging Systems, Inc. Uncooled focal plane array sensor
US7030378B2 (en) 2003-08-05 2006-04-18 Bae Systems Information And Electronic Systems Integration, Inc. Real-time radiation sensor calibration
US8028531B2 (en) 2004-03-01 2011-10-04 GlobalFoundries, Inc. Mitigating heat in an integrated circuit
US20220240414A1 (en) * 2021-01-27 2022-07-28 Panasonic Intellectual Property Management Co., Ltd. Imaging device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4496982A (en) * 1982-05-27 1985-01-29 Rca Corporation Compensation against field shading in video from field-transfer CCD imagers
US4525743A (en) * 1984-03-28 1985-06-25 Rca Corporation Dark current measurement and control for cameras having field-transfer CCD imagers
US4551762A (en) * 1984-01-18 1985-11-05 Rca Corporation Dark-current level regulation in solid-state devices
US4551760A (en) * 1983-09-16 1985-11-05 Rca Corporation Television camera with solid-state imagers cooled by a thermal servo
US4562473A (en) * 1984-10-10 1985-12-31 Rca Corporation Dark current sensing with a solid-state imager having a CCD line register output
US4580168A (en) * 1982-05-27 1986-04-01 Rca Corporation Charge-storage-well dark current accumulator with CCD circuitry
US4587563A (en) * 1984-09-28 1986-05-06 Rca Corporation Cooler control for a solid-state imager camera
US4739382A (en) * 1985-05-31 1988-04-19 Tektronix, Inc. Package for a charge-coupled device with temperature dependent cooling

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4496982A (en) * 1982-05-27 1985-01-29 Rca Corporation Compensation against field shading in video from field-transfer CCD imagers
US4580168A (en) * 1982-05-27 1986-04-01 Rca Corporation Charge-storage-well dark current accumulator with CCD circuitry
US4551760A (en) * 1983-09-16 1985-11-05 Rca Corporation Television camera with solid-state imagers cooled by a thermal servo
US4551762A (en) * 1984-01-18 1985-11-05 Rca Corporation Dark-current level regulation in solid-state devices
US4525743A (en) * 1984-03-28 1985-06-25 Rca Corporation Dark current measurement and control for cameras having field-transfer CCD imagers
US4587563A (en) * 1984-09-28 1986-05-06 Rca Corporation Cooler control for a solid-state imager camera
US4562473A (en) * 1984-10-10 1985-12-31 Rca Corporation Dark current sensing with a solid-state imager having a CCD line register output
US4739382A (en) * 1985-05-31 1988-04-19 Tektronix, Inc. Package for a charge-coupled device with temperature dependent cooling

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994000950A1 (fr) * 1992-06-19 1994-01-06 Honeywell Inc. Camera a infrarouges avec stabilisation thermoelectrique de la temperature
US6515285B1 (en) 1995-10-24 2003-02-04 Lockheed-Martin Ir Imaging Systems, Inc. Method and apparatus for compensating a radiation sensor for ambient temperature variations
WO1997022860A1 (fr) * 1995-12-19 1997-06-26 Lockheed-Martin Ir Imaging Systems Procede et appareil de stabilisation du gradient thermique de matrices planes focales de microbolometre
US5763885A (en) * 1995-12-19 1998-06-09 Loral Infrared & Imaging Systems, Inc. Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays
US6249002B1 (en) 1996-08-30 2001-06-19 Lockheed-Martin Ir Imaging Systems, Inc. Bolometric focal plane array
US6791610B1 (en) 1996-10-24 2004-09-14 Lockheed Martin Ir Imaging Systems, Inc. Uncooled focal plane array sensor
US6730909B2 (en) 2000-05-01 2004-05-04 Bae Systems, Inc. Methods and apparatus for compensating a radiation sensor for temperature variations of the sensor
US7030378B2 (en) 2003-08-05 2006-04-18 Bae Systems Information And Electronic Systems Integration, Inc. Real-time radiation sensor calibration
US8028531B2 (en) 2004-03-01 2011-10-04 GlobalFoundries, Inc. Mitigating heat in an integrated circuit
US20220240414A1 (en) * 2021-01-27 2022-07-28 Panasonic Intellectual Property Management Co., Ltd. Imaging device
US11936966B2 (en) * 2021-01-27 2024-03-19 Panasonic Intellectual Property Management Co., Ltd. Imaging device with cooling mechanism

Similar Documents

Publication Publication Date Title
US6610984B2 (en) Method and apparatus for correction of microbolometer output
US8378290B1 (en) Sensor calibration systems and methods for infrared cameras
US8049163B1 (en) Calibration systems and methods for infrared cameras
US7834325B2 (en) Radiation image information capturing apparatus and method of detecting temperature of amplifier thereof
CA2226495C (fr) Systeme de detection thermique avec dispositif d'etalonnage a reponse rapide
US6891160B2 (en) Method and apparatus for temperature compensation of an uncooled focal plane array
KR100271083B1 (ko) 열전 온도 안정화를 갖는 적외선 카메라(Infrared Camera with Thermoelectric Temperature Stabilization)
US6630674B2 (en) Method and apparatus for correction of microbolometer output
US8143574B2 (en) Method and apparatus for compensating infrared sensor for temperature
DE69222227D1 (de) Wärmeübertragungsgeschwindigkeitsmessgerät
US20050152035A1 (en) Method of thermal condensate reduction for optical devices
WO1992006561A1 (fr) Tampon stabilisateur de temperature pour composants electroniques a semi-conducteurs
TWI716229B (zh) 高精準度非接觸式溫度量測裝置
JPS6086971A (ja) テレビジヨンカメラ
CN107101727A (zh) 非均匀性校正时校正参数的标定方法
US5023459A (en) Miniature multi-temperature radiometric reference
US20210382301A1 (en) Optical measurement apparatus
JPH1123722A (ja) 放射線検出器
CN111024240A (zh) 一种两点校正温控快门的装置及方法
US11125625B2 (en) Microbolometer readout circuit and calibration method using the same
JP4753763B2 (ja) 放射線画像情報撮影装置
JPH055435B2 (fr)
JP2019213193A (ja) 赤外線撮像装置及びそれに用いられるプログラム
JPH1048052A (ja) 赤外線熱画像装置及びその光学系温度測定装置
US11543298B1 (en) Temperature calibration method for a temperature measuring device

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CA JP

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IT LU NL SE

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: CA