WO1992005432A1 - Integrated sensor - Google Patents

Integrated sensor Download PDF

Info

Publication number
WO1992005432A1
WO1992005432A1 PCT/EP1991/001845 EP9101845W WO9205432A1 WO 1992005432 A1 WO1992005432 A1 WO 1992005432A1 EP 9101845 W EP9101845 W EP 9101845W WO 9205432 A1 WO9205432 A1 WO 9205432A1
Authority
WO
WIPO (PCT)
Prior art keywords
protruding portion
sensing element
heating element
substrate
sensor according
Prior art date
Application number
PCT/EP1991/001845
Other languages
French (fr)
Inventor
Peter Maria Van Geloven
Jean Joseph Marie Roggen
Original Assignee
Engicom N.V.
Vaisala Oy
Kemira Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engicom N.V., Vaisala Oy, Kemira Oy filed Critical Engicom N.V.
Publication of WO1992005432A1 publication Critical patent/WO1992005432A1/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid

Definitions

  • Sensors for measuring gas concentrations show a sensing element, a heating element and/or associated electronics at relatively short distances from each other. Electronics components are sensitive to temperature influences.
  • US patent 4,413,502 discloses a sensor in which two substrates are combined together, a first one on which a sensing element is arranged and a second one which is provided with a heating element. It is an object of the present invention to provide an integrated sensor, in which heating and sensing elements are both provided on one substrate.
  • the present invention provides a sensor comprising :
  • first conductor paths connected on one end to said heating element and extending over the protruding portion; - first terminals ' fo .supplying electric current to the heating element, which are located opposite the protruding portion of the substrate and which are connected to the other ends of the first conductor paths extending over said protruding portion; - a sheet of insulating material provided over said heating element;
  • Especially sub-claims 4-10 are directed to optimizing the sensitivity and/or heat-dissipation, viz the power efficiency, of the sensor according to the present invention.
  • a sensor 1 comprises an insulating substrate 2, preferably of aluminium oxide (A1 2 0 3 ) , onto which is arranged a sensing element of a layer of tin oxide 3, or tin oxide doped with small amounts of additives (e.g. platinum) , under which ex ⁇ tend gold conductor paths 4 which are conductively connected via further conductor paths 6 of gold to solderable terminal contacts 7.
  • the substrate 2 is preferably also provided with terminal contacts 8 for a heating element which is conductively connected via conductor paths 9, preferably of platinum, to a heating element (not further shown) which is deposited under a layer 11 of dielectric material.
  • a sensor 1 is preferably disposed in a housing 12, for instance of plastic, and a cover 13, for instance of porous metal, fitting thereon.
  • the conduction of the tin oxide gives, depending on the temperature, a measure for the concentration of gases in the air such as H / CH 4 etc.
  • the surface of tin oxide can be taken to different temperatures, and a series of such elements held at different temperatures and/or with different tin oxide compositions (additives) can optionally be arranged. In this way, an array of sensors is constructed, yielding high selectivity.
  • the insulating substrate is provided with a protruding portion on which the sensing element is arranged and the terminal contacts, optionally with electronics placed directly thereon, are placed at a distance from the protruding portion, the influences of temperature acting on the electronics via the terminal contacts remain minimal.
  • the geometry of the protruding portion is optimalized in order to limit the amount of electric power dissipated by the heating element.
  • the length of the protruding portion is such that the electrical resistance of the conductor paths 9 does not become too high, whereby the dissipation for these conductor paths 9 is increased.
  • the protruding portion also cannot be too short.
  • the width of the protruding portion can also be optimized with respect to thermal resistance and the electrical resistance of the conductor paths, which latter depends on the width thereof.
  • the substrate has a thickness of 0,25 mm a width of about 1 mm and a length of about 8 mm.
  • the preferred value for the width is to some extend increased relative to the optimal dimensions for the heattransfer, because of strength requirements for the protruding portion.

Abstract

A sensor (1) comprising: an insulating substrate (2) provided with a protruding portion; a heating element, arranged on said insulating substrate near the tip end of said protruding portion; first conductor paths (9) connected on one end to said heating element and extending over the protruding portion; first terminals (8) for supplying electric current to the heating element, which are located opposite the protruding portion of the substrate and which are connected to the other ends of the first conductor paths extending over said protruding portion; a sheet of insulating material provided over said heating element; a sensing element (3) arranged over said heating element near the tip end of said protruding portion; second conductor paths (4) connected on one end to the sensor element (3) and extending over said protruding portion; and second terminals (7) located opposite of said protruding portion of the substrate, and which are connected to the other ends of said second conductor paths and which are adapted for connecting one or more electronic circuits, which might be placed as a hybrid circuit in the same substrate.

Description

INTEGRATED SENSOR
Sensors for measuring gas concentrations, for instance polluting gases in air, show a sensing element, a heating element and/or associated electronics at relatively short distances from each other. Electronics components are sensitive to temperature influences.
US patent 4,413,502 discloses a sensor in which two substrates are combined together, a first one on which a sensing element is arranged and a second one which is provided with a heating element. It is an object of the present invention to provide an integrated sensor, in which heating and sensing elements are both provided on one substrate.
The present invention provides a sensor comprising :
- an insulating substrate provided with a protruding portion;
- a heating element, arranged on said insulating substrate near the tip end of said protruding portion;
- first conductor paths connected on one end to said heating element and extending over the protruding portion; - first terminals' fo .supplying electric current to the heating element, which are located opposite the protruding portion of the substrate and which are connected to the other ends of the first conductor paths extending over said protruding portion; - a sheet of insulating material provided over said heating element;
- a sensing element arranged over said heating element near the tip end of said protruding portion;
- second conductor paths connected on one end to the sensor element and extending over said protruding portion; and
- second terminals located opposite of said protruding portion of the substrate, and which are connected to the other ends of said second conductor paths and which are adapted for connecting one or more electronic circuits.
SUBSTITUTESHEET The above mentioned component of the sensor can easily be disposed by means of thick-film techniques.
Especially sub-claims 4-10 are directed to optimizing the sensitivity and/or heat-dissipation, viz the power efficiency, of the sensor according to the present invention.
A doctor's thesis will be published in the forth coming year, in which proof for the formulas from the sub- claims can be found. Further advantages, features and details of the present invention will become apparent in the light of a description with reference to the annexed figure, wherein a sensor 1 comprises an insulating substrate 2, preferably of aluminium oxide (A1203) , onto which is arranged a sensing element of a layer of tin oxide 3, or tin oxide doped with small amounts of additives (e.g. platinum) , under which ex¬ tend gold conductor paths 4 which are conductively connected via further conductor paths 6 of gold to solderable terminal contacts 7. The substrate 2 is preferably also provided with terminal contacts 8 for a heating element which is conductively connected via conductor paths 9, preferably of platinum, to a heating element (not further shown) which is deposited under a layer 11 of dielectric material. As shown schematically, a sensor 1 is preferably disposed in a housing 12, for instance of plastic, and a cover 13, for instance of porous metal, fitting thereon.
The conduction of the tin oxide gives, depending on the temperature, a measure for the concentration of gases in the air such as H / CH4 etc.
Using the heating element and suitable calibration the surface of tin oxide can be taken to different temperatures, and a series of such elements held at different temperatures and/or with different tin oxide compositions (additives) can optionally be arranged. In this way, an array of sensors is constructed, yielding high selectivity.
SUBSTITUTESHEET Since the insulating substrate is provided with a protruding portion on which the sensing element is arranged and the terminal contacts, optionally with electronics placed directly thereon, are placed at a distance from the protruding portion, the influences of temperature acting on the electronics via the terminal contacts remain minimal. In addition, the geometry of the protruding portion is optimalized in order to limit the amount of electric power dissipated by the heating element. In preference the length of the protruding portion is such that the electrical resistance of the conductor paths 9 does not become too high, whereby the dissipation for these conductor paths 9 is increased. On account of the above mentioned thermal resistance between the sensing element and the terminal contacts, the protruding portion also cannot be too short.
The width of the protruding portion can also be optimized with respect to thermal resistance and the electrical resistance of the conductor paths, which latter depends on the width thereof.
Preferably the substrate has a thickness of 0,25 mm a width of about 1 mm and a length of about 8 mm. The preferred value for the width is to some extend increased relative to the optimal dimensions for the heattransfer, because of strength requirements for the protruding portion.
SUBSTITUTESHEET

Claims

1. A sensor comprising :
- an insulating substrate provided with a protruding portion;
- a heating element, arranged on said insulating substrate near the tip end of said protruding portion;
- first conductor paths connected on one end to said heating element and extending over the protruding portion;
- first terminals for supplying electric current to the heating element, which are located opposite the protruding portion of the substrate and which are connected to the other ends of the first conductor paths extending over said protruding portion;
- a sheet of insulating material provided over said heating element; - a sensing element arranged over said heating element near the tip end of said protruding portion;
- second conductor paths connected on one end to the sensor element and extending over said protruding portion; and - second terminals located opposite of said protruding portion of the substrate, and which are connected to the other ends of said second conductor paths and which are adapted for connecting one or more electronic circuits, which might be placed as a hybrid circuit in the same substrate.
2. A sensor according to claim 1, in which said sensing element, said insulating sheet, said heating element, said conductor paths and/or said terminals, said electronic circuits are arranged using screen prints or thick-film technique.
3. A sensor according to claim 1 or 2, wherein the sensing element comprises a surface of tin oxide or tin oxide doped with small amounts of additives (e.g. platinum) .
4. A sensor according to claim 1,2 or 3, in which the dimensions of the surface area of the sensing element
SUBSTITUTE SHEET material is optimized by maximizing the change in temperature and thereby causes change in conductivity of the sensing element material, both of which changes are due to the presence of certain gases in the ambient.
5. A sensor according to claim 4, in which the change of temperature is based upon the formula
T> " -2 +-£,"£ " E <T3 - T2) -f2 + i-L-fc in which Ti is the temperature of the substrate near the tip end of the protruding portion; T2 is the ambient temperature of the surrounding in which the sensor is placed; a is a constant representing the power of the exotherm reaction per unit of surface area for the sensing element material; AT is the surface area between the sensing element and the ambient; A2 is the surface area between the substrate of the tip end and the ambient; hi is the heat transfer-coefficient between substrate and ambient; h2 is the heat transfer- coefficient between sensing element and ambient; T3 is the temperature of the sensing element and Qi is the power supplied to the heating element.
6. A sensor according to claim 4 or 5, in which the sensing element substantially extends over the complete width of said tip end of said protruding portion.
7. A sensor according to any of the foregoing claims, in which a layer of the same material as the material of said sensing element is arranged on the back side of said protruding portion near the tip end thereof.
8. A sensor according to ary one of the proceeding claims, in which the length of the protruding portion is optimized with respect to minimizing temperature gradient from tip end to the opposite side of the protruding portion and minimizing the length of the first conductor path connected to the heating element.
9. A sensor according to claim 8, in which the optimal length of the protruding portion is obtained from the following formula
L
P: = PT - k.f(p) + / pdl
0
SUBSTITUTESHEET in which P is the power dissipation of the sensor as a whole; PT is the power dissipated at the sensing element; k is the heat conduction coefficient of a cross section of the protruding portion; f(p) is a known function of the electrical power dissipation per unit length in the heater wires; L is the length of the protruding portion minus the
L length of the sensing element; J pdl can be determined from
0 the formula equation
Figure imgf000008_0001
in which Ri is the resistance value of the heating element; h is the heat transfer coefficient between the protruding portion and ambient; A is the surface area of the cross section of the protruding portion; R2 is the resistance value of the conducting path to the heating element and dT 1 ~Λdx1-Q 1S the temperature gradient at 1=0 , viz . at the border of the sensing element.
10. A sensor according to any one of the proceeding claims, in which the thickness of the substrate is in the order of magnitude of 0,25 mm, the length is in the order of magnitude of 8 mm and the width is in the order of magnitude of 1 mm.
SUBSTITUTESHEET
PCT/EP1991/001845 1990-09-22 1991-09-23 Integrated sensor WO1992005432A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9002077A NL9002077A (en) 1990-09-22 1990-09-22 SENSOR.
NL9002077 1990-09-22

Publications (1)

Publication Number Publication Date
WO1992005432A1 true WO1992005432A1 (en) 1992-04-02

Family

ID=19857715

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1991/001845 WO1992005432A1 (en) 1990-09-22 1991-09-23 Integrated sensor

Country Status (2)

Country Link
NL (1) NL9002077A (en)
WO (1) WO1992005432A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6453723B1 (en) * 1999-02-22 2002-09-24 Ngk Spark Plug Co., Ltd. Gas sensor device
US7304715B2 (en) 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2061520A (en) * 1979-10-20 1981-05-13 Draegerwerk Ag Hydrogen Sulphide Detector
US4413502A (en) * 1981-04-27 1983-11-08 Nippon Soken, Inc. Gas detecting sensor
JPS58195146A (en) * 1982-05-10 1983-11-14 Nippon Soken Inc Gaseous component detector
EP0101249A2 (en) * 1982-08-06 1984-02-22 Hitachi, Ltd. Gas sensor
US4450428A (en) * 1981-05-25 1984-05-22 Nippon Soken, Inc. Gas detecting sensor
EP0280540A2 (en) * 1987-02-24 1988-08-31 American Intell-Sensors Corporation Method and apparatus for simultaneous detection of target gases in ambient air
EP0313390A2 (en) * 1987-10-22 1989-04-26 Kabushiki Kaisha Toshiba Gas sensor and method for production thereof
EP0444753A1 (en) * 1990-03-02 1991-09-04 ENIRICERCHE S.p.A. Method of determining gaseous hydrocarbons using gas sensors formed of thin tin oxide films

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2061520A (en) * 1979-10-20 1981-05-13 Draegerwerk Ag Hydrogen Sulphide Detector
US4413502A (en) * 1981-04-27 1983-11-08 Nippon Soken, Inc. Gas detecting sensor
US4450428A (en) * 1981-05-25 1984-05-22 Nippon Soken, Inc. Gas detecting sensor
JPS58195146A (en) * 1982-05-10 1983-11-14 Nippon Soken Inc Gaseous component detector
EP0101249A2 (en) * 1982-08-06 1984-02-22 Hitachi, Ltd. Gas sensor
EP0280540A2 (en) * 1987-02-24 1988-08-31 American Intell-Sensors Corporation Method and apparatus for simultaneous detection of target gases in ambient air
EP0313390A2 (en) * 1987-10-22 1989-04-26 Kabushiki Kaisha Toshiba Gas sensor and method for production thereof
EP0444753A1 (en) * 1990-03-02 1991-09-04 ENIRICERCHE S.p.A. Method of determining gaseous hydrocarbons using gas sensors formed of thin tin oxide films

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 8, no. 42 (P-256)(1479) 23 February 1984 & JP,A,58 195 146 ( NIPPON JIDOSHA BUHIN SOGO KENKYUSHO K.K. ) 14 November 1983 see abstract *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6453723B1 (en) * 1999-02-22 2002-09-24 Ngk Spark Plug Co., Ltd. Gas sensor device
US7304715B2 (en) 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7804575B2 (en) 2004-08-13 2010-09-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method having liquid evaporation control
US9188880B2 (en) 2004-08-13 2015-11-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater
US9268242B2 (en) 2004-08-13 2016-02-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater and a temperature sensor
US10254663B2 (en) 2004-08-13 2019-04-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater
US10838310B2 (en) 2004-08-13 2020-11-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater
US11378893B2 (en) 2004-08-13 2022-07-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater

Also Published As

Publication number Publication date
NL9002077A (en) 1992-04-16

Similar Documents

Publication Publication Date Title
US11382182B2 (en) Planar heating element with a PTC resistive structure
CN102665306B (en) Heater and method for producing the same using PCB process
US5823680A (en) Temperature sensor
US4307373A (en) Solid state sensor element
US6072165A (en) Thin film metal/metal oxide thermocouple
US4952903A (en) Ceramic heater having portions connecting heat-generating portion and lead portions
US4193965A (en) Circuit assembly for exhaust emission monitoring
EP1114994A3 (en) Thermally conductive sensor
EP0496136A2 (en) Heated solid electrolyte oxygen sensor
KR100799025B1 (en) Sensor unit comprising an air moisture sensor and an air temperature sensor
JP3174059B2 (en) Heater device
US20200240848A1 (en) Sensor for detecting a spatial temperature profile and method for producing a sensor unit
US4450428A (en) Gas detecting sensor
WO1989003021A1 (en) Heat-sensitive fuel quantity detector
KR930011169B1 (en) Method and apparatus for measuring mass of flowing medium
GB2378253A (en) Integrated microstructural sensor element for detecting thermodynamic variables of a fluid.
US20020109577A1 (en) Electrical resistor with platinum metal or a platinum metal compound and sensor arrangement with the resistor
US4631350A (en) Low cost thermocouple apparatus and methods for fabricating the same
WO1992005432A1 (en) Integrated sensor
US20070023414A1 (en) Heatable infrared sensor and infrared thermometer comprising such an infrared sensor
US4770036A (en) Apparatus for measuring velocity of flow
CN1220052C (en) Catalytic sensor
EP0334614A3 (en) Catalytic gas detector
GB2002907A (en) Semiconductor gas sensing elements
JP2000206081A (en) Gas sensor with two electrodes

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): FI JP NO US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IT LU NL SE